CN210807332U

CN210807332U - All-in-one converter using low-rate optical modules on high-rate switch

Info

Publication number: CN210807332U
Application number: CN201920907528.5U
Authority: CN
Inventors: 关鹤林; 吴天书; 杨现文; 李林科; 张健; 唐凯
Original assignee: Wuhan Linktel Technologies Co Ltd
Current assignee: Wuhan Linktel Technologies Co Ltd
Priority date: 2019-06-17
Filing date: 2019-06-17
Publication date: 2020-06-19
Anticipated expiration: 2029-06-17

Abstract

The utility model relates to an use converter of unifying more of low rate optical module on high rate switch, this patent relates to the optical module field among the optical communication, provides the scheme that uses the 25G optical module on 100G switch to can satisfy the 10G optical module simultaneously and use on the 40G switch. The first electrical interface of the converter is connected with a 100G/40G switch, meets the requirements of SFF-8636 protocol, and realizes the bidirectional transmission of signals from the switch to the converter. The second electrical interface of the converter is connected to the optical module, which enables the bi-directional transmission of the module from the converter to the optical module. The converter is internally provided with a signal conversion circuit, so that signals of the two electrical interfaces meet respective protocol requirements. MCU is integrated in the converter, and the conversion of I2C communication between the first electrical interface and the second electrical interface is realized through the MCU; the MCU can also read the EEPROM information in the module, so that the converter is more beneficial to personnel.

Description

All-in-one converter using low-rate optical modules on high-rate switch

Technical Field

The utility model relates to an optical module field among the optical communication especially relates to an use converter of unifying more of low speed optical module on high rate switch.

Background

The rate of the current common switches is 10G, 25G, 40G and 100G, however, the rate of 100G switches is more and more common due to the update of the communication equipment. However, in the using process, the low-rate optical module cannot be directly used on the high-rate switch, and a common switching scheme is to use a one-to-four AOC optical cable for switching. However, four low-rate optical modules are required, so that the use is very inconvenient and a large amount of space is occupied.

Disclosure of Invention

An object of the utility model is to overcome prior art's defect, provide an all-in-one converter that uses low speed optical module on the high rate switch, use the scheme of 25G optical module on 100G switch to can satisfy the 10G optical module simultaneously and use on the 40G switch, make things convenient for operating personnel's use more.

The utility model discloses a realize like this: the utility model discloses an all-in-one converter using low-rate optical modules on a high-rate switch, which comprises a first electrical interface J1 and a second electrical interface J2, wherein the first electrical interface J1 is used for being connected with a four-channel high-speed switch and realizing the two-way transmission of signals from the switch to the converter; the second electrical interface J2 is used for connecting with a single-channel optical module, and is used for realizing bidirectional transmission of signals from the converter to the optical module; one channel of the first electrical interface J1 is correspondingly connected with the second electrical interface J2, and is used as an effective signal channel for signal transmission, and other channels of the first electrical interface J1 do not transmit signals; an MCU module is arranged between the first electrical interface J1 and the second electrical interface J2, an SDA pin and an SCL pin of the first electrical interface J1 are correspondingly connected with the MCU module, an SDA pin and an SCL pin of the second electrical interface J2 are correspondingly electrically connected with the MCU module, and the MCU module is used for realizing the conversion of I2C communication between the first electrical interface J1 and the second electrical interface J2; a first input end of the MCU module is connected to a MODSELL pin of the first electrical interface J1, and is configured to collect an enable signal that allows I2C communication; a signal conversion circuit is connected between the first electrical interface J1 and the second electrical interface J2, and is used for realizing conversion of reported signals, so that the signals of the first electrical interface J1 and the second electrical interface J2 all meet respective protocol requirements.

And a third input end of the MCU module is connected to a RESET pin of the first electrical interface J1, and is configured to collect a RESET signal of the optical module, and after receiving the RESET signal, the MCU initializes all internal information to an original value.

The Mod _ ABS pin of the second electrical interface J2 is connected to the MODPRSL pin of the first electrical interface J1, and is used for the switch to determine whether the optical module is inserted.

The signal conversion circuit uses a MOS tube as a carrier of signal conversion, and converts a Digital imaging monitoring (DDM) related signal. Two Gold Finger (Gold Finger) areas are arranged at the first and second electrical interfaces, and signal conversion is carried out through a circuit between the first electrical interface and the second electrical interface, so that respective multi-source agreement requirements can be met.

The signal conversion circuit comprises a first conversion circuit, the first conversion circuit comprises a MOS tube Q7, the grid electrode of the MOS tube Q7 is connected with one end of a resistor R17 and a RESET pin of a first electrical interface J1, the drain electrode of the MOS tube Q7 is connected with one end of a resistor R18 and a TX _ DISABLE pin of a second electrical interface J2, the other end of the resistor R17 and the other end of the resistor R18 are connected with one end of a 3.3V voltage and a capacitor C6, the other end of the capacitor C6 is grounded, and the source electrode of the MOS tube Q7 is grounded.

The signal conversion circuit comprises a second conversion circuit, the second conversion circuit comprises a MOS tube Q8, the grid of the MOS tube Q8 is connected with one end of a resistor R19 and an LPMODE pin of a first electrical interface J1, the drain of the MOS tube Q8 is connected with one end of a resistor R20 and an RS0 pin of a second electrical interface J2, the other end of the resistor R19 and the other end of the resistor R20 are connected with one end of a 3.3V voltage and a capacitor C7, the other end of the capacitor C7 is grounded, and the source of the MOS tube Q8 is grounded.

The second conversion circuit further comprises a MOS tube Q9, the grid of the MOS tube Q9 is connected with the LPMODE pin of the first electrical interface J1, the drain of the MOS tube Q9 is connected with one end of a resistor R16 and the RS1 pin of the second electrical interface J2, the other end of the resistor R16 is connected with one end of a 3.3V voltage and a capacitor C8, the other end of the capacitor C8 is grounded, and the source of the MOS tube Q9 is grounded.

The signal conversion circuit comprises a third conversion circuit, the third conversion circuit comprises a MOS tube Q6 and a MOS tube Q10, the grid of the MOS tube Q6 is respectively connected with one end of a resistor R13 and a TX _ FAULT pin of a second electrical interface J2, the grid of the MOS tube Q10 is respectively connected with one end of a resistor R15 and an RX _ LOS pin of a second electrical interface J2, the drain of the MOS tube Q6 and the drain of the MOS tube Q10 are respectively connected with one end of the resistor R14 and an INTL pin of a first electrical interface J1, the other end of the resistor R13, the other end of the resistor R14 and the other end of the resistor R15 are connected with a 3.3V voltage and one end of a capacitor C5, the other end of the capacitor C5 is grounded, and the source of the MOS tube Q6 and the source of the MOS tube Q10 are grounded.

The method comprises the steps of defining the content of 128 bytes in the EEPROM and PAGE00 in the converter MCU, and enabling the priority of the converter area to be higher than that of the optical module area, reading the information of the EEPROM in the converter, reading the content of 128 bytes in the PAGE00 no matter whether the converter is inserted into the optical module or not, so that the type, SN number and manufacturer series of information of the converter can be distinguished, when one end of the converter is connected with the optical module and the other end of the converter is connected with the switch and works normally, the MCU of the converter downloads the information of other areas of the optical module to the local, the information of the other areas of the module is read normally from the switch, and when the optical module is pulled out, all the information of the areas is cleared.

The MCU module is used for reading and writing EEPROM information in the optical module through a second electrical interface J2, distinguishing the type, SN number and a series of information of manufacturers of the converter, and reading the information of the EEPROM in the converter MCU through a first electrical interface J1 and transmitting the information to the switch; the second input end of the MCU module is connected to the Mod _ ABS pin of the second electrical interface J2, and is used to determine whether the optical module is inserted into the converter.

The MCU and the I2C conversion circuit convert the address space where the register is located, so that the I2C signal transmission meets respective transmission standards. The circuit between the first electrical interface J1 and the second electrical interface J2 adopts a differential design including high-speed signal wires, so that the loss of signals in the transmission process is reduced to the maximum extent, and the converter can support the signal transmission rate of a single circuit 28GB/s at the highest energy.

The MCU module adopts a chip with the model number of EFM8 LB; the 24 th pin of the MCU module is connected with one end of a resistor R7 and an SDA pin of a first electrical interface J1, and the other end of the resistor R7 is connected with 3.3V voltage; the 23 rd pin of the MCU module is connected with one end of a resistor R10 and an SCL pin of a first electrical interface J1, and the other end of the resistor R10 is connected with 3.3V voltage; the 16 th pin of the MCU module is connected with one end of a resistor R22 and an SDA pin of a second electrical interface J2, and the other end of the resistor R22 is connected with 3.3V voltage; the 13 th pin of the MCU module is connected with one end of a resistor R23 and an SCL pin of a second electrical interface J2, and the other end of the resistor R23 is connected with 3.3V voltage; a 22 th pin of the MCU module is connected with one end of a resistor R11 and a MODSELL pin of a first electrical interface J1, and the other end of the resistor R11 is connected with 3.3V voltage; the 18 th pin of the MCU module is connected with one end of a resistor R21 and a Mod _ ABS pin of a second electrical interface J2, and the other end of the resistor R21 is connected with 3.3V voltage; the 5 th pin of the MCU module is connected with a RESET pin of the first electrical interface J1.

And a VDD pin of the MCU module is connected with 3.3V voltage and one end of a capacitor C4, and the other end of the capacitor C4 is grounded. And the GND pin of the MCU module is grounded.

The utility model also discloses an all-in-one converter that uses low-speed optical module on high-speed switch, including unlocking device and base and upper cover, the base is fixedly connected with the upper cover to form the casing, the electronic equipment is fixed between the base and the upper cover, the afterbody of the upper cover is connected with the hasp sheet metal component in a clamping manner for locking the optical module inserted into the converter; the outer wall of the shell is provided with a sliding groove used for being in sliding fit with the unlocking device, the unlocking device is in sliding fit and limited in the sliding groove formed in the outer wall of the shell, the side wall of the unlocking device is provided with an unlocking portion used for enabling the corresponding cage elastic sheet to be separated from the converter to be bounced, and the base is provided with a spring and used for providing resetting force for the unlocking device.

The unlocking device comprises an unlocking seat and a pull belt or a pull ring connected with the unlocking seat, the unlocking seat comprises two parallel side plates and a bottom plate fixed between the two parallel side plates, the left side plate and the right side plate of the unlocking seat are provided with an upper bulge extending upwards and a lower bulge extending downwards, the base is provided with a limiting groove corresponding to the lower bulge of the left side plate and the right side plate of the unlocking device, the upper cover is provided with a limiting groove corresponding to the upper bulge of the left side plate and the right side plate of the unlocking device, the lower bulge of the left side plate and the right side plate of the unlocking device extends into the limiting groove corresponding to the base, and the upper bulge of the left side plate and the right side plate of the unlocking seat extends into the limiting groove corresponding to the upper cover, so that the unlocking seat has a certain degree of freedom; the ends of the left side plate and the right side plate of the unlocking seat are provided with outward bent parts to form unlocking parts for separating the corresponding cage elastic pieces from the converter to bounce; the lower terminal surface of base is equipped with the spring mounting recess, is equipped with the spring in the spring mounting recess, the bottom plate of unblock seat is located spring mounting recess below, supporting spring, the bottom plate of unblock seat is equipped with the spring catch that upwards extends, spring catch on the bottom plate of unblock seat stretches into the spring mounting recess of terminal surface under the base in, contacts with the spring one end in the spring mounting recess, makes the spring provide the power that resets for unlocking device.

The transversal U type of personally submitting of hasp sheet metal component, the outer wall is equipped with the joint boss about the upper cover afterbody, the lateral wall is equipped with the bayonet socket about the hasp sheet metal component for with the joint boss joint cooperation that the upper cover afterbody was equipped with.

The base is clamped with the tail end of the upper cover, and the base is fixedly connected with the head end of the upper cover through a bolt; the heads of the base and the upper cover are respectively provided with corresponding bolt mounting holes.

The electronic device is provided with the first electrical interface J1 (golden finger part), the second electrical interface J2 (golden finger part), the MCU module and the signal conversion circuit. The electronic equipment comprises a PCB and a connector for plugging the optical module, wherein the PCB is electrically connected with the connector. The PCB board comprises a golden finger part, an MCU module and a signal conversion circuit.

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model discloses to the inconvenient problem of conversion, design a equipment that directly is used for 100G switch port switching 25G optical module, can satisfy the optical module of lower speed simultaneously. Because the 100G/40G module has four channels, the first channel is selected as an effective signal channel, and other channels do not transmit signals, so that the bidirectional conversion between the four-channel high-speed switch and the single-channel optical module is realized. The module transmits signals to achieve a switching function, bidirectional conversion of the signals from the high-speed switch to the low-speed optical module and from the low-speed optical module to the high-speed switch is achieved, the MCU is integrated in the device, and EEPROM information in the optical module can be read and written. And can define the high 128 bytes content of EEPROM, PAGE00 in the converter MCU. And the priority of the area of the converter is higher than that of the area of the optical module. By this design, address conflicts between the converter and the module are avoided. By reading the information of the EEPROM inside the converter, the contents of 128 bytes in the PAGE00 can be read out no matter whether the converter is inserted into a 25G/10G module or not. So that a series of information of the type of the converter, the SN number, the manufacturer, etc. can be distinguished. When the converter is connected with the 10G/25G optical module at one section and the switch at one end, and works normally, the MCU of the converter can download information of other areas of the optical module to the local, so that the information of other areas of the module can be read normally from the direction of the switch. When the optical module is pulled out, the information of the areas is completely cleared, so that the misjudgment of an operator is prevented, and the designs are more convenient for the operator to use.

Drawings

Fig. 1 is a schematic block diagram of a converter according to the present invention;

fig. 2 is a schematic circuit diagram of the gold finger portion (the first electrical interface J1, the second electrical interface J2) of the converter according to the present invention;

fig. 3 is a circuit diagram of the communication between the converter MCU and I2C according to the present invention;

fig. 4 is a circuit diagram of a first conversion circuit of the present invention;

fig. 5 is a circuit diagram of a second conversion circuit of the present invention;

fig. 6 is a circuit diagram of a third conversion circuit of the present invention;

fig. 7 is a part view of the converter of the present invention;

fig. 8 is an assembly view of the converter of the present invention;

fig. 9 is a top view of fig. 8.

In the attached drawings, 1 is a base, 11 is a spring mounting groove, 12 is a limiting groove of the base, 2 is an upper cover, 21 is a clamping boss, 22 is a limiting groove of the upper cover, 3 is a lock catch sheet metal part, 31 is a bayonet, 32 is an elastic sheet, 4 is an unlocking device, 41 is an upper bulge, 42 is a lower bulge, 43 is an unlocking part, 44 is a spring catch, 45 is a draw belt, 5 is a spring, 6 is a PCB (printed Circuit Board), 7 is a connector, 8 is an optical module, and 9 is a screw.

Detailed Description

The technical solutions in the embodiments of the present invention are described below clearly and completely, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1 to 6, the present invention discloses an all-in-one converter using low-speed optical modules on a high-speed switch, including a first electrical interface J1 and a second electrical interface J2, where the first electrical interface J1 is used for connecting with a four-channel high-speed switch such as a 100G or 40G switch, and is used for realizing bidirectional transmission of signals from the switch to the converter; the second electrical interface J2 is used for connecting with a single-channel optical module, such as a 25G or 10G optical module, and is used for realizing bidirectional transmission of signals from the converter to the optical module; one channel of the first electrical interface J1 is correspondingly connected with the second electrical interface J2, and is used as an effective signal channel for signal transmission, and other channels of the first electrical interface J1 do not transmit signals; the remaining channels of this example were connected with a 100ohm resistor, which is equivalent to no use. And other control and indication signals are normally connected. The definition of golden finger conforms to MSA multi-source agreement.

An MCU module is arranged between the first electrical interface J1 and the second electrical interface J2, an SDA pin and an SCL pin of the first electrical interface J1 are correspondingly connected with the MCU module, an SDA pin and an SCL pin of the second electrical interface J2 are correspondingly electrically connected with the MCU module, and the MCU module is used for realizing the conversion of I2C communication between the first electrical interface J1 and the second electrical interface J2; a first input end of the MCU module is connected to a MODSELL pin of the first electrical interface J1, and is configured to collect an enable signal that allows I2C communication; MODSELL is a low enable pin that when low allows I2C communication.

A signal conversion circuit is connected between the first electrical interface J1 and the second electrical interface J2, and is used for realizing conversion of reported signals, so that the signals of the first electrical interface J1 and the second electrical interface J2 all meet respective protocol requirements.

And a second input end of the MCU module is connected with a Mod _ ABS pin of the second electrical interface J2. The Mod _ ABS pin of the second electrical interface J2 is connected with the MODPRSL pin of the first electrical interface J1. One path of Mod _ ABS pin is connected to MCU to judge whether 25G module is inserted into the converter, and the other path is directly connected with MODPRSL of golden finger of 100G switch to judge whether optical module is inserted into the converter. The MCU EEPROM stores the customer-defined high 128 bits of Page00 information. Information to Page00 is available whether or not an SFP module is inserted. When the SFP28 module is inserted, the information of other areas of the module can be read; when the module is unplugged, these regions are all set to FF or 00.

And a third input end of the MCU module is connected to a RESET pin of the first electrical interface J1, and is configured to collect a RESET signal of the optical module, and after receiving the RESET signal, the MCU initializes all internal information to an original value. The RESET pin of the QSFP28 is connected to the RESET pin of the MCU in one path, and when the optical module needs to be RESET, the information related to the MCU is also RESET, so that the MCU information and the optical module information are kept consistent.

The MCU module adopts a chip with the model number of EFM8 LB; the 24 th pin of the MCU module is connected with one end of a resistor R7 and an SDA pin of a first electrical interface J1, and the other end of the resistor R7 is connected with 3.3V voltage; the 23 rd pin of the MCU module is connected with one end of a resistor R10 and an SCL pin of a first electrical interface J1, and the other end of the resistor R10 is connected with 3.3V voltage; the 16 th pin of the MCU module is connected with one end of a resistor R22 and an SDA pin of a second electrical interface J2, and the other end of the resistor R22 is connected with 3.3V voltage; the 13 th pin of the MCU module is connected with one end of a resistor R23 and an SCL pin of a second electrical interface J2, and the other end of the resistor R23 is connected with 3.3V voltage; a 22 th pin of the MCU module is connected with one end of a resistor R11 and a MODSELL pin of a first electrical interface J1, and the other end of the resistor R11 is connected with 3.3V voltage; the 18 th pin of the MCU module is connected with one end of a resistor R21 and a Mod _ ABS pin of a second electrical interface J2, and the other end of the resistor R21 is connected with 3.3V voltage; and a 5 th pin of the MCU module is connected with a RESET pin of the first electrical interface J1 and one end of a resistor R24, and the other end of the resistor R24 is connected with a 6 th pin of the MCU module. The resistor R24 of the present embodiment is 0ohm resistor.

Because the reported information definitions of the 100G/40G optical module and the 25G/10G optical module are different, the logic conversion is required to be carried out by using the MOSFET.

The signal conversion circuit comprises a first conversion circuit, a second conversion circuit and a third conversion circuit, wherein the input end of the first conversion circuit is connected with a RESET pin of a first electrical interface J1, and the output end of the first conversion circuit is connected with a TX _ DISABLE pin of a second electrical interface J2; two input ends of the second conversion circuit are connected with an LPMODE pin of the first electrical interface J1, and two output ends of the second conversion circuit are respectively connected with an RS0 pin and an RS1 pin of the second electrical interface J2; two input ends of the third conversion circuit are respectively connected with a TX _ FAULT pin and an RX _ LOS pin of the second electrical interface J2, and an output end of the third conversion circuit is connected with an INTL pin of the first electrical interface J1.

The signal conversion circuit mainly uses an MOS tube as a component, and has the main functions that the signal conversion circuit is provided with three electrodes: a source S, a drain D and a gate G. The grid voltage is used for controlling the drain-source current to realize level conversion. And through each PIN of the chip, the DDM related report of the optical module is led out.

The first conversion circuit comprises a MOS tube Q7, the grid electrode of the MOS tube Q7 is connected with one end of a resistor R17 and a RESET pin of a first electrical interface J1, the drain electrode of the MOS tube Q7 is connected with one end of a resistor R18 and a TX _ DISABLE pin of a second electrical interface J2, the other end of the resistor R17 and the other end of the resistor R18 are connected with 3.3V voltage and one end of a capacitor C6, the other end of the capacitor C6 is grounded, and the source electrode of the MOS tube Q7 is grounded. The first switching circuit is used for switching the reset signal.

The second conversion circuit comprises a MOS tube Q8, the grid of the MOS tube Q8 is connected with one end of a resistor R19 and an LPMODE pin of a first electrical interface J1, the drain of the MOS tube Q8 is connected with one end of a resistor R20 and an RS0 pin of a second electrical interface J2, the other end of the resistor R19 and the other end of a resistor R20 are connected with 3.3V voltage and one end of a capacitor C7, the other end of the capacitor C7 is grounded, and the source of the MOS tube Q8 is grounded. The second conversion circuit is used for conversion of the rate selection signal.

The LPMODE signal is converted into an RS0 signal through an NOT gate, and the LPMODE signal is converted into an RS1 signal without level transition, but passes through a MOS tube in order to keep consistent time delay. This completes the conversion of the rate selection signal.

The second conversion circuit comprises a MOS tube Q9, the grid of the MOS tube Q9 is connected with the LPMODE pin of the first electrical interface J1, the drain of the MOS tube Q9 is connected with one end of a resistor R16 and the RS1 pin of the second electrical interface J2, the other end of the resistor R16 is connected with one end of a 3.3V voltage and a capacitor C8, the other end of the capacitor C8 is grounded, and the source of the MOS tube Q9 is grounded.

The third conversion circuit comprises a MOS transistor Q6 and a MOS transistor Q10, a gate of the MOS transistor Q6 is connected with one end of a resistor R13 and a TX _ FAULT pin of a second electrical interface J2, a gate of the MOS transistor Q10 is connected with one end of a resistor R15 and an RX _ LOS pin of the second electrical interface J2, a drain of the MOS transistor Q6 and a drain of the MOS transistor Q10 are connected with one end of the resistor R14 and an INTL pin of the first electrical interface J1, the other end of the resistor R13, the other end of the resistor R14 and the other end of the resistor R15 are connected with 3.3V voltage and one end of a capacitor C5, the other end of the capacitor C5 is grounded, and a source of the MOS transistor Q6 and a source of the MOS transistor Q10 are grounded.

When either TX _ FAULT, RX _ LOS is high, the INTL signal is high, which is equivalent to a nor gate, for switching the interrupt signal.

According to SFP + or SFP 28A 0H byte 110, bit 1and bit 2 can distinguish which one specifically caused the occurrence of QSFP28/QSFP + INTL.

Address A0H area, 110 bytes, 1, 2 bits, contents of SFF8472 protocol

The embodiment also discloses the following scheme as a preferred scheme: the MCU module is used for reading and writing EEPROM information in the optical module through the second electrical interface J2, distinguishing the type, SN number and a series of information of manufacturers of the converter, and reading the information of the EEPROM in the converter MCU through the first electrical interface J1 and transmitting the information to the switch.

The patent provides a scheme for using a 25G optical module on a 100G switch, and can simultaneously meet the requirement that a 10G optical module is used on a 40G switch. Through the design of the high-speed differential wire and the use of the SFP socket plated with nickel and gold, the requirements of high-speed signal transmission are met, and the problem of transmitting low-speed signals is naturally solved. The first electrical interface 100G/40G switch of the converter is connected, meets the requirements of SFF-8636 protocol, and realizes the bidirectional transmission of signals from the switch to the converter. The second electrical interface of the converter is connected to the optical module, which enables the bi-directional transmission of the module from the converter to the optical module. The converter has unique circuit design inside, and the signal converting circuit makes the signals of the two electric interfaces meet the requirement of their own protocol. MCU has been integrated to this converter inside, can read out the inside EEPROM information of module for this converter does benefit to personnel's use more.

Referring to fig. 7 to 9, the embodiment further discloses an all-in-one converter using a low-rate optical module on a high-rate switch, which includes an unlocking device, a base and an upper cover, wherein the base is fixedly connected with the upper cover to form a housing, the electronic device is fixed between the base and the upper cover, and a latch sheet metal part is clamped on a tail of the upper cover and used for locking the optical module inserted into the converter; the outer wall of the shell is provided with a sliding groove used for being in sliding fit with the unlocking device, the unlocking device is in sliding fit and limited in the sliding groove formed in the outer wall of the shell, the side wall of the unlocking device is provided with an unlocking portion used for enabling the corresponding cage elastic sheet to be separated from the converter to be bounced, and the base is provided with a spring and used for providing resetting force for the unlocking device.

The unlocking device comprises an unlocking seat and a pull belt or a pull ring connected with the unlocking seat, the unlocking seat comprises two parallel side plates and a bottom plate fixed between the two parallel side plates, the left side plate and the right side plate of the unlocking seat are symmetrically provided with an upper protrusion extending upwards and a lower protrusion extending downwards, the base is provided with a limiting groove corresponding to the lower protrusion of the left side plate and the right side plate of the unlocking device, the upper cover is provided with a limiting groove corresponding to the upper protrusion of the left side plate and the right side plate of the unlocking device, the lower protrusions of the left side plate and the right side plate of the unlocking device extend into the limiting groove corresponding to the base, and the upper protrusions of the left side plate and the right side plate of the unlocking seat extend into the limiting groove corresponding to the upper cover, so that the unlocking seat has a certain degree of freedom; the ends of the left side plate and the right side plate of the unlocking seat are provided with outward bent parts to form unlocking parts for separating the corresponding cage elastic pieces from the converter to bounce; the lower terminal surface of base is equipped with the spring mounting recess, is equipped with the spring in the spring mounting recess, the bottom plate of unblock seat is located spring mounting recess below, supporting spring, the bottom plate of unblock seat is equipped with the spring catch that upwards extends, spring catch on the bottom plate of unblock seat stretches into the spring mounting recess of terminal surface under the base in, contacts with the spring one end in the spring mounting recess, makes the spring provide the power that resets for unlocking device.

The pull belt of this embodiment is fixedly connected with the bottom plate of unblock seat. The bottom plate of the unlocking seat is provided with a mounting hole for mounting the drawstring, the bottom of the drawstring is provided with a U-shaped groove, the drawstring is inserted into the mounting hole at the bottom, and the U-shaped groove can be occluded with the cross beam at the edge of the bottom plate to complete the fixation. The base is provided with a groove for the installation of the drawstring to yield.

The transversal U type of personally submitting of hasp sheet metal component, the outer wall is equipped with the joint boss about the upper cover afterbody, the lateral wall is equipped with the bayonet socket about the hasp sheet metal component for with the joint boss joint cooperation that the upper cover afterbody was equipped with. The lock catch sheet metal part is provided with an elastic sheet, and the elastic sheet is also provided with a bayonet which is used for being matched with the bulge of the optical module inserted into the converter to lock the optical module inserted into the converter.

The base is clamped with the tail end of the upper cover, and the base is fixedly connected with the head end of the upper cover through a screw; the heads of the base and the upper cover are respectively provided with corresponding mounting holes.

The electronic device is provided with the first electrical interface J1 (golden finger part), the second electrical interface J2 (golden finger part), the MCU module and the signal conversion circuit. The electronic equipment comprises a PCB and a connector for plugging the optical module, wherein the PCB is electrically connected with the connector. The PCB board comprises a golden finger part, an MCU module and a signal conversion circuit. This patent has adopted a flat connector, reduces the loss of signal of telecommunication when the conversion, also can practice thrift the inside space of converter. The high-speed line adopts a wiring mode of a differential line, so that the loss of signals on the transmission line is reduced.

The base and the upper cover can be made of zinc alloy materials. The locking sheet metal part can be made of stainless steel materials.

In a specific implementation process, when the converter is connected with the external optical module, after the external optical module is inserted into the converter, the external optical module is automatically locked by the elastic sheet of the lock catch sheet metal part at the tail part of the converter through the unlocking piece. During the unblock, pulling optical module pull ring rotates 90, promotes the unblock key (have the spring to withstand), and the unblock key has an oblique angle, slowly jacks up the panel beating hasp on the converter, and hasp sheet metal component shell fragment automatic tripping realizes the unblock function.

When the converter is connected with the switch interface and the converter is inserted into the switch (corresponding cage), the cage spring plate is buckled into the converter structure and is clamped and locked. When unlocking, the pull belt of the unlocking device of the converter is pulled, so that the cage elastic sheet is separated from the adapter to bounce, and the unlocking function is realized.

The first electrical interface is generally a Quad Small Form-factor plug 28Gbps (QSFP28) interface, and simultaneously meets the requirement of the Quad Small Form-factor plug (QSFP +) interface. The second electrical interface is usually a Small Form Factor plug 28Gbps (SFP28) interface, and simultaneously satisfies a 10Gigabit Small Form Factor plug (SFP +) interface.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The all-in-one converter using the low-speed optical module on the high-speed switch is characterized by comprising a first electrical interface J1 and a second electrical interface J2, wherein the first electrical interface J1 is used for being connected with a four-channel high-speed switch and used for realizing bidirectional transmission of signals from the switch to the converter; the second electrical interface J2 is used for connecting with a single-channel optical module, and is used for realizing bidirectional transmission of signals from the converter to the optical module; one channel of the first electrical interface J1 is correspondingly connected with the second electrical interface J2, and is used as an effective signal channel for signal transmission, and other channels of the first electrical interface J1 do not transmit signals; an MCU module is arranged between the first electrical interface J1 and the second electrical interface J2, an SDA pin and an SCL pin of the first electrical interface J1 are correspondingly connected with the MCU module, an SDA pin and an SCL pin of the second electrical interface J2 are correspondingly electrically connected with the MCU module, and the MCU module is used for realizing the conversion of I2C communication between the first electrical interface J1 and the second electrical interface J2; a first input end of the MCU module is connected to a MODSELL pin of the first electrical interface J1, and is configured to collect an enable signal that allows I2C communication; a signal conversion circuit is connected between the first electrical interface J1 and the second electrical interface J2, and is used for realizing conversion of reported signals, so that the signals of the first electrical interface J1 and the second electrical interface J2 all meet respective protocol requirements.

2. The all-in-one converter using low-rate optical modules on a high-rate switch according to claim 1, wherein: and a third input end of the MCU module is connected to a RESET pin of the first electrical interface J1, and is configured to collect a RESET signal of the optical module, and after receiving the RESET signal, the MCU initializes all internal information to an original value.

3. The all-in-one converter using low-rate optical modules on a high-rate switch according to claim 1, wherein: the Mod _ ABS pin of the second electrical interface J2 is connected to the MODPRSL pin of the first electrical interface J1, and is used for the switch to determine whether the optical module is inserted.

4. The all-in-one converter using low-rate optical modules on a high-rate switch according to claim 1, wherein: the signal conversion circuit comprises a first conversion circuit, the first conversion circuit comprises a MOS tube Q7, the grid electrode of the MOS tube Q7 is connected with one end of a resistor R17 and a RESET pin of a first electrical interface J1, the drain electrode of the MOS tube Q7 is connected with one end of a resistor R18 and a TX _ DISABLE pin of a second electrical interface J2, the other end of the resistor R17 and the other end of the resistor R18 are connected with one end of a 3.3V voltage and a capacitor C6, the other end of the capacitor C6 is grounded, and the source electrode of the MOS tube Q7 is grounded.

5. The all-in-one converter using low-rate optical modules on a high-rate switch according to claim 1, wherein: the signal conversion circuit comprises a second conversion circuit, the second conversion circuit comprises a MOS tube Q8, the grid electrode of the MOS tube Q8 is connected with one end of a resistor R19 and an LPMODE pin of a first electrical interface J1, the drain electrode of the MOS tube Q8 is connected with one end of a resistor R20 and an RS0 pin of a second electrical interface J2, the other end of the resistor R19 and the other end of a resistor R20 are connected with one end of a 3.3V voltage and a capacitor C7, the other end of the capacitor C7 is grounded, and the source electrode of the MOS tube Q8 is grounded; the second conversion circuit further comprises a MOS tube Q9, the grid of the MOS tube Q9 is connected with the LPMODE pin of the first electrical interface J1, the drain of the MOS tube Q9 is connected with one end of a resistor R16 and the RS1 pin of the second electrical interface J2, the other end of the resistor R16 is connected with one end of a 3.3V voltage and a capacitor C8, the other end of the capacitor C8 is grounded, and the source of the MOS tube Q9 is grounded.

6. The all-in-one converter using low-rate optical modules on a high-rate switch according to claim 1, wherein: the signal conversion circuit comprises a third conversion circuit, the third conversion circuit comprises a MOS tube Q6 and a MOS tube Q10, the grid of the MOS tube Q6 is respectively connected with one end of a resistor R13 and a TX _ FAULT pin of a second electrical interface J2, the grid of the MOS tube Q10 is respectively connected with one end of a resistor R15 and an RX _ LOS pin of a second electrical interface J2, the drain of the MOS tube Q6 and the drain of the MOS tube Q10 are respectively connected with one end of the resistor R14 and an INTL pin of a first electrical interface J1, the other end of the resistor R13, the other end of the resistor R14 and the other end of the resistor R15 are connected with a 3.3V voltage and one end of a capacitor C5, the other end of the capacitor C5 is grounded, and the source of the MOS tube Q6 and the source of the MOS tube Q10 are grounded.

7. The all-in-one converter using low-rate optical modules on a high-rate switch according to claim 1, wherein: the MCU module is used for reading and writing EEPROM information in the optical module through a second electrical interface J2, distinguishing the type, SN number and a series of information of manufacturers of the converter, and reading the information of the EEPROM in the converter MCU through a first electrical interface J1 and transmitting the information to the switch; the second input end of the MCU module is connected to the Mod _ ABS pin of the second electrical interface J2, and is used to determine whether the optical module is inserted into the converter.

8. The all-in-one converter using low-rate optical modules on a high-rate switch according to claim 1 or 7, wherein: the MCU module adopts a chip with the model number of EFM8 LB; the 24 th pin of the MCU module is connected with one end of a resistor R7 and an SDA pin of a first electrical interface J1, and the other end of the resistor R7 is connected with 3.3V voltage; the 23 rd pin of the MCU module is connected with one end of a resistor R10 and an SCL pin of a first electrical interface J1, and the other end of the resistor R10 is connected with 3.3V voltage; the 16 th pin of the MCU module is connected with one end of a resistor R22 and an SDA pin of a second electrical interface J2, and the other end of the resistor R22 is connected with 3.3V voltage; the 13 th pin of the MCU module is connected with one end of a resistor R23 and an SCL pin of a second electrical interface J2, and the other end of the resistor R23 is connected with 3.3V voltage; a 22 th pin of the MCU module is connected with one end of a resistor R11 and a MODSELL pin of a first electrical interface J1, and the other end of the resistor R11 is connected with 3.3V voltage; the 18 th pin of the MCU module is connected with one end of a resistor R21 and a Mod _ ABS pin of a second electrical interface J2, and the other end of the resistor R21 is connected with 3.3V voltage; the 5 th pin of the MCU module is connected with a RESET pin of the first electrical interface J1.

9. An all-in-one converter using a low-rate optical module on a high-rate switch is characterized by comprising an unlocking device, a base and an upper cover, wherein the base is fixedly connected with the upper cover to form a shell; the outer wall of the shell is provided with a sliding groove used for being in sliding fit with the unlocking device, the unlocking device is in sliding fit and limited in the sliding groove formed in the outer wall of the shell, the side wall of the unlocking device is provided with an unlocking portion used for enabling the corresponding cage elastic sheet to be separated from the converter to be bounced, and the base is provided with a spring and used for providing resetting force for the unlocking device.

10. The all-in-one converter using low-rate optical modules on a high-rate switch according to claim 9, wherein: the unlocking device comprises an unlocking seat and a pull belt or a pull ring connected with the unlocking seat, the unlocking seat comprises two parallel side plates and a bottom plate fixed between the two parallel side plates, the left side plate and the right side plate of the unlocking seat are provided with an upper bulge extending upwards and a lower bulge extending downwards, the base is provided with a limiting groove corresponding to the lower bulge of the left side plate and the right side plate of the unlocking device, the upper cover is provided with a limiting groove corresponding to the upper bulge of the left side plate and the right side plate of the unlocking device, the lower bulge of the left side plate and the right side plate of the unlocking device extends into the limiting groove corresponding to the base, and the upper bulge of the left side plate and the right side plate of the unlocking seat extends into the limiting groove corresponding to the upper cover, so that the unlocking seat has freedom degree under; the ends of the left side plate and the right side plate of the unlocking seat are provided with outward bent parts to form unlocking parts for separating the corresponding cage elastic pieces from the converter to bounce; the lower terminal surface of base is equipped with the spring mounting recess, is equipped with the spring in the spring mounting recess, the bottom plate of unblock seat is located spring mounting recess below, supporting spring, the bottom plate of unblock seat is equipped with the spring catch that upwards extends, spring catch on the bottom plate of unblock seat stretches into the spring mounting recess of terminal surface under the base in, contacts with the spring one end in the spring mounting recess, makes the spring provide the power that resets for unlocking device.

11. The all-in-one converter using low-rate optical modules on a high-rate switch according to claim 9, wherein: the transversal U type of personally submitting of hasp sheet metal component, the outer wall is equipped with the joint boss about the upper cover afterbody, the lateral wall is equipped with the bayonet socket about the hasp sheet metal component for with the joint boss joint cooperation that the upper cover afterbody was equipped with.