CN210806213U - RJ45 paster capacitor terminal need not to weld ground structure - Google Patents

Abstract

The utility model discloses a RJ45 paster capacitor terminal without welding a grounding structure, which comprises an insulating body, a shielding shell, a PCB, a capacitor terminal and a paster capacitor; the shielding shell is covered on the insulating body, and a contact elastic sheet is bent inwards and extends from one edge of a slotted hole of the shielding shell; the PCB is provided with a capacitor pad, a welding hole and a grounding circuit; the capacitor terminal comprises a fixed end, a first connecting end and a second connecting end which are integrally formed, and the second connecting end is elastically extruded to interfere with the contact elastic sheet to be in contact conduction; the chip capacitor is arranged on the PCB. One edge through the slotted hole is inwards bent and is extended to have a contact shell fragment to cooperation second link is interfered the contact with contact shell fragment elasticity extrusion and is switched on, makes the electric capacity terminal need not just can be connected with shielding shell through the welding, thereby reaches the purpose of paster electric capacity ground connection, not only saves the preparation time, conveniently dismantles shielding shell behind the discovery defective products in addition, and the processing procedure is also simpler.

Description

RJ45 paster capacitor terminal need not to weld ground structure

Technical Field

The utility model relates to a RJ45 socket connector field technique especially indicates a RJ45 paster electric capacity terminal need not to weld the ground structure.

Background

The RJ45 plug is also called RJ45 crystal plug, and is used for the connection of data cable, realizes the connection and change between equipment and distribution frame module, and the shielding case of RJ45 connector needs the ground connection just can play the effect that prevents the radiation and exceed standard, and ground connection is through paster electric capacity ground connection best, and electric capacity can play the effect of high frequency bypass, if direct ground connection, the earth connection high frequency reactance is very high, can outwards emit the interference through the space.

Present paster electric capacity ground structure generally is for connecting the PCB board through paster electric capacity, and the PCB board is connected to the electric capacity terminal simultaneously, and passes the electric capacity hole of shielding shell, then fix the electric capacity terminal through the welded mode, and this kind of structure is not only long during the manufacturing process, and after finished product test or outward appearance discovery defective products, need disassemble and scrap the shielding shell, and maintain the electric capacity terminal, make the cost increase, and the processing procedure is loaded down with trivial details simultaneously, consequently, need do further improvement to current RJ45 structure.

SUMMERY OF THE UTILITY MODEL

In view of this, the present invention provides a RJ45 patch capacitor terminal without welding a grounding structure, which can effectively solve the problems of long manufacturing time, high maintenance cost and complex manufacturing process of the conventional RJ45 grounding structure.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a grounding structure of an RJ45 patch capacitor terminal without welding comprises an insulating body, a shielding shell, a PCB (printed Circuit Board), a capacitor terminal and a patch capacitor; the shielding shell is covered on the insulating body, an accommodating cavity is formed between the shielding shell and the insulating body, a slot hole is formed in the rear side wall of the shielding shell in a punching mode, and a contact elastic sheet extends from one edge of the slot hole in an inward bending mode; the PCB is arranged on the insulating body and positioned in the accommodating cavity, a capacitor bonding pad, a welding hole and a grounding circuit are arranged on the PCB, and the grounding circuit is connected between the capacitor bonding pad and the welding hole in a conduction mode; the capacitor terminal comprises a fixed end, a first connecting end and a second connecting end which are integrally formed, wherein the fixed end is fixed on the insulating body, the first connecting end is inserted into the welding hole and is welded and conducted, and the second connecting end is elastically extruded with the contact elastic sheet to be in interference contact and conduction; the chip capacitor is arranged on the PCB and is welded and conducted with the capacitor bonding pad.

As a preferred scheme, the rear side of the insulating body is integrally recessed inwards to form a positioning hole, the insulating body is recessed to form a guiding limiting groove, the guiding limiting groove is located outside the opening of the positioning hole, the contact elastic sheet corresponds to the guiding limiting groove in position and is embedded in the guiding limiting groove, and the fixed end is inserted into the positioning hole for fixing.

As a preferred scheme, the guide limiting groove is positioned below the outer side of the inlet of the positioning hole and is communicated with the positioning hole.

As a preferred scheme, the slot is located at the lower end of the rear side wall of the shielding shell, a grounding pin extends downwards from the shielding shell, the grounding pin is located right below the contact spring, a convex rib is formed on the surface of the contact spring, and the second connecting end abuts against and presses the convex rib of the contact spring.

Preferably, the PCB is located above the positioning hole.

As a preferred scheme, the first connecting end extends obliquely and backwards and upwards at the rear end of the fixed end, and the second connecting end extends horizontally and backwards at the rear end of the fixed end.

As a preferred scheme, the insulating body is made of plastic.

Compared with the prior art, the utility model obvious advantage and beneficial effect have, particularly, can know by above-mentioned technical scheme:

the rear side wall of the shielding shell is punched to form a slotted hole, one edge of the slotted hole is bent inwards to extend to form a contact elastic sheet, and the contact elastic sheet is extruded and interfered to be in contact conduction by matching the second connecting end with the contact elastic sheet, so that the capacitor terminal can be in conduction connection with the shielding shell without welding, the purpose of grounding the patch capacitor is achieved, the manufacturing time is saved, the shielding shell is convenient to detach after a defective product is found, the maintenance cost is lower, and the manufacturing process is simpler.

To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.

Drawings

FIG. 1 is a schematic perspective view of a preferred embodiment of the present invention;

FIG. 2 is an exploded view of the preferred embodiment of the present invention;

FIG. 3 is a schematic cross-sectional view of a preferred embodiment of the present invention;

fig. 4 is a schematic cross-sectional view of another embodiment of the present invention.

The attached drawings indicate the following:

10. insulation body 11, positioning hole

12. Guide limiting groove 20 and shielding shell

21. Containing cavity 22, slotted hole

23. Contact spring 231, convex rib

24. Grounding pin 30 and PCB

31. Capacitor bonding pad 32 and bonding hole

33. Grounding line 40 and capacitor terminal

41. Fixed end 42 and first connection end

43. Second link 50, patch capacitor.

Detailed Description

Referring to fig. 1 to 4, a specific structure of a preferred embodiment of the present invention is shown, which includes an insulating body 10, a shielding case 20, a PCB 30, a capacitor terminal 40 and a chip capacitor 50.

The insulation body 10 is made of plastic material, a positioning hole 11 is integrally formed in the rear side surface of the insulation body 10 in a concave manner, a guiding limiting groove 12 is concavely formed in the insulation body 10, the guiding limiting groove 12 is located outside an opening of the positioning hole 11, in this embodiment, the guiding limiting groove 12 is located below an outer side of an entrance of the positioning hole 11, and the guiding limiting groove 12 is communicated with the positioning hole 11.

The shielding shell 20 is covered on the insulating body 10, an accommodating cavity 21 is formed between the shielding shell 20 and the insulating body 10, a slot 22 is punched on the rear side wall of the shielding shell 20, a contact elastic sheet 23 extends from an edge of the slot 22 by bending inwards, the contact elastic sheet 23 corresponds to the position of the guide limiting groove 12 and is embedded in the guide limiting groove 12, and a grounding pin 24 extends downwards integrally from the shielding shell 20.

The PCB 30 is disposed on the insulating body 10 and located in the accommodating cavity 21, the PCB 30 has a capacitor pad 31, a solder hole 32 and a ground line 33, and the ground line 33 is conductively connected between the capacitor pad 31 and the solder hole 32; in the present embodiment, the PCB board 30 is located above the positioning hole 11.

The capacitor terminal 40 includes a fixed end 41, a first connecting end 42 and a second connecting end 43, which are integrally formed, the fixed end 41 is fixed on the insulating body 10, the first connecting end 42 is inserted into the welding hole 32 for welding conduction, and the second connecting end 43 is elastically extruded to interfere with the contact spring 23 for contact conduction.

The chip capacitor 50 is disposed on the PCB 30 and is soldered to the capacitor pad 31.

Detailed description the utility model discloses a manufacture process as follows:

during manufacturing, the chip capacitor 50 is welded and fixed on the capacitor pad 31 on the PCB 30, the capacitor terminal 40 is fixed on the insulating body 10, the PCB 30 is fixed on the insulating body 10, the first connection end 42 of the capacitor terminal 40 passes through the welding hole 32 and is welded and fixed, the grounding circuit 33 is connected with the first connection end 42 in a conduction mode, the shielding shell 20 is covered on the insulating body 10, and after the chip is installed in place, the contact elastic sheet 23 and the second connection end 43 are elastically extruded, interfered, contacted and conducted.

In the using process, the patch capacitor 50 is connected to the external circuit in sequence through the grounding circuit 33, the first connection end 42, the second connection end 43, the contact spring 23 and the grounding pin 24 to achieve grounding conduction.

The utility model discloses a design focus lies in: the rear side wall of the shielding shell is punched to form a slotted hole, one edge of the slotted hole is bent inwards to extend to form a contact elastic sheet, and the contact elastic sheet is extruded and interfered to be in contact conduction by matching the second connecting end with the contact elastic sheet, so that the capacitor terminal can be in conduction connection with the shielding shell without welding, the purpose of grounding the patch capacitor is achieved, the manufacturing time is saved, the shielding shell is convenient to detach after a defective product is found, the maintenance cost is lower, and the manufacturing process is simpler.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.

Claims (7)

1. The utility model provides a RJ45 paster electric capacity terminal need not to weld ground structure which characterized in that: the PCB comprises an insulating body, a shielding shell, a PCB, a capacitor terminal and a chip capacitor; the shielding shell is covered on the insulating body, an accommodating cavity is formed between the shielding shell and the insulating body, a slot hole is formed in the rear side wall of the shielding shell in a punching mode, and a contact elastic sheet extends from one edge of the slot hole in an inward bending mode; the PCB is arranged on the insulating body and positioned in the accommodating cavity, a capacitor bonding pad, a welding hole and a grounding circuit are arranged on the PCB, and the grounding circuit is connected between the capacitor bonding pad and the welding hole in a conduction mode; the capacitor terminal comprises a fixed end, a first connecting end and a second connecting end which are integrally formed, wherein the fixed end is fixed on the insulating body, the first connecting end is inserted into the welding hole and is welded and conducted, and the second connecting end is elastically extruded with the contact elastic sheet to be in interference contact and conduction; the chip capacitor is arranged on the PCB and is welded and conducted with the capacitor bonding pad.

2. The RJ45 patch capacitor terminal of claim 1, wherein the grounding structure is not soldered: the rear side surface of the insulating body is inwards integrally and concavely provided with a positioning hole, the insulating body is concavely provided with a guide limiting groove, the guide limiting groove is positioned at the outer side of the opening of the positioning hole, the contact elastic sheet corresponds to the guide limiting groove in position and is embedded in the guide limiting groove, and the fixed end is inserted into the positioning hole for fixing.

3. The RJ45 patch capacitor terminal of claim 2, wherein the grounding structure is not soldered: the guide limiting groove is located below the outer side of the inlet of the positioning hole and communicated with the positioning hole.

4. The RJ45 patch capacitor terminal of claim 1, wherein the grounding structure is not soldered: the slotted hole is positioned at the lower end of the rear side wall of the shielding shell, the shielding shell is further integrally extended downwards to form a grounding pin, the grounding pin is positioned under the contact elastic sheet, a convex rib is formed on the surface of the contact elastic sheet, and the second connecting end is abutted against and pressed on the convex rib of the contact elastic sheet.

5. The RJ45 patch capacitor terminal of claim 1, wherein the grounding structure is not soldered: the PCB is positioned above the positioning hole.

6. The RJ45 patch capacitor terminal of claim 1, wherein the grounding structure is not soldered: the first connecting end extends from the rear end of the fixed end to the rear upper side in an inclined mode, and the second connecting end extends from the rear end of the fixed end to the rear side horizontally.

7. The RJ45 patch capacitor terminal of claim 1, wherein the grounding structure is not soldered: the insulating body is made of plastic materials.

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