CN210805750U

CN210805750U - Chip packaging structure convenient for heat dissipation

Info

Publication number: CN210805750U
Application number: CN201922286210.2U
Authority: CN
Inventors: 魏进团
Original assignee: Shenzhen Aum Technology Co Ltd
Current assignee: Shenzhen Aum Technology Co Ltd
Priority date: 2019-12-18
Filing date: 2019-12-18
Publication date: 2020-06-19
Anticipated expiration: 2029-12-18

Abstract

The utility model discloses a chip package structure convenient to heat dissipation, including placing the board and placing the chamber, place fixedly connected with backup pad in the board, the side fixedly connected with slide bar of screw thread piece, fixedly connected with pin in the through-hole, it sets up in placing board center department to place the chamber. This chip packaging structure convenient to heat dissipation is provided with the block board, including metal sleeve, a spring, first metal sheet, the metal pole, the second metal sheet, promote the second metal sheet before the encapsulation, the second metal sheet passes through the spring that the metal pole made first metal sheet extrusion metal sleeve in, then place the chip in the block board, loosen the second metal sheet, the second metal sheet is laminated with the chip surface under the effect of spring, the heat that sends after the chip work passes through the second metal sheet, metal pole and first metal sheet pass away the heat, need not set up the louvre, not only be convenient for dispel the heat but also can effectively prevent that the dust from falling on the chip.

Description

Chip packaging structure convenient for heat dissipation

Technical Field

The utility model relates to an packaging structure technical field specifically is a chip packaging structure convenient to heat dissipation.

Background

The chip package is a package for mounting a semiconductor integrated circuit chip, plays a role in mounting, fixing, sealing, protecting the chip and enhancing the electric heating performance, and is also a bridge for communicating the internal world of the chip with an external circuit.

However, the existing chip packaging structure is inconvenient to disassemble the chip, workers are complex in operation when the chip packaging structure is assembled and disassembled, the chip is easy to damage, inconvenience is brought to people in use, most of the existing chip packaging structure is provided with heat dissipation holes, dust is easily accumulated in the chip, and the service life of the chip is shortened.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a chip packaging structure convenient to heat dissipation to solve the above-mentioned chip packaging structure on the current market that the background art provided and it is not convenient for dismantle the chip, workman not only complex operation when the installation is dismantled, damage the chip easily moreover, bring inconvenience for people's use, and current chip packaging structure most all sets up the louvre, lead to its inside easy deposition, reduced the problem of the working life of chip.

In order to achieve the above object, the utility model provides a following technical scheme: a chip packaging structure convenient for heat dissipation comprises a placing plate and a placing cavity, wherein a supporting plate is fixedly connected in the placing plate, a bearing is fixedly connected in the supporting plate, a rotating shaft is fixedly connected in the bearing, a knob is fixedly connected at one end of the rotating shaft, which penetrates through the bearing, and a bidirectional threaded rod is fixedly connected at the other end of the rotating shaft,

the bidirectional threaded rod is movably connected with a threaded block, a sliding rod is fixedly connected to the side face of the threaded block, the sliding rod is connected in the sliding groove in a clamped mode, one end, penetrating through the sliding groove, of the sliding rod is fixedly connected to the side face of the clamping plate, a through hole is formed in the clamping plate, a pin is fixedly connected to the inside of the through hole, and the placing cavity is formed in the center of the placing plate.

Preferably, the placing plate is of a double-layer structure, and the middle of the placing plate is fixedly connected with the supporting plate.

Preferably, the thread blocks, the slide rod, the clamping plate, the through holes and the pins are symmetrically arranged in two groups around the central axis of the bidirectional threaded rod.

Preferably, the side surface of the thread block is fixedly connected with a sliding rod, and the sliding rod is connected in the sliding groove in a clamping mode to form a sliding structure.

Preferably, the clamping plate comprises a metal sleeve, a spring, a first metal plate, a metal rod and a second metal plate, the metal sleeve is fixedly connected in the clamping plate, the spring is fixedly connected in the metal sleeve, the first metal plate is fixedly connected at the tail end of the spring, the metal rod is fixedly connected at the bottom surface of the first metal plate, and the second metal plate is fixedly connected at the tail end of the metal rod.

Preferably, three groups of the metal sleeve, the spring, the first metal plate, the metal rod and the second metal plate are fixedly connected inside the clamping plate at equal intervals.

Preferably, the first metal plate, the metal rod and the second metal plate are made of silver.

Compared with the prior art, the beneficial effects of the utility model are that: this chip package structure convenient to heat dissipation:

1. the two-way threaded rod and the two-way threaded block are arranged, the two groups of threaded blocks and the clamping plate are symmetrically arranged about the central axis of the two-way threaded rod, one side of a chip is placed in the clamping plate, then the knob is rotated, the knob rotates the two-way threaded rod under the action of the bearing and the rotating shaft, the threaded blocks on the two-way threaded rod move inwards, the clamping plate is driven to move inwards by the sliding rod while the threaded blocks move inwards, meanwhile, the knob on the other side is rotated, the other clamping plate can move inwards, the chip is packaged by the 2 clamping plates, the installation process is simplified, and the chip is convenient to detach;

2. the packaging structure is provided with a sliding rod and a sliding groove, the side surface of the thread block is fixedly connected with the sliding rod, the sliding rod is clamped and connected in the sliding groove to form a sliding structure, when the thread block drives the clamping plate to move inwards, the clamping plate is limited through the sliding rod and the sliding groove, the situation that the chip is broken due to the fact that the chip is shaken up and down after the 2 clamping plates package the chip is prevented, and the packaging structure is more stable;

3. be provided with the block board, including the metal sleeve, a spring, first metal sheet, the metal pole, the second metal sheet, promote the second metal sheet before the encapsulation, the second metal sheet makes the spring in the first metal sheet extrusion metal sleeve through the metal pole, then place the chip in the block board, loosen the second metal sheet, the second metal sheet is laminated with the chip surface under the effect of spring, the heat that sends after the chip work passes through the second metal sheet, metal pole and first metal sheet pass away the heat, need not set up the louvre, not only be convenient for dispel the heat but also can effectively prevent that the dust from falling on the chip.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic diagram of the structure of the placement plate of the present invention;

fig. 3 is a schematic diagram of the structure of the clamping plate of the present invention.

In the figure: 1. placing the plate; 2. a support plate; 3. a bearing; 4. a rotating shaft; 5. a knob; 6. a bidirectional threaded rod; 7. a thread block; 8. a slide bar; 9. a chute; 10. a clamping plate; 1001. a metal sleeve; 1002. a spring; 1003. a first metal plate; 1004. a metal rod; 1005. a second metal plate; 11. a through hole; 12. a pin; 13. a placement chamber.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a chip packaging structure convenient for heat dissipation comprises a placing plate 1, a supporting plate 2, a bearing 3, a rotating shaft 4, a knob 5, a bidirectional threaded rod 6, a threaded block 7, a sliding rod 8, a sliding groove 9, a clamping plate 10, a through hole 11, pins 12 and a placing cavity 13, wherein the supporting plate 2 is fixedly connected in the placing plate 1, the placing plate 1 is of a double-layer structure, the middle of the placing plate is fixedly connected with the supporting plate 2 to facilitate the placement of chips, the bearing 3 is fixedly connected in the supporting plate 2, the rotating shaft 4 is fixedly connected in the bearing 3, the knob 5 is fixedly connected at one end of the rotating shaft 4, which penetrates through the bearing 3, the bidirectional threaded rod 6 is fixedly connected at the other end of the,

the bidirectional threaded rod 6 is movably connected with a threaded block 7, the side surface of the threaded block 7 is fixedly connected with a slide rod 8, the slide rod 8 is clamped and connected in a sliding groove 9 to form a sliding structure, the situation that the chip is broken due to the fact that 2 clamping plates 10 shake up and down after packaging the chip is prevented, one end, penetrating through the sliding groove 9, of the slide rod 8 is fixedly connected to the side surface of the clamping plate 10, each clamping plate 10 comprises a metal sleeve 1001, a spring 1002, a first metal plate 1003, a metal rod 1004 and a second metal plate 1005, the metal sleeve 1001 is fixedly connected in each clamping plate 10, the spring 1002 is fixedly connected in each metal sleeve 1001, the tail end of each spring 1002 is fixedly connected with the first metal plate 1003, the bottom surface of each first metal plate 1003 is fixedly connected with the metal rod 1004, the first metal plate 1003, the metal rod 1004 and the second metal plate 1005 are made of silver, and the heat conduction performance, the tail end of the metal rod 1004 is fixedly connected with a second metal plate 1005, three groups of metal sleeves 1001, springs 1002, a first metal plate 1003, the metal rod 1004 and the second metal plate 1005 are fixedly connected inside the clamping plate 10, so that the chip is prevented from deviating in the moving process, a through hole 11 is formed in the clamping plate 10, a pin 12 is fixedly connected inside the through hole 11, two groups of screw blocks 7, a slide rod 8, the clamping plate 10, the through hole 11 and the pin 12 are symmetrically arranged about the central axis of the bidirectional threaded rod 6, so that the chip can be fixed in a placing cavity 13 through 2 clamping plates 10, and the placing cavity 13 is formed in the center of the placing plate 1.

The working principle is as follows: when the chip packaging structure convenient for heat dissipation is used, the device is simply understood, firstly, the second metal plate 1005 is pushed before packaging, the second metal plate 1005 enables the first metal plate 1003 to press the spring 1002 in the metal sleeve 1001 through the metal rod 1004, then the chip is placed in the clamping plate 10, the second metal plate 1005 is loosened, the second metal plate 1005 is attached to the surface of the chip under the action of the spring 1002, the position of the chip is prevented from being deviated when the chip is moved, then, the knob 5 is rotated, the bidirectional threaded rod 6 is rotated by the action of the bearing 3 and the rotating shaft 4 through the knob 5, the thread block 7 on the bidirectional threaded rod 6 is moved inwards, the slide rod 8 drives the clamping plate 10 to move inwards while the thread block 7 moves inwards, the knob 5 on the other side is rotated, the other clamping plate 10 can move inwards, the packaging of the chip is realized through 2 clamping plates 10, the chip is convenient to detach while the installation flow is simplified, finally, heat emitted after the chip works is transmitted out through the second metal plate 1005, the metal rod 1004 and the first metal plate 1003 without arranging heat dissipation holes, heat dissipation is facilitated, dust can be effectively prevented from falling onto the chip, and the content which is not described in detail in the description belongs to the prior art which is known by professionals in the field.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a chip package structure convenient to heat dissipation, is including placing board (1) and placing chamber (13), its characterized in that: the placing plate (1) is fixedly connected with a supporting plate (2), the supporting plate (2) is fixedly connected with a bearing (3) inside, the bearing (3) is fixedly connected with a rotating shaft (4) inside, one end of the rotating shaft (4) penetrating through the bearing (3) is fixedly connected with a knob (5), the other end of the rotating shaft (4) is fixedly connected with a bidirectional threaded rod (6),

swing joint has screw thread piece (7) on two-way threaded rod (6), side fixedly connected with slide bar (8) of screw thread piece (7), slide bar (8) block is connected in spout (9), slide bar (8) pass the one end fixed connection of spout (9) in the side of block board (10), through-hole (11) have been seted up in block board (10), fixedly connected with pin (12) in through-hole (11), place chamber (13) and set up and locate placing board (1) center department.

2. The chip packaging structure facilitating heat dissipation according to claim 1, wherein: the placing plate (1) is of a double-layer structure, and the middle of the placing plate is fixedly connected with the supporting plate (2).

3. The chip packaging structure facilitating heat dissipation according to claim 1, wherein: the two groups of the thread blocks (7), the slide rods (8), the clamping plates (10), the through holes (11) and the pins (12) are symmetrically arranged around the central axis of the bidirectional threaded rod (6).

4. The chip packaging structure facilitating heat dissipation according to claim 1, wherein: the side face of the thread block (7) is fixedly connected with a sliding rod (8), and the sliding rod (8) is connected in the sliding groove (9) in a clamping mode to form a sliding structure.

5. The chip packaging structure facilitating heat dissipation according to claim 1, wherein: the clamping plate (10) comprises a metal sleeve (1001), a spring (1002), a first metal plate (1003), a metal rod (1004) and a second metal plate (1005), wherein the metal sleeve (1001) is fixedly connected in the clamping plate (10), the spring (1002) is fixedly connected in the metal sleeve (1001), the first metal plate (1003) is fixedly connected to the tail end of the spring (1002), the metal rod (1004) is fixedly connected to the bottom surface of the first metal plate (1003), and the second metal plate (1005) is fixedly connected to the tail end of the metal rod (1004).

6. The chip package structure facilitating heat dissipation according to claim 5, wherein: the metal sleeve (1001), the spring (1002), the first metal plate (1003), the metal rod (1004) and the second metal plate (1005) are fixedly connected with three groups in the clamping plate (10).

7. The chip package structure facilitating heat dissipation according to claim 5, wherein: the first metal plate (1003), the metal rod (1004) and the second metal plate (1005) are made of silver.