CN210781871U - Heat radiation structure of high-power device and motor controller using same - Google Patents
Heat radiation structure of high-power device and motor controller using same Download PDFInfo
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- CN210781871U CN210781871U CN201921530691.0U CN201921530691U CN210781871U CN 210781871 U CN210781871 U CN 210781871U CN 201921530691 U CN201921530691 U CN 201921530691U CN 210781871 U CN210781871 U CN 210781871U
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Abstract
The utility model discloses a high-power device's heat radiation structure and use its machine controller, high-power device's heat radiation structure includes the box, box the inside vacuole formation, high-power device installs in the cavity the inside, high-power device pastes the surface tightly at the radiator, the radiator includes heat dissipation mainboard and apron, the heat dissipation mainboard digs out and holds the chamber, stretch out a plurality of spacers holding the chamber, set up erection column under a plurality of at the spacer interval, set up the second screw hole in the middle of the erection column down, it has the second ring channel to open at the outlying lower erection column top surface of second screw hole, the second sealing washer has been placed to the second ring channel, the position that corresponds down the erection column on the apron sets up the second through-hole, the screw passes the second through-hole and screws up on the second screw hole, the apron compresses tightly the second sealing washer and reaches sealed and makes apron and separate the spacer paste tightly. The heat dissipation structure is large in heat dissipation area and good in heat dissipation performance, and meets the heat dissipation effect of a high-power device.
Description
The technical field is as follows:
the utility model relates to a high-power device's heat radiation structure and use its machine controller.
Background art:
along with the development of electric automobiles, a driving motor controller of the electric automobile is a key core part of the electric automobile, small volume and high power are required, and high power density and reliability are achieved.
The invention content is as follows:
the utility model aims at providing a high-power device's heat radiation structure and use its machine controller, heat radiation structure's heat radiating area is restricted by the IGBT module among the solution prior art, and heat radiating area is little, and the controller is because heat radiating area is less, and the part that can dispel the heat is few, can not satisfy high-power device's technical problem.
The purpose of the utility model is realized by the following technical scheme.
A heat radiation structure of a high-power device comprises a box body, wherein a cavity is formed in the box body, the high-power device is installed in the cavity and is tightly attached to the surface of the heat radiator, the heat radiator comprises a heat radiation main board and a cover plate, a containing cavity is dug out of the heat radiation main board, a plurality of separating sheets extend out of the containing cavity and are separated into a plurality of parallel water channels, the plurality of water channels are connected end to end, a water inlet and a water outlet are formed in the heat radiation main board and are communicated with the containing cavity, the cover plate is installed on the containing cavity to seal the containing cavity, a first annular groove is formed in the heat radiation main board around the containing cavity, a first sealing ring is installed in the first annular groove, a plurality of first through holes are formed in the edge of the cover plate, first screw holes corresponding to the first through holes are formed in the heat radiation main board, screws penetrate through the first through holes and the first screw, the method is characterized in that: the partition plate is provided with a plurality of lower mounting columns at intervals, a second screw hole is formed in the middle of each lower mounting column, a second annular groove is formed in the top surface of the lower mounting column on the periphery of the second screw hole, a second sealing ring is placed in the second annular groove, a second through hole is formed in the position, corresponding to the lower mounting column, of the cover plate, the screw penetrates through the second through hole and is screwed on the second screw hole, and the cover plate tightly presses the second sealing ring to achieve sealing and enables the cover plate to be tightly attached to the partition plate.
The position of the cover plate corresponding to the lower mounting column protrudes out of the upper mounting column, the second through hole penetrates through the upper mounting column, when the cover plate is tightly attached to the separating sheet, the upper mounting column is pressed on the lower mounting column, and the upper mounting column compresses the second sealing ring to achieve sealing.
The containing cavity is square, the plurality of separating sheets extend out of the opposite side walls of the two sides of the square containing cavity, are staggered with each other, and are provided with gaps which are communicated with the two adjacent water channels.
The heat dissipation main board is arranged in the middle of the box body to divide the cavity into an upper cavity and a lower cavity, and the plurality of high-power devices are respectively arranged in the upper cavity and the lower cavity and are respectively attached to the heat dissipation main board or the cover board for heat dissipation.
The heat dissipation main board is arranged at the bottom of the box body, the containing cavity is dug out of the bottom surface of the heat dissipation main board, the cover plate is positioned outside the box body and covers the containing cavity, and the plurality of high-power devices are tightly attached to the heat dissipation main board for heat dissipation.
And counter bores are formed in the edges, corresponding to the second through holes, of the cover plate, and screw heads of the screws are located in the counter bores when the screws penetrate through the second through holes and are screwed in the second screw holes.
The heat dissipation main board and the box body are integrated.
A motor controller comprises a box body and an inverter, wherein the inverter is installed in the box body, a heat dissipation structure of a high-power device is arranged in the box body, the heat dissipation structure of the high-power device is the heat dissipation structure of the high-power device, the inverter is the high-power device, and the inverter is attached to the surface of a heat radiator for heat dissipation.
Compared with the prior art, the utility model, following effect has:
1) the utility model comprises a box body, a cavity is formed in the box body, a high-power device is arranged in the cavity, the high-power device is tightly attached to the surface of the radiator, the radiator comprises a heat dissipation mainboard and a cover plate, the heat dissipation mainboard digs out a containing cavity, a plurality of separating sheets extend out of the containing cavity, the separating sheets are separated into a plurality of parallel water channels, the plurality of water channels are connected end to end, the heat dissipation mainboard is provided with a water inlet and a water outlet which are communicated with the containing cavity, the cover plate is arranged on the containing cavity to cover the containing cavity, a first annular groove is arranged on the heat dissipation mainboard around the containing cavity, a first sealing ring is arranged in the first annular groove, a plurality of first through holes are arranged at the edge of the cover plate, a first screw hole corresponding to the first through hole is arranged on the heat dissipation mainboard, a screw passes through the first through hole and is arranged on the containing, the method is characterized in that: a plurality of lower mounting columns are arranged at intervals on the separating sheet, a second screw hole is arranged in the middle of each lower mounting column, a second annular groove is formed in the top surface of the lower mounting column on the periphery of the second screw hole, a second sealing ring is placed in the second annular groove, a second through hole is formed in the position, corresponding to the lower mounting column, of the cover plate, the screw penetrates through the second through hole and is screwed on the second screw hole, the cover plate tightly presses the second sealing ring to achieve sealing, the cover plate is tightly attached to the separating sheet, and the middle part of the cover plate can be prevented from being bulged due to water flow pressure to reduce the sealing effect; the utility model discloses cancel traditional IGBT module bottom and be equipped with the mode that the heat dissipation needle bed inserted the scattered water course of going into, avoid heat radiating area to receive the restriction of heat dissipation needle bed, adopt face and the tight radiating mode of face subsides, can improve the area of heat dissipation mainboard by a wide margin to improve heat radiating area, heat dissipation water course setting is in the middle of the box, can make the upper and lower two sides heat dissipation of water course, further improve heat radiating area, the water conservancy diversion nature of water course is better, effectively improve the radiating efficiency, satisfy high-power device's radiating effect.
2) Other advantages of the present invention will be described in detail in the examples section.
Description of the drawings:
FIG. 1 is a perspective view of a first embodiment;
FIG. 2 is a bottom view of the first embodiment;
FIG. 3 is a cross-sectional view A-A of FIG. 2;
FIG. 4 is a partial enlarged view of B in FIG. 3;
FIG. 5 is an enlarged view of a portion C of FIG. 3;
FIG. 6 is a cross-sectional view D-D of FIG. 2;
FIG. 7 is a schematic view of another angle structure of the first embodiment;
FIG. 8 is a perspective view of a cover plate according to one embodiment;
FIG. 9 is another angular perspective view of the cover plate in accordance with one embodiment;
fig. 10 is a schematic structural view of the second embodiment.
The specific implementation mode is as follows:
the present invention will be described in further detail with reference to the following detailed description of preferred embodiments and accompanying drawings.
The first embodiment is as follows:
as shown in fig. 1 to 9, the present embodiment provides a heat dissipation structure for a high power device, which includes a case 1, a cavity 11 is formed in the case 1, the high power device 2 is installed in the cavity 11, the high power device 2 is attached to the surface of the heat sink 100, the heat sink 100 includes a heat dissipation main board 3 and a cover board 4, the heat dissipation main board 3 is hollowed out of a containing cavity 31, a plurality of partition sheets 32 extend out of the containing cavity 31, the partition sheets 32 are divided into a plurality of side-by-side water channels 33, the plurality of water channels 33 are connected end-to-end, a water inlet 34 and a water outlet 35 are provided on the heat dissipation main board 3 and are communicated with the containing cavity 31, the cover board 4 is installed on the containing cavity 31 to cover the containing cavity 31, a first annular groove 36 is provided on the heat dissipation main board 3 around the containing cavity 31, a first sealing ring 30 is installed in the first annular groove 36, a plurality of first through holes 41 are provided at the, the screw 5 passes through first through-hole 41 and first screw hole 37 and will lap 4 lock installation on holding chamber 31, thereby apron 4 compresses tightly first sealing washer 30 and the closing cap seal holds and holds chamber 31, its characterized in that: set up a plurality of lower erection column 321 at the spacing of spacing piece 32, set up second screw hole 322 in the middle of lower erection column 321, it has second annular groove 323 to open at the peripheral lower erection column 321 top surface of second screw hole 322, second sealing washer 300 has been placed to second annular groove 323, set up second through-hole 42 in the position that corresponds lower erection column 321 on apron 4, screw 5 passes second through-hole 42 and screws up on second screw hole 322, apron 4 compresses tightly second sealing washer 300 and reaches sealed and make apron 4 and spacing piece 32 paste tightly together, can prevent that the apron mid portion from receiving rivers pressure and leading to protruding messenger's sealed effect to reduce, make the water conservancy diversion nature of water course better, effectively improve the radiating efficiency. The utility model discloses cancel traditional IGBT module bottom and be equipped with the mode that the heat dissipation needle bed inserted the scattered water course of going into, avoid heat radiating area to receive the restriction of heat dissipation needle bed, adopt face and the tight radiating mode of face subsides, can improve the area of heat dissipation mainboard by a wide margin to improve heat radiating area, heat dissipation water course setting is in the middle of the box, can make the water course about the two sides heat dissipation, further improve heat radiating area, satisfy high-power device's radiating effect.
The position of the cover plate 4 corresponding to the lower mounting post 321 protrudes the upper mounting post 43, the second through hole 42 penetrates the upper mounting post 43, when the cover plate 4 and the separating sheet 32 are attached together, the upper mounting post 43 is pressed on the lower mounting post 321, the upper mounting post 43 compresses the second sealing ring 300 to achieve sealing, and the sealing effect is good.
The containing cavity 31 is square, the plurality of separating sheets 32 extend out of the opposite side walls of the two sides of the square containing cavity 31 and are staggered with each other, a gap 311 is reserved, the gap 311 is communicated with the two adjacent water channels 33, circulation of water flow is guaranteed, the flow guiding performance is good, and the heat dissipation effect is good.
The heat dissipation main board 3 is arranged in the middle of the box body 1 to divide the cavity 11 into an upper cavity 111 and a lower cavity 112, the plurality of high-power devices 2 are respectively arranged in the upper cavity 111 and the lower cavity 112 and respectively cling to the heat dissipation main board 3 or the cover plate 4 to dissipate heat, the heat dissipation area is large, and the heat dissipation effect is good.
The edge of the cover plate 4 corresponding to the second through hole 42 is provided with a counter bore 44, when the screw 5 passes through the second through hole 42 and is screwed on the second screw hole 322, the screw head 51 of the screw 5 is positioned in the counter bore 44, the heat dissipation area on the cover plate is not reduced, and the high-power device is convenient to mount.
The heat dissipation main board 3 and the box body 1 are integrated, and the structure is simple.
Example two:
as shown in fig. 10, in this embodiment, a basic improvement is provided according to the first embodiment, the heat dissipation main board 3 is disposed at the bottom of the box body 1, the accommodating cavity 31 is dug out from the bottom surface of the heat dissipation main board 3, the cover plate 4 is located outside the box body 1 to cover the accommodating cavity 31, and the plurality of high-power devices 2 are tightly attached to the heat dissipation main board 3 for heat dissipation, so that the heat dissipation effect is good.
Example three:
the utility model provides a motor controller, includes box and dc-to-ac converter, and the dc-to-ac converter is installed in the box the inside, is provided with high-power device's heat radiation structure inside the box, its characterized in that: in the heat dissipation structure of the high power device according to the first embodiment or the second embodiment, the inverter is a high power device, and the inverter is attached to the surface of the heat sink 100 to dissipate heat.
The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited thereto, and any other changes, modifications, substitutions, combinations, and simplifications made without departing from the spirit and principle of the present invention are equivalent replacement modes, and are all included in the scope of the present invention.
Claims (8)
1. A heat dissipation structure of a high-power device comprises a box body (1), a cavity (11) is formed in the box body (1), the high-power device (2) is installed in the cavity (11), the high-power device (2) is attached to the surface of a heat sink (100), the heat sink (100) comprises a heat dissipation main board (3) and a cover plate (4), a containing cavity (31) is dug out of the heat dissipation main board (3), a plurality of partition sheets (32) extend out of the containing cavity (31), the partition sheets (32) are divided into a plurality of parallel water channels (33), the plurality of water channels (33) are connected end to end, a water inlet (34) and a water outlet (35) are formed in the heat dissipation main board (3) and communicated with the containing cavity (31), the cover plate (4) is installed on the containing cavity (31) to cover the containing cavity (31), a first annular groove (36) is formed in the heat dissipation main board (3), first sealing washer (30) of first annular groove (36) inside installation, the edge of apron (4) sets up a plurality of first through-holes (41), be equipped with first screw hole (37) that correspond with first through-hole (41) on heat dissipation mainboard (3), screw (5) are passed first through-hole (41) and are installed apron (4) locking with first screw hole (37) and hold chamber (31), thereby apron (4) compress tightly first sealing washer (30) the closing cap seal and hold chamber (31), its characterized in that: set up a plurality of at spacing spacer (32) lower erection column (321), set up second screw hole (322) in the middle of lower erection column (321), it has second ring channel (323) to open at the peripheral lower erection column (321) top surface of second screw hole (322), second sealing washer (300) have been placed to second ring channel (323), the position that corresponds lower erection column (321) on apron (4) sets up second through-hole (42), screw (5) pass second through-hole (42) and screw up on second screw hole (322), apron (4) compress tightly second sealing washer (300) and reach sealed and make apron (4) and spacer (32) paste tightly together.
2. The heat dissipating structure of a high power device as claimed in claim 1, wherein: the position of the cover plate (4) corresponding to the lower mounting column (321) protrudes out of the upper mounting column (43), the second through hole (42) penetrates through the upper mounting column (43), when the cover plate (4) and the separating sheet (32) are attached together, the upper mounting column (43) is pressed on the lower mounting column (321), and the upper mounting column (43) compresses the second sealing ring (300) to achieve sealing.
3. The heat dissipating structure for high power device as claimed in claim 1 or 2, wherein: the containing cavity (31) is square, the plurality of separating sheets (32) extend out from the opposite side walls of the two sides of the square containing cavity (31) and are staggered with each other, a gap (311) is reserved, and the gap (311) is communicated with the two adjacent water channels (33).
4. The heat dissipating structure for high power device as claimed in claim 3, wherein: the heat dissipation main board (3) is arranged in the middle of the box body (1) to divide the cavity (11) into an upper cavity (111) and a lower cavity (112), and the plurality of high-power devices (2) are respectively arranged in the upper cavity (111) and the lower cavity (112) and are respectively attached to the heat dissipation main board (3) or the cover plate (4) for heat dissipation.
5. The heat dissipating structure for high power device as claimed in claim 3, wherein: the heat dissipation main board (3) is arranged at the bottom of the box body (1), the containing cavity (31) is dug out from the bottom surface of the heat dissipation main board (3), the cover plate (4) is located outside the box body (1) and covers the containing cavity (31), and the plurality of high-power devices (2) are attached to the heat dissipation main board (3) to dissipate heat.
6. The heat dissipating structure for high power device as claimed in claim 4, wherein: the edge of the cover plate (4) corresponding to the second through hole (42) is provided with a counter bore (44), when the screw (5) passes through the second through hole (42) and is screwed on the second screw hole (322), the screw head (51) of the screw (5) is positioned in the counter bore (44).
7. The heat dissipating structure for high power device as claimed in claim 4, wherein: the heat dissipation main board (3) and the box body (1) are integrated.
8. The utility model provides a motor controller, includes box and dc-to-ac converter, and the dc-to-ac converter is installed in the box the inside, is provided with high-power device's heat radiation structure inside the box, its characterized in that: the heat dissipation structure of the high-power device is the heat dissipation structure of the high-power device as claimed in any one of claims 1 to 7, the inverter is the high-power device, and the inverter is attached to the surface of the heat sink (100) for heat dissipation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921530691.0U CN210781871U (en) | 2019-09-16 | 2019-09-16 | Heat radiation structure of high-power device and motor controller using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921530691.0U CN210781871U (en) | 2019-09-16 | 2019-09-16 | Heat radiation structure of high-power device and motor controller using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210781871U true CN210781871U (en) | 2020-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921530691.0U Active CN210781871U (en) | 2019-09-16 | 2019-09-16 | Heat radiation structure of high-power device and motor controller using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210781871U (en) |
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2019
- 2019-09-16 CN CN201921530691.0U patent/CN210781871U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220915 Address after: 5th Floor, Office Building, No. 1 Guangfeng Industrial Avenue, West District, Zhongshan City, Guangdong Province, 528400 Patentee after: Dayang electric fuel cell technology (Zhongshan) Co.,Ltd. Address before: 528400 Guangdong province Zhongshan City West sirlon third industrial zone Patentee before: ZHONGSHAN BROAD-OCEAN MOTOR Co.,Ltd. |
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| TR01 | Transfer of patent right |