CN210778281U - Pouring device for shell-free capacitor - Google Patents
Pouring device for shell-free capacitor Download PDFInfo
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- CN210778281U CN210778281U CN201921638508.9U CN201921638508U CN210778281U CN 210778281 U CN210778281 U CN 210778281U CN 201921638508 U CN201921638508 U CN 201921638508U CN 210778281 U CN210778281 U CN 210778281U
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Abstract
The utility model discloses a pour device for no shell condenser, including mould and inside being used for placing the condenser core and at the outer die cavity of condenser core outside shaping epoxy, set up the sprue with the die cavity intercommunication on the mould, the hole of wearing that is used for supplying the pin to wear out is offered at the top of mould, is provided with the pin locating rack on the mould, and the pin locating hole has been offered on the part that the pin locating rack is located the mould top, passes the pin locating hole be provided with pin screw hole threaded connection in order to be fixed in the pin with pin and condenser core set screw on the pin locating rack. Its technical scheme main points are that a pair of pin and condenser core are fixed in on the pin locating rack, and the condenser core is located the die cavity, and the pin location of processing out the condenser is accurate, and the pin is difficult for appearing the condition such as slope, skew, and the condenser can be in time quick insert on the PCB board.
Description
Technical Field
The utility model relates to a condenser installation technical field, in particular to a pour device for no shell condenser.
Background
As shown in fig. 1 and 2, a conventional capacitor includes two capacitor cores 1, and the capacitor core 1 is generally formed by alternately arranging a first metal thin film 11, a first insulating film 12, a second metal thin film 13, and a second insulating film 14 in an insulating manner and then winding them, and a pair of leads 2 are sandwiched between the first metal thin film 11, the first insulating film 12, the second metal thin film 13, and the second insulating film 14 and led out. The part of the two pins 2 inserted between the films of the capacitor core 1 is flat, the part of the pin 2 positioned outside the capacitor core 1 is cylindrical, the two pins 2 are respectively welded on the first metal film 11 and the second metal film 13, and the top surface of the pin 2 is provided with a pin threaded hole 4. The two capacitor cores 1 are wrapped by epoxy resin outer layers 5, and the two pairs of pins 2 penetrate out of the top surfaces of the epoxy resin outer layers 5.
The PCB board is also called printed circuit board, be electronic components's supporter, the PCB board of installing above-mentioned condenser is when the board is made, its mounting hole that is used for installing pin 2 is designed processing in advance corresponding to many pairs of pin 2's position and forms, the position of mounting hole is accurate inconvenient on the PCB board, this just requires to wait that pin 2 of the condenser of installing on the PCB board can accurately correspond to the mounting hole of having made on the PCB board, then the condenser can be in time quick in the installation on inserting the PCB board, if the condition such as slope, skew appear when the encapsulation in pin 2, then can influence the normal installation of condenser.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The to-be-solved problem of the utility model is not enough to provide a pour device for no shell condenser to the above-mentioned that exists among the prior art, its technical scheme main points are that a pair of pin and condenser core are fixed in on the pin locating rack, and the condenser core is located the die cavity, and the pin location of processing out the condenser is accurate, and the pin is difficult for appearing the circumstances such as slope, skew, and the condenser can be in time quick insert on the PCB board.
(II) technical scheme
The above utility model discloses an above-mentioned utility model purpose can realize through following technical scheme: the utility model provides a pour device for no shell condenser, includes the mould and inside is used for placing the condenser core and at the outer die cavity of condenser core outside shaping epoxy, set up the sprue with the die cavity intercommunication on the mould, the hole of wearing that is used for supplying the pin to wear out is offered at the top of mould, be provided with pin locating rack on the mould, pin locating rack has seted up the pin locating hole on the part that is located the mould top, passes the pin locating hole be provided with pin screw hole threaded connection in order to be fixed in the pin with the condenser core set screw on the pin locating rack.
The utility model discloses further set up to: the mould forms the die cavity and is by lower supreme bottom plate, curb plate, the roof that sets gradually including connecting, the curb plate sets up two first curb plates on the bottom plate including the symmetry, the symmetry sets up on the bottom plate and sets up two second curb plates on the both sides wall that first curb plate carried on the back mutually respectively, the roof lid is located on two first curb plates and two second curb plates, the sprue all sets up on the roof with wearing out the hole.
The utility model discloses further set up to: the bottom plate is offered on the terminal surface towards the curb plate and is used for supplying first curb plate and second curb plate male slot, two first perforation have been seted up to equal symmetry on the both sides wall at the long limit place of bottom plate, two equal symmetry is seted up on the lateral wall that the second curb plate deviates from first curb plate and is used for the second perforation that aligns with first perforation, every first curb plate all sets up on the lateral wall towards two second curb plates and is used for the first screw hole that aligns with the second perforation, passes first perforation and second perforation are provided with and are used for being fixed in the first screw on the bottom plate with first screw hole threaded connection and second curb plate.
The utility model discloses further set up to: the roof is including two half roofs that the symmetry set up, wear out the pore pair and half open and locate two half roofs on, the sprue is seted up on one of them half roof, two half roof passes through the second fix with screw on the curb plate.
The utility model discloses further set up to: two all seted up the support body screw hole on the both sides wall that first curb plate carried on the back mutually, the pin locating rack sets up two vertical braces on the crossbeam both ends including setting up in the crossbearer of mould top, down, the pin locating hole is seted up on the terminal surface of crossbearer towards the mould, two the lateral wall butt that the relative lateral wall of vertical brace was carried on the back mutually with two first curb plates respectively, two all offer the third perforation that is used for lining up with the support body screw hole on the vertical brace, pass the third perforation is provided with and just is used for being fixed in the third screw on the mould with support body screw hole threaded connection.
The utility model discloses further set up to: two all be provided with the bracket on the both sides wall that first curb plate carried on the back mutually, two the lower terminal surface of erecting the frame and the up end butt of two brackets are in order to make things convenient for the workman to install the pin locating rack on the mould.
(III) advantageous effects
To sum up, the utility model discloses the beneficial effect who contrasts in prior art does:
1. the processing quality is good: the pins and the capacitor cores are fixed on the pin positioning frame, and the capacitor cores are positioned in the die cavity, so that the pins of the processed capacitor are accurately positioned, the pins are not easy to incline, deviate and the like, and the capacitor can be timely and quickly inserted into a PCB (printed circuit board);
2. the demoulding is convenient: during the drawing of patterns, the workman unscrews set screw and third screw, takes off pin locating rack from the mould, then unscrews the second screw, takes off two half roofs from two first curb plates and two second curb plates, unscrews first screw after that, separates bottom plate and two first curb plates and two second curb plates, separates the condenser after with two first curb plates and two second curb plates and shaping at last, and the mould adopts foretell structure, and is comparatively convenient during the drawing of patterns.
Drawings
FIG. 1 is a schematic structural diagram of a conventional capacitor, mainly highlighting the specific structure of the capacitor;
FIG. 2 is a schematic structural diagram of a conventional capacitor core, mainly highlighting the specific structure of the capacitor core;
fig. 3 is a schematic structural diagram of a pouring device for a shell-less capacitor in the embodiment, mainly highlighting a specific structure of the pouring device for the shell-less capacitor;
FIG. 4 is a sectional structural view taken along line I-I of FIG. 3, mainly highlighting the internal structure of the casting apparatus for a case-less capacitor;
FIG. 5 is a sectional structural view taken along line J-J of FIG. 3, mainly highlighting the internal structure of the casting apparatus for a case-less capacitor;
fig. 6 is a schematic structural diagram of the top plate in the embodiment, mainly highlighting the specific structure of the top plate.
Reference numerals: 1. a capacitor core; 11. a first metal thin film; 12. a first insulating film; 13. a second metal film; 14. a second insulating film; 2. a pin; 4. pin threaded holes; 5. an outer layer of epoxy resin; 6. a mold; 7. a mold cavity; 8. a base plate; 9. a side plate; 91. a first side plate; 92. a second side plate; 10. a top plate; 101. a half top plate; 15. a slot; 16. a first perforation; 17. a second perforation; 18. a first threaded hole; 19. a first screw; 20. an outlet hole is formed; 21. a second screw; 22. a material injection port; 23. a threaded hole of the frame body; 24. a pin positioning frame; 241. a cross frame; 242. erecting; 25. pin positioning holes; 26. a set screw; 27. a third perforation; 28. a third screw; 29. a bracket.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in FIG. 3, the pouring device for the shell-less capacitor comprises a mold 6 and a mold cavity 7 arranged inside the mold 6 and used for placing a capacitor core 1 and molding an epoxy resin outer layer 5 outside the capacitor core 1, wherein a pin positioning frame 24 used for positioning pins 2 is arranged on the mold 6.
The mold 6 comprises a bottom plate 8, a side plate 9 and a top plate 10 which are sequentially arranged from bottom to top, wherein the bottom plate 8, the side plate 9 and the top plate 10 are assembled to form the mold 6, and a mold cavity 7 for molding the epoxy resin outer layer 5 is formed in the mold.
As shown in fig. 3 and 4, the bottom plate 8 is a rectangular plate, four rectangular slots 15 are formed in the top surface of the bottom plate 8, and the four slots 15 are communicated and form a square ring shape. The side plate 9 comprises two mutually symmetrical first side plates 91 and two mutually symmetrical second side plates 92, the first side plates 91 and the second side plates 92 are rectangular plate bodies, and the bottoms of the two first side plates 91 and the two second side plates 92 are respectively inserted into the four slots 15, so that the side plate 9 is preliminarily positioned, and subsequent installation work is facilitated. The two second side plates 92 are respectively located on two sides of the two first side plates 91, the two second side plates 92 are abutted against two side walls of each first side plate 91, which are opposite to each other, and the two first side plates 91 and the two second side plates 92 are connected to form a square frame shape.
As shown in fig. 3 and 5, two circular first through holes 16 are symmetrically formed in both side walls of the long side of the bottom plate 8, two circular second through holes 17 are symmetrically formed in both side walls of the two second side plates 92 away from the first side plate 91, the four second through holes 17 are aligned with the four first through holes 16 at the corresponding positions, a first threaded hole 18 is formed in each side wall of the first side plate 91 facing the two second side plates 92, the four first threaded holes 18 are respectively aligned with the four first through holes 16 and the four second through holes 17 at the corresponding positions, a first screw 19 in threaded connection with the first threaded hole 18 is arranged through the aligned first through holes 16 and the aligned second through holes 17, and the first screw 19 is used for fixing the first side plate 91 and the second side plate 92 on the bottom plate 8.
As shown in fig. 4 and 6, the top plate 10 is installed on the two first side plates 91 and the two second side plates 92, the top plate 10 is provided with a through hole 20 for the pin 2 to pass through, and the top plate 10 is used for molding the upper surface of the epoxy resin outer layer 5, so as to ensure the flatness of the upper surface of the epoxy resin outer layer 5. Roof 10 includes two half roof 101 of mutual symmetry, and two half roof 101 splices and forms roof 10, and when covering and locate on two first curb plate 91 and two second curb plates 92, bottom plate 8, curb plate 9, roof 10 enclose into die cavity 7 jointly, and two half roof 101 are fixed in on two first curb plates 91 and two second curb plates 92 through second screw 21 to guarantee that the shaping adds man-hour, the holistic stability of mould 6. The penetrating hole 20 is opened in half on the opposite side walls of the two half top plates 101, and the penetrating hole 20 is molded while the two half top plates 101 are spliced to form the top plate 10. And a feeding port 22 communicated with the die cavity 7 is formed in one half top plate 101, and during processing, workers operate feeding equipment to inject epoxy resin into the die cavity 7 through the feeding port 22.
As shown in fig. 3 and 4, frame body threaded holes 23 are formed in two opposite side walls of the two first side plates 91, and the two frame body threaded holes 23 are symmetrical to each other. The lead frame 24 includes a cross frame 241 and two vertical frames 242 disposed downward on two ends of the cross beam.
The cross frame 241 is a cuboid, the cross frame 241 is located above the die 6, a round pin 2 positioning hole is formed in the end face, facing the die 6, of the cross frame 241, and the pin 2 positioning hole is used for being aligned with the pin threaded hole 4. And a fixing screw 26 penetrates through the pin 2 positioning hole, and the fixing screw 26 is in threaded connection with the pin threaded hole 4. During processing, the upper surface of the pin 2 is attached to the lower end surface of the pin positioning frame 24, and then the fixing screw 26 passes through the pin 2 positioning hole and is in threaded connection with the pin threaded hole 4 on the pin 2, so that the pin 2 and the capacitor core 1 are also positioned.
Two perpendicular mutual symmetries of frame 242 and with crossbearer 241 an organic whole connection, two perpendicular frames 242 are the cuboid, two perpendicular relative lateral walls of frame 242 respectively with the lateral wall butt that first curb plate 91 carried on the back mutually, all seted up the circular shape third on two perpendicular frames 242 and perforate 27, the third is perforated 27 and is aligned with support body screw hole 23, wears to be equipped with third screw 28 in the third is perforated 27, third screw 28 and support body screw hole 23 threaded connection are in order to be fixed in mould 6 with pin 2 mount. The dimension of the vertical frame 242 is pre-designed according to the structure of the capacitor, so that the horizontal frame 241 is located at a certain position above the die 6, and the formed capacitor is guaranteed to meet the pre-designed marked dimension.
As shown in fig. 4, two opposite side walls of the two first side plates 91 are fixedly connected with brackets 29, the two brackets 29 are rectangular plates and are symmetrical to each other, and the upper end surfaces of the two brackets 29 are used for abutting against the lower end surfaces of the two vertical frames 242 to support the pin positioning frame 24. When pin locating rack 24 is placed on two brackets 29, support body screw hole 23 and third are perforated 27 and are located same horizontal plane, then the workman only needs to carry out the adjustment along 6 broadside directions of mould to pin locating rack 24, can make support body screw hole 23 and third punch 27 align to when installing pin locating rack 24 on mould 6, need not the workman and hold between the fingers pin locating rack 24 with the hand always, it is comparatively convenient to install.
When the capacitor is processed, a worker attaches the top surfaces of two pairs of pins 2 to the lower end surface of a pin positioning frame 24, then a fixing screw 26 penetrates through a pin 2 positioning hole and is in threaded connection with a pin threaded hole 4 on the pin 2, then a capacitor core 1 connected with the pin 2 is also positioned, then the pin 2 is positioned on two brackets 29, the position of the pin positioning frame 24 is adjusted, a frame body threaded hole 23 is aligned with a third through hole 27, then the pin positioning frame 24 can be fixed on a die 6 by screwing a third screw 28, then the two half top plates 101 are spliced and covered on the two first side plates 91 and the two second side plates 92, then the two half top plates 101 can be fixed on the two first side plates 91 and the two second side plates 92 by screwing a second screw 21, at the moment, the capacitor core 1 is positioned in a die cavity 7, and a gap is left between the capacitor core 1 and the cavity wall of the die cavity 7, then the workman operates the notes material equipment, injects epoxy into the die cavity 7 through the sprue 22, and epoxy flows and fills in the clearance between the chamber wall of capacitor core 1 and die cavity 7 in die cavity 7, then can wrap up capacitor core 1 including completely after the shaping of epoxy outer 5.
During the drawing of patterns, the workman unscrews set screw 26 and third screw 28, take off pin locating rack 24 from mould 6, then unscrew second screw 21, take off two half roof 101 from two first curb plates 91 and two second curb plates 92, unscrew first screw 19 after that, separate bottom plate 8 and two first curb plates 91 and two second curb plates 92, separate two first curb plates 91 and two second curb plates 92 with the condenser after the shaping at last, mould 6 adopts foretell structure, it is comparatively convenient during the drawing of patterns.
Finally, although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the present invention can be modified or replaced by other means without departing from the spirit and scope of the present invention, which should be construed as limited only by the appended claims.
Claims (6)
1. The utility model provides a pour device for no shell condenser which characterized in that: including mould (6) and inside die cavity (7) that are used for placing condenser core (1) and at condenser core (1) external shaping epoxy outer (5), set up sprue (22) with die cavity (7) intercommunication on mould (6), the top of mould (6) is offered and is used for supplying wearing out hole (20) that pin (2) wore out, be provided with pin locating rack (24) on mould (6), pin locating rack (24) are located and have been offered pin (2) locating hole on the part of mould (6) top, pass pin (2) locating hole be provided with pin (2) screw hole threaded connection in order to be fixed in fixing screw (26) on pin locating rack (24) with pin (2) and condenser core (1).
2. A casting device for a shell-less capacitor as claimed in claim 1, characterized in that: mould (6) are including connecting formation die cavity (7) and by bottom plate (8), curb plate (9), roof (10) that supreme set gradually down, curb plate (9) set up two first curb plate (91), symmetry on bottom plate (8) including the symmetry and set up respectively on bottom plate (8) and set up two second curb plate (92) on the both sides wall that first curb plate (91) carried on the back mutually, roof (10) lid is located on two first curb plates (91) and two second curb plates (92), sprue (22) and wear out hole (20) and all set up on roof (10).
3. A casting device for a shell-less capacitor as claimed in claim 2, characterized in that: the end surface of the bottom plate (8) facing the side plate (9) is provided with a slot (15) for inserting the first side plate (91) and the second side plate (92), two first through holes (16) are symmetrically formed in two side walls where the long edges of the bottom plate (8) are located, two second through holes (17) which are used for being aligned with the first through holes (16) are symmetrically formed in the side wall, away from the first side plate (91), of the second side plate (92), each first side plate (91) faces the side wall of the two second side plates (92), first threaded holes (18) which are used for being aligned with the second through holes (17) are formed in the side wall, and the first through holes (16) and the second through holes (17) are provided with first screws (19) which are in threaded connection with the first threaded holes (18) and used for fixing the first side plate (91) and the second side plate (92) on the bottom plate (8).
4. A casting device for a shell-less capacitor as claimed in claim 3, characterized in that: roof (10) are including two half roof (101) that the symmetry set up, wear hole (20) and half open on two half roof (101), on one of them half roof (101) is opened in sprue (22), two half roof (101) are fixed in on curb plate (9) through second screw (21).
5. A casting device for a shell-less capacitor as claimed in claim 2, characterized in that: two all seted up support body screw hole (23) on the both sides wall that first curb plate (91) carried on the back mutually, pin locating rack (24) including set up in crossbearer (241) of mould (6) top, set up two perpendicular frame (242) on crossbeam both ends down, pin (2) locating hole is seted up on crossbearer (241) towards the terminal surface of mould (6), two perpendicular frame (242) relative lateral wall respectively with two lateral wall butts that first curb plate (91) carried on the back mutually, two all offer on perpendicular frame (242) and be used for the third perforation (27) that align with support body screw hole (23), pass third perforation (27) are provided with support body screw hole (23) threaded connection and are used for being fixed in third screw (28) on mould (6) with pin locating rack (24).
6. A casting device for a shell-less capacitor as claimed in claim 5, wherein: brackets (29) are arranged on two side walls of the two first side plates (91) which are opposite to each other, and the lower end faces of the vertical frames (242) are abutted against the upper end faces of the two brackets (29) so that a worker can conveniently install the pin positioning frame (24) on the die (6).
Priority Applications (1)
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CN201921638508.9U CN210778281U (en) | 2019-09-29 | 2019-09-29 | Pouring device for shell-free capacitor |
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CN201921638508.9U CN210778281U (en) | 2019-09-29 | 2019-09-29 | Pouring device for shell-free capacitor |
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CN210778281U true CN210778281U (en) | 2020-06-16 |
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CN201921638508.9U Active CN210778281U (en) | 2019-09-29 | 2019-09-29 | Pouring device for shell-free capacitor |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114420473A (en) * | 2022-01-29 | 2022-04-29 | 常熟市国瑞科技股份有限公司 | Packaging device for shell-less capacitor |
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2019
- 2019-09-29 CN CN201921638508.9U patent/CN210778281U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114420473A (en) * | 2022-01-29 | 2022-04-29 | 常熟市国瑞科技股份有限公司 | Packaging device for shell-less capacitor |
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