CN210765117U - High-temperature-resistant copper-clad film - Google Patents
High-temperature-resistant copper-clad film Download PDFInfo
- Publication number
- CN210765117U CN210765117U CN201921406470.2U CN201921406470U CN210765117U CN 210765117 U CN210765117 U CN 210765117U CN 201921406470 U CN201921406470 U CN 201921406470U CN 210765117 U CN210765117 U CN 210765117U
- Authority
- CN
- China
- Prior art keywords
- copper
- layer
- clad film
- high temperature
- temperature resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229910052802 copper Inorganic materials 0.000 claims abstract description 39
- 239000010949 copper Substances 0.000 claims abstract description 39
- 238000010030 laminating Methods 0.000 claims abstract description 10
- 229920000297 Rayon Polymers 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 122
- 230000001681 protective effect Effects 0.000 claims description 46
- 238000004804 winding Methods 0.000 claims description 29
- 239000012790 adhesive layer Substances 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- 238000005192 partition Methods 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000005096 rolling process Methods 0.000 abstract description 14
- 230000011218 segmentation Effects 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 77
- 239000010409 thin film Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 206010066054 Dysmorphism Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Arc Welding In General (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921406470.2U CN210765117U (en) | 2019-08-27 | 2019-08-27 | High-temperature-resistant copper-clad film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921406470.2U CN210765117U (en) | 2019-08-27 | 2019-08-27 | High-temperature-resistant copper-clad film |
Publications (1)
Publication Number | Publication Date |
---|---|
CN210765117U true CN210765117U (en) | 2020-06-16 |
Family
ID=71065575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201921406470.2U Active CN210765117U (en) | 2019-08-27 | 2019-08-27 | High-temperature-resistant copper-clad film |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN210765117U (en) |
-
2019
- 2019-08-27 CN CN201921406470.2U patent/CN210765117U/en active Active
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A high temperature resistant copper clad film Effective date of registration: 20211216 Granted publication date: 20200616 Pledgee: Bank of China Limited Huangshi Branch Pledgor: HUBEI HENGCHI ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021420000146 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230106 Granted publication date: 20200616 Pledgee: Bank of China Limited Huangshi Branch Pledgor: HUBEI HENGCHI ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021420000146 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A high temperature resistant copper coating film Effective date of registration: 20230109 Granted publication date: 20200616 Pledgee: Bank of China Limited Huangshi Branch Pledgor: HUBEI HENGCHI ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2023420000010 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20200616 Pledgee: Bank of China Limited Huangshi Branch Pledgor: HUBEI HENGCHI ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2023420000010 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A high-temperature resistant copper coated film Granted publication date: 20200616 Pledgee: Bank of China Limited Huangshi Branch Pledgor: HUBEI HENGCHI ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2024980007119 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |