CN210765102U - Thermal decomposition adhesive tape - Google Patents
Thermal decomposition adhesive tape Download PDFInfo
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- CN210765102U CN210765102U CN201822268116.XU CN201822268116U CN210765102U CN 210765102 U CN210765102 U CN 210765102U CN 201822268116 U CN201822268116 U CN 201822268116U CN 210765102 U CN210765102 U CN 210765102U
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Abstract
The utility model discloses a pyrolysis is glued area of gluing, include in proper order that first from type layer, first gluing layer, substrate layer, second gluing layer and second from type layer, first gluing layer and/or second gluing layer structure are ultraviolet curing gluing layer including the foaming microballon, wherein, the originated foaming temperature of foaming microballon is not higher than 85 ℃. The utility model provides a thermal decomposition is got rid of and is glued area can reach the simplified operation flow, reduces beneficial effect such as artifical expenditure, and the surface of electron spare part does not have the cull risk completely simultaneously, guarantees that the electronic product component does not receive any pollution.
Description
Technical Field
The invention relates to an adhesive tape, in particular to a low-temperature pyrolysis adhesive tape.
Background
The conventional double-sided adhesive tape plays a role in supporting and fixing in the manufacturing process and the assembling process, but is difficult to remove after the manufacturing process and the assembling process are finished, so that the operation is more complicated, and meanwhile, the working hour and the labor consumption are increased. With the continuous development of the electronic terminal product industry, in the manufacturing and assembling process, a high viscosity can be ensured under the condition of viscosity, and the viscosity can be lost through a convenient means after the adhesive tape is used, so that the perfect removing effect of the adhesive tape is achieved. Chinese patent document CN204569798U discloses a high temperature thermal pyrolytic bonding pressure sensitive adhesive protective film, which discloses the use of thousand mesh grade powder, preferably with a bond line thickness of 10-30um, and no specific description is made on the temperature of adhesive failure.
In the prior art, the thickness of the thermal debonding adhesive tape is generally thin, which cannot be satisfied by some products requiring a thick adhesive tape, and the temperature for foaming and debonding the adhesive tape is high.
Disclosure of Invention
The invention aims to solve the technical problem of providing an adhesive tape capable of being thermally decomposed and tack-free at a low temperature.
In order to solve the technical problems, the invention discloses a thermal decomposition viscosity loss adhesive tape which sequentially comprises a first release layer, a first adhesive layer, a base material layer, a second adhesive layer and a second release layer, wherein the first adhesive layer and/or the second adhesive layer are/is constructed into an ultraviolet curing adhesive layer comprising foaming microspheres, and the foaming temperature of the foaming microspheres is not higher than 90 ℃.
In one embodiment of the present invention, the thickness of the first adhesive layer and/or the second adhesive layer is 10 μm to 100 μm.
As a specific embodiment of the present invention, the glass transition temperature of the first adhesive layer and/or the second adhesive layer is not greater than-20 ℃.
As a specific embodiment of the present invention, the expanded microspheres are acrylonitrile-carbohydrate copolymer expanded microspheres.
As a specific embodiment of the present invention, the foaming temperature of the foaming microspheres is not higher than 85 ℃.
In one embodiment of the present invention, the expansion ratio of the expanded beads is 6 to 10 times.
In one embodiment of the present invention, the primary particle size of the expanded beads is 10 μm to 30 μm.
In one embodiment of the present invention, the substrate layer is a PET film layer.
As a specific embodiment of the present invention, the thickness of the first release layer is smaller than the thickness of the second release layer.
In one embodiment of the present invention, the thickness of the first release layer and the second release layer is 25 μm to 125 μm.
The thermal adhesive tape provided by the invention has higher viscosity under the condition of normally attaching iron, aluminum or various metal electrodes, and can firmly fix various electronic parts. After the manufacturing procedure and the assembling process are finished, the foaming microspheres in the glue are expanded by heating at a lower temperature (85 ℃), so that the glue loses viscosity completely, the beneficial effects of simplifying the operation flow, reducing the labor expenditure and the like are achieved, meanwhile, the surface of the electronic part has no residual glue risk completely, and the electronic product element is ensured not to be polluted.
Drawings
FIG. 1 is a schematic view of a thermal debonding tape according to one embodiment of the present invention.
The adhesive comprises a substrate layer, a first release layer, a second release layer, a first adhesive layer, a base material layer, a second adhesive layer and a second release layer, wherein the first release layer is 1-2-3-4-5-one.
Detailed Description
The present invention will be described in detail below with reference to specific embodiments shown in the drawings. These embodiments are not intended to limit the present invention, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the present invention.
It is to be understood that the terms "first," "second," and the like in the description of the embodiments of the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit indication of the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
As shown in fig. 1, an embodiment of the invention provides a thermal debonding adhesive tape, which sequentially includes a first release layer 1, a first adhesive layer 2, a substrate layer 3, a second adhesive layer 4, and a second release layer 5. Wherein the first adhesive layer 2 and/or the second adhesive layer 4 is configured as an ultraviolet light curing adhesive layer comprising foamed microspheres, wherein the foaming temperature of the foamed microspheres is not higher than 90 ℃.
In this embodiment, the thickness of the first adhesive layer 2 and/or the second adhesive layer 4 is 10 μm to 100 μm. Preferably, the thickness of the first adhesive layer 2 is 50 μm, and the thickness of the second adhesive layer 5 is 50 μm.
In this embodiment, the glass transition temperature of the first adhesive layer 2 and/or the second adhesive layer 4 is not greater than-20 ℃. Preferably, the glass transition temperature of the first adhesive layer 2 and the second adhesive layer 5 is-40 ℃, so that the foaming microspheres can be effectively expanded, and meanwhile, the UV curing does not need to have higher temperature, so that the foaming microspheres cannot be expanded in advance to enable the adhesive tape to lose viscosity in the manufacturing process of the adhesive tape.
In this embodiment, the foaming microspheres are acrylonitrile-carbohydrate copolymer foaming microspheres, and the foaming temperature is not higher than 85 ℃.
In the embodiment, the initial particle size of the foaming microsphere is 10 to 30 μm, and the expansion ratio is 6 to 10 times.
In this embodiment, the substrate layer 3 is a PET film layer. The thickness of the base material layer 3 is 25 to 125 μm. Preferably, the thickness of the base material layer 3 is 50 μm.
In this embodiment, the thickness of the first release layer 1 and the second release layer 5 is 25 μm to 125 μm. Specifically, the thickness of the first release layer 1 is smaller than that of the second release layer 5, and further preferably, the thickness of the first release layer 1 is 25 μm, and the thickness of the second release layer 5 is 75 μm.
In the above thermal debonding tape, the first adhesive layer 2 and the second adhesive layer 4 are coated by a slit coating method.
The pyrolytic debonding adhesive tape according to a preferred embodiment of the present invention is subjected to performance verification, and the pyrolytic debonding adhesive tape according to the preferred embodiment sequentially comprises a PET silicone release film layer with a thickness of 25 μm, an ultraviolet light curing adhesive layer with a thickness of 50 μm, which comprises acrylonitrile-carbohydrate copolymer foamed microspheres, a glass transition temperature of-40 ℃, a PET substrate layer with a thickness of 50 μm, an ultraviolet light curing adhesive layer with a thickness of 50 μm, which comprises acrylonitrile-carbohydrate copolymer foamed microspheres, a glass transition temperature of-40 ℃, and a PET silicone release film layer with a thickness of 75 μm. And attaching SUS steel sheets to two sides of the thermal debonding adhesive tape stripped of the first release layer 1 and the second release layer 5 to form a test object. The test piece was subjected to a water bath at 85 ℃ to find that the heat-debonded tape began to lose tackiness. The above test pieces were subjected to a water bath at 95 ℃ to completely release the two SUS steel sheets.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.
Claims (10)
1. The utility model provides a pyrolysis is glued area of gluing, includes in proper order that first from type layer (1), first sticky layer (2), substrate layer (3), second sticky layer (4) and second from type layer (5), characterized by, first sticky layer (2) and/or second sticky layer (4) construct for the ultraviolet curing sticky layer including the foaming microballon, wherein, the originated foaming temperature of foaming microballon is not higher than 85 ℃.
2. The thermal debonding tape according to claim 1, wherein the thickness of the first adhesive layer (2) and/or the second adhesive layer (4) is between 10 μm and 100 μm.
3. The thermal debonding tape according to claim 1, wherein the glass transition temperature of the first adhesive layer (2) and/or the second adhesive layer (4) is not greater than-20 ℃.
4. The thermal debonding tape according to claim 1, wherein said expanded microspheres are acrylonitrile-carbohydrate copolymer expanded microspheres.
5. The thermal debonding tape according to claim 1, wherein said expanded microspheres have an initial expansion temperature of not greater than 85 ℃.
6. The thermal debonding adhesive tape according to claim 1, wherein the expansion factor of said expanded microspheres is 6 to 10 times.
7. The thermal debonding adhesive tape according to claim 1, wherein the primary particle size of said foamed microspheres is from 10 μm to 30 μm.
8. The heat-shrinkable tape according to claim 1, wherein the substrate layer (3) is a PET film layer.
9. The thermal debonding tape according to claim 1, wherein the thickness of the first release layer (1) is less than the thickness of the second release layer (5).
10. The thermal debonding adhesive tape according to claim 1, wherein the thickness of the first release layer (1) and the second release layer (5) is from 25 μm to 125 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822268116.XU CN210765102U (en) | 2018-12-28 | 2018-12-28 | Thermal decomposition adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822268116.XU CN210765102U (en) | 2018-12-28 | 2018-12-28 | Thermal decomposition adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210765102U true CN210765102U (en) | 2020-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822268116.XU Active CN210765102U (en) | 2018-12-28 | 2018-12-28 | Thermal decomposition adhesive tape |
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| CN (1) | CN210765102U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111748313A (en) * | 2020-07-29 | 2020-10-09 | 上海仁速新材料有限公司 | Ultraviolet curing adhesive and preparation method and application thereof |
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2018
- 2018-12-28 CN CN201822268116.XU patent/CN210765102U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111748313A (en) * | 2020-07-29 | 2020-10-09 | 上海仁速新材料有限公司 | Ultraviolet curing adhesive and preparation method and application thereof |
| CN111748313B (en) * | 2020-07-29 | 2022-04-01 | 上海仁速新材料有限公司 | Ultraviolet curing adhesive and preparation method and application thereof |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 213149 No. 20, Changyang Road, West Taihu science and Technology Industrial Park, Wujin District, Changzhou City, Jiangsu Province Patentee after: Xinlun electronic materials (Changzhou) Co.,Ltd. Address before: 213149 No. 20, Changyang Road, West Taihu science and Technology Industrial Park, Wujin District, Changzhou City, Jiangsu Province Patentee before: Xinlun Technology (Changzhou) Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |