CN210754632U - Special-shaped hole forming high-precision die for mobile phone backlight plate - Google Patents
Special-shaped hole forming high-precision die for mobile phone backlight plate Download PDFInfo
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- CN210754632U CN210754632U CN201921139405.8U CN201921139405U CN210754632U CN 210754632 U CN210754632 U CN 210754632U CN 201921139405 U CN201921139405 U CN 201921139405U CN 210754632 U CN210754632 U CN 210754632U
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Abstract
A high-precision die for molding special-shaped holes of a backlight plate of a mobile phone comprises an upper die base, a punch group, a lower die base and a female die cavity group; the punch is assembled on the bottom surface of the upper die base, and the cavity group of the female die is arranged on the top surface of the lower die base; the punch set comprises a pre-hole punch, a stretching punch, a punching punch and a hole drawing punch, the female die cavity set comprises a pre-hole groove, a stretching groove, a punching groove and a hole drawing groove, and the pre-hole groove, the stretching groove, the punching groove and the hole drawing groove are in one-to-one correspondence with the pre-hole punch, the stretching punch, the punching punch and the hole drawing punch. The utility model discloses not only reducible copper material shaping is strained, the product warp and the problem that the demoulding is not in the same direction as, and the concentricity precision is high, and position concentricity stability is good, can improve the yields of processing procedure production. In addition, the punching head is changed into fixed direction by original free direction, and the direction precision improves greatly, and the broken drift of drift also is difficult for wearing and tearing during the volume production, can effectively promote mould part life and stably promote the production quality.
Description
Technical Field
The utility model relates to a mould especially relates to a high-accuracy mould of cell-phone board in a poor light abnormal shape hole shaping.
Background art:
with the development of society, the electronic products are updated as fast as the dragon, and the requirements of people on mobile phones are higher and higher. The backlight source is an important part in the field of mobile phone screen manufacturing, and a backlight plate is arranged on the outer side of the backlight source and used for mounting and limiting the backlight source. In order to meet the demand of mobile phones developing toward light and thin, the backlight plate is usually made thinner and softer. The backlight plate is provided with a stretching hole (as shown in fig. 1) at a position corresponding to the camera or the lamp, and the stretching hole extends outwards to form a side edge 10 a. However, the backlight plate is thin and soft, so that the lateral edge 10a of the stretching hole is easy to be damaged and broken, the fold is deformed, and the heights are different in the punching process, and further the problems of poor light leakage, camera shooting and shooting effects of the mobile phone are caused.
The utility model has the following contents:
based on this, the utility model discloses a main aim at provides a cell-phone board in a poor light dysmorphism hole shaping high-accuracy mould to solve the tensile hole edge of traditional cell-phone piece in a poor light easy problem that is cracked, the fold warp, the height differs of being strained.
In order to achieve the purpose, the utility model provides a special-shaped hole forming high-precision die for a mobile phone backlight plate;
a high-precision die for molding special-shaped holes of a backlight plate of a mobile phone comprises an upper die base, a punch group, a lower die base and a female die cavity group; the punch is assembled on the bottom surface of the upper die base, the female die cavity group is arranged on the top surface of the lower die base, and the punch group and the female die cavity are arranged in an up-down opposite mode; the punch group comprises a pre-hole punch, a stretching punch, a punching punch and a hole drawing punch, a feeding port and a discharging port are arranged on the special-shaped hole forming high-precision die of the mobile phone backlight plate, and the pre-hole punch, the stretching punch, the punching punch and the hole drawing punch are sequentially arranged from the feeding port to the discharging port; the pre-hole punch, the stretching punch and the punching punch are all arranged in a cylindrical shape with a horizontal bottom surface, and a round guiding structure is arranged between the side surface and the bottom end surface of the stretching punch; the female die cavity group comprises a pre-hole groove, a stretching groove, a punching groove and a hole drawing groove, wherein the pre-hole groove, the stretching groove, the punching groove and the hole drawing groove are arranged in a one-to-one correspondence with the pre-hole punch, the stretching punch, the punching punch and the hole drawing punch.
Furthermore, the outer diameter of the stretching punch is larger than the outer diameters of the pre-hole punch and the punching punch, the outer diameter of the punching punch is larger than the outer diameter of the pre-hole punch, and the maximum outer diameter of the hole drawing punch is larger than the outer diameter of the stretching punch.
Furthermore, the sizes and the shapes of the pre-hole groove, the stretching groove and the hole drawing groove are consistent with the external sizes of the corresponding punches,
furthermore, the depth of the punching groove is consistent with that of the pre-hole groove, the depth of the hole drawing groove is larger than that of the punching groove, and the inner diameter of the hole drawing groove is also larger than that of the stretching groove.
Furthermore, the punching groove comprises an outer groove and an inner groove arranged on the bottom surface of the outer groove, the outer groove is consistent with the size specification of the hole drawing groove, and the inner groove is consistent with the external dimension of the punching punch.
And further, the device also comprises a material pushing device, and the material pushing device pushes the products to be processed into the upper parts of the grooves in sequence from the material inlet so as to process the products.
To sum up, the utility model discloses a set up cope match-plate pattern subassembly, drift subassembly and lower bolster subassembly, the reducible copper material shaping of setting of drift subassembly is strained, the product warp and the problem that the deciduate is not in proper order, and the concentricity precision is high, and position concentricity stability is good to can improve the yields of processing procedure production. The punching head is changed from original free guiding to fixed guiding, the guide precision greatly improves the production time drift and is difficult to wear and break the drift, can effectively promote the die part life and stably promote the production quality. The utility model discloses a practicality is strong, has stronger popularization meaning.
Drawings
FIG. 1 is a schematic cross-sectional view of a draw hole;
fig. 2 is a schematic structural view of the high-precision mold for molding the special-shaped hole of the backlight plate of the mobile phone of the present invention;
fig. 3 is an exploded view of the mold of fig. 2 and an enlarged view of a part of the structure thereof.
The specific implementation mode is as follows:
in order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and embodiments.
As shown in fig. 2 and fig. 3, it is a high-precision mold for molding special-shaped holes of backlight plates of mobile phones provided by the present invention, wherein the high-precision tool is used for processing the stretching holes 10a shown in fig. 1. The high-precision die for molding the special-shaped hole of the backlight plate of the mobile phone comprises an upper die holder 10, a punch group 20, a lower die holder 30 and a female die cavity group 40. The punch set 20 is arranged on the bottom surface of the upper die base 10, the female die cavity set 40 is arranged on the top surface of the lower die base 30, and the punch set 20 and the female die cavity 40 are arranged in a vertically opposite mode.
The punch group 20 comprises a pre-hole punch 21, a stretching punch 22, a punching punch 23 and a hole drawing punch 24, a feeding port and a discharging port are formed in the special-shaped hole forming high-precision die of the mobile phone backlight plate, and the pre-hole punch 21, the stretching punch 22, the punching punch 23 and the hole drawing punch 24 are sequentially arranged from the feeding port to the discharging port. In this embodiment, the pre-hole punch 21, the drawing punch 22, and the piercing punch 23 are all provided in a cylindrical shape. The difference between the three is that the bottom ends of the pre-hole punch 21 and the punching punch 22 are horizontally arranged; the bottom end of the drawing punch 22 is also arranged in a horizontal plane, but a rounded corner structure is arranged between the side surface and the bottom end surface. And the end of the hole drawing punch 23 is arranged in a bullet shape with the outer diameter gradually reduced from top to bottom. The outer diameter of the drawing punch 22 is larger than the outer diameters of the pre-hole punch 21 and the punching punch 23, the outer diameter of the punching punch 23 is larger than the outer diameter of the pre-hole punch 21, and the maximum outer diameter of the draw punch 23 is larger than the outer diameter of the drawing punch 22.
The female die cavity group 40 comprises a pre-hole groove 41, a stretching groove 42, a punching groove 43 and a hole drawing groove 44, wherein the pre-hole groove 41, the stretching groove 42, the punching groove 43 and the hole drawing groove 44 are arranged in one-to-one correspondence with the pre-hole punch 21, the stretching punch 22, the punching punch 23 and the hole drawing punch 24. The sizes and shapes of the pre-hole groove 41, the drawing groove 42 and the hole drawing groove 44 are all consistent with the corresponding punch external dimensions. The punching groove 43 includes an outer groove 431 and an inner groove 432 provided on the bottom surface of the outer groove 431, the outer groove 431 and the drawing groove 42 have the same dimension, and the inner groove 432 and the outer dimension of the punching punch 23 have the same dimension. The inner groove 432 has a smaller diameter than the outer groove 431, but the inner groove 432 has a larger diameter than the pre-hole groove 41. The depth of the punching groove 43 is the same as that of the pre-hole groove 41, the depth of the hole drawing groove 42 is larger than that of the punching groove 43, and the inner diameter of the hole drawing groove is larger than that of the hole drawing groove 42.
In addition, the high-precision die for molding the special-shaped hole of the backlight plate of the mobile phone is further provided with a material pushing device (not shown), the backlight plate is pushed into the die from a material inlet by the material pushing device, the backlight plate is punched by the pre-hole punch 21, a pre-hole is formed in the backlight plate, the backlight plate is pushed to the position right below the stretching punch 22 by the material pushing device, the pre-hole is arranged in the middle and corresponds to the stretching groove 42, and the stretching punch 22 is sunken downwards on the backlight plate by taking the pre-hole as the center to form a stretching groove. The punching punch 23 punches the hole by taking the pre-hole as the center in the stretching groove, the outer side of the bottom surface of the stretching groove is expanded to form a side edge, the hole drawing punch 24 moves downwards to expand the punched hole to the required size, meanwhile, the pointed structure is arranged, so that a good alignment function can be achieved, the punched hole can be gradually expanded, and the problem that the side wall is too thin and breaks due to one-time expansion of the punched hole can be avoided.
To sum up, the utility model discloses a set up cope match-plate pattern subassembly, drift subassembly and lower bolster subassembly, the reducible copper material shaping of setting of drift subassembly is strained, the product warp and the problem that the deciduate is not in proper order, and the concentricity precision is high, and position concentricity stability is good to can improve the yields of processing procedure production. The punching head is changed from the original free guide to the fixed guide, the guide precision is greatly improved, the punching head is not easy to wear and break during the mass production, the service life of the die part can be effectively prolonged, and the production quality can be stably improved. The utility model discloses a practicality is strong, has stronger popularization meaning.
The above-mentioned embodiments only represent one embodiment of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. The utility model provides a high-accuracy mould of special-shaped hole shaping of cell-phone board in a poor light which characterized in that: comprises an upper die holder, a punch group, a lower die holder and a female die cavity group; the punch is assembled on the bottom surface of the upper die base, the female die cavity group is arranged on the top surface of the lower die base, and the punch group and the female die cavity are arranged in an up-down opposite mode; the punch group comprises a pre-hole punch, a stretching punch, a punching punch and a hole drawing punch, a feeding port and a discharging port are arranged on the special-shaped hole forming high-precision die of the mobile phone backlight plate, and the pre-hole punch, the stretching punch, the punching punch and the hole drawing punch are sequentially arranged from the feeding port to the discharging port; the pre-hole punch, the stretching punch and the punching punch are all arranged in a cylindrical shape with a horizontal bottom surface, and a round guiding structure is arranged between the side surface and the bottom end surface of the stretching punch; the female die cavity group comprises a pre-hole groove, a stretching groove, a punching groove and a hole drawing groove, wherein the pre-hole groove, the stretching groove, the punching groove and the hole drawing groove are arranged in a one-to-one correspondence with the pre-hole punch, the stretching punch, the punching punch and the hole drawing punch.
2. The special-shaped hole forming high-precision die for the mobile phone backlight plate as claimed in claim 1, wherein the special-shaped hole forming high-precision die comprises: the outer diameter of the drawing punch is larger than that of the pre-hole punch and that of the punching punch, the outer diameter of the punching punch is larger than that of the pre-hole punch, and the maximum outer diameter of the hole drawing punch is larger than that of the drawing punch.
3. The special-shaped hole forming high-precision die for the mobile phone backlight plate as claimed in claim 1, wherein the special-shaped hole forming high-precision die comprises: the sizes and the shapes of the pre-hole groove, the stretching groove and the hole drawing groove are consistent with the external sizes of the corresponding punches.
4. The special-shaped hole forming high-precision die for the mobile phone backlight plate as claimed in claim 1, wherein the special-shaped hole forming high-precision die comprises: the depth of the punching groove is consistent with that of the pre-hole groove, the depth of the hole drawing groove is larger than that of the punching groove, and the inner diameter of the hole drawing groove is larger than that of the stretching groove.
5. The special-shaped hole forming high-precision die for the mobile phone backlight plate as claimed in claim 1, wherein the special-shaped hole forming high-precision die comprises: the punching groove comprises an outer groove and an inner groove arranged on the bottom surface of the outer groove, the outer groove is consistent with the drawing groove in size and specification, and the inner groove is consistent with the outer size of the punching punch.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201921139405.8U CN210754632U (en) | 2019-07-19 | 2019-07-19 | Special-shaped hole forming high-precision die for mobile phone backlight plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201921139405.8U CN210754632U (en) | 2019-07-19 | 2019-07-19 | Special-shaped hole forming high-precision die for mobile phone backlight plate |
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Publication Number | Publication Date |
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CN210754632U true CN210754632U (en) | 2020-06-16 |
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CN201921139405.8U Active CN210754632U (en) | 2019-07-19 | 2019-07-19 | Special-shaped hole forming high-precision die for mobile phone backlight plate |
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2019
- 2019-07-19 CN CN201921139405.8U patent/CN210754632U/en active Active
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Address after: Room 101, building 3, No. 31, jiangchengdong Road, Gaopu Town, Dongguan City, Guangdong Province Patentee after: Dongguan Juwei Electronic Technology Co.,Ltd. Address before: 523270 building C and D, fuybao Industrial Zone, shangjiangcheng, Gaopu Town, Dongguan City, Guangdong Province Patentee before: Dongguan Juwei Electronic Technology Co.,Ltd. |