CN210745794U

CN210745794U - PCB (printed circuit board) laminated mounting structure and intelligent glasses

Info

Publication number: CN210745794U
Application number: CN201921048629.8U
Authority: CN
Inventors: 高飞; 马秋收; 沈晓明; 曾祥建
Original assignee: Allgsight Intelligent Technology Suzhou Co ltd
Current assignee: Allgsight Intelligent Technology Suzhou Co ltd
Priority date: 2019-07-05
Filing date: 2019-07-05
Publication date: 2020-06-12
Anticipated expiration: 2029-07-05

Abstract

The utility model discloses a PCB layer stacks mounting structure and intelligent glasses, wherein, PCB layer stacks mounting structure and is applied to intelligent glasses, and intelligent glasses include the casing, and the casing is formed with the installation cavity, and this PCB layer stacks mounting structure includes: the first PCB board is accommodated in the mounting cavity and provided with a plurality of first circuit elements; the second PCB is accommodated in the mounting cavity and is electrically connected with the first PCB, and the second PCB is provided with a control processing unit; the first support plate is arranged in the mounting cavity and positioned between the first PCB and the second PCB, a first accommodating groove is formed in the first support plate corresponding to the plurality of first circuit elements, the first PCB is arranged on the surface of the first support plate, and the plurality of first circuit elements are accommodated and limited in the first accommodating groove; the first support plate is also provided with a second accommodating groove corresponding to the control processing unit, and the control processing unit is accommodated and limited in the second accommodating groove. The utility model provides a PCB board lamination mounting structure can improve the utilization ratio of intelligent glasses inner space.

Description

PCB (printed circuit board) laminated mounting structure and intelligent glasses

Technical Field

The utility model relates to an intelligence wearing equipment technical field, in particular to PCB board lamination mounting structure and intelligent glasses.

Background

A Printed Circuit Board (PCB) is integrated in VR, AR and other smart glasses, and components for realizing the functions of the smart glasses are integrated on the PCB. Usually this PCB board can set up on the casing of intelligent glasses, in the synthetic inner space of casing enclosure of intelligent glasses, has many spaces and not integrated the utilization, and especially the space near PCB board is generally all idle around, causes the space utilization of intelligent glasses low, is unfavorable for intelligent glasses to the direction development of miniaturization.

The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a PCB board lamination mounting structure aims at promoting intelligent glasses inner space's utilization ratio.

In order to achieve the above object, the utility model provides a PCB layer stacks mounting structure is applied to intelligent glasses, intelligent glasses include the casing, the casing is formed with the installation cavity, PCB layer stacks mounting structure includes:

the first PCB board is accommodated in the mounting cavity and provided with a plurality of first circuit elements;

the second PCB is accommodated in the mounting cavity and is electrically connected with the first PCB, and the second PCB is provided with a control processing unit; and

the first support plate is arranged in the mounting cavity and positioned between the first PCB and the second PCB, the first support plate is provided with first accommodating grooves corresponding to the first circuit elements, and the first circuit elements are accommodated and limited in the first accommodating grooves; the first support plate is provided with a second accommodating groove corresponding to the control processing unit, and the control processing unit is accommodated and limited in the second accommodating groove.

In an embodiment of the present invention, two first accommodating grooves are formed at an interval on one side of the first support plate facing the first PCB;

each the diapire of first holding tank is equipped with the support column, the support column with first PCB board is connected.

In an embodiment of the present invention, a spacer portion is further formed between the two first accommodating grooves of the first support plate, and the spacer portion abuts against the first PCB;

the second accommodating groove is formed in one side, back to the spacer portion, of the first support plate.

In an embodiment of the present invention, a plurality of first circuit elements are disposed on a side of the first PCB facing the spacer portion;

the spacer part is provided with a plurality of avoiding holes corresponding to the first circuit elements, and the avoiding holes are communicated with the second accommodating groove; the first circuit elements are accommodated in the avoiding holes.

In an embodiment of the present invention, a heat conducting member is further disposed on the bottom wall of the second accommodating groove, and the control processing unit is attached to the heat conducting member;

and/or a limiting step is further formed on the first support plate adjacent to the notch of the second accommodating groove, and the edge of the second PCB is in limiting abutting joint with the limiting step.

In an embodiment of the present invention, the PCB layer stacking and mounting structure further includes a second supporting plate disposed on a side of the second PCB plate opposite to the first supporting plate;

a plurality of second circuit elements arranged at intervals are arranged on one side, facing the second support plate, of the second PCB;

the second bracket plate is provided with a third accommodating groove corresponding to the plurality of second circuit elements, and the plurality of second circuit elements are accommodated in the third accommodating groove.

In an embodiment of the present invention, the second PCB further has positioning holes formed at opposite ends thereof;

and one side of the second support plate facing the second PCB is provided with a positioning column corresponding to the positioning hole, and the positioning column is accommodated and limited in the positioning hole.

In an embodiment of the present invention, the PCB layer stacking and mounting structure further includes a third PCB disposed on a side of the second supporting board opposite to the second PCB;

the PCB laminated mounting structure further comprises a board-to-board connector for connecting the second PCB and the third PCB, and a through hole for the board-to-board connector to pass through is formed in the bottom wall of the third accommodating groove.

In an embodiment of the present invention, the PCB layer stacking and mounting structure further includes a third supporting plate disposed on a side of the third PCB plate opposite to the second supporting plate;

a plurality of third circuit elements arranged at intervals are arranged on one side, facing the third support plate, of the third PCB;

the third supporting plate is provided with a fourth accommodating groove corresponding to the plurality of third circuit elements, and the plurality of third circuit elements are accommodated in the fourth accommodating groove.

In addition, the utility model also provides an intelligent glasses, including the above-mentioned PCB board lamination mounting structure;

the intelligent glasses comprise a shell, wherein the shell is provided with an installation cavity, and the PCB laminating installation structure is arranged in the installation cavity.

The utility model discloses technical scheme is through setting up first support plate in the installation cavity that intelligent glasses casing formed to set up first PCB board and second PCB board in the both sides of first support plate, first PCB face is equipped with a plurality of first circuit component to one side of first support plate, the second PCB board is equipped with the control processing unit towards one side of first support plate, the both sides of first support plate are equipped with the first holding tank that can hold a plurality of first circuit component respectively, and can hold the second holding tank of control processing unit. With this, through the circuit component with in the intelligent glasses, set up respectively on first PCB board and second PCB board, and set up first PCB board and second PCB board respectively in the both sides of first support plate, hold a plurality of first circuit component on the first PCB board through first holding tank, hold the control processing unit on the second PCB board through the second holding tank, make full use of the space on the first support plate, promoted the utilization ratio of intelligent glasses inner space.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic diagram of an explosion structure of the smart glasses of the present invention;

fig. 2 is a schematic structural view of the PCB laminated mounting structure of the present invention;

FIG. 3 is an enlarged schematic view of portion A of FIG. 2;

FIG. 4 is a schematic diagram of the exploded structure of FIG. 2;

fig. 5 is an enlarged schematic view of a portion B in fig. 4.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				1	Shell body	5	Second bracket plate
11	Mounting cavity	51	Third holding tank
				2	First support plate	52	Positioning column
21	First holding tank	53	Through hole
				22	Second holding tank	6	Third PCB board
23	Spacer part	61	Third circuit element
				231	Avoiding hole	7	Board-to-board connector
24	Support column	8	Third support plate
				25	Limiting step	81	The fourth accommodating groove
3	First PCB board	811	Top block
				31	First circuit element	82	Bump
4	Second PCB board	821	Limiting groove
				41	Control processing unit	9	Camera head
42	Second circuit element	91	Connecting terminal
				43	Locating hole

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. Throughout this document, "and/or" is meant to include three juxtaposed cases, exemplified by "A and/or B," including case A, case B, or cases where both case A and case B are satisfied. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a PCB board lamination mounting structure is applied to intelligent glasses.

In an embodiment of the present invention, referring to fig. 1 and combining fig. 2 and fig. 3, the smart glasses include a housing 1, the housing 1 is formed with a mounting cavity 11, and the PCB board stacking and mounting structure includes: a first PCB 3 accommodated in the mounting cavity 11, the first PCB 3 being provided with a plurality of first circuit elements 31; the second PCB 4 is accommodated in the mounting cavity 11 and is electrically connected with the first PCB 3, and the second PCB 4 is provided with a control processing unit 41; the first support plate 2 is arranged in the mounting cavity 11 and is positioned between the first PCB 3 and the second PCB 4, the first support plate 2 is provided with a first accommodating groove 21 corresponding to the plurality of first circuit elements 31, and the plurality of first circuit elements 31 are accommodated and limited in the first accommodating groove 21; the first rack plate 2 has a second receiving groove 22 corresponding to the processing control unit, and the control processing unit 41 is received and limited in the second receiving groove 22.

In this embodiment, the housing 1 may be made of various materials, such as plastic, and the housing 1 encloses the mounting cavity 11. First support plate 2 is located in installation cavity 11 to be connected with the inner wall of casing 1, the material of first support plate 2 can be metal or metal alloy, so that heat transfer on first PCB board 3 and the second PCB board 4 dispels the heat to first support plate 2 on, makes first circuit component 31 and control processing unit 41 normally work under safe temperature.

Printed circuits are printed on the first PCB 3 and the second PCB 4, a plurality of first circuit components 31 connected to the printed circuits on the first PCB 3 are further disposed on the first PCB 3, the first circuit components 31 may be resistors, capacitors, and the like, and the plurality of first circuit components 31 may include a plurality of circuit components, but not all the first circuit components 31 must be the same or the same circuit component. The second PCB 4 is further provided with a control processing unit 41 connected to the printed circuit on the second PCB 4, the control processing unit 41 may be a signal and data processing unit such as a chip and a single chip, of course, the number of the control processing unit 41 is not limited, and the control processing unit 41 may be additionally provided according to actual data processing requirements.

The first receiving groove 21 can receive part or all of the first circuit components 31, the number of the first receiving grooves 21 is not limited, and the first receiving grooves 21 can be correspondingly formed on the first bracket plate 2 according to the actual distribution of the plurality of first circuit components 31 on the first PCB 3. Of course, if the first PCB 3 is provided with a plurality of first receiving slots 21, the structures and the sizes of the plurality of first receiving slots 21 may be different, and the same structures and the same sizes are not necessarily adopted. The shape and size of the second receiving groove 22 match with the control processing unit 41, so that the control processing unit 41 can be completely received and limited in the second receiving groove 22, which is beneficial to saving the space on the first support plate 2. Of course, the second receiving groove 22 may also be opened large enough to allow the control processing unit 41 to be received in the second receiving groove 22, and then a sufficient space is provided between the control processing unit 41 and the inner wall of the second receiving groove 22, which is favorable for heat dissipation of the control processing unit 41.

The first PCB 3 may be electrically connected to the second PCB 4 by means of flexible wiring strips or circuit connection wires. Specifically, an interface connected to the printed circuit on the first PCB 3 may be disposed on the first PCB 3, a port connected to the printed circuit on the second PCB 4 may be disposed on the second PCB 4, and the interface and the port are connected by a flexible circuit tape or a circuit connection line, so as to electrically connect the first PCB 3 and the second PCB 4.

This embodiment scheme is through setting up first support plate 2 in the installation cavity 11 that intelligence glasses casing 1 formed, and set up first PCB board 3 and second PCB board 4 in the both sides of first support plate 2, first PCB board 3 is equipped with a plurality of first circuit component 31 towards one side of first support plate 2, second PCB board 4 is equipped with control processing unit 41 towards one side of first support plate 2, the both sides of first support plate 2 are equipped with first holding tank 21 that can hold a plurality of first circuit component 31 respectively, and can hold control processing unit 41's second holding tank 22. With this, through the circuit component with in the intelligent glasses, set up respectively on first PCB board 3 and second PCB board 4, and set up first PCB board 3 and second PCB board 4 respectively in the both sides of first PCB board 2, hold a plurality of first circuit component 31 on the first PCB board 3 through first holding tank 21, hold control processing unit 41 on the second PCB board 4 through second holding tank 22, make full use of the space on the first PCB board 2, the utilization ratio of intelligent glasses inner space has been promoted.

In an embodiment of the present invention, referring to fig. 2 and combining with fig. 3, two first accommodating grooves 21 are formed at an interval on one side of the first support plate 2 facing the first PCB 3; the bottom wall of each first accommodating groove 21 is provided with a supporting pillar 24, and the supporting pillar 24 is connected with the first PCB 3.

In this embodiment, a plurality of first circuit components 31 are respectively provided with at the both ends of first PCB 3, a first holding tank 21 has respectively been seted up at the both ends of first support plate 2, each first holding tank 21 all can correspond and hold a plurality of first circuit components 31, the diapire of each first holding tank 21 is provided with at least one support column 24, the one end that first support plate 2 was kept away from to each support column 24 is connected in first PCB 3, so that first PCB 3 is reliably positioned on first support plate 2 through at least one support column 24, the stability that first PCB 3 and first support plate 2 are connected has also been guaranteed.

In an embodiment of the present invention, referring to fig. 2 and combining fig. 3, the first bracket plate 2 further forms a spacer portion 23 between the two first accommodating grooves 21, and the spacer portion 23 abuts against the first PCB plate 3; the second receiving groove 22 is opened at a side of the first rack plate 2 facing away from the spacer part 23.

In this embodiment, the spacer portion 23 is formed between the two first receiving grooves 21 of the first bracket board 2, the spacer portion 23 is a protruding structure on the first bracket board 2, and the vertical height of the spacer portion 23 is equal to the groove depth of the limiting groove 821, so that when the first PCB 3 is connected to the first bracket board 2, one end of the spacer portion 23 away from the first bracket board 2 abuts against the first PCB 3. With this, the first PCB 3 is reliably positioned on the first support plate 2 by the support posts 24 and the spacer parts 23, ensuring stability of connection of the first PCB 3 and the first support plate 2.

In an embodiment of the present invention, referring to fig. 4 and combining with fig. 5, a plurality of first circuit elements 31 are disposed on a side of the first PCB 3 facing the spacer portion 23; the spacer portion 23 has a plurality of clearance holes 231 corresponding to the first circuit components 31, and the clearance holes 231 are communicated with the second receiving grooves 22; the plurality of first circuit elements 31 are accommodated in the clearance holes 231.

In the present embodiment, the first PCB 3 is further provided with a plurality of first circuit elements 31 on a side facing the spacer portion 23, the plurality of first circuit elements 31 are disposed right opposite to the spacer portion 23, and the spacer portion 23 is correspondingly provided with a plurality of avoiding holes 231 for avoiding the plurality of first circuit elements 31. Through the setting of avoiding a hole 231, the utilization ratio in space on first support plate 2 has further been promoted, also makes the distribution setting of a plurality of first circuit component 31 on the first PCB board 3 more nimble.

In an embodiment of the present invention, the bottom wall of the second accommodating groove 22 is further provided with a heat conducting member (not shown), and the control processing unit 41 is attached to the heat conducting member.

In this embodiment, the heat conducting member may be a heat conducting adhesive, a metal heat conducting sheet, and the like, which is not limited herein. The heat conducting member is disposed on the bottom wall of the second accommodating groove 22, and one side of the heat conducting member away from the bottom wall of the second accommodating groove 22 abuts against and is attached to the control processing unit 41. Because the control processing unit 41 needs to process a huge amount of data signals, the heat generation amount is generally large, and the heat dissipation efficiency of the control processing unit 41 can be improved by arranging the heat conducting member, so that the control processing unit 41 is prevented from being damaged due to overheating. It can be understood that, when the heat conducting member is a heat conducting adhesive, the heat conducting member can also be coated on a side of the control processing unit 41 facing the second PCB 4, so as to improve the heat dissipation efficiency of the control processing unit 41.

In an embodiment of the present invention, referring to fig. 4 and combining fig. 2, fig. 3 and fig. 5, a limiting step 25 is further formed on the notch of the first support plate 2 adjacent to the second accommodating groove 22, and the edge of the second PCB 4 is in limit abutment with the limiting step 25.

In this embodiment, the limiting step 25 may be disposed annularly, and may also be formed on two opposite sidewalls of the second accommodating groove 22, and the edge of the second PCB 4 abuts against and is limited by the limiting step 25, so that the second PCB 4 is accommodated and limited in the second accommodating groove 22. Through setting up spacing step 25, make second PCB board 4 hold and spacing in second holding tank 22 through spacing step 25, promoted the reliability of second PCB board 4 location on first support plate 2, be favorable to making the accurate spacing in second holding tank 22 of control processing unit 41 on the second PCB board 4, guarantee the accurate counterpoint and the connection of second PCB board 4 and first support plate 2.

In an embodiment of the present invention, referring to fig. 4 and shown in fig. 5, the smart glasses further include a second supporting board 5 disposed on a side of the second PCB 4 opposite to the first supporting board 2; a plurality of second circuit elements 42 arranged at intervals are arranged on one side of the second PCB 4 facing the second bracket plate 5; the second supporting board 5 has a third receiving groove 51 corresponding to the plurality of second circuit elements 42, and the plurality of second circuit elements 42 are received in the third receiving groove 51.

In this embodiment, the second supporting board 5 may be made of metal or metal alloy, so that heat on the second PCB 4 is transferred to the second supporting board 5 for heat dissipation, so that the plurality of second circuit elements 42 can normally operate at a safe temperature.

A plurality of second circuit elements 42 are disposed on a side of the second PCB 4 facing away from the control processing unit 41, the second circuit elements 42 may be resistors, capacitors, and the like, and the plurality of second circuit elements 42 may include a plurality of circuit elements, but not all the second circuit elements 42 must be the same or identical circuit elements.

Through set up third holding tank 51 on second mounting panel 5, make a plurality of second circuit component 42 on second PCB board 4 can hold in third holding tank 51, be favorable to protecting second circuit component 42, and can arrange more circuit component through installing other PCB boards on second mounting panel 5, have better scalability.

In an embodiment of the present invention, referring to fig. 4 and combining with fig. 5, the second PCB 4 is further provided with positioning holes 43 at opposite ends thereof; one side of the second supporting plate 5 facing the second PCB 4 is provided with a positioning post 52 corresponding to the positioning hole 43, and the positioning post 52 is received and limited in the positioning hole 43.

In the present embodiment, the size and shape of the positioning hole 43 are matched with the size and shape of the positioning column 52, so that the positioning column 52 can pass through the positioning hole 43, the outer peripheral wall of the positioning column 52 abuts against the inner wall of the positioning hole 43, and the interference fit between the positioning column 52 and the positioning hole 43 is preferably realized.

Through the arrangement of the positioning columns 52 and the positioning holes 43, the second supporting plate 5 can be accurately positioned on the second PCB 4 through the insertion fit of the positioning columns 52 and the positioning holes 43, so that the plurality of second circuit components 42 can be accurately accommodated and limited in the third accommodating groove 51.

In an embodiment of the present invention, referring to fig. 4 and shown in fig. 5, the smart glasses further include a third PCB 6 disposed on a side of the second supporting board 5 opposite to the second PCB 4; the intelligent glasses further comprise a board-to-board connector 7 connected with the second PCB 4 and the third PCB 6, and the bottom wall of the third accommodating groove 51 is provided with a through hole 53 for the board-to-board connector 7 to pass through.

In this embodiment, the third PCB 6 is printed with a printed circuit, the first PCB 3 and the second PCB 4 are electrically connected to the board-to-board connector 7, the signal transmission capability of the board-to-board connector 7 is strong and the connection is stable, and efficient signal transmission between the first PCB 3 and the second PCB 4 can be realized.

The size and shape of the through hole 53 match those of the board-to-board connector 7. The through hole 53 is used for avoiding the position of the board to board connector 7, after the first PCB board 3, the second support board 5 and the second PCB board 4 are connected in sequence, the board to board connector 7 penetrates through the through hole 53, and the two opposite ends of the board to board connector 7 are connected to the first PCB board 3 and the second PCB board 4 respectively. Through the setting of through-hole 53, keep away the position to the board connecting piece, make the board to board connector 7 can hold and spacing in through-hole 53 to this, further promoted intelligent glasses inner space's utilization ratio.

In an embodiment of the present invention, referring to fig. 4 and shown in fig. 5, the smart glasses further include a third supporting board 8 disposed on a side of the third PCB 6 opposite to the second supporting board 5; a plurality of third circuit elements 61 arranged at intervals are arranged on one side of the third PCB 6 facing the third bracket plate 8; the third supporting plate 8 has a fourth receiving groove 81 corresponding to the plurality of third circuit elements 61, and the plurality of third circuit elements 61 are received in the fourth receiving groove 81.

In this embodiment, the third supporting board 8 may be made of metal or metal alloy, so that heat on the third PCB 6 is transferred to the third supporting board 8 for heat dissipation, so that the plurality of third circuit elements 61 can normally operate at a safe temperature.

The third circuit elements 61 may be resistors, capacitors, and the like, and a plurality of third circuit elements 61 may include a plurality of circuit elements, but not all of the third circuit elements 61 must be the same or identical circuit elements.

Through set up fourth holding tank 81 on third mounting panel 8, make a plurality of third circuit component 61 on third PCB board 6 can hold in fourth holding tank 81, be favorable to protecting third circuit component 61, and can arrange more circuit component through installing other PCB boards on third mounting panel 8, have better scalability.

In an embodiment of the present invention, referring to fig. 4 and combining with fig. 5, a top block 811 is protruded from a bottom wall of the fourth accommodating groove 81; when the third supporting board 8 is connected to the third PCB 6, the top block 811 abuts against the third PCB 6.

In this embodiment, the top block 811 may be integrally formed with the third supporting plate 8, and the material of the top block 811 may be metal or metal alloy, which is not limited herein. The top block 811 is not limited in shape and may be rectangular, semicircular, etc.

Set up kicking block 811 through the diapire at fourth holding tank 81, when making third mounting panel 8 be connected with third PCB board 6, the one end butt that fourth holding tank 81 diapire was kept away from to kicking block 811 in third PCB board 6, makes third PCB board 6 closely laminate with second mounting panel 5, has guaranteed the compactness and the intensity of connecting between second mounting panel 5, third PCB board 6 and the third mounting panel 8.

In an embodiment of the present invention, referring to fig. 4 and combining with fig. 5, a bump 82 is convexly disposed on a side of the third supporting board 8 facing away from the third PCB 6, and the bump 82 is formed with a limiting groove 821 communicated with a bottom wall of the fourth accommodating groove 81; the intelligent glasses further comprise a camera 9 accommodated and limited in the limiting groove 821, and the camera 9 is electrically connected with the second PCB 4.

In this embodiment, the shape and size of the limiting groove 821 are matched with those of the camera 9, so that the camera 9 can be accommodated in the limiting groove 821, and the outer wall of the camera 9 abuts against the inner wall of the limiting groove 821. The second PCB 4 integrates a power circuit for supplying power to the first PCB 3 and the third PCB 6. The second PCB 4 is provided with a power supply and a power interface connected to the power supply. Third PCB 6 corresponds camera 9 and has seted up first position portion of keeping away (not shown), and second mounting panel 5 corresponds camera 9 and has seted up the second and keep away position portion (not shown), so that connecting terminal 91 on the camera 9 can pass in proper order and connect the power source on second PCB 4 after the first position portion of keeping away on third PCB 6 and the second position portion of keeping away on second mounting panel 5, in order to realize second PCB 4 and camera 9's electricity and be connected, and supply power to camera 9 through second PCB 4.

The utility model also provides an intelligent glasses, this intelligent glasses include PCB board stack mounting structure in the above-mentioned embodiment, and this intelligent glasses still includes casing 1, and casing 1 is formed with installation cavity 11, and PCB board stack mounting structure locates in installation cavity 11. The specific structure of the PCB laminated mounting structure refers to the above embodiments, and since the smart glasses adopt all technical solutions of all the above embodiments, all beneficial effects brought by the technical solutions of the above embodiments are at least achieved, and are not repeated here.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. The utility model provides a PCB board lamination mounting structure, is applied to intelligent glasses, intelligent glasses include the casing, the casing is formed with the installation cavity, its characterized in that, PCB board lamination mounting structure includes:

2. The PCB laminated mounting structure of claim 1, wherein one side of the first bracket plate facing the first PCB is formed with two first receiving grooves spaced apart from each other;

3. The PCB panel stacking and mounting structure of claim 2, wherein the first bracket plate is further formed with a spacer portion between the two first receiving grooves, the spacer portion abutting against the first PCB panel;

4. The PCB board stack-up mounting structure of claim 3, wherein a side of the first PCB panel facing the spacer part is provided with a plurality of first circuit components;

5. The PCB board stack-up mounting structure of claim 1, wherein the bottom wall of the second receiving groove is further provided with a heat conductive member, and the control processing unit is attached to the heat conductive member;

6. The PCB board stack-up mounting structure of any one of claims 1 to 5, further comprising a second bracket plate provided at a side of the second PCB plate facing away from the first bracket plate;

7. The PCB stacking and mounting structure of claim 6, wherein the second PCB is further provided with positioning holes at opposite ends;

8. The PCB stack mounting structure of claim 6, further comprising a third PCB disposed on a side of the second bracket plate facing away from the second PCB;

9. The PCB board stack-up mounting structure of claim 8, further comprising a third bracket plate disposed on a side of the third PCB plate facing away from the second bracket plate;

10. Smart eyewear comprising a PCB board lamination mounting structure according to any one of claims 1 to 9;