CN210745655U

CN210745655U - Electronic device

Info

Publication number: CN210745655U
Application number: CN201790001441.0U
Authority: CN
Inventors: 马场贵博; 用水邦明
Original assignee: Murata Manufacturing Co Ltd
Current assignee: Murata Manufacturing Co Ltd
Priority date: 2016-12-28
Filing date: 2017-12-26
Publication date: 2020-06-12
Anticipated expiration: 2027-12-26
Also published as: WO2018124004A1

Abstract

The utility model provides an electronic equipment. An electronic device (101) is provided with a circuit board (5), a first element (1) and a second element (2) which are surface-mounted on the circuit board (5), and a third element (3) which is mounted so as to straddle the first element (1) and the second element (2). The first connection portion of the first element (1) is connected to the circuit board (5) via a conductive bonding material, and the third connection portion electrode of the second element (2) is connected to the circuit board (5) via a conductive bonding material. The third element (3) has a fifth connecting portion and a sixth connecting portion formed on the same surface, the second connecting portion (T2) of the first element (1) and the fifth connecting portion of the third element are connected via a conductive bonding material, and the fourth connecting portion (T4) of the second element (2) and the sixth connecting portion of the third element (3) are connected via a conductive bonding material.

Description

Electronic device

Technical Field

The present invention relates to an electronic device, and more particularly to an electronic device including a circuit board and a plurality of elements mounted on the circuit board.

Background

In recent years, with the development of high-frequency electronic devices such as mobile communication terminals, which are highly functional and compact, there are cases where a sufficient space for accommodating a coaxial cable cannot be secured in a terminal housing. Therefore, a flat cable including a transmission line formed by stacking thin base material sheets is sometimes used.

Patent document 1 discloses an electronic device configured such that a first element is connected to a circuit formed on a circuit board by bonding a plurality of electrodes exposed at an end portion of a flat cable to a plurality of electrodes formed on the circuit board.

Prior art documents

Patent document

Patent document 1: international publication No. 2016/088592

SUMMERY OF THE UTILITY MODEL

Problem to be solved by utility model

In the electronic apparatus shown in patent document 1, a small-sized electronic apparatus can be realized as compared with a case where a cable is connected to a circuit formed on a circuit board using a connector (socket) or the like. In addition, in the above configuration, since a connector (receptacle) or the like is not required, the number of components can be reduced.

The flat cable can be surface-mounted on the circuit board by the same method (process) as that of a general chip component. However, if the circuit board is long, handling during transportation becomes difficult, or the stability of the posture on the circuit board tends to be lowered.

A structure may be adopted in which a plurality of relatively short flat cables are mounted on a circuit board and are relayed by conductor patterns on the circuit board, but in such a structure, problems (a) and (b) described below occur, and as a result, the occupied area on the circuit board required for connection between the flat cables may increase.

(a) When a large number of electrodes are arranged at the end of the flat cable in a concentrated manner, not only the area of the end of the flat cable increases, but also another conductor pattern cannot be formed on the circuit board facing the end of the flat cable.

(b) According to the arrangement of many electrodes exposed at the end of the flat cable, a plurality of conductor patterns connecting the electrodes to each other cannot be routed on the circuit substrate at the shortest distance. Therefore, the line length of the plurality of conductor patterns is increased, and a large space for routing the plurality of conductor patterns is required on the surface of the circuit board.

The above-described problems occur not only in the flat cable but also in an electronic device in which a long device is mounted on a circuit board.

Therefore, an object of the present invention is to provide an electronic apparatus in which, in a configuration in which a plurality of elongated elements are mounted on a circuit board, an occupied area on the circuit board is reduced without reducing mountability to the circuit board.

Means for solving the problems

(1) The electronic device of the present invention is configured as follows.

The utility model discloses an electronic equipment possesses: a circuit substrate; a first element and a second element which are surface-mounted on the surface of the circuit board; and a third element mounted on the first element and the second element.

The first element and the second element have a smaller planar shape than the circuit board.

The first element has:

a first surface opposed to the front surface of the circuit board and a second surface opposite to the first surface;

a plurality of side surfaces connecting the first surface and the second surface;

a first end portion and a second end portion in a direction along the surface of the circuit substrate;

a first connection electrode formed on the first surface of the first end portion; and

a second connection portion electrode formed on the second surface of the second end portion.

The second element has:

a third surface facing the surface of the circuit board, and a fourth surface that is an opposite surface of the third surface;

a third end portion and a fourth end portion in a direction along the surface of the circuit substrate;

a third connection portion electrode formed on the third surface of the third end portion; and

a fourth connection electrode formed on the fourth surface of the fourth end portion.

The first connection portion electrode and the third connection portion electrode are connected to the circuit board via a conductive bonding material.

Further, the third element has:

a fifth aspect; and

and a fifth connection portion electrode and a sixth connection portion electrode formed on the fifth surface.

The second connection portion electrode and the fifth connection portion electrode are connected via a conductive bonding material, and the fourth connection portion electrode and the sixth connection portion electrode are connected via a conductive bonding material.

With the above configuration, the circuit board does not require a conductor pattern for connecting the first element and the second element, and the area occupied by the second connection portion and the fourth connection portion on the circuit board is minimized.

(2) In the case where the first element and the second element are used as transmission lines provided on a circuit board, the first element, the second element, and the third element each have a transmission line including a high-frequency signal line and a ground conductor, and the transmission line of the first element and the transmission line of the second element are connected via the transmission line of the third element by connection of the second connection portion electrode and the fifth connection portion electrode and connection of the fourth connection portion electrode and the sixth connection portion electrode. With this configuration, it is possible to configure an electronic device including a transmission line on a circuit board without forming a special conductor pattern for relaying the transmission line on the circuit board.

(3) Preferably, the first end portion and the second end portion are wider than a width of a region other than the first end portion and the second end portion. This makes it possible to improve the positional stability of the first element on the circuit board without excessively increasing the mounting area on the circuit board, and to facilitate surface mounting.

(4) Preferably, the circuit board has a dielectric portion and a conductor portion, the first element and the second element have a dielectric portion and a conductor portion, respectively, the dielectric portion of the first element has a dielectric loss lower than that of the dielectric portion of the circuit board, and the dielectric portion of the second element has a dielectric loss lower than that of the dielectric portion of the circuit board. Thus, the circuit board having a large dielectric loss is used, but the circuit of the first element and the circuit of the second element can be reduced in loss.

(5) Preferably, the third element has a dielectric portion and a conductor portion, and the dielectric portion of the third element has a dielectric loss lower than that of the dielectric portion of the circuit substrate. Thus, the circuit board having a large dielectric loss is used, but the circuit of the third element can be reduced in loss.

(6) Preferably, the first element, the second element, and the third element are each formed of a multilayer substrate in which a plurality of resin base materials including a resin base material on which a conductor pattern is formed are laminated. This can reduce the mounting area on the circuit board. Further, the first element, the second element, and the third element can be arranged at positions having different heights and angles by providing flexibility.

(7) Preferably, the raw materials of the resin base material of the first member, the second member, and the third member are the same. This makes the coefficients of linear expansion and the elastic modulus of the first element, the second element, and the third element uniform, and improves the mountability. Further, the bonding strength between the elements is improved along with this.

(8) Preferably, a part or all of the second end portion is thinner than a portion connected to the second end portion. This can reduce the height of the portion where the first element and the third element overlap.

(9) Preferably, the fifth connection electrode forming portion has a recess including an inner side surface along the plurality of side surfaces of the second connection electrode forming portion. This can reduce the height of the portion where the first element and the third element overlap, and further improve the positional accuracy of the first element and the third element in the planar direction.

(10) Preferably, the recess is a shaped portion in which a forming portion of the second connection portion electrode is fitted into the recess. This facilitates improvement in positional accuracy in the planar direction of the first element and the third element.

(11) Preferably, a region of the first element other than the first connection portion electrode is bonded to the circuit substrate with a non-conductive bonding material. This improves the bonding strength of the first element to the circuit board.

(12) Preferably, a region of the first element other than the second connection portion electrode is bonded to the third element with a non-conductive bonding material. This improves the bonding strength between the first element and the third element.

(13) Preferably, the first element has a dummy electrode formed on the first surface of the second end portion, the circuit board has a substrate-side dummy electrode opposed to the dummy electrode, and the dummy electrode is connected to the substrate-side dummy electrode. This improves the mountability of the first element to the circuit board. In addition, the mountability of the third element with respect to the first element is also improved.

(14) The electronic device may further include an element mounted on the circuit board, and the third element may be disposed at a position across the element. With this configuration, the degree of freedom in the arrangement of the first element, the second element, and the third element on the circuit substrate is improved.

Effect of the utility model

According to the present invention, in the structure in which the plurality of elongated elements are mounted on the circuit board, the occupied area on the circuit board can be reduced without deteriorating the mountability to the circuit board.

Drawings

Fig. 1 is an exploded perspective view of a main part of an electronic apparatus 101 according to a first embodiment.

Fig. 2 is an exploded perspective view of a main part of the electronic apparatus 101 according to the first embodiment.

Fig. 3 is a perspective view of a main portion of the electronic apparatus 101.

Fig. 4A is a longitudinal sectional view of a portion X-X in fig. 3, and fig. 4B is a longitudinal sectional view of a portion Y-Y in fig. 3.

Fig. 5 is a perspective view of the first element 1.

Fig. 6 is an exploded perspective view of the first member 1.

Fig. 7 is a perspective view looking up from obliquely below the third element 3.

Fig. 8 is an exploded perspective view of the third element 3.

Fig. 9A and 9B are vertical sectional views of an electronic apparatus according to a second embodiment.

Fig. 10 is a perspective view of the first element 1 according to the third embodiment.

Fig. 11 is an exploded perspective view of the first element 1 according to the third embodiment.

Fig. 12 is a perspective view of the third element according to the third embodiment viewed obliquely from below.

Fig. 13 is an exploded perspective view of the third element 3 according to the third embodiment.

Fig. 14 is an exploded perspective view of a main part of an electronic device 103 according to a third embodiment.

Fig. 15 is a perspective view of a main part of an electronic apparatus 103 according to a third embodiment.

Fig. 16 is a sectional view of a main portion of an electronic apparatus 104 of the fourth embodiment.

Fig. 17 is a plan view of a main portion of an electronic apparatus 105A according to the fifth embodiment.

Fig. 18 is a top view of a main portion of another electronic device 105B according to the fifth embodiment.

Fig. 19 is a plan view of a main portion of an electronic device 106 according to a sixth embodiment.

Fig. 20 is a plan view showing a main part of an electronic apparatus 101P of a comparative example.

Detailed Description

Hereinafter, a plurality of modes for carrying out the present invention will be described with reference to the drawings and specific examples. In the drawings, the same reference numerals are given to the same parts. The embodiments are separately shown for convenience in view of ease of explanation or understanding of the points, but partial replacement or combination of the structures shown in different embodiments can be made. In the second and subsequent embodiments, descriptions of common matters with the first embodiment will be omitted, and only differences will be described. In particular, the same operational effects due to the same configurations will not be mentioned in each embodiment.

First embodiment

Fig. 1 and 2 are exploded perspective views of main parts of an electronic apparatus 101 according to the first embodiment. Fig. 3 is a perspective view of a main portion of the electronic apparatus 101.

The electronic device 101 includes: a circuit board (5); a first element 1 and a second element 2 surface-mounted on the circuit board 5; and a third element 3 mounted on the first element 1 and the second element 2. The first element 1 and the second element 2 have a smaller planar size than the circuit board 5.

The first element 1 has a first surface (lower surface in fig. 1) S1, a second surface (upper surface in fig. 1) S2, a main body portion B1, a first end portion, a second end portion E2, a first connection portion in which a first connection portion electrode is formed on the first surface S1 of the first end portion, and a second connection portion T2 in which a second connection portion electrode is formed on the second surface S2 of the second end portion E2.

The first connection portion of the first element 1 is connected to the circuit board 5 via a conductive bonding material. The configuration of the first end of the first member 1 will be described later.

The second element 2 has a third surface (lower surface in fig. 1) S3, a fourth surface (upper surface in fig. 1) S4, a main body portion B2, a third end portion, a fourth end portion E4, a third connection portion in which a third connection portion electrode is formed on the third surface of the third end portion, and a fourth connection portion T4 in which a fourth connection portion electrode is formed on the third surface S3 of the fourth end portion E4.

The third connection portion of the second element 2 is connected to the circuit board 5 via a conductive bonding material. The configuration of the third end portion of the second member is shown later.

As shown in fig. 2, the first element 1 and the second element 2 are surface-mounted on the circuit board 5. The other components 4 required in addition to the first component 1 and the second component 2 are surface-mounted on the circuit board 5.

The third element 3 has a fifth connecting portion and a sixth connecting portion on the same surface (lower surface in fig. 2), and the second connecting portion T2 of the first element 1 and the fifth connecting portion of the third element are connected to each other via a conductive bonding material on the second surface S2 (see fig. 1) of the first element 1. Similarly, the fourth connection portion T4 of the second element 2 and the sixth connection portion of the third element 3 are connected to the fourth surface S4 (see fig. 1) of the second element 2 via a conductive bonding material.

As shown in fig. 4A, the first element 1 has a first connection portion T1 on the first surface S1 of the first end E1, on which a first connection portion electrode P1 is formed. A substrate-side connection electrode P7 is formed on the circuit substrate 5, and the first connection electrode P1 of the first element is connected to the substrate-side connection electrode P7 via a conductive bonding material SB such as solder.

As will be described later, a plurality of openings through which the ground conductor G11 is partially exposed are formed in the first surface S1 of the first element 1, and the ground conductor G11 is connected to the electrodes on the circuit board 5 via these openings.

Between the first element 1 and the circuit board 5, a region other than the connection portion of the first connection portion electrode P1 of the first element 1 and the connection portion of the ground conductor G11 is bonded to the circuit board 5 with an underfill 6 which is a non-conductive bonding material.

Further, as shown in fig. 4A, a fifth link electrode P5 is formed on the lower surface of the third element 3, and the fifth link electrode P5 of the third element is connected to the second link electrode P2 of the first element 1 via a conductive bonding material SB such as solder.

As shown in fig. 4B, the second element 2 includes a signal line SL and ground conductors G31 and G33, and a third connector T3 having a third connector electrode P3 is provided on a third surface S3 of the third end E3. A substrate-side connection electrode P8 is formed on the circuit substrate 5, and a third connection electrode P3 of the second element is connected to the substrate-side connection electrode P8 via a conductive bonding material SB such as solder.

A plurality of openings through which the ground conductor G31 is partially exposed are formed in the third surface S3 of the second element 2, and the ground conductor G31 is connected to the electrodes on the circuit board 5 through these openings.

Between the second element 2 and the circuit board 5, a region other than the connection portion of the third connection-portion electrode P3 of the second element 2 and the connection portion of the ground conductor G31 is bonded to the circuit board 5 by the underfill 6 which is a non-conductive bonding material.

Further, as shown in fig. 4B, a fifth joint electrode P5 and a sixth joint electrode P6 are formed on the lower surface of the third element 3, and the sixth joint electrode P6 of the third element 3 is connected to the fourth joint electrode P4 of the second element 2 via a conductive bonding material SB such as solder. The fifth link electrode P5 of the third element 3 is connected to the second link electrode P2 of the first element 1 via a conductive bonding material SB such as solder.

In addition, the region other than the second connection portion electrode P2 of the first element 1 may be bonded to the third element 3 with a non-conductive bonding material (underfill). Similarly, the region other than the fourth connection portion electrode P4 of the second element 2 may be bonded to the third element 3 with a non-conductive bonding material (underfill). This improves the bonding strength between the third element 3 and the first and

second elements

1 and 2.

Fig. 5 is a perspective view of the first member 1, and fig. 6 is an exploded perspective view of the first member 1. In the first element 1, the first end portion E1 and the second end portion E2 are each wider than the width of the main body portion B1 as a region other than them.

As shown in fig. 6, the first element 1 includes insulating

base materials

11, 12, and 13. A ground conductor G11 and a first connection electrode P1s are formed on the lower surface of the insulating base material 11. This first connection electrode P1s is one of the first connection electrodes P1 shown in fig. 4A and the like. A ground conductor G12 and a signal line SL are formed on the upper surface of the insulating base 12. A ground conductor G13 and a second connection portion electrode P2s are formed on the upper surface of the insulating base 13. This second connector electrode P2s is one of the second connector electrodes P2 shown in fig. 4A and the like.

The surface of the multilayer substrate composed of the insulating

base materials

11, 12, and 13 is coated with resist films R11 and R13. A plurality of openings OP exposing portions of the first connection electrode P1s and the ground conductor G11 are formed in the resist film R11. Further, a plurality of openings OP exposing portions of the second connection electrode P2s and the ground conductor G13 are formed in the resist film R13.

The insulating

substrates

11, 12, and 13 are sheets of thermoplastic resin such as Liquid Crystal Polymer (LCP), for example. The ground conductors G11, G12, G13, the signal line SL, the first connection electrode P1s, and the second connection electrode P2s are formed by patterning a Cu foil adhered to an insulating base material by photolithography or the like. The insulating

base materials

11, 12, and 13 having the conductor patterns formed thereon are stacked and heated and pressed to form a multilayer substrate. The resist films R11 and R13 are, for example, epoxy resins. Resist films R11 and R13 were printed on the multilayer substrate. These steps are processed in a state of an aggregate substrate, and are finally cut into individual pieces (individual first elements).

The circuit board 5 is also a multilayer board having a conductor pattern therein, but a filler for adjusting the coefficient of linear expansion is dispersed in a dielectric portion (insulator material) thereof. Therefore, the dielectric loss of the dielectric portion of the circuit board 5 is higher than the dielectric loss of the dielectric portions (insulating base materials) of the first element 1 and the second element 2. In other words, the dielectric loss of the dielectric portion (insulating base material) of the first element 1 and the second element 2 is lower than the dielectric loss of the dielectric portion of the circuit board 5.

In the present embodiment, as shown in fig. 6, the first element 1 is a transmission line having a strip line structure with connection portions at a first end and a second end, and is used as a cable mounted on the circuit board 5. The second element 2 has a basic structure similar to that of the first element 1, is a transmission line having a strip line structure and having connection portions at a third end and a fourth end, and is used as a cable mounted on the circuit board 5.

Fig. 7 is a perspective view looking up from obliquely below the third element 3, and fig. 8 is an exploded perspective view of the third element 3. The third element 3 has fifth and sixth connecting portions T5 and T6 formed on the same surface.

As shown in fig. 8, the third member 3 includes insulating

base materials

31, 32, and 33. A ground conductor G31, a fifth connector electrode P5s, and a sixth connector electrode P6s are formed on the lower surface of the insulating base material 31. This fifth connector electrode P5s is one of the fifth connector electrodes P5 shown in fig. 4A, 4B, and the like. Further, the sixth connector electrode P6s is one of the sixth connector electrodes P6 shown in fig. 4B and the like. A ground conductor G32 and a signal line SL are formed on the lower surface of the insulating base 32. A ground conductor G33 is formed on the lower surface of the insulating base material 33.

One surface of the multilayer substrate composed of the insulating

base materials

31, 32, and 33 is coated with a resist film R31. A plurality of openings OP exposing portions of the fifth connection-portion electrode P5s, the sixth connection-portion electrode P6s, and the ground conductor G31 are formed in the resist film R31.

In the present embodiment, as shown in fig. 8, the third element 3 is a transmission line having a strip line structure and having two connection portions T5 and T6, and is used as a cable for relaying the transmission line of the first element and the transmission line of the second element.

The third element 3 is also manufactured from the same material and by the same manufacturing method as the first element 1 and the second element 2.

After the first element 1 and the second element 2 described above are surface-mounted on the circuit board 5, a third element is mounted on the first element and the second element, thereby configuring the electronic apparatus 101 shown in fig. 3.

Here, a comparative example is given to show the advantages in the case of adopting the configuration according to the present embodiment. Fig. 20 is a plan view showing a main part of an electronic apparatus 101P of a comparative example.

The electronic device 101P of the comparative example includes a first element 1P, a second element 2P, and a circuit board 5P. In the electronic apparatus 101P, the first element 1P and the second element 2P are connected by a plurality of electrode connection patterns formed on the circuit substrate 5P.

In the electronic apparatus 101P of the comparative example, the electrode connection pattern is formed so as to bypass the other conductor pattern, and therefore the occupied area OA required for the connection of the first element 1P and the second element 2P is large.

According to the present embodiment, the following effects are achieved.

(a) The circuit board 5 does not need a conductor pattern for connecting the first element 1 and the second element 2, and the area occupied by the second connection portion T2 and the fourth connection portion T4 on the circuit board 5 is the minimum area.

(b) An electronic device including a transmission line on the circuit board 5 can be configured without forming a special conductor pattern for relaying the transmission line on the circuit board 5.

(c) Since the first end E1 and the second end E2 of the first element 1 are wider than the other regions, the mounting area on the circuit board 5 is not excessively increased, the positional stability (self-supporting property) of the first element 1 on the circuit board 5 is improved, and surface mounting is facilitated. The same is true for the second element.

(d) The circuit (transmission line) of the first element 1, the second element 2, and the third element 3 can be reduced in loss even when the circuit board 5 having a large dielectric loss is used.

(e) Since the first element 1, the second element 2, and the third element 3 are formed of a multilayer substrate in which a plurality of resin base materials including a resin base material on which a conductor pattern is formed are laminated, the mounting area on the circuit board 5 can be reduced, and the first element 1, the second element 2, and the third element 3 can be arranged at positions having different heights and angles by providing flexibility.

(f) Since the region other than the first connection electrode P1 of the first element 1 and the region other than the third connection electrode P3 of the second element 2 are bonded to the circuit board 5 with a non-conductive bonding material, the bonding strength of the first element 1 and the second element 2 to the circuit board 5 is high.

(g) The region other than the second connector electrode P2 of the first element 1 and the region other than the fourth connector electrode P4 of the second element 2 are bonded to the third element 3 with a non-conductive bonding material, whereby the bonding strength between the first element 1 and the second element 2 and the third element 3 is high.

(h) Since the ground conductor G33 is formed on the upper portion of the third element 3, and the second connection portion T2 of the first element 1, the fourth connection portion T4 of the second element 2, and the signal line SL of the third element are covered with the ground conductor G33, unwanted radiation from the connection portions of the first element 1 and the second element 2 can be suppressed.

(i) The third element 3 is also formed of a multilayer substrate and is formed of the same base material as the first element 1 and the second element 2, so that the linear expansion coefficient can be matched with the first element 1 and the second element 2, and a connection failure can be made less likely to occur.

Second embodiment

In the second embodiment, an electronic device in which the structure of the mounting portion of the third element 3 is different from that of the first embodiment is shown.

The first element 1, the second element 2, and the third element 3 of the present embodiment have the same configurations as those of the first embodiment. Fig. 9A and 9B are both vertical sectional views of the electronic apparatus. Fig. 9A is a longitudinal sectional view of a portion X-X in fig. 3 shown in the first embodiment, and fig. 9B is a longitudinal sectional view of a portion Y-Y in fig. 3.

Unlike the example shown in fig. 4A and 4B, the dummy electrode Pd1 is formed on the lower surface of the second end portion (see E2 in fig. 2) of the first element 1. Similarly, the dummy electrode Pd2 is formed on the lower surface of the fourth end portion (see E4 in fig. 2) of the second element 2 (also some of the dummy electrodes Pd1 are part of the ground conductor G11). (in this example, the dummy electrode Pd2 is also a part of the ground conductor G31.) a substrate-side dummy electrode Pd5 is formed on the upper surface of the circuit substrate 5 at a position facing the dummy electrodes Pd1 and Pd2, and the dummy electrodes Pd1 and Pd2 are connected to the substrate-side dummy electrode Pd5 via a conductive bonding material such as solder.

In this way, the connection portion electrodes exposed on the lower surfaces of the both end portions of the elongated first element 1 and second element 2 are connected to the connection portion electrodes on the circuit board 5, and therefore, the mountability of the first element 1 and second element 2 is high.

Further, the dummy electrode Pd1 of the first element 1 is formed at a position (rear surface) of the lower surface of the first element that is opposed to the position where the second connection portion electrode P2 of the first element 1 is formed. Similarly, the dummy electrode Pd2 of the second element 2 is formed at a position (rear surface) of the lower surface of the second element that is opposite to the position where the fourth connection electrode P4 of the second element 2 is formed. Therefore, due to the presence of the dummy electrodes Pd1, Pd2, the substrate-side dummy electrode Pd5, and the conductive bonding material therebetween, the rigidity in the vicinity of the second connection electrode P2 of the first element 1 and the fourth connection electrode P4 of the second element 2 is high. This also improves the mountability when the third component 3 is mounted on the first component 1 and the second component 2.

Third embodiment

In the third embodiment, an electronic apparatus in which the configuration of the third element with respect to the connection portion of the first element and the second element is different from that of the first embodiment is shown.

Fig. 10 is a perspective view of the first element 1 according to the third embodiment, and fig. 11 is an exploded perspective view of the first element 1. Unlike the first element 1 shown in fig. 5, a portion of the second end portion E2 is thinner than the main body portion B1 connected to the second end portion E2. In the present embodiment, a step portion is formed at the second end E2 of the first element 1.

As shown in fig. 11, the first element 1 includes insulating

base materials

11, 12, and 13. A ground conductor G11 and a first connection electrode P1s are formed on the lower surface of the insulating base material 11. This first connection electrode P1s is one of the first connection electrodes P1 shown in fig. 4A and the like. A ground conductor G12, a second connector electrode P2s, and a signal line SL are formed on the upper surface of the insulating base 12. This second connector electrode P2s is one of the second connector electrodes P2 shown in fig. 4A and the like. A ground conductor G13 is formed on the upper surface of the insulating base 13.

The surface of the multilayer substrate composed of the insulating

base materials

11, 12, and 13 is coated with resist films R11 and R13. A plurality of openings OP exposing portions of the first connection electrode P1s and the ground conductor G11 are formed in the resist film R11.

Fig. 12 is a perspective view of the third element according to the present embodiment viewed obliquely from below, and fig. 13 is an exploded perspective view of the third element 3. The third element 3 has fifth and sixth connecting portions T5 and T6 formed on the same surface.

As shown in fig. 13, the third member 3 includes insulating

base materials

31, 32, and 33. A ground conductor G31 is formed on the lower surface of the insulating base material 31. A ground conductor G33 is formed on the lower surface of the insulating base material 33. On the lower surface of the insulating base 32, a signal line SL, a fifth connector electrode P5s, a sixth connector electrode P6s, and electrodes that are electrically connected to the ground conductors G31 and G33 via interlayer connection conductors are formed. The fifth connector electrode P5s is one of the fifth connector electrodes P5 shown in fig. 4A, 4B, and the like. Further, the sixth connector electrode P6s is one of the sixth connector electrodes P6 shown in fig. 4B and the like.

The insulating base material 31 has three inner surfaces at positions corresponding to the fifth connecting portion T5 and the sixth connecting portion T6, respectively, and is formed as a concave portion that is concave in both the thickness direction and the surface direction. The three inner side surfaces of the recess forming the fifth connecting portion T5 are side surfaces along a plurality of directions (X-axis direction and Y-axis direction shown in fig. 10) of the second connecting portion T2 of the first element 1. Similarly, the three inner side surfaces of the concave portion forming the sixth connecting portion T6 are along the side surfaces of the fourth connecting portion T4 of the second element 2 in a plurality of directions.

Fig. 14 is an exploded perspective view of a main part of the electronic device 103 according to the present embodiment. Fig. 15 is a perspective view of a main portion of the electronic apparatus 103.

The electronic device 103 includes a circuit board 5, a first element 1 and a second element 2 surface-mounted on the circuit board 5, and a third element 3 mounted on the first element 1 and the second element 2. The first element 1 and the second element 2 have a smaller planar size than the circuit board 5.

The concave portion of the fifth link T5 of the third element 3 corresponds to the second link T2 of the first element 1, and the concave portion of the sixth link T6 of the third element 3 corresponds to the fourth link T4 of the second element 2.

According to the present embodiment, as shown in fig. 15, the lower surface of the third element 3 is in contact with or close to the upper surface of the circuit board 5, and the height of the portion of the circuit board 5 where the first element and the third element overlap is reduced.

Further, according to the present embodiment, since the fifth connecting portion T5 of the third element 3 has the concave portion including the inner side surface along the side surfaces in the plurality of directions of the second connecting portion T2 of the first element 1, the height of the portion where the first element 1 and the third element 3 overlap can be reduced, and further, the positional accuracy in the planar direction of the first element 1 and the third element 3 is improved. In this example, since the fifth connecting portion T5 of the third element 3 is shaped to fit into the second connecting portion T2 of the first element 1, the positional accuracy in the planar direction of the first element 1 and the third element 3 is easily improved. The same applies to the relationship between the sixth connecting portion T6 of the third element 3 and the fourth connecting portion T4 of the second element 2.

Fourth embodiment

In the fourth embodiment, an electronic device 104 in which the configuration of the lower part of the third element 3 is different from that of the first embodiment is shown.

Fig. 16 is a sectional view of a main portion of an electronic apparatus 104 of the fourth embodiment. In this electronic device 104, a first element 1 and a second element 2 are mounted on a circuit board 5, respectively, and a third element 3 is mounted on the first element 1 and the second element 2. The third element 3 is disposed at a position across the other element 4 mounted on the circuit board 5.

As described above, since the third element 3 is disposed in the space along the circuit board 5 on the circuit board 5, the third element 3 can be disposed without being affected by the other element 4 mounted on the circuit board 5. Accordingly, the end portion of the first element 1 and the end portion of the second element 2 can be arranged beside the other element 4, and the like, and the degree of freedom of arrangement of the first element 1, the second element 2, and the third element 3 on the circuit board 5 is improved.

Fifth embodiment

In the fifth embodiment, an example of an electronic device including a plurality of second elements and an electronic device including a first element having a plurality of transmission lines is shown.

Fig. 17 is a plan view of a main portion of an electronic apparatus 105A according to the fifth embodiment. In this electronic apparatus 105A, a first element 1 and two

second elements

2A and 2B are mounted on a circuit board 5, respectively, and a third element 3 is mounted on the first element 1 and the

second elements

2A and 2B.

The first element 1 includes two signal lines SL11 and SL12, and has a connection portion at each of a first end E1 and a second end E2. The other structure of the first element 1 is the same as the first element 1 shown in the first embodiment. The second element 2A has a signal line SL21, and has connection portions at a third end E3 and a fourth end E4, respectively. Similarly, the second element 2B has a signal line SL22, and has connection portions at a third end E3 and a fourth end E4, respectively. The other structures of the

second elements

2A, 2B are the same as the second element 2 shown in the first embodiment.

The third element 3 includes signal lines SL31 and SL32, and their connection portions are exposed on the lower surface. The signal line SL31 connects the signal line SL11 of the first element 1 and the signal line SL21 of the second element 2A, and the signal line SL32 connects the signal line SL12 of the first element 1 and the signal line SL22 of the second element 2B.

In this example, a shunt circuit of two transmission lines including the signal lines SL11, SL12 of the first element 1, a transmission line including the signal line SL21 of the second element 2A, and a transmission line including the signal line SL22 of the second element 2B is configured.

Fig. 18 is a top view of a main portion of another electronic device 105B according to the fifth embodiment. In this electronic apparatus 105B, a first element 1 and two

second elements

2A and 2B.

The first element 1 has a signal line SL1, and has connection portions at a first end E1 and a second end E2, respectively. The other structure of the first element 1 is the same as the first element 1 shown in the first embodiment. The second element 2A has a signal line SL21, and has connection portions at a third end E3 and a fourth end E4, respectively. A high-pass filter HPF is provided in the transmission line of the second element 2A. The second element 2B has a signal line SL22, and has connection portions at a third end E3 and a fourth end E4, respectively. A low pass filter LPF is provided in the transmission line of the second element 2B. The other structures of the

second elements

2A, 2B are the same as the second element 2 shown in the first embodiment.

In this example, a multiplexer/demultiplexer circuit is formed of a transmission line including the signal line SL1 of the first element 1, a transmission line including the signal line SL21 of the second element 2A, and a transmission line including the signal line SL22 of the second element 2B.

In addition, the first element may be plural, and the second element may be three or more. Thus, three or more elements can be connected to the third element.

Sixth embodiment

In the sixth embodiment, an electronic device including a third element having a circuit other than a transmission line is shown.

Fig. 19 is a plan view of a main portion of an electronic device 106 according to a sixth embodiment. In this electronic apparatus 106, a first element 1 and two

second elements

2A and 2B.

The first element 1 has a signal line SL1, and has connection portions at a first end E1 and a second end E2, respectively. The other structure of the first element 1 is the same as the first element 1 shown in the first embodiment. The second element 2A has a signal line SL21, and has connection portions at a third end E3 and a fourth end E4, respectively. The second element 2B has a signal line SL22, and has connection portions at a third end E3 and a fourth end E4, respectively. The other structures of the

second elements

2A, 2B are the same as the second element 2 shown in the first embodiment.

The third element 3 includes signal lines SL31 and SL32, and their connection portions are exposed on the lower surface. The signal line SL31 connects the signal line SL1 of the first element 1 and the signal line SL21 of the second element 2A, and the signal line SL32 connects the signal line SL1 of the first element 1 and the signal line SL22 of the second element 2B. A high-pass filter HPF is provided in a transmission line including the signal line SL 31. A low pass filter LPF is provided in a transmission line including the signal line SL 32.

In this example, a multiplexer/demultiplexer circuit is formed of a transmission line including the signal line SL1 of the first element, a transmission line including the signal line SL21 of the second element 2A, and a transmission line including the signal line SL22 of the second element 2B. In this manner, a circuit other than the transmission line may be formed in the third element 3.

Other embodiments

The several embodiments shown above are illustrative in all aspects and are not restrictive. It is obvious to those skilled in the art that the modifications and variations can be appropriately made. The scope of the present invention is shown not by the above-described embodiments but by the claims. Further, the scope of the present invention includes modifications from the embodiments within the scope equivalent to the scope of the claims.

For example, the dielectric portions (insulating substrates) of the first, second, and

third elements

1, 2, and 3 are not limited to thermoplastic resins, and may be thermosetting resins.

Further, the first end portion E1, the second end portion E2 of the first element 1 are not necessarily wider than the width of the main body portion B1. The body portion B1 of the first element 1 is not limited to a straight line, and may have a bent portion. The same applies to the second element 2.

The third element 3 is not limited to a rectangular parallelepiped plate shape, and may have an L-shaped, U-shaped, crank-shaped, or the like planar shape.

Further, circuit components may be mounted on or in the first element 1, the second element 2, and the third element 3.

The first element 1 and the second element 2 are not limited to elements used as transmission lines. The present invention can be applied to a long-sized element mounted on a circuit board.

Description of the reference numerals

B1, B2: a main body portion;

e1: a first end portion;

e2: a second end portion;

e3: a third end portion;

e4: a fourth end portion;

g11, G12, G13: a ground conductor;

g31, G32, G33: a ground conductor;

HPF: a high-pass filter;

LPF: a low-pass filter;

OP: an opening;

p1, P1 s: a first connection portion electrode;

p2, P2 s: a second connection portion electrode;

p3: a third connection portion electrode;

p4: a fourth connection portion electrode;

p5, P5 s: a fifth connection portion electrode;

p6, P6 s: a sixth connection portion electrode;

p7, P8: a substrate-side connection portion electrode;

pd1, Pd 2: a dummy electrode;

pd 5: a substrate-side dummy electrode;

r11, R13, R31: a resist film;

s1: a first side;

s2: a second face;

s3: a third surface;

s4: a fourth surface;

SB: a conductive bonding material;

SL1, SL11, SL12, SL21, SL22, SL31, SL 32: a signal line;

t1: a first connection portion;

t2: a second connecting portion;

t3: a third connecting portion;

t4: a fourth connecting portion;

t5: a fifth connecting part;

t6: a sixth connecting portion;

1: a first element;

2: a second element;

2A, 2B: a second element;

3: a third element;

4: other elements;

5: a circuit substrate;

6: bottom filling;

11. 12, 13: an insulating base material;

31. 32, 33: an insulating base material;

101. 103, 104, 105A, 105B, 106: an electronic device.

Claims

1. An electronic device comprising a circuit board, a first element and a second element mounted on a surface of the circuit board, and a third element mounted on the first element and the second element,

the planar shape of the first element and the second element is smaller than that of the circuit board,

the first element has:

a second connection portion electrode formed on the second surface of the second end portion,

the second element has:

a fourth connection portion electrode formed on the fourth surface of the fourth end portion,

the first connection portion electrode and the third connection portion electrode are connected to the circuit board via a conductive bonding material,

the third element has:

a fifth aspect; and

a fifth connection portion electrode and a sixth connection portion electrode formed on the fifth surface,

the second connection portion electrode and the fifth connection portion electrode are connected via a conductive bonding material,

the fourth connection portion electrode and the sixth connection portion electrode are connected via a conductive bonding material.

2. The electronic device of claim 1,

the first element, the second element, and the third element each have a transmission line including a high-frequency signal line and a ground conductor, and the transmission line of the first element and the transmission line of the second element are connected via the transmission line of the third element by the connection of the second connection portion electrode and the fifth connection portion electrode and the connection of the fourth connection portion electrode and the sixth connection portion electrode.

3. The electronic device of claim 1 or 2,

the first end and the second end are wider than a region other than the first end and the second end.

4. The electronic device of claim 1 or 2,

the circuit substrate has a dielectric portion and a conductor portion,

the first element and the second element each have a dielectric portion and a conductor portion,

the dielectric loss of the dielectric portion of the first element is lower than the dielectric loss of the dielectric portion of the circuit substrate,

the dielectric loss of the dielectric portion of the second element is lower than the dielectric loss of the dielectric portion of the circuit substrate.

5. The electronic device of claim 1 or 2,

the third element has a dielectric portion and a conductor portion,

the dielectric loss of the dielectric portion of the third element is lower than the dielectric loss of the dielectric portion of the circuit substrate.

6. The electronic device of claim 1 or 2,

the first element, the second element, and the third element are each formed of a multilayer substrate in which a plurality of resin base materials including a resin base material on which a conductor pattern is formed are laminated.

7. The electronic device of claim 6,

the resin base material of the first member, the second member, and the third member is the same.

8. The electronic device of claim 1 or 2,

a part or the whole of the second end portion is thinner than a portion connected to the second end portion.

9. The electronic device of claim 1 or 2,

the fifth connection electrode forming portion has a recess including an inner surface along the plurality of side surfaces of the second connection electrode forming portion.

10. The electronic device of claim 9,

the recess is a shaped portion in which a forming portion of the second connection portion electrode is fitted into the recess.

11. The electronic device of claim 1 or 2,

the region of the first element other than the first connection portion electrode is bonded to the circuit board with a non-conductive bonding material.

12. The electronic device of claim 1 or 2,

the region of the first element other than the second connection portion electrode is bonded to the third element with a non-conductive bonding material.

13. The electronic device of claim 1 or 2,

the first element has a dummy electrode formed on the first surface of the second end portion, the circuit board has a substrate-side dummy electrode opposed to the dummy electrode, and the dummy electrode is connected to the substrate-side dummy electrode.

14. The electronic device of claim 1 or 2,

the device is provided with a component mounted on the circuit substrate,

the third element is disposed at a position across the elements.