CN210734840U

CN210734840U - Damping device for transporting memory chips

Info

Publication number: CN210734840U
Application number: CN201921767026.3U
Authority: CN
Inventors: 李旭; 张明进
Original assignee: Shenzhen Future Intelligent Technology Service Co Ltd
Current assignee: Shenzhen Future Intelligent Technology Service Co Ltd
Priority date: 2019-10-21
Filing date: 2019-10-21
Publication date: 2020-06-12
Anticipated expiration: 2029-10-21

Abstract

The utility model discloses a damping device for memory chip transportation, including box and U type case, the inside wall cover of box is equipped with U type case, the bottom of U type case is installed damper, damper includes projection, first spring, second spring, slider, recess, third spring, fixed column and commentaries on classics board, the bottom and the projection fixed connection of U type case, the lateral wall cover of projection is equipped with first spring, the bottom of first spring and the inboard bottom fixed connection of box; the memory chip is placed in the storage mechanism, vibration generated in the transportation process is transmitted to the damping mechanism through the box body, the first spring, the second spring and the third spring in the damping mechanism act together to generate deformation, vibration energy is converted into elastic potential energy of the springs, vibration of the U-shaped box and the foam plate is slowed down, and meanwhile, the bubble film can absorb certain vibration energy, vibration is slowed down, and the chip is protected.

Description

Damping device for transporting memory chips

Technical Field

The utility model relates to a memory chip technical field specifically is a damping device is used in memory chip transportation.

Background

The memory chip is a specific application of the concept of an embedded system chip in the memory industry. Therefore, both the system chip and the memory chip can realize multifunction and high performance by embedding software in a single chip, and support various protocols, various hardware and different applications. The memory chip technology is mainly focused on the application of an enterprise-level memory system, and provides high-quality support for access performance, storage protocols, management platforms, storage media, and various applications. With the rapid growth of data and the increasing importance of data to business, the data storage market rapidly evolves. From DAS, NAS, SAN to virtual data centers, cloud computing, there is no great challenge to traditional storage design capabilities. For storage and data disaster tolerance, functions such as virtualization, data protection, data security (encryption), data compression, data de-duplication, thin provisioning, and the like increasingly become standard functions of solutions. Managing more data with fewer resources is becoming a necessary trend in the marketplace. How to quickly realize the multifunctional production process and ensure the high performance of the optimized system is the market driving force for the development of the memory chip. The memory chip can quickly integrate various memory functions into a single chip. The sale of memory chips requires the transportation of the finished memory chips to different locations. At present, in the transportation process of memory chips, certain vibration force can be generated during the operation of transportation tools such as vehicles and the like, and then the memory chips in the memory chips are damaged through a storage device, so that subsequent sales are influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a memory chip damping device for transportation to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a damping device for transporting a memory chip comprises a box body and a U-shaped box, wherein the inner side wall of the box body is sleeved with the U-shaped box, a damping mechanism is installed at the bottom of the U-shaped box and comprises a protruding column, a first spring, a second spring, a sliding block, a groove, a third spring, a fixed column and a rotating plate, the bottom of the U-shaped box is fixedly connected with the protruding column, the outer side wall of the protruding column is sleeved with the first spring, the bottom end of the first spring is fixedly connected with the inner side bottom of the box body, the inner side bottom of the box body is provided with the groove, the bottom end of the protruding column penetrates through the box body and extends into the groove, the bottom of the protruding column is rotatably connected with two rotating plates which are symmetrical by taking the central point of the protruding column as a symmetry center, one side of each rotating plate, far away from the protruding column, is rotatably connected with the sliding block, one side of the sliding block, far away from, the bottom center welding of projection has the third spring, the bottom and the box fixed connection of third spring.

As further preferable in the present technical solution: the inner ring of the third spring is sleeved with a fixing column, and the bottom end of the fixing column is fixedly connected with the box body.

As further preferable in the present technical solution: the top fixedly connected with hinge of box, the top of box articulates through the hinge has the roof.

As further preferable in the present technical solution: the utility model discloses a portable electronic device, including U type case, foam board, seventy storage mechanism are no less than in evenly distributed's quantity to the inboard foam board of placing quantity for five evenly distributed of U type case, the top fixedly connected with quantity of foam board is two and uses the central point of foam board as the symmetrical centrosymmetric handle.

As further preferable in the present technical solution: the storage mechanism comprises a sliding groove, a storage groove and a bubble film, the storage groove is formed in the top of the foam board, the sliding groove is formed in the storage groove, and the bubble film is arranged in the storage groove.

As further preferable in the present technical solution: sixteen are no less than in damping mechanism's quantity, damping mechanism evenly distributed is in the bottom of U type case.

Compared with the prior art, the beneficial effects of the utility model are that: the memory chip is placed in the storage mechanism, vibration generated in the transportation process is transmitted to the damping mechanism through the box body, the first spring, the second spring and the third spring in the damping mechanism act together to generate deformation, vibration energy is converted into elastic potential energy of the springs, vibration of the U-shaped box and the foam plate is slowed down, and meanwhile, the bubble film can absorb certain vibration energy, vibration is slowed down, and the chip is protected.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic top view of the foam board of the present invention;

fig. 3 is a schematic structural view of the damping mechanism of the present invention;

fig. 4 is a schematic top view of the storage mechanism of the present invention.

In the figure: 1. a box body; 2. a hinge; 3. a top plate; 4. a handle; 5. a storage mechanism; 6. a foam board; 7. a U-shaped box; 8. a damping mechanism; 51. a chute; 52. a storage tank; 53. a bubble film; 81. a convex column; 82. a first spring; 83. a second spring; 84. a slider; 85. a groove; 86. a third spring; 87. fixing a column; 88. and (6) rotating the plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

Referring to fig. 1-4, the present invention provides a technical solution: a damping device for transporting a memory chip comprises a box body 1 and a U-shaped box 7, wherein the U-shaped box 7 is sleeved on the inner side wall of the box body 1, a damping mechanism 8 is installed at the bottom of the U-shaped box 7, the damping mechanism 8 comprises a convex column 81, a first spring 82, a second spring 83, a sliding block 84, a groove 85, a third spring 86, a fixed column 87 and a rotating plate 88, the bottom of the U-shaped box 7 is fixedly connected with the convex column 81, the outer side wall of the convex column 81 is sleeved with the first spring 82, the bottom end of the first spring 82 is fixedly connected with the bottom of the inner side of the box body 1, the groove 85 is formed in the bottom of the inner side of the box body 1, the bottom end of the convex column 81 penetrates through the box body 1 and extends into the groove 85, the bottom of the convex column 81 is rotatably connected with two rotating plates 88 which are symmetrical by taking the central point of the convex column 81 as the symmetrical center, one side of the rotating plate 88, one end of the second spring 83, which is far away from the sliding block 84, is fixedly connected with the box body 1, a third spring 86 is welded at the center of the bottom of the convex column 81, and the bottom end of the third spring 86 is fixedly connected with the box body 1.

In this embodiment, specifically: the inner race cover of third spring 86 is equipped with fixed column 87, and fixed column 87's bottom and box 1 fixed connection, fixed column 87 are used for moulding third spring 86, make the difficult deformation that produces the horizontal direction of third spring 86.

In this embodiment, specifically: the top fixedly connected with hinge 2 of box 1, the top of box 1 is articulated through hinge 2 has roof 3, and through above setting, roof 3 can overturn relative to box 1.

In this embodiment, specifically: foam board 6 that the quantity is five evenly distributed has been placed to U type 7 inboard, and evenly distributed's quantity is installed at foam board 6's top and is no less than seventy depositing mechanism 5, and foam board 6's top fixedly connected with quantity is two and uses foam board 6's central point as the handle 4 of symmetry central symmetry, and the staff takes out foam board 6 through handle 4.

In this embodiment, specifically: storage mechanism 5 includes spout 51, storage tank 52 and bubble membrane 53, and storage tank 52 opens the top of locating cystosepiment 6, and spout 51 has been seted up to storage tank 52's inside, and storage tank 52's inside is provided with bubble membrane 53, and storage mechanism 5 can be put into with the chip to the staff in the setting of spout 51, and bubble membrane 53 can protect the chip.

In this embodiment, specifically: sixteen is no less than to damper 8's quantity, and damper 8 evenly distributed is in the bottom of U type case 7, and a plurality of damper 8 combined action makes the shock attenuation effect more excellent.

Working principle or structure principle, during the use, place the memory chip in the inside of storage tank 52, through handle 4, place cystosepiment 6 in the inside of U type case 7, close roof 3, put into the transport on the transport with box 1, the vibrations power that the transport produced passes through box 1 and transmits to damper 8, box 1 extrudes to U type case 7, make first spring 82 produce deformation, projection 81 moves to box 1, make third spring 86 produce deformation, extrude slider 84 through commentaries on classics board 88 simultaneously, and then extrude second spring 83, the third spring 86 of deformation, second spring 83 and first spring 82 convert the vibrations energy into elastic potential energy, slow down the vibrations power, and then slow down the vibrations of U type case 7 and cystosepiment 6, simultaneously, bubble membrane 53 can absorb certain vibrations energy, slow down vibrations, protect the chip.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a memory chip damping device for transportation, includes box (1) and U type case (7), its characterized in that: the damping device is characterized in that a U-shaped box (7) is sleeved on the inner side wall of the box body (1), a damping mechanism (8) is installed at the bottom of the U-shaped box (7), the damping mechanism (8) comprises a convex column (81), a first spring (82), a second spring (83), a sliding block (84), a groove (85), a third spring (86), a fixed column (87) and a rotating plate (88), the bottom of the U-shaped box (7) is fixedly connected with the convex column (81), the outer side wall of the convex column (81) is sleeved with the first spring (82), the bottom end of the first spring (82) is fixedly connected with the inner side bottom of the box body (1), the groove (85) is formed in the inner side bottom of the box body (1), the bottom end of the convex column (81) penetrates through the box body (1) and extends to the inside of the groove (85), the bottom of the convex column (81) is rotatably connected with two rotating plates (88) which are symmetrical by taking the central point, the rotary plate is characterized in that a sliding block (84) is rotatably connected to one side, away from the convex column (81), of the rotary plate (88), a second spring (83) is welded to one side, away from the rotary plate (88), of the sliding block (84), one end, away from the sliding block (84), of the second spring (83) is fixedly connected with the box body (1), a third spring (86) is welded to the center of the bottom of the convex column (81), and the bottom end of the third spring (86) is fixedly connected with the box body (1).

2. The memory chip transportation shock absorbing device according to claim 1, wherein: the inner ring of the third spring (86) is sleeved with a fixed column (87), and the bottom end of the fixed column (87) is fixedly connected with the box body (1).

3. The memory chip transportation shock absorbing device according to claim 1, wherein: the top fixedly connected with hinge (2) of box (1), the top of box (1) is articulated through hinge (2) has roof (3).

4. The memory chip transportation shock absorbing device according to claim 1, wherein: foam board (6) that the quantity is five evenly distributed have been placed to the inboard of U type case (7), evenly distributed's quantity is installed at the top of foam board (6) and is no less than seventy depositing mechanism (5), the handle (4) that the top fixedly connected with quantity of foam board (6) is two and use the central point of foam board (6) as the symmetry center symmetry.

5. The memory chip transportation shock absorbing device according to claim 4, wherein: deposit mechanism (5) and include spout (51), storing trough (52) and bubble membrane (53), storing trough (52) are seted up in the top of cystosepiment (6), spout (51) have been seted up to storing trough (52) inside, the inside of storing trough (52) is provided with bubble membrane (53).

6. The memory chip transportation shock absorbing device according to claim 1, wherein: sixteen are no less than in the quantity of damper (8), damper (8) evenly distributed is in the bottom of U type case (7).