CN210722999U - Cooling device for power semiconductor - Google Patents
Cooling device for power semiconductor Download PDFInfo
- Publication number
- CN210722999U CN210722999U CN201921784219.XU CN201921784219U CN210722999U CN 210722999 U CN210722999 U CN 210722999U CN 201921784219 U CN201921784219 U CN 201921784219U CN 210722999 U CN210722999 U CN 210722999U
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- CN
- China
- Prior art keywords
- power semiconductor
- cooling device
- range
- cooler
- laminated member
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a cooling device for power semiconductor is with power semiconductor as the center install the cooler just in last lower part power semiconductor cooling device for power semiconductor who installs a plurality of range upon range of utensil between the cooler, range upon range of utensil is formed by the interior upper portion range upon range of part and the lower part range upon range of part that is formed with the space and central authorities and is formed with the cooling water passageway and joins symmetrically. The utility model discloses a cooling device for power semiconductor is suitable for other component through the range upon range of utensil that is located between cooler and the cooler and simplifies airtight structure, can adjust the equipment height of cooler according to power semiconductor's thickness, consequently not only can improve the assembling nature and the air tightness performance of cooler, still has the effect that can save its relevant expense.
Description
Technical Field
The present invention relates to a cooling device for a power semiconductor, and more particularly, to a cooling device for a power semiconductor, which can improve assembling performance and gas-tight performance by improving a stack of cooling devices for cooling a power semiconductor.
Background
Recently, hybrid vehicles, electric vehicles, and plug-in hybrid vehicles combining the advantages of both are actively studied. The driving of the motor of such an eco-friendly vehicle requires AC three-phase voltage.
Therefore, in order to drive the motor with the DC voltage of the high-voltage battery used as the power source, a device that converts to AC three-phase voltage is required, and a device that can also convert to 12V low voltage used in the vehicle is required.
The forward side is referred to as an inverter, and the backward side is referred to as a Low voltage DC/DC Converter (LDC), and both are collectively referred to as a power conversion device.
Fig. 1 shows a configuration of a hybrid vehicle, which is composed of a high-voltage battery 1, a low-voltage battery 2, a power conversion device 3, a motor 4, a generator 5, and an engine 6.
In the case of the plug-in hybrid vehicle, a charger is provided, and in the case of the electric vehicle, the electric vehicle is configured to have a structure without a generator and an engine and without a charger as compared with the hybrid vehicle.
In addition, the power conversion device of the eco-car is the most important component in the drive system. Since such a power converter requires voltage change, it is difficult for components mounted inside to generate heat during operation.
Such components are gradually miniaturized in order to improve the performance of the power conversion apparatus.
It is important in designing a power conversion device that the structure of the cooling power semiconductor determines the performance. That is, it means how compact it will affect performance in order to cool the power semiconductor.
Fig. 2A and 2B show a conventional stacked power semiconductor cooling device having a press-fit stacked structure applied to a PCU cooler.
According to this contact-pressure type laminated structure, the coolers of the respective layers are not individually provided with an airtight structure, but are brazed into an integral type post-compression joint portion and assembled.
However, the conventional stacked power semiconductor cooling device has a structure that is deformed when assembled after being manufactured from the viewpoint of the cooler, and thus, is not easy to design and manufacture, and has a problem that defects may occur during the manufacturing process.
SUMMERY OF THE UTILITY MODEL
Technical problem
In view of the above circumstances, an object of the present invention is to provide a cooling device for a power semiconductor, which can improve the assembling performance and the air-tight performance of a cooler by adjusting the assembly height of the cooler according to the thickness of the power semiconductor by applying another structure to a lamination tool located between the cooler and the cooler to simplify the air-tight structure.
Technical scheme
The utility model discloses a power semiconductor cooling device for one embodiment is with power semiconductor install the cooler just at last lower part as the center power semiconductor installs the power semiconductor cooling device of a plurality of range upon range of utensils between the cooler, range upon range of utensil is formed by the interior upper portion range upon range of part, the lower part range upon range of part that is formed with the space and central authorities and is formed with the cooling water passageway and joins symmetrically.
The upper and lower laminated members may have a horizontal-shaped contact portion that is formed at a central portion thereof where the cooling water passage is formed, and that is protruded outward and contacts the cooler.
Further, the upper laminated member and the lower laminated member may have a joint portion formed at an edge end thereof which is connected to each other and extended in a horizontal direction.
Further, a buffer portion may be provided between the close contact portion and the coupling portion, the buffer portion being formed in a corrugated shape in a vertical direction.
One or more springs may be installed in the spaces of the upper and lower stacking members.
The upper and lower laminated members may have one or more rigidity reinforcing portions formed in the outward direction.
Also, the rigidity reinforcing part may be a corrugated shape.
Technical effects
The utility model discloses a power is cooling device for semiconductor is through being located the range upon range of utensil between cooler and be suitable for other structures, can simplify airtight structure.
And, the utility model discloses can adjust the equipment height of cooler according to power semiconductor's thickness, consequently can improve the assembling nature and the air tightness performance of cooler.
Therefore, the utility model discloses can save the various expenses related to above.
Drawings
Fig. 1 is a schematic diagram showing a configuration of a general hybrid vehicle;
fig. 2A and 2B are schematic views showing a conventional stacked power semiconductor cooling device;
fig. 3 is a sectional view showing a cooling device for a power semiconductor according to the present invention;
fig. 4 and 5 are a perspective view and a sectional view showing a lamination tool constituting a cooling device for a power semiconductor according to the present invention;
fig. 6 and 7 are schematic diagrams showing another embodiment of a laminated device constituting a cooling device for a power semiconductor according to the present invention.
Description of the reference numerals
100: power semiconductor cooling device 200: power semiconductor
300: the cooler 320: cooling water channel
400: the laminating tool 410: upper laminated member
420: lower laminated member 430: cooling water channel
440: the close contact portion 450: joining part
460: the buffer section 470: rigidity reinforcing part
500: a spring S: space(s)
Detailed Description
The advantages, features and methods of accomplishing the same will become apparent from the following detailed description of the embodiments when considered in conjunction with the accompanying drawings. However, the present invention is not limited to the following disclosed embodiments, but can be realized in different forms, and the present embodiment only makes the present invention discloses a more complete disclosure, makes the utility model discloses the general technical personnel who belongs to the technical field completely understand the scope of the utility model, the utility model discloses by technical scheme's scope definition. In addition, the terms used in the present specification are only for describing the embodiments, and are not intended to limit the present invention. In the present specification, the singular forms "a", "an" and "the" include plural forms unless the context clearly dictates otherwise. The use of "including" or "comprising" in the specification does not exclude the presence or addition of one or more other components, steps, actions and/or elements than those described.
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Fig. 3 is a sectional view showing a power semiconductor cooling device according to the present invention, and fig. 4 and 5 are a perspective view and a sectional view showing a stacked tool constituting the power semiconductor cooling device according to the present invention.
The cooling device 100 for a power semiconductor of the present invention is composed of a cooler 300 mounted on the upper and lower portions with the power semiconductor 200 as the center, and a plurality of stacking tools 400 mounted between the coolers 300.
Note that, a known cooler may be applied to the cooler 300 constituting the power semiconductor cooling device 100 in addition to the drawings shown, and thus, a separate description is omitted.
The cooling device 100 for a power semiconductor of the present invention is characterized in that the assembling property and the air tightness are improved by improving the stacking tool 400.
The stack 400 is formed by symmetrically joining an upper stack member 410 and a lower stack member 420, each of which has a space S formed therein and a cooling water passage 430 formed at the center thereof.
That is, the stack 400 is integrally formed by joining an upper stack member 410 and a lower stack member 420, and a cooling water passage 430 communicating with the cooler 300 is formed at the center.
Further, the lamination tool 400 is integrally formed by joining an upper lamination member 410 and a lower lamination member 420, each of which has a disk shape and is open at the lower or upper portion.
Here, the cooling water passage 430 formed in the center of the upper and lower laminated members 410 and 420 is formed to be equal to or larger than the cooling water passage 320 formed in the cooler 300.
The upper and lower laminated members 410 and 420 have horizontal contact portions 440 protruding outward and contacting the cooler 300 at the center portions thereof where the cooling water passages 430 are formed.
That is, the close contact portion 440, in which the cooling water passage 430 is formed, is formed to protrude outward, and has a horizontal shape. Therefore, the close contact portion 440 can be smoothly brought into close contact with the cooler 330 and prevent the cooling water from flowing out.
The upper and lower laminated members 410 and 420 have horizontal coupling portions 450 formed at their respective edge ends. The joining portion 450 fixes and joins the edge ends where the upper and lower laminated members 410 and 420 meet.
The coupling portion 450 is formed to be horizontally extended so as to easily couple the edge ends of the upper and lower laminated members 410 and 420.
A buffer portion 460 having a corrugated shape with a compressive structure in the vertical direction is formed between the close contact portion 440 and the coupling portion 450.
The reason why the buffer portion 460 is formed in a corrugated shape is that a heating element (not shown) must be inserted between the integrated coolers 300 formed in each layer.
The stacking tool 400 may be configured as shown in fig. 6 and 7.
First, the lamination jig 400 shown in fig. 6 is formed with at least one or more rigidity reinforcement parts 470 in the outward direction to improve the air-tightness.
That is, the rigidity reinforcing parts 470 are formed at both ends of the upper and lower laminated members 410 and 420, and enhance the strength while improving the air-tightness of the upper and lower laminated members 410 and 420. Wherein the rigidity increasing part 470 is formed in a corrugated shape.
Here, the end portion of the rigidity increasing portion 470 may be formed in any one of a curved surface, an inclined surface, and a multi-step bending according to circumstances and purposes.
Thereafter, one or more springs 500 may be installed in the spaces S of the upper and lower stacking members 410 and 420 of the stacking tool 400 shown in fig. 7.
Here, the stack tool 400 constitutes a structure in which the spring 500 is mounted in the space S located inside the buffer 460. Here, the spring 500 enhances the internal rigidity against the force occurring upon compression.
Further, the stack tool 400 is not permanently deformed after compression by the spring 500. Also, the stack 400 is restored to the original shape before the compression of the spring, thereby facilitating disassembly and reassembly.
The assembly procedure of the power semiconductor cooling device 100 configured as described above will be described below.
First, the upper laminated member 410 and the lower laminated member 420 are formed.
The upper laminated member 410 and the lower laminated member 420 are formed with a close contact portion 440, a coupling portion 450, and a cushion portion 460.
The space S is formed inside the close contact portion 440, and the cooling water passage 430 is formed at the center.
The coupling portion 450 is formed at the edge ends of the upper and lower laminated members 410 and 420.
A buffer portion 460 having a corrugated shape formed in a vertical direction is provided between the close contact portion 440 and the coupling portion 450.
Then, the upper laminated member 410 and the lower laminated member 420 are joined by the joining portion 450, and then a plurality of laminated tools 400 are formed by a joining process.
Thereafter, a cooler 300 is provided at the lower part, a power semiconductor 200 is mounted at the center of the cooler 300, and a stack 400 is mounted with a gap from the power semiconductor 200.
Then, the stacked power semiconductor cooling device 100 may be provided so that the cooler 300 is mounted on the power semiconductor 200 and the upper portion of the stack 400.
The assembly sequence of the power semiconductor cooling device 100 may be different from the above sequence. Therefore, the present invention is not limited to the assembly sequence of the cooling device 100 for a power semiconductor.
The above description is only an example of the technical solution of the present invention, and those skilled in the art to which the present invention pertains can make various modifications, alterations, and substitutions without departing from the essential characteristics of the present invention.
Therefore, the embodiments of the present invention are not intended to limit the technical solutions of the present invention, but to illustrate the technical solutions. The protection scope of the present invention is determined by the technical solutions, and all the technical solutions equivalent or equal ranges thereof are included in the right scope of the present invention.
Claims (7)
1. A power semiconductor cooling device in which coolers are mounted at upper and lower portions with a power semiconductor as a center and a plurality of stacking tools are mounted between the coolers, the power semiconductor cooling device comprising:
the laminated body is formed by symmetrically joining an upper laminated member and a lower laminated member, which have a space formed therein and a cooling water passage formed at the center thereof.
2. The cooling device for a power semiconductor according to claim 1, wherein:
the upper and lower laminated members have horizontal contact portions protruding outward and contacting the cooler at the center portions thereof where the cooling water passages are formed.
3. The cooling device for a power semiconductor according to claim 2, wherein:
the upper laminated member and the lower laminated member have a joint portion formed at the end of the edge thereof which is in contact with each other and extending in the horizontal direction.
4. The cooling device for a power semiconductor according to claim 3, wherein:
a corrugated buffer part is formed between the close contact part and the combining part in the vertical direction.
5. The cooling device for a power semiconductor according to claim 3, wherein:
one or more springs are mounted in the spaces of the upper and lower laminated members.
6. The cooling device for a power semiconductor according to claim 1, wherein:
the upper laminated member and the lower laminated member have one or more rigidity reinforcing portions formed in an outward direction.
7. The cooling device for a power semiconductor according to claim 6, wherein:
the rigidity reinforcing part is in a corrugated shape.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2018-0145664 | 2018-11-22 | ||
| KR1020180145664A KR102579439B1 (en) | 2018-11-22 | 2018-11-22 | Cooling device for power semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210722999U true CN210722999U (en) | 2020-06-09 |
Family
ID=70911933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921784219.XU Active CN210722999U (en) | 2018-11-22 | 2019-10-23 | Cooling device for power semiconductor |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102579439B1 (en) |
| CN (1) | CN210722999U (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4100328B2 (en) * | 2003-11-05 | 2008-06-11 | 株式会社デンソー | Multilayer cooler and manufacturing method thereof |
| JP2009212137A (en) | 2008-02-29 | 2009-09-17 | Nissan Motor Co Ltd | Cooling device for heat generating element |
| KR102317037B1 (en) | 2015-03-20 | 2021-10-25 | 엘지전자 주식회사 | Washing machine |
| CN207491429U (en) * | 2017-03-06 | 2018-06-12 | 达纳加拿大公司 | For cooling down multiple layers of electronic module of heat exchanger assemblies and heat exchanger module |
-
2018
- 2018-11-22 KR KR1020180145664A patent/KR102579439B1/en active IP Right Grant
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2019
- 2019-10-23 CN CN201921784219.XU patent/CN210722999U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20200060111A (en) | 2020-05-29 |
| KR102579439B1 (en) | 2023-09-18 |
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