CN210722957U - Chip wire bonding machine with protect function - Google Patents
Chip wire bonding machine with protect function Download PDFInfo
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- CN210722957U CN210722957U CN201921631467.0U CN201921631467U CN210722957U CN 210722957 U CN210722957 U CN 210722957U CN 201921631467 U CN201921631467 U CN 201921631467U CN 210722957 U CN210722957 U CN 210722957U
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- nitrogen gas
- chip
- collecting cover
- heat collecting
- wire
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Abstract
The utility model discloses a chip wire welding machine with protection function, which comprises a bracket, wherein a wire porcelain nozzle is arranged on the lower surface of the bracket, a heat collecting cover is arranged below the bracket, a push-pull cylinder for driving the heat collecting cover to run back and forth is arranged behind the heat collecting cover, the heat collecting cover comprises a rectangular part and a pointed part, a nitrogen gas jet head is connected on the rectangular part, an air outlet pipe is connected on the pointed part, graphite discs are arranged on the lower surfaces of the rectangular part and the pointed part, a heating nozzle is arranged on one side of the wire porcelain nozzle, and the heating nozzle is arranged obliquely, the heat collecting cover is arranged, the nitrogen gas jet head sprays nitrogen gas into the heat collecting cover, the nitrogen gas is heated into hot nitrogen gas when the heating nozzle is heated, the hot nitrogen gas is discharged through the air outlet pipe, and the heat collecting cover can prevent heat caused by the outward expansion of the hot nitrogen gas from spreading to other positions of the chip, the whole chip generates heat, and the chip is protected.
Description
Technical Field
The utility model relates to a chip production technical field specifically is a chip bonding wire machine with protect function.
Background
The existing wire bonding machine generally comprises a wire ceramic nozzle for leading out an aluminum wire, a swing arm for driving the wire ceramic nozzle to swing, a heating nozzle for heating the bonding wire and a nitrogen gas outlet device for providing a nitrogen environment;
this kind of bonding wire machine is when the bonding wire, and the heating mouth heating bonding wire, when heating, the heating mouth can be with the nitrogen gas heating one-tenth hot nitrogen gas on every side, and continuous nitrogen gas is through the welding position of chip, and the nitrogen gas that is heated then can flow to the all sides of chip, leads to each position of chip all to be heated, is in under the diffuse state of hot nitrogen gas for a long time, can lead to the chip function to go down, so need set up protection device and avoid hot nitrogen gas to diffuse.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a chip bonding wire machine with protect function to be in among the solution prior art for a long time under the state that hot nitrogen gas is filled, can lead to the problem that the chip function went to reduce.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a chip bonding wire machine with protect function, includes the support, the lower surface mounting of support has wire porcelain mouth, the below of support is provided with receives the heat exchanger, the rear of receiving the heat exchanger is provided with and is used for driving the push-and-pull cylinder who receives the heat exchanger and move from beginning to end, receive the heat exchanger and include rectangle portion and beak portion, be connected with the nitrogen gas jet head in the rectangle portion, be connected with the outlet duct on the beak portion.
Preferably, graphite discs are arranged on the lower surfaces of the rectangular part and the cusp part.
Preferably, one side of the wire porcelain mouth is provided with a heating mouth, and the heating mouth is obliquely arranged.
Preferably, still include the nitrogen cylinder, the upper end of nitrogen cylinder is connected with universal return bend, and universal return bend and nitrogen gas air nozzle are connected.
Preferably, still include the operation panel, the backup pad is all installed to the below both sides of operation panel, the lower terminal surface of support is fixed in the upper surface rear of operation panel.
Preferably, the lower surface of the bracket is provided with a swing arm for driving the wire porcelain nozzle.
Preferably, a cooling device is installed at one end, far away from the heat collecting cover, of the air outlet pipe, the cooling device comprises a hose, a cooling cylinder and a cold water coil pipe, one end of the hose is fixedly communicated with the air outlet pipe, the cooling cylinder is installed at the other end of the hose, and the cold water coil pipe is wound on the outer portion of the circumference of the cooling cylinder.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses set up and receive the heat exchanger, the nitrogen gas jet head spouts the nitrogen gas in receiving the inside of heat exchanger, can heat the nitrogen gas into hot nitrogen gas when heating the mouth heating, hot nitrogen gas is discharged through the outlet duct, receive the heat exchanger and then can avoid the heat that hot nitrogen gas expands and leads to spread other positions of chip, the condition that the chip that leads to wholly generates heat plays the guard action to the chip;
2. having set up cooling device, hot nitrogen gas gets into the inside of hose after being discharged from the outlet duct, and the inside of reentrant cooling cylinder, the inside cold water of cold water coil is used for cooling for hot nitrogen gas for the escaped nitrogen gas is the normal atmospheric temperature state, avoids the workshop temperature higher.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of area A of FIG. 1;
FIG. 3 is a schematic structural view of the heat collecting cover of the present invention;
fig. 4 is a schematic structural diagram of the cooling device of the present invention.
In the figure: 1. a support plate; 2. an operation table; 3. a support; 4. a nitrogen gas cylinder; 5. a universal bend; 6. a nitrogen gas showerhead; 7. a heat collecting cover; 71. a rectangular portion; 72. a nib part; 73. graphite packing; 8. a lead wire porcelain nozzle; 9. heating the nozzle; 10. a push-pull cylinder; 11. an air outlet pipe; 12. a cooling device; 121. a hose; 122. a cooling cylinder; 123. a cold water coil pipe.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, in an embodiment of the present invention, a chip wire bonding machine with a protection function includes an operation platform 2 and a support 3, wherein support plates 1 are respectively installed on two sides of the lower portion of the operation platform 2, a lower end surface of the support 3 is fixed behind the upper surface of the operation platform 2, the support plate 1 is used for supporting the operation platform 2, the operation platform 2 is used for placing a chip to be subjected to wire bonding and serves as an operation station, and the support 3 is used for installing parts and plays a role of a framework;
referring to fig. 1 and 2, a wire porcelain mouth 8 is mounted on the lower surface of the bracket 3, a swing arm for driving the wire porcelain mouth 8 is arranged on the lower surface of the bracket 3, the wire porcelain mouth 8 can guide a bonding wire, and the wire porcelain mouth 8 and the swing arm are the same as those proposed in the patent with the application number of 201420848572.0;
continuing to refer to fig. 1 and 2, a heating nozzle 9 is arranged on one side of the wire porcelain nozzle 8, the heating nozzle 9 is obliquely arranged, and the heating nozzle 9 is used for heating the bonding wire and the chip welding position to ensure that the bonding wire is heated;
referring to fig. 1, the upper end of a nitrogen gas cylinder 4 is connected with a universal elbow 5, the universal elbow 5 is connected with a nitrogen gas nozzle 6, the nitrogen gas cylinder 4 can store nitrogen gas, and the nitrogen gas is ejected through the universal elbow 5 and the nitrogen gas nozzle 6, so that the nitrogen gas has good stability, the whole welding process can be carried out in a nitrogen environment, and the welding process is prevented from being oxidized;
as shown in fig. 1 and 3, a heat collecting cover 7 is arranged below the bracket 3, when the heating nozzle 9 is used for heating, nitrogen is heated into hot nitrogen, the heat collecting cover 7 can prevent heat caused by outward expansion of the hot nitrogen from being scattered to other positions of the chip, so that the chip is protected, a push-pull air cylinder 10 for driving the heat collecting cover 7 to operate forwards and backwards is arranged behind the heat collecting cover 7, and the push-pull air cylinder 10 pushes and pulls the heat collecting cover 7, so that the heat collecting cover 7 can be located at different positions of the chip;
referring to fig. 1 and 3, the heat collecting cover 7 includes a rectangular portion 71 and a nozzle portion 72, graphite packing 73 is disposed on lower surfaces of the rectangular portion 71 and the nozzle portion 72, the graphite packing 73 enables the lower surface of the heat collecting cover 7 to be attached to a chip, the rectangular portion 71 is connected with the nitrogen gas nozzle 6, the nozzle portion 72 is connected with the gas outlet pipe 11, the nitrogen gas nozzle 6 sprays nitrogen gas into the heat collecting cover 7, welding lines are formed in a nitrogen environment, and after the nitrogen gas is heated by the heating nozzle 9, the hot nitrogen gas is discharged from the gas outlet pipe 11;
as shown in fig. 1 and 4, a cooling device 12 is installed at one end of the air outlet pipe 11 away from the heat collecting cover 7, the cooling device 12 includes a hose 121, a cooling cylinder 122 and a cold water coil 123, one end of the hose 121 is fixedly communicated with the air outlet pipe 11, the cooling cylinder 122 is installed at the other end of the hose 121, the cold water coil 123 is wound around the circumference of the cooling cylinder 122, hot nitrogen is discharged from the air outlet pipe 11 and enters the inside of the hose 121 and then enters the inside of the cooling cylinder 122, and cold water in the cold water coil 123 is used for cooling the hot nitrogen, so that the escaped nitrogen is in a normal temperature state; when the device is used, a chip to be welded is placed on the upper surface of an operating platform 2, the position of the wire to be welded is aligned with a wire ceramic nozzle 8, then a heat receiving cover 7 is pushed through a push-pull air cylinder 10, the heat receiving cover 7 surrounds the wire ceramic nozzle 8 and a heating nozzle 9, the wire ceramic nozzle 8 leads out an aluminum wire, then the heating nozzle 9 is responsible for heating, and then the wire is welded, meanwhile, nitrogen in a nitrogen bottle 4 is sprayed into the heat receiving cover 7 through a universal bent pipe 5 and a nitrogen gas nozzle 6, the heating nozzle 9 heats the nitrogen into hot nitrogen, the hot nitrogen is discharged through an air outlet pipe 11, the hot nitrogen is discharged into a hose 121 from the air outlet pipe 11 and then enters into a cooling cylinder 122, cold water in a coil 123 is used for cooling the hot nitrogen, the escaped nitrogen is in a normal temperature state, and the heat receiving cover 7 can avoid heat caused by outward expansion of the hot nitrogen from being spread to other positions of the chip, the chip is protected.
The utility model discloses a theory of operation and use flow: when the device is used, a chip to be welded is placed on the upper surface of an operating platform 2, the position of the wire to be welded is aligned with a wire ceramic nozzle 8, then a heat receiving cover 7 is pushed through a push-pull air cylinder 10, the heat receiving cover 7 surrounds the wire ceramic nozzle 8 and a heating nozzle 9, the wire ceramic nozzle 8 leads out an aluminum wire, then the heating nozzle 9 is responsible for heating, and then the wire is welded, meanwhile, nitrogen in a nitrogen bottle 4 is sprayed into the heat receiving cover 7 through a universal bent pipe 5 and a nitrogen gas nozzle 6, the heating nozzle 9 heats the nitrogen into hot nitrogen, the hot nitrogen is discharged through an air outlet pipe 11, the hot nitrogen is discharged into a hose 121 from the air outlet pipe 11 and then enters into a cooling cylinder 122, cold water in a coil 123 is used for cooling the hot nitrogen, the escaped nitrogen is in a normal temperature state, and the heat receiving cover 7 can avoid heat caused by outward expansion of the hot nitrogen from being spread to other positions of the chip, the chip is protected.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a chip bonding wire machine with protect function, includes support (3), its characterized in that: the lower surface mounting of support (3) has wire porcelain mouth (8), the below of support (3) is provided with receives heat exchanger (7), the rear of receiving heat exchanger (7) is provided with and is used for driving push-and-pull cylinder (10) of receiving heat exchanger (7) front and back operation, receive heat exchanger (7) and include rectangle portion (71) and sharp mouth portion (72), be connected with nitrogen gas jet-propelled head (6) on rectangle portion (71), be connected with outlet duct (11) on sharp mouth portion (72).
2. The chip wire bonding machine with protection function of claim 1, characterized in that: graphite packing roots (73) are arranged on the lower surfaces of the rectangular portion (71) and the sharp mouth portion (72).
3. The chip wire bonding machine with protection function of claim 1, characterized in that: one side of the wire porcelain mouth (8) is provided with a heating mouth (9), and the heating mouth (9) is obliquely arranged.
4. The chip wire bonding machine with protection function of claim 1, characterized in that: still include nitrogen cylinder (4), the upper end of nitrogen cylinder (4) is connected with universal return bend (5), and universal return bend (5) are connected with nitrogen gas jet-propelled head (6).
5. The chip wire bonding machine with protection function of claim 1, characterized in that: still include operation panel (2), backup pad (1) are all installed to the below both sides of operation panel (2), the upper surface rear at operation panel (2) is fixed to the lower terminal surface of support (3).
6. The chip wire bonding machine with protection function of claim 1, characterized in that: the lower surface of the support (3) is provided with a swing arm used for driving the wire porcelain nozzle (8).
7. The chip wire bonding machine with protection function of claim 1, characterized in that: the cooling device (12) is installed to the one end that receives heat cover (7) is kept away from in outlet duct (11), and cooling device (12) include hose (121), cooling cylinder (122) and cold water coil pipe (123), and the one end and the fixed intercommunication of outlet duct (11) of hose (121), and cooling cylinder (122) are installed to the other end of hose (121), and the outside winding of the circumference of cooling cylinder (122) has cold water coil pipe (123).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921631467.0U CN210722957U (en) | 2019-09-28 | 2019-09-28 | Chip wire bonding machine with protect function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921631467.0U CN210722957U (en) | 2019-09-28 | 2019-09-28 | Chip wire bonding machine with protect function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210722957U true CN210722957U (en) | 2020-06-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921631467.0U Active CN210722957U (en) | 2019-09-28 | 2019-09-28 | Chip wire bonding machine with protect function |
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| CN (1) | CN210722957U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113579121A (en) * | 2021-06-23 | 2021-11-02 | 苏州斯尔特微电子有限公司 | High-power LED chip wire bonding machine |
-
2019
- 2019-09-28 CN CN201921631467.0U patent/CN210722957U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113579121A (en) * | 2021-06-23 | 2021-11-02 | 苏州斯尔特微电子有限公司 | High-power LED chip wire bonding machine |
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