CN210720954U

CN210720954U - Backlight module

Info

Publication number: CN210720954U
Application number: CN201921762425.0U
Authority: CN
Inventors: 倪明明
Original assignee: Nanjing CEC Panda LCD Technology Co Ltd; Nanjing CEC Panda FPD Technology Co Ltd
Current assignee: Nanjing CEC Panda FPD Technology Co Ltd
Priority date: 2019-10-21
Filing date: 2019-10-21
Publication date: 2020-06-09
Anticipated expiration: 2029-10-21

Abstract

The utility model discloses a backlight module, which relates to the technical field of LED display and comprises a back plate, a plurality of printed circuit boards which are positioned on the back plate and are adjacently arranged, a plurality of LED particles positioned on each printed circuit board and a splicing seam pressing strip which is positioned between two adjacent printed circuit boards and is positioned on the back plate; the splicing seam pressing strip comprises covering surfaces which are overlapped on two adjacent printed circuit boards, seam filling strips which are connected with the covering surfaces and located below the covering surfaces, and a plurality of fixing pieces which are arranged on two sides of the seam filling strips and are arranged in a pairwise opposite mode, wherein the seam filling strips are used for filling gaps between the two adjacent printed circuit boards, and the fixing pieces penetrate through openings of the back plates and are fixed on the edges of the outer sides of the openings. The utility model discloses an use concatenation seam layering to replace traditional rubberizing method between printed circuit board's gap, on the similar or the same basis of the reflectivity of guaranteeing concatenation seam layering and printed circuit board's reflectivity, can avoid the black line problem that the concatenation seam leads to effectively.

Description

Backlight module

Technical Field

The utility model belongs to the technical field of the LED shows, concretely relates to backlight unit.

Background

In the existing large-size MINI-LED backlight module, due to the limitation of the packaging process of the printed circuit board and the MINI-LED, a whole Printed Circuit Board (PCB) cannot be used for layout and placement in the backlight module, and only a plurality of printed circuit boards can be used for splicing, although the gap is theoretically designed to be 0, gaps with different widths still exist between the printed circuit boards in actual manufacturing, and the splicing gaps are not reflected by light rays, so that a black line can be shown when a panel displays, and the picture quality is influenced.

In the prior art, a method of filling white glue or sticking a reflector plate is adopted, but the gap between MINI-LEDs is too small, the glued bonding surface of the reflector plate is relatively small, the reflector plate is easy to fall off along with the increase of heat, the reflectivity of the white paint on the reflector plate and the lamp plate is different, bright stripes can be caused when a panel displays, and the method cannot achieve the effect of eliminating black lines displayed.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a backlight module replaces traditional reflector plate method of pasting through using the concatenation seam layering between printed circuit board's gap, on the similar or the same basis of the reflectivity of guaranteeing the concatenation seam layering and printed circuit board's reflectivity, can avoid the demonstration black line problem that the concatenation seam leads to effectively.

The technical scheme of the utility model as follows:

the invention discloses a backlight module, which comprises a back plate, a plurality of printed circuit boards, a plurality of LED particles and a splicing seam pressing strip, wherein the printed circuit boards are positioned on the back plate and are arranged adjacently;

the splicing seam pressing strip comprises covering surfaces which are overlapped on two adjacent printed circuit boards, seam filling strips which are connected with the covering surfaces and located below the covering surfaces, and a plurality of fixing pieces which are arranged on two sides of the seam filling strips and are arranged in a pairwise opposite mode, wherein the seam filling strips are used for filling gaps between the two adjacent printed circuit boards, and the fixing pieces penetrate through openings of the back plates and are fixed on the edges of the outer sides of the openings.

Preferably, the fixing member is a hook.

Preferably, the reflectivity of the covering surface is similar to or the same as that of the printed circuit board.

Preferably, the height of the cover surface is not higher than the height of the LED particles.

Preferably, the LED particles are LEDs or MINI-LEDs.

The utility model provides a technical scheme has following beneficial effect:

the utility model discloses use the concatenation seam layering between printed circuit board's gap, can avoid the black line problem that the concatenation seam leads to effectively.

Drawings

The present invention will be further described in the following preferred embodiments in a clearly understandable manner, with reference to the attached drawings.

FIG. 1 is a schematic diagram of the splicing seam pressure of the backlight module of the present invention;

FIG. 2 is a cross-sectional view A-A of the assembly of the splice seam strip of FIG. 1 to a backplane and a printed circuit board;

FIG. 3 is a cross-sectional view at B-B of the assembly of the splice seam strip of FIG. 1 to a backplane and a printed circuit board.

Detailed Description

The present invention will be further clarified by the following description with reference to the attached drawings and specific examples, which should be understood as being merely illustrative of the present invention and not limiting the scope of the present invention, and modifications of various equivalent forms of the present invention by those skilled in the art after reading the present invention, all fall within the scope defined by the appended claims of the present application.

The utility model discloses a backlight module, as shown in fig. 1 to 3, including backplate 10, be located on backplate 10 and a plurality of printed circuit board 20 of adjacent setting, be located a plurality of LED granule 40 on every printed circuit board 20 and be located between two adjacent printed circuit board 20 and be located the concatenation seam layering 30 on the backplate. In addition, a number of optical materials (not shown) are located over the LED particles 40. The printed circuit board 20 and the LED particles 40 form an LED light bar, and the upper surface of the printed circuit board is a white paint surface 22.

The joint strip 30 is formed by injecting plastic through a mold, and has a cross section in a shape of a "T", as shown in fig. 1, the joint strip 30 includes a covering surface 31 overlapping two adjacent printed circuit boards 20, a joint strip 32 connected to the covering surface 31 and located below the covering surface, and a plurality of fixing members 33 disposed on two sides of the joint strip 32 and disposed opposite to each other. As shown in fig. 3, the joint strip 32 is used to fill the gap 21 between two adjacent printed circuit boards 20, the covering surface 31 is pressed against the white paint surfaces 22 of two adjacent printed circuit boards 20, and the fixing member 33 passes through the opening 11 of the back plate 10 and is fixed at the edge outside the opening 11.

The cover 31 and the joint strip 32 are both integrally formed in an elongated shape, and have a length corresponding to the length of the slit 21 of the printed circuit board 20. The fixing members 33 are used for fixing the opening 11 of the back panel 10, generally, one opening 11 corresponds to two symmetrical fixing members 33 at left and right for fixing the back panel, and the total number of the fixing members 33 on the splice joint strip 30 is adjusted according to the number of the openings 11 on the back panel 10.

The fixing member 33 may be a hook or other fixing component, and the hook can be used to clamp the edge of the opening 11 by a snap action to fix the back plate 10.

The reflectivity of the covering surface 31 is similar to or the same as that of the white paint surface 22 of the printed circuit board 20, so that the problem that the splicing position of the printed circuit board 20 is easy to cause black lines can be better solved,

in addition, the height of the covering surface 31 is not higher than the height of the LED particles 40, so that the display of the LED is not obstructed.

The LED particles 40 may be LEDs or MINI-LEDs.

The utility model discloses an use concatenation seam layering to replace traditional rubberizing method between printed circuit board's gap, on the basis that the reflectivity that guarantees concatenation seam layering is close or the same with printed circuit board 20's reflectivity, can avoid the black line problem that the concatenation seam leads to effectively.

It should be understood that the above-mentioned embodiments are only preferred embodiments of the present invention, and not intended to limit the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included within the scope of the present invention.

Claims

1. A backlight module is characterized by comprising a back plate, a plurality of printed circuit boards, a plurality of LED particles and a splicing seam pressing strip, wherein the printed circuit boards are positioned on the back plate and are arranged adjacently;

2. The backlight module as claimed in claim 1, wherein the fixing member is a hook.

3. The backlight module according to claim 1, wherein the reflectivity of the covering surface is similar to or the same as that of the printed circuit board.

4. A backlight module according to claim 1, wherein the height of the cover surface is not higher than the height of the LED particles.

5. The backlight module according to claim 1, wherein the LED particles are LEDs or MINI-LEDs.