CN210717965U - Temperature control system of machine room - Google Patents
Temperature control system of machine room Download PDFInfo
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- CN210717965U CN210717965U CN201921282517.9U CN201921282517U CN210717965U CN 210717965 U CN210717965 U CN 210717965U CN 201921282517 U CN201921282517 U CN 201921282517U CN 210717965 U CN210717965 U CN 210717965U
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- machine room
- air
- temperature control
- control system
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Abstract
The utility model provides a temperature control system of computer lab, include: the air inlet pipe is provided with an air inlet end and an air outlet end, the air outlet end is connected to the machine room, and an air inlet fan is mounted in the air outlet end; the temperature control equipment is arranged in the air inlet pipe; the overhead floor is laid on the ground of the machine room, an overhead space is formed between the overhead floor and the ground, the air outlet end is communicated with the overhead space, and the overhead floor is provided with an air supply outlet; and the exhaust pipe is provided with an exhaust end and an exhaust end, the exhaust end is arranged above the equipment in the machine room, and an exhaust fan is arranged in the exhaust end. The utility model provides a traditional air conditioner room's inhomogeneous problem of accuse temperature.
Description
Technical Field
The utility model relates to a construction technical field, concretely relates to temperature control system of computer lab.
Background
The special air conditioner for the machine room, which can fully meet the environmental condition requirement of the air conditioner machine room, is a new machine type which is gradually developed in the last 30 years. When the comfortable air conditioner is used in an early machine room, the problems of interference, static electricity and the like of the equipment working process in the machine room caused by improper control of environmental temperature and humidity parameters often occur. The use of a constant temperature and humidity air conditioner can achieve a relatively stable environment, but the operation cost is relatively high, and the problem of uneven temperature control exists.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects in the prior art, a temperature control system of a machine room is provided so as to solve the problem of uneven temperature control of the traditional air conditioner machine room.
In order to achieve the above object, there is provided a temperature control system of a machine room, comprising:
the air inlet pipe is provided with an air inlet end and an air outlet end, the air outlet end is connected to the machine room, and an air inlet fan is mounted in the air outlet end;
the temperature control equipment is arranged in the air inlet pipe;
the overhead floor is laid on the ground of the machine room, an overhead space is formed between the overhead floor and the ground, the air outlet end is communicated with the overhead space, and the overhead floor is provided with an air supply outlet; and
the exhaust pipe is provided with an exhaust end and an exhaust end, the exhaust end is arranged above the equipment in the machine room, and an exhaust fan is installed in the exhaust end.
Further, the raised floor comprises a first unit plate provided with the air supply opening and a second unit plate not provided with the air supply opening, the first unit plate and the second unit plate are spliced together, and the first unit plate is arranged around the equipment.
Further, the support shelf includes: the bearing plate is provided with a plurality of accommodating grooves, and the unit plate blocks are embedded in the accommodating grooves; and
and the supporting column is supported at the bottom of the bearing plate.
Furthermore, an air guide hole communicated with the overhead space is formed at the bottom of the accommodating groove and is aligned to the air supply outlet.
Further, install temperature monitoring device on the raised floor, temperature control equipment includes: the heating device is arranged in the air inlet pipe;
the cooling device is arranged in the air inlet pipe;
and the controller is connected with the temperature monitoring device, the heating device and the cooling device.
Further, the controller comprises a comparison circuit and a control chip, the comparison circuit is connected to the temperature monitoring device, and the control chip is connected to the comparison circuit, the heating device and the cooling device.
Furthermore, a filter screen is arranged in the air exhaust end.
Furthermore, a dehumidifying filter element is arranged in the air inlet pipe.
Furthermore, the dehumidifying filter element is a desiccant dehumidifying filter element.
The beneficial effects of the utility model reside in that, the utility model discloses a temperature control system of computer lab adopts and send down the air supply form of taking out (returning). Specifically, the air flow organization of the lower air supply and the upper air suction (return) is that an air supply opening is positioned on the floor, and an air suction opening is arranged at the upper part in the machine room. Clean air firstly enters a working area, low-temperature air can enter a machine room through a short path, the air entering the machine room is little influenced by indoor pollution, cold and heat are well utilized, and meanwhile, a large amount of waste heat in an upper space is taken away by an upper air suction opening. The utility model discloses a temperature control system of computer lab makes air conditioning directly get into under the raised floor, makes under the raised floor form the static pressure case like this, then through the supply-air outlet on raised floor, send air conditioning into the computer lab uniformly in to send into in the equipment cabinet.
Drawings
Fig. 1 is a schematic structural diagram of a temperature control system of a machine room according to an embodiment of the present invention.
Fig. 2 is a schematic structural view of a raised floor according to an embodiment of the present invention.
Fig. 3 is a top view of a raised floor according to an embodiment of the present invention.
Fig. 4 is a plan view of a deck plate according to an embodiment of the present invention.
Fig. 5 is a circuit diagram of a signal amplification unit according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
Fig. 1 is the utility model discloses the temperature control system's of computer lab structural schematic diagram, fig. 2 are the utility model discloses the overhead floor's of embodiment structural schematic diagram, fig. 3 are the utility model discloses the overhead floor's of embodiment plan view, fig. 4 are the utility model discloses the bearing board's of embodiment plan view, fig. 5 are the utility model discloses a signal amplification unit's circuit diagram.
Referring to fig. 1 to 4, the utility model provides a temperature control system of computer lab, include:
the air inlet pipe is arranged on the machine room in a wall penetrating manner. The air inlet pipe 1 is provided with an air inlet end and an air outlet end. The air inlet end of the air inlet pipe is provided with a control valve, the outer side of the air inlet end is provided with a fan, and the fan is aligned with the air inlet end of the air inlet pipe. The air outlet end of the air inlet pipe 1 is connected to the inside of the machine room 5. An air inlet fan is arranged in the air outlet end of the air inlet pipe. The air inlet fan is used for discharging air entering from the air inlet end into the machine room. The temperature control device is installed in the air inlet duct 1 for heating and cooling the incoming air flow. The raised floor 3 is laid on the floor of the machine room by a support frame 31. The raised floor is erected above the air outlet end of the air inlet pipe 1. The air outlet end of the air inlet pipe is communicated with an overhead space formed between the overhead floor and the ground. The raised floor 3 is provided with an air supply outlet. The exhaust pipe 4 has an exhaust end and an exhaust end. The air exhaust end of the air exhaust pipe 4 is arranged above the equipment 7 placed in the room of the machine room. An exhaust fan is arranged in the air exhaust end of the air exhaust pipe.
In this embodiment, in order to reduce energy loss, the exhaust end of the exhaust pipe 4 is connected to the intake end. The exhaust end of the exhaust pipe is provided with a check valve.
The utility model discloses a temperature control system of computer lab adopts and send down the air supply form of taking out (returning). Specifically, the air flow organization of the lower air supply and the upper air suction (return) is that an air supply opening is positioned on the floor, and an air suction opening is arranged at the upper part in the machine room. Clean air firstly enters a working area, low-temperature air can enter a machine room through a short path, the air entering the machine room is little influenced by indoor pollution, cold and heat are well utilized, and meanwhile, a large amount of waste heat in an upper space is taken away by an upper air suction opening. The utility model discloses a temperature control system of computer lab makes air conditioning directly get into under the raised floor, makes under the raised floor form the static pressure case like this, then through the supply-air outlet on raised floor, send air conditioning into the computer lab uniformly in to send into in the equipment cabinet.
As a preferred embodiment, the raised floor 3 includes unit blocks 321 provided with air blowing ports and unit blocks 32 not provided with air blowing ports. The unit blocks 321 and 32 are spliced together. The unit blocks 321 are arranged around the device 7. Further, depending on the position of the device 7, the air supply openings are arranged.
When arranging the air supply openings, the unorganized air leakage quantity is considered. When the air supply device is operated, due to the air leakage phenomenon of pressure difference, the leaked air quantity is deducted when the area of the air supply opening is calculated, the air outlet speed of the air opening is not more than 3m/s, the air supply air flow is not directly corresponding to workers, the area of the air supply opening below the exchanger is calculated according to the air quantity which is more than or equal to the air quantity required by equipment cooling, and the entering cold air quantity is not enough.
In the present embodiment, the support frame 31 includes a stage plate 311 and support columns 312.
Specifically, the platform plate 311 is formed with a plurality of receiving grooves. The unit plates 32 are embedded in the receiving grooves. The bottom of the containing groove is provided with an air guide hole communicated with the overhead space. The air guide holes are aligned with the air supply ports of the unit plates 321. The support columns 312 are supported at the bottom of the deck plate 311.
The position of part of the unit blocks 321 can be arbitrarily adjusted according to the position of the equipment 7, so that the air supply opening faces the equipment 7, and the heat of the equipment can be effectively taken away.
A temperature monitoring device 21 is mounted on the raised floor. The temperature control device 2 comprises a heating means, a cooling means and a controller.
The heating device is arranged in the air inlet pipe 1. The cooling device is installed in the air inlet pipe 1. The controller is connected to the temperature monitoring device 21, the heating device and the cooling device.
The controller comprises a comparison circuit and a control chip. The comparison circuit is connected to the temperature monitoring device 21. The control chip is connected with the comparison circuit, the heating device and the cooling device.
In this embodiment, the heating device is a heating wire, and the cooling device includes a spiral condenser tube, a cooling liquid, and a delivery pump. A transfer pump cyclically pumps the cooling liquid in the condenser tube to cool the gas flow.
The temperature monitoring device comprises a temperature sensor and an information sending unit. The temperature sensor collects the temperature in the machine room, and the information sending unit sends the temperature information to the controller.
In this embodiment, the controller further includes a signal conversion unit and a signal processing circuit. The information sending unit sends the acquired temperature signal to the signal conversion unit. The signal conversion unit converts the temperature signal into a voltage signal and transmits the voltage signal to the signal processing circuit. The signal processing circuit sequentially performs signal amplification and signal filtering processing on the received voltage signals.
Specifically, the temperature sensor collects temperature signals in the machine room, the signal conversion unit converts the collected temperature signals into voltage signals V0 and transmits the voltage signals V0 to the signal processing circuit, and V1 is the voltage signals processed by the signal processing circuit. The signal processing circuit comprises a signal amplifying unit and a signal filtering unit. The signal conversion unit is connected with the input end of the signal amplification unit, the output end of the signal amplification unit is connected with the input end of the signal filtering unit, and the output end of the signal filtering unit is connected with the input end of the comparison circuit.
The comparator circuit is a comparator, a voltage signal is input to a non-inverting input end of the comparator, and a preset voltage threshold value is input to an inverting input end of the comparator.
The temperature sensor collects real-time temperature in the machine room, the information sending unit sends temperature information to the signal conversion unit, the information conversion unit sends converted voltage signals to the signal processing circuit, the signal processing circuit performs signal amplification and filtering processing and then sends the voltage signals to the comparator, and the comparator compares the voltage signals with a preset voltage threshold value to judge the size of the voltage signals and the preset voltage threshold value. When the voltage signal is small, the controller controls the heating device to heat the air flow, so that the air flow is heated. When the voltage signal is small, the controller controls the cooling device to cool the airflow, so that the airflow is cooled.
As shown in FIG. 5, the signal amplification unit comprises an integrated operational amplifier A1-A2, a field effect transistor VT1-VT2, a capacitor C1-C3 and a resistor R1-R10.
The signal conversion unit is connected with one end of a resistor R1, one end of a resistor R1 is further connected with a grid of a field effect transistor VT1, the other end of the resistor R1 is connected with an inverting input end of an integrated operational amplifier A1, the other end of a resistor R1 is further connected with one end of a capacitor C1, one end of a resistor R2 is connected with a grid of a field effect transistor VT2, the other end of a resistor R2 is further connected with one end of a resistor R9, the other end of a resistor R2 is connected with a non-inverting input end of an integrated operational amplifier A1, one end of a capacitor C2 is grounded, the other end of a capacitor C2 is connected with a non-inverting input end of an integrated operational amplifier A1, the other end of a capacitor C1 is connected with an output end of an integrated operational amplifier A1, one end of a resistor R3 is connected with an output end of the integrated operational amplifier A3, one end of a capacitor C3 is grounded, the other end of the capacitor C3 is connected with the other end of the resistor R3, and one end of the, the other end of the resistor R5 is connected with a +5V power supply, one end of the resistor R6 is connected with the inverting input end of the integrated operational amplifier A2, the other end of the resistor R6 is connected with one end of the resistor R5, one end of the resistor R6 is also connected with the drain of the field-effect transistor VT1, one end of the resistor R7 is connected with the non-inverting input end of the integrated operational amplifier A2, the other end of the resistor R7 is connected with the +5V power supply, one end of the resistor R7 is also connected with the drain of the field-effect transistor VT2, one end of the resistor R8 is connected with the-5V power supply, the source of the field-effect transistor VT1 and the source of the field-effect transistor VT2 are both connected with the other end of the resistor R8, one end of the resistor R10 is grounded, the other end of the resistor R10 is connected with the gate of the field-effect transistor VT2, the other end of the resistor R10 is.
Specifically, the signal filtering unit comprises resistors R11-R14, capacitors C4-C5 and an integrated operational amplifier A3.
The output end of the signal amplification unit is connected with one end of a resistor R11, the other end of the resistor R11 is connected with one end of a capacitor C4, the other end of the resistor R11 is further connected with one end of a resistor R12, one end of the capacitor C5 is grounded, the other end of the capacitor C5 is connected with the other end of a resistor R12, the other end of the resistor R12 is further connected with the non-inverting input end of an integrated operational amplifier A3, the other end of the capacitor C4 is connected with the output end of an integrated operational amplifier A3, one end of a resistor R14 is grounded, the other end of a resistor R14 is connected with one end of a resistor R13, the other end of a resistor R14 is further connected with the inverting input end of the integrated operational amplifier A3, the other end of the resistor R13 is connected with the output end of the integrated operational amplifier A3, the output end of the integrated operational amplifier A3 is connected with the.
In the above embodiment, the noise of the signal processing circuit is within 1.7nV, the drift is 0.7 μ V/° c, the model of the integrated operational amplifier a1 is LTC2050HV, the model of the integrated operational amplifier a2 is LT1797, and the model of the integrated operational amplifier A3 is LT1097, and the dc offset and the drift of the integrated operational amplifier a1 do not affect the overall offset of the circuit, so that the circuit has extremely low offset and drift.
In the signal amplifying unit, the resistance of the resistor R1 is 100K Ω, the resistance of the resistor R2 is 100K Ω, the resistance of the resistor R3 is 2K Ω, the resistance of the resistor R4 is 2K Ω, the resistance of the resistor R5 is 499 Ω, the resistance of the resistor R6 is 499 Ω, the resistance of the resistor R7 is 1K Ω, the resistance of the resistor R8 is 499 Ω, the resistance of the resistor R9 is 1OK Ω, the resistance of the resistor R10 is 10 Ω, the types of the field effect transistors VT1-VT2 are all LSK-389, the capacitance of the capacitor C1 is 0.02 μ F, the capacitance of the capacitor C2 is 0.02 μ F, and the capacitance of the capacitor C3 is 0.22 μ F.
The signal amplification unit overcomes noise errors caused by the input by connecting a stabilization element to the signal path.
In the signal amplification unit, the fet VT1 is back-fed into the integrated op-amp a2, forming a low noise operational amplifier circuit, and the resistor R9 and the resistor R10 provide feedback to set the closed loop gain in the normal manner (here, the amplification gain in the signal amplification unit is 1000).
In the above embodiment, although the fet VT1 has very low noise characteristics, the offset and drift of the fet VT1 are relatively high. The integrated operational amplifier a1 is a chopper-stabilized amplifier, that is, in the signal amplification unit, the integrated operational amplifier a1 overcomes the disadvantages caused by the field effect transistor VT 1. Specifically, the integrated operational amplifier a1 measures the difference between the input terminals of the amplifier and adjusts the minimum difference of the channel current of the fet VT1, and the drain of the fet VT1 also ensures that the integrated operational amplifier a1 in the signal amplification unit can obtain the offset.
The integrated operational amplifier a1 provides the fet VT1 with the current it needs so that the fet VT1 does not drift more than 5 μ V.
Also, the low bias current of the integrated op-amp a1 does not significantly increase the bias current of the entire 500pA amplifier.
In the signal amplification unit, the offset calibration circuit is connected in parallel with the signal path of the sensor, and a wide band can be realized.
In a specific test, when the input signal of the sensor is 1mV, the signal has a rise time of 29kHz bandwidth at 12 μ s when the gain of the signal amplification unit is 1000, and thus it has an excellent effect on the sensor signal amplification.
The output signal of the signal amplification unit is V01.
In the signal filtering unit, the resistance values of the resistors R15-R20 and the capacitance values of the capacitors C6-C7 are set according to the filtering requirement.
The output signal of the signal filtering unit is V1, and the analysis results in:
wherein, V02 is the voltage value of the node between the resistor R11 and the resistor R12, and s is Laplace operator;
in addition, the following methods are provided,
then, the filter frequency is ω0And the filtering quality parameter is Q.
Because the signals collected by the temperature sensor 9 are weak voltage signals, the signal amplification unit amplifies the voltage V0 output by the temperature sensor 9 through the integrated operational amplifier A1-A2, the field effect transistor VT1-VT2, the capacitor C1-C3 and the resistor R1-R10, and the signal amplification unit formed by the integrated operational amplifier A1-A2, the field effect transistor VT1-VT2, the capacitor C1-C3 and the resistor R1-R10 has only 0.7 muV/DEG C drift, shift within 2 muV, 100pA bias current and 1.7nV noise within a 0.1Hz to 10Hz bandwidth. The signal filtering unit performs low-pass filtering processing on the amplified voltage signal by using resistors R11-R14, capacitors C4-C5 and an integrated operational amplifier A3, so that the temperature detection accuracy is improved.
In the present embodiment, a filter screen 41 is provided in the discharge end of the exhaust pipe 4.
In a preferred embodiment, the filter net 41 is a PP net or a PET net.
In this embodiment, a filter screen is arranged in the air inlet end of the air inlet pipe 1. In a preferred embodiment, the filter net is a PP net or a PET net.
In order to ensure that the humidity of the air flow discharged into the machine room meets the requirement, a dehumidification filter element 6 is arranged in the air inlet pipe 1.
In this embodiment, the dehumidifying cartridge 6 is a desiccant dehumidifying cartridge.
It should be noted that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions that the present invention can be implemented, so that the present invention has no technical essential meaning, and any structure modification, ratio relationship change or size adjustment should still fall within the scope that the technical content disclosed in the present invention can cover without affecting the efficacy and the achievable purpose of the present invention. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes, and the present invention is also regarded as the scope of the present invention.
The present invention has been described in detail with reference to the embodiments shown in the drawings, and those skilled in the art can make various modifications to the present invention based on the above description. Therefore, certain details of the embodiments should not be construed as limitations of the present invention, which are intended to be limited only by the scope of the appended claims.
Claims (9)
1. A temperature control system of a machine room, comprising:
the air inlet pipe is provided with an air inlet end and an air outlet end, the air outlet end is connected to the machine room, and an air inlet fan is mounted in the air outlet end;
the temperature control equipment is arranged in the air inlet pipe;
the overhead floor is laid on the ground of the machine room, an overhead space is formed between the overhead floor and the ground, the air outlet end is communicated with the overhead space, and the overhead floor is provided with an air supply outlet; and
the exhaust pipe is provided with an exhaust end and an exhaust end, the exhaust end is arranged above the equipment in the machine room, and an exhaust fan is installed in the exhaust end.
2. The temperature control system of machine room of claim 1, wherein the raised floor comprises a first unit block provided with the air supply opening and a second unit block not provided with the air supply opening, the first unit block and the second unit block being spliced together, the first unit block being disposed around the equipment.
3. The temperature control system of a machine room according to claim 2, wherein a raised floor is laid on the floor of the machine room by a support frame, the support frame comprising: the bearing plate is provided with a plurality of accommodating grooves, and the unit plate blocks are embedded in the accommodating grooves; and
and the supporting column is supported at the bottom of the bearing plate.
4. The temperature control system of the machine room according to claim 3, wherein a wind guide hole communicated with the overhead space is formed at a bottom of the accommodating tank, and the wind guide hole is aligned with the air supply outlet.
5. The temperature control system of machine room according to claim 1, wherein the raised floor is mounted with a temperature monitoring device, and the temperature control apparatus comprises: the heating device is arranged in the air inlet pipe;
the cooling device is arranged in the air inlet pipe;
and the controller is connected with the temperature monitoring device, the heating device and the cooling device.
6. The temperature control system of the machine room according to claim 5, wherein the controller comprises a comparison circuit and a control chip, the comparison circuit is connected to the temperature monitoring device, and the control chip is connected to the comparison circuit, the heating device and the cooling device.
7. The temperature control system of the machine room according to claim 1, wherein a filter screen is arranged in the air exhaust end.
8. The temperature control system of machine room of claim 1, wherein a dehumidifying filter element is arranged in the air inlet pipe.
9. The temperature control system of machine room of claim 8, wherein the dehumidifying filter cartridge is a desiccant dehumidifying filter cartridge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921282517.9U CN210717965U (en) | 2019-08-07 | 2019-08-07 | Temperature control system of machine room |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921282517.9U CN210717965U (en) | 2019-08-07 | 2019-08-07 | Temperature control system of machine room |
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| CN210717965U true CN210717965U (en) | 2020-06-09 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113251528A (en) * | 2021-06-15 | 2021-08-13 | 湖南普信工程技术有限公司 | Active laboratory intelligence air current control system |
| CN117171532A (en) * | 2023-10-31 | 2023-12-05 | 中国电子工程设计院股份有限公司 | Leakage monitoring method and device for air conditioner air supply system of data center module machine room |
-
2019
- 2019-08-07 CN CN201921282517.9U patent/CN210717965U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113251528A (en) * | 2021-06-15 | 2021-08-13 | 湖南普信工程技术有限公司 | Active laboratory intelligence air current control system |
| CN117171532A (en) * | 2023-10-31 | 2023-12-05 | 中国电子工程设计院股份有限公司 | Leakage monitoring method and device for air conditioner air supply system of data center module machine room |
| CN117171532B (en) * | 2023-10-31 | 2024-02-02 | 中国电子工程设计院股份有限公司 | Leakage monitoring method and device for air conditioner air supply system of data center module machine room |
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