CN210711809U

CN210711809U - Badge electroplating equipment

Info

Publication number: CN210711809U
Application number: CN201921199996.8U
Authority: CN
Inventors: 龚伟伟; 龚文剑; 龚大金; 范国森; 裴成帆
Original assignee: Zhejiang Goldsaxo Dress Leather Co ltd
Current assignee: Zhejiang Goldsaxo Dress Leather Co ltd
Priority date: 2019-07-29
Filing date: 2019-07-29
Publication date: 2020-06-09
Anticipated expiration: 2029-07-29

Abstract

The utility model discloses a badge electroplating device. The technical key points are as follows: organism, electroplating frame are equipped with the plating bath on the organism, and the plating bath is used for discharging the plating solution, and electroplating frame is used for placing the badge, electroplates in the frame can putting into the plating bath, is equipped with rabbling mechanism on the organism, and the mixer is used for stretching into the plating bath and stirs the badge and pile, the utility model discloses can make the thickness of badge plating layer more even, reduce manual operation, reduce manpower and materials, efficiency is higher.

Description

Badge electroplating equipment

Technical Field

The utility model relates to a badge electroplating field, more specifically the utility model relates to a badge electroplating device.

Background

Badge all is direct to fall large batch badge on electroplating frame at the electroplating in-process, the frame of will electroplating again puts into the electroplating bath, all badges are all submerged by the plating solution, badge stacks at will on electroplating frame, it is inconsistent between badge and the badge, the clearance is little between badge and the badge, the plating solution is difficult for circulating, lead to electroplating the effect not good, the plating layer is thin inhomogeneous, push away the badge through the manual work in the present production process and pile, improve the degree of consistency that the plating layer of badge is thin and thick, but manual stirring badge is piled up inefficiency, extravagant manpower commodity circulation, and manual stirring can't guarantee that the stirring amplitude is the same at every turn, then can't guarantee that the plating layer thickness of all badges is even.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects existing in the prior art, the utility model aims to provide a badge electroplating device which can make the thickness of the badge electroplating layer more uniform.

In order to achieve the above purpose, the utility model provides a following technical scheme: a badge electroplating apparatus comprising: the badge electroplating machine comprises a machine body and an electroplating frame, wherein the electroplating frame is arranged on the machine body and used for discharging electroplating solution, the electroplating frame is used for placing badges and can be placed in the electroplating bath, a stirring mechanism is arranged on the machine body, and the stirrer is used for stretching into the electroplating bath and stirring badge piles.

As a further improvement, the rabbling mechanism is including two agitator motors and two lifter, and the lifter symmetry sets up, and every agitator motor is connected with a lifter interlock respectively, and the lifter slides and connects on the organism, be equipped with the spout on the organism, the lifter slides and connects in the spout, the lifter can be dismantled with electroplating the frame and be connected, and the lifter goes up and down to drive and electroplates the frame vibration.

As a further improvement, the electroplating rack is including placing the board, snatching the pole, place the board and be used for placing the badge, it is used for the manipulator to snatch the pole, it sets up on placing the board to snatch the pole, it is equipped with the coupling assembling that corresponds with two lifters to place the relative both sides of board, coupling assembling is including dead lever, rotary rod, the dead lever slides and connects on placing the board, the dead lever stretches out the one end of placing the board and has seted up the mounting groove, the rotatable setting of rotary rod is on the mounting groove, be equipped with the mounting hole on the rotary rod, be equipped with the connecting rod of "L" type on the lifter, connecting rod one end fixed connection is on the lifter, and the other end is used for imbedding in the.

As the utility model discloses a further improvement, through latch and gear connection between two agitator motor and the lifter, two agitator motor's gear is the semi-gear, and wherein, two agitator motor turn to on the contrary, and the shape of semi-gear, orientation are the same, and two lifters are between two semi-gears.

As a further improvement of the utility model, the placing plate is provided with a through hole, wherein the diameter of the through hole is smaller than the diameter of the badge.

As a further improvement, the vertical truncation of the through hole is a hexagon with a wide upper part and a short middle part.

As a further improvement, the upper side surface of the placing plate is provided with a plurality of drainage grooves which are communicated with at least one through hole.

The beneficial effects of the utility model, in the electroplating process, place the badge earlier and place electroplating frame on, later outside manipulator snatchs electroplating frame, will electroplate in putting into the plating bath frame, later electroplate, and stirring mechanism stirring badge piles in the electroplating process makes badge plating layer thickness more even, and after the badge was electroplated and is accomplished, the manipulator snatchs electroplating frame and takes off the badge.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic structural view of a connecting assembly;

fig. 3 is a schematic structural view of a cross section of the placement board.

Description of the labeling: 1. a body; 2. electroplating frame; 10. an electroplating bath; 3. a stirring mechanism; 31. a stirring motor; 32. a lifting rod; 11. a chute; 21. placing the plate; 22. a grabbing rod; 4. a connecting assembly; 321. a connecting rod; 41. fixing the rod; 42. rotating the rod; 410. a placing groove; 420. mounting holes; 210. a through hole; 211. and (4) a drainage groove.

Detailed Description

The present invention will be described in further detail with reference to embodiments shown in the drawings.

Referring to fig. 1 to 3, a medal plating apparatus of the present embodiment includes: the badge electroplating machine comprises a machine body 1 and an electroplating frame 2, wherein the electroplating frame 1 is provided with an electroplating bath 10, the electroplating bath 10 is used for discharging electroplating solution, the electroplating frame 2 is used for placing badges, the electroplating frame 2 can be placed in the electroplating bath 10, the machine body 1 is provided with a stirring mechanism 3, and the stirrer is used for extending into the electroplating bath 10 to stir badge piles.

Through above-mentioned technical scheme, among the electroplating process, place the badge earlier and place electroplating frame 2 on, later outside manipulator snatchs electroplating frame 2, will electroplate frame 2 and put into electroplating bath 10 in, later electroplate, electroplate 3 stirring badge piles of in-process rabbling mechanism, make the plating layer thickness of badge more even, the badge is electroplated and is accomplished the back, and the manipulator snatchs electroplating frame 2 and takes off the badge, need not artifical work, low in labor strength. Avoided piling through artifical promotion badge in the present production process, improved the thin and thick degree of consistency of the plating layer of badge, but manual stirring badge piles inefficiency, extravagant manpower commodity circulation to manual stirring can't guarantee that the stirring range is the same at every turn, can't guarantee then that the plating layer thickness of all badges is even, sets up rabbling mechanism 3 on the organism, keeps the integrality of plating bath 10 side and bottom, avoids the plating solution to run off, and stability is higher.

As a modified embodiment, rabbling mechanism 3 is including two agitator motor 31 and two lifter 32, and lifter 32 symmetry sets up, and every agitator motor 31 is connected with a lifter 32 interlock respectively, and lifter 32 slides and connects on organism 1, be equipped with spout 11 on the organism 1, lifter 32 slides and connects in spout 11, lifter 32 can dismantle with electroplating frame 2 and be connected, and lifter 32 goes up and down to drive electroplating frame 2 vibration.

Through the technical scheme, the manipulator snatchs electroplates the in-process of putting into plating bath 10 with it the frame 2, electroplate when putting up 2 and inconsistent with plating bath 10 tank bottom, lifter 32 just is connected with electroplating frame 2, later two agitator motor 31 are rotatory, drive two lifters 32 and go up and down in spout 11, lifter 32 goes up and down in spout 11 and has improved the stability of lifter 32 position, improve the stability of going up and down, lifter 32 goes up and down to drive and electroplates frame 2 and goes up and down, make the badge vibration on electroplating frame 2, guarantee every face of badge and plating solution even contact, the thickness that makes the badge plating layer is more even, lifter 32 symmetry sets up, improve the stability of placing board 21, and the structural strength is improved, and service life is prolonged. After the electroplating is finished, the manipulator grabs the electroplating frame 2 to take down the badge.

As an improved specific embodiment, the electroplating rack 2 includes a placing plate 21 and a grabbing rod 22, the placing plate 21 is used for placing badges, the grabbing rod 22 is used for grabbing by a manipulator, the grabbing rod 22 is disposed on the placing plate 21, two opposite sides of the placing plate 21 are provided with connecting assemblies 4 corresponding to two lifting rods 32, each connecting assembly 4 includes a fixing rod 41 and a rotating rod 42, the fixing rods 41 are connected to the placing plate 21 in a sliding manner, one end of each fixing rod 41 extending out of the placing plate 21 is provided with a placing groove 410, the rotating rod 42 is rotatably disposed on the placing groove 410, a mounting hole 420 is formed in the rotating rod 42, an L-shaped connecting rod 321 is disposed on the lifting rod 32, one end of each connecting rod 321 is fixedly connected to the lifting rod 32, and the other end of each connecting rod is used for being embedded into the mounting hole 420.

Through the technical scheme, after the badge is placed on the placing plate 21, the manipulator snatchs the pole 22 and drives the placing plate 21 to move, the manipulator snatchs the in-process placing plate 21 and is in the horizontal state all the time with it placed in the plating bath 10, place the plate 21 when descending in the placing groove, be in the horizontal state all the time, until descending, in connecting rod 321 one end embedding mounting hole 420, the connecting rod 321 opposite side is inconsistent with rotary rod 42, place the plate 21 and be connected with lifter 32, later lifter 32 goes up and down, it reciprocates to drive the placing plate 21.

As a modified specific embodiment, the two stirring motors 31 and the lifting rods 32 are connected with a gear through a latch, and the gears of the two stirring motors 31 are half gears, wherein the rotation directions of the two stirring motors 31 are opposite, the shape and the orientation of the half gears are the same, and the two lifting rods 32 are between the two half gears.

Through the technical scheme, the highest and the lowest position of lifter 32 are spacing, agitator motor 31 is rotatory simultaneously, when one side half-gear rotates to drive this side lifter 32 and rises to the highest position, the half-gear of opposite side just offers and kneads rather than corresponding lifter 32, continue to rotate, one side half-gear breaks away from the state of kneading with this side lifter 32, lifter 32 directly descends, descend to the lowest from the highest, the half-gear of opposite side rotates the lifter 32 that drives the opposite side and rises, place the repeated oscilaltion in board 21 both sides, the drive is placed the badge on board 21 and is piled the vibration, improve the vibration effect through sudden whereabouts, make the thickness of badge electroplated layer more even. When the lifting rods 32 on two sides lift, the placing plate 21 inclines, the fixing rods 41 slide to meet the distance change between the two connecting rods 321, when the placing plate 21 on one side rises, the rotating rods 42 on two sides rotate, and the fixing rods 41 on the side extend out; when the one-side placing plate 21 is lowered, the both-side rotating rods 42 are rotated, and the fixing rods 41 of the one side are retracted.

In a modified embodiment, the placement plate 21 is provided with a through hole 210, wherein the diameter of the through hole 210 is smaller than the diameter of the badge.

Through the technical scheme, when the placing plate 21 moves up and down, the electroplating solution flows from the through holes 210, so that the concentration of the electroplating solution in the whole electroplating tank 10 in the electroplating process is more uniform, and the through holes 210 are formed in the placing plate 21, so that the stress area of the placing plate 21 is reduced, the received resistance is reduced, the power of a driving motor is reduced, the power consumption is reduced, and the electroplating device is energy-saving and environment-friendly.

As a specific embodiment of the improvement, the vertical section of the through hole 210 is a hexagon with a wide top and a short middle.

Through above-mentioned technical scheme, the section of cutting of width, centre short about makes to place board 21 and reciprocates the in-process plating solution flow more convenient, by big to little again to have the guide effect, and the output is reliable after the guide, makes the thickness of plating layer more even.

As a modified embodiment, the placing plate 21 is provided with a plurality of drainage grooves 211 on the upper side, and the drainage grooves 211 are communicated with at least one through hole 210.

Through the technical scheme, the placing plate 21 continuously moves up and down in the vibration of the placing plate 21, when the placing plate 21 moves down from top to bottom, the electroplating solution on the lower side of the placing plate 21 flows upwards from the through hole 210, the electroplating solution on the lower side flows through the through hole 210 and then flows in the gaps of the badge pile, and simultaneously flows in the drainage groove 211, so that the electroplating solution in contact with the badges in contact with the placing plate 21 also flows; when the placing plate 21 is lifted from the bottom, the plating liquid on the upper side of the placing plate 21 and the upper side of the medal stack flows downward through the through hole 210 and the gap between the medal stacks, and the plating liquid between the medals is exchanged, so that the thickness of the plating layer is more uniform.

It is above only the utility model discloses a preferred embodiment, the utility model discloses a scope of protection does not only confine above-mentioned embodiment, the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims

1. A badge electroplating apparatus comprising: organism (1), electroplating frame (2), be equipped with plating bath (10) on organism (1), plating bath (10) are used for the plating bath that discharges, electroplating frame (2) are used for placing the badge, electroplating frame (2) can be put into plating bath (10), its characterized in that: the machine body (1) is provided with a stirring mechanism (3), and the stirrer is used for extending into the electroplating bath (10) to stir the badge pile.

2. A medal plating apparatus as claimed in claim 1, wherein: rabbling mechanism (3) are connected with a lifter (32) interlock respectively including two agitator motor (31) and two lifter (32), lifter (32) symmetry setting, every agitator motor (31), and lifter (32) slides and connects on organism (1), be equipped with spout (11) on organism (1), lifter (32) slide and connect in spout (11), lifter (32) can be dismantled with electroplating frame (2) and be connected, and lifter (32) go up and down to drive and electroplate frame (2) vibration.

3. A medal plating apparatus as claimed in claim 2, wherein: the electroplating rack (2) comprises a placing plate (21) and a grabbing rod (22), the placing plate (21) is used for placing badges, the grabbing rod (22) is used for grabbing by a manipulator, the grabbing rod (22) is arranged on the placing plate (21), connecting assemblies (4) corresponding to two lifting rods (32) are arranged on two opposite sides of the placing plate (21), each connecting assembly (4) comprises a fixing rod (41) and a rotating rod (42), the fixing rods (41) are connected to the placing plate (21) in a sliding mode, a placing groove (410) is formed in one end, extending out of the placing plate (21), of each fixing rod (41), the rotating rods (42) are rotatably arranged on the placing grooves (410), mounting holes (420) are formed in the rotating rods (42), L-shaped connecting rods (321) are arranged on the lifting rods (32), one ends of the connecting rods (321) are fixedly connected to the lifting rods (32), the other end is used for being embedded into the mounting hole (420).

4. A medal plating apparatus as claimed in claim 3, wherein: the two stirring motors (31) are connected with the lifting rod (32) through the clamping teeth and the gears, the gears of the two stirring motors (31) are half gears, the rotation directions of the two stirring motors (31) are opposite, the shapes and the directions of the half gears are the same, and the two lifting rods (32) are arranged between the two half gears.

5. A medal plating apparatus as claimed in claim 4, wherein: the placing plate (21) is provided with a through hole (210), wherein the diameter of the through hole (210) is smaller than that of the badge.

6. A medal plating apparatus as claimed in claim 5, wherein: the vertical truncated surface of the through hole (210) is a hexagon with a wide upper part and a short middle part.

7. A medal plating apparatus as claimed in claim 6, wherein: the upper side surface of the placing plate (21) is provided with a plurality of drainage grooves (211), and the drainage grooves (211) are at least communicated with one through hole (210).