CN210692503U - Silicon wafer bearing flower basket - Google Patents
Silicon wafer bearing flower basket Download PDFInfo
- Publication number
- CN210692503U CN210692503U CN201922187872.4U CN201922187872U CN210692503U CN 210692503 U CN210692503 U CN 210692503U CN 201922187872 U CN201922187872 U CN 201922187872U CN 210692503 U CN210692503 U CN 210692503U
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- end plates
- supporting
- end plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 94
- 239000010703 silicon Substances 0.000 title claims abstract description 94
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 91
- 239000002184 metal Substances 0.000 claims abstract description 19
- 238000003780 insertion Methods 0.000 claims description 19
- 230000037431 insertion Effects 0.000 claims description 19
- 230000000712 assembly Effects 0.000 claims description 7
- 238000000429 assembly Methods 0.000 claims description 7
- 230000007423 decrease Effects 0.000 claims description 2
- 239000012634 fragment Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 48
- 230000013011 mating Effects 0.000 description 8
- 239000002033 PVDF binder Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000003032 molecular docking Methods 0.000 description 6
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 150000003376 silicon Chemical class 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011435 rock Substances 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
Images
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
The utility model discloses a silicon wafer bearing flower basket, which comprises an end plate, supporting component and slot board, the end plate is two, two end plate intervals set up, two end plates can dock with the end panel of metal basket of flowers, the supporting component is two, two supporting component intervals set up, every supporting component all includes the bracing piece that two intervals set up, all be equipped with a plurality of joint grooves that are used for the joint silicon chip on every bracing piece, the both ends of every bracing piece link to each other with two end plates respectively, two supporting component are used for supporting two sides of the relative setting of silicon chip respectively, the slot board is two, every slot board corresponds a supporting component setting and is located between two bracing pieces of supporting component, be equipped with a plurality of intercommunication draw-in grooves on the slot board, every intercommunication draw-in groove can feed through two joint grooves that correspond on two bracing pieces, the both ends and the end plate of slot board can be dismantled and be connected. The silicon wafer bearing flower basket can reduce the probability of fragments when the silicon wafer is transferred, and facilitates the transfer of the silicon wafer.
Description
Technical Field
The utility model relates to a photovoltaic cell technical field especially relates to a silicon chip bears basket of flowers.
Background
At present, the process flow of the solar cell is commonly used for 2 flower baskets of 100pcs, namely a metal flower basket and a PVDF flower basket. The existing manual wafer rewinder can directly push the silicon wafer from the PVDF flower basket into the metal flower basket; due to the hollow design of the PVDF flower basket and the influence of gravity on the silicon wafer, the silicon wafer cannot be pushed into the PVDF flower basket from the metal flower basket by using a manual wafer reversing machine. The silicon wafers are clamped one by one from the metal flower basket and inserted into the PVDF flower basket by using tweezers, the consumed time is long, and the electrical property of the finished battery piece is influenced after the product is exposed in the air for a long time; use tweezers reciprocal piece easily fish tail silicon chip surface, and PVDF basket fretwork design, all have the notch on two adjacent basket of flowers bracing pieces, the inserted sheet needs 2 times counterpoints, easily causes the piece.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a silicon chip bears basket of flowers, this silicon chip bears the weight of the basket of flowers when can reducing the silicon chip and shift the piece probability to make things convenient for the silicon chip to shift.
In order to achieve the above technical effect, the technical solution of the silicon wafer bearing flower basket of this embodiment is as follows:
a silicon wafer carrying basket, comprising: the number of the end plates is two, the two end plates are arranged at intervals, and the two end plates can be respectively butted with the two end plates of the metal flower basket; the two supporting assemblies are arranged at intervals, each supporting assembly comprises two supporting rods arranged at intervals, each supporting rod is provided with a plurality of clamping grooves used for clamping a silicon wafer, two ends of each supporting rod are respectively connected with the two end plates, and the two supporting assemblies are respectively used for supporting two oppositely arranged side edges of the silicon wafer; the slot board, the slot board is two, every the slot board corresponds one the supporting component sets up and is located two of supporting component between the bracing piece, every be equipped with a plurality of intercommunication draw-in grooves on the slot board, every the intercommunication draw-in groove can be with two joint groove intercommunications of correspondence on the bracing piece, the both ends of slot board with the connection can be dismantled to the end plate.
In some embodiments, the end surfaces of each end plate facing each other are provided with a matching protrusion, and both ends of each slot plate are respectively provided with a matching groove matched with the matching protrusion.
In some alternative embodiments, the fitting protrusion is provided in a plurality at intervals.
In some alternative embodiments, the cross-sectional area of the mating projection on one of the end plates increases gradually in a direction toward the other of the end plates.
In some embodiments, two opposite side walls of each end plate are provided with insertion grooves, and two ends of each insertion groove plate are provided with insertion protrusions matched with the insertion grooves.
In some alternative embodiments, the insertion grooves on one side wall of each end plate are arranged at intervals.
In some alternative embodiments, the width of the insertion groove is gradually reduced in a direction away from the side wall of the end plate.
In some alternative embodiments, each of the end plates is formed in a U shape, the open end of the end plate is provided with a docking protrusion, and the end plate of the metal flower basket is provided with a docking groove matched with the docking protrusion.
In some optional embodiments, each of the end plates is formed as a U-shaped plate, the U-shaped plate includes a transverse portion and two longitudinal portions, two of the support assemblies are respectively disposed on the two longitudinal portions, the silicon wafer carrying flower basket further includes a plurality of support columns, and two ends of each of the support columns are respectively disposed on the two transverse portions of the two end plates.
The utility model discloses a silicon chip bears basket of flowers, owing to have detachable slot board, be equipped with the intercommunication draw-in groove on the slot board, the intercommunication draw-in groove has on every slot board, two joint groove intercommunications of correspondence on two bracing pieces that the intercommunication draw-in groove can be same supporting component for the silicon chip only need pass a notch when getting into the silicon chip and bearing the basket of flowers, need not the secondary and counterpoint the silicon chip, the piece probability has been reduced, the transfer rate of silicon chip has been promoted, the time that the silicon chip exposes in the air has been reduced, thereby reduce the negative effects to electric property.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
Fig. 1 is a schematic structural diagram of a silicon wafer carrying basket according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a silicon wafer carrying basket according to another embodiment of the present invention.
Reference numerals:
1. an end plate; 11. a transverse portion; 12. a longitudinal portion; 121. a mating protrusion; 122. inserting grooves;
2. a support bar; 21. a clamping groove;
3. a slot plate; 31. the clamping groove is communicated; 32. a mating groove; 33. inserting and connecting the bulges;
4. a support pillar;
100. a metal flower basket.
Detailed Description
In order to make the technical problem solved by the present invention, the technical solution adopted by the present invention and the technical effect achieved by the present invention clearer, the technical solution of the present invention will be further explained by combining the drawings and by means of the specific implementation manner.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, features defined as "first" and "second" may explicitly or implicitly include one or more of the features for distinguishing between descriptive features, non-sequential, non-trivial and non-trivial. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The specific structure of the silicon wafer carrying basket according to the embodiment of the present invention is described below with reference to fig. 1 to 2.
As shown in fig. 1-2, the silicon wafer carrying basket of this embodiment includes two end plates 1, two supporting members and two slot plates 3, the two end plates 1 are spaced apart from each other, the two end plates 1 can be respectively abutted against the two end plates of the metal basket 100, the two supporting members are spaced apart from each other, each supporting member includes two supporting rods 2 spaced apart from each other, each supporting rod 2 is provided with a plurality of engaging grooves 21 for engaging with a silicon wafer, two ends of each supporting rod 2 are respectively connected to the two end plates 1, the two supporting members are respectively used for supporting two opposite side edges of the silicon wafer, the two slot plates 3 are two, each slot plate 3 is disposed corresponding to one supporting member and located between the two supporting rods 2 of the supporting member, each slot plate 3 is provided with a plurality of communicating slots 31, each communicating slot 31 can communicate the two corresponding engaging grooves 21 on the two supporting rods 2, the two ends of the slot plate 3 are detachably connected with the end plate 1.
It can be understood that, when transferring silicon wafers from the metal basket 100 into the silicon wafer bearing basket, the two end plates 1 of the silicon wafer bearing basket are first butted against the two end plates of the metal basket 100, and the clamping grooves 21 on each support component are aligned with the silicon wafer grooves of the metal basket 100. Then connect two slot boards 3 respectively on end plate 1 to make intercommunication draw-in groove 31 on every slot board 3 communicate two joint grooves 21 that correspond on two bracing pieces 2 of same supporting component, intercommunication draw-in groove 31 makes on same height with two joint grooves 21 intercommunications like this, the silicon chip only need pass a notch when getting into the silicon chip and bearing the basket of flowers, the phenomenon of need passing two joint grooves 21 on two bracing pieces 2 that correspond the setting respectively when having avoided the silicon chip to insert the silicon chip and bearing the basket of flowers among the prior art takes place. Because the silicon wafer only needs to pass through one notch when entering the silicon wafer bearing flower basket, the silicon wafer can be directly pushed by the wafer reversing machine when being transferred from the metal flower basket 100 to the silicon wafer bearing flower basket, the probability of fragments is reduced, and the transfer speed of the silicon wafer is also improved. After the transfer is finished, the two slot plates 3 are detached from the end plate 1, so that when the silicon wafer bearing flower basket with the silicon wafers is conveyed to the next station, the silicon wafer bearing flower basket can be in a hollow state, and the normal operation of the subsequent process is well guaranteed.
The utility model discloses a silicon chip bears basket of flowers, owing to have detachable slot board 3, be equipped with intercommunication draw-in groove 31 on the slot board 3, intercommunication draw-in groove 31 has on every slot board 3, two joint grooves 21 intercommunications of correspondence on two bracing pieces 2 of intercommunication draw-in groove 31 can same supporting component, only need pass a notch when making the silicon chip get into the silicon chip and bear the basket of flowers, need not the secondary and counterpoint the silicon chip, the piece probability has been reduced, the transfer speed of silicon chip has been promoted, the time that the silicon chip exposes in the air has been reduced, thereby reduce the negative effects to electric property.
In some embodiments, as shown in fig. 1, the end surfaces of each end plate 1 facing each other are provided with a fitting protrusion 121, and both ends of each socket plate 3 are respectively provided with a fitting groove 32 fitted with the fitting protrusion 121. It will be appreciated that the mounting of the slot plate 3 is simply carried out by bringing the mating recess 32 of the slot plate 3 into correspondence with the mating protrusion 121 and then pushing the slot plate 3. The installation structure is very simple, the connection between the slot board 3 and the end plate 1 is realized without an external connecting piece, and the convenience is brought to an operator for installing the slot board 3 before transferring the silicon wafer and disassembling the slot board 3 after transferring the silicon wafer.
In some alternative embodiments, the fitting protrusion 121 is provided in a plurality at intervals. From this, guaranteed the stability of being connected between slot board 3 and the end plate 1 to avoided the silicon chip transfer in-process because slot board 3 rocks the piece phenomenon that leads to.
In some alternative embodiments, the cross-sectional area of the mating protrusion 121 on one of the end plates 1 gradually increases in a direction approaching the other end plate 1. It can be understood that the wedge-shaped matching protrusion 121 and the matching groove 32 can further improve the connection stability between the slot plate 3 and the end plate 1, so as to better avoid the chip phenomenon caused by the sloshing of the slot plate 3 in the silicon wafer transferring process. It should be added here that the shape, size and distribution of the fitting protrusion 121 and the fitting groove 32 can be selected according to actual needs.
In some embodiments, as shown in fig. 2, two opposite side walls of each end plate 1 are provided with insertion grooves 122, and two ends of the socket plate 3 are provided with insertion protrusions 33 which are matched with the insertion grooves 122. It will be understood that the insertion projections 33 on the slot plate 3 are only required to be brought into engagement with the insertion grooves 122 and then the slot plate 3 is pushed when the slot plate 3 is mounted. The installation structure is very simple, the connection between the slot board 3 and the end plate 1 is realized without an external connecting piece, and the convenience is brought to an operator for installing the slot board 3 before transferring the silicon wafer and disassembling the slot board 3 after transferring the silicon wafer.
In some alternative embodiments, the insertion grooves 122 on one side wall of each end plate 1 are provided in a plurality at intervals. From this, guaranteed the stability of being connected between slot board 3 and the end plate 1 to avoided the silicon chip transfer in-process because slot board 3 rocks the piece phenomenon that leads to.
In some alternative embodiments, the width of the plug groove 122 gradually decreases in a direction away from the side wall of the end plate 1. It can be understood that the wedge-shaped insertion protrusion 33 and the wedge-shaped insertion groove 122 can further improve the connection stability between the slot board 3 and the end board 1, thereby better avoiding the chip phenomenon caused by the shaking of the slot board 3 during the silicon wafer transferring process.
It should be noted that the shape, size and distribution of the plugging protrusion 33 and the plugging groove 122 can be selected according to actual needs.
It should be added that, in other embodiments of the present invention, the end plate 1 and the socket plate 3 may be connected by a connector such as a screw or a rivet, and are not limited to the connection structure of the mating protrusion 121 and the mating groove 32 or the plugging protrusion 33 and the plugging groove 122 in this embodiment.
In some alternative embodiments, each end plate 1 is formed in a U shape, the open end of the end plate 1 is provided with a docking protrusion, and the end plate of the metal flower basket 100 is provided with a docking groove matched with the docking protrusion. From this, guaranteed that the end face plate butt joint with metal basket of flowers 100 can be stabilized and accurately at silicon chip transfer front end plate 1 to make joint groove 21 on the bracing piece 2 flush with the silicon chip groove on the metal basket of flowers 100, avoided because joint groove 21 and silicon chip groove have the piece phenomenon that the difference in height leads to.
In some alternative embodiments, as shown in fig. 1-2, each end plate 1 is formed as a U-shaped plate, the U-shaped plate includes a transverse portion 11 and two longitudinal portions 12, two support assemblies are respectively disposed on the two longitudinal portions 12, the silicon wafer carrying basket further includes a plurality of support columns 4, two ends of each support column 4 are respectively disposed on the two transverse portions 11 of the two end plates 1. It can be understood that the supporting column 4 can play a role in preventing the silicon wafer from sliding out of the silicon wafer bearing flower basket, and ensure that the silicon wafer can be stably installed on the silicon wafer bearing flower basket. It should be noted that the number, shape and distribution of the supporting columns 4 can be selected according to actual needs, and the number, shape and the like of the supporting columns 4 are not specifically limited herein.
Example 1:
the structure of a silicon wafer carrying basket according to an embodiment of the present invention is described below with reference to fig. 1.
The silicon wafer bearing flower basket comprises end plates 1, a supporting component, slot plates 3 and supporting columns 4, wherein the number of the end plates 1 is two, the two end plates 1 are arranged at intervals, the two end plates 1 can be butted with end plates of a metal flower basket 100, each end plate 1 is formed into a U-shaped plate, the U-shaped plate comprises a transverse part 11 and two longitudinal parts 12,
the supporting component is two, two supporting components are established respectively on two vertical portions 12, every supporting component all includes the bracing piece 2 that two intervals set up, all be equipped with a plurality of joint grooves 21 that are used for the joint silicon chip on every bracing piece 2, the both ends of every bracing piece 2 link to each other with two end plates 1 respectively, two supporting components are used for two sides of the relative setting of supporting the silicon chip respectively, slot plate 3 is two, every slot plate 3 corresponds a supporting component setting and is located between two bracing pieces 2 of supporting component, be equipped with a plurality of intercommunication draw-in grooves 31 on the slot plate 3, every intercommunication draw-in groove 31 can communicate two joint grooves 21 of correspondence on two bracing pieces 2, the both ends and the end plate 1 of slot plate 3 can be dismantled and be connected. The number of the supporting columns 4 is two, and two ends of each supporting column 4 are respectively connected with the two transverse parts 11 of the two end plates 1. Two matching protrusions 121 are distributed at intervals on the end faces of each end plate 1 facing each other, and two matching grooves 32 matched with the matching protrusions 121 are respectively arranged at two ends of each slot plate 3.
Example 2:
the structure of a silicon wafer carrying basket according to an embodiment of the present invention is described below with reference to fig. 2.
The silicon wafer bearing flower basket of this embodiment is similar to the structure that the silicon wafer bears the flower basket in embodiment 1 for the most part, and the difference is that the silicon wafer of this embodiment bears and is equipped with grafting recess 122 on two lateral walls of the relative setting of every end plate 1 of flower basket, and the both ends of slot board 3 are equipped with and peg graft protruding 33 of recess 122 complex.
In the description herein, references to the description of "some embodiments," "other embodiments," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.
Claims (9)
1. A silicon wafer bearing flower basket, comprising:
the number of the end plates (1) is two, the two end plates (1) are arranged at intervals, and the two end plates (1) can be respectively butted with the two end plates of the metal flower basket (100);
the silicon wafer clamping device comprises two supporting assemblies, wherein the two supporting assemblies are arranged at intervals, each supporting assembly comprises two supporting rods (2) arranged at intervals, each supporting rod (2) is provided with a plurality of clamping grooves (21) used for clamping a silicon wafer, two ends of each supporting rod (2) are respectively connected with two end plates (1), and the two supporting assemblies are respectively used for supporting two oppositely arranged side edges of the silicon wafer;
slot board (3), slot board (3) are two, every slot board (3) correspond one the supporting component sets up and is located two of supporting component between bracing piece (2), every be equipped with a plurality of intercommunication draw-in grooves (31), every on slot board (3) intercommunication draw-in groove (31) can be with two joint grooves (21) the intercommunication of correspondence on bracing piece (2), the both ends of slot board (3) with end plate (1) can be dismantled and be connected.
2. The silicon wafer carrying basket according to claim 1, wherein each end plate (1) is provided with a fitting protrusion (121) on its end surface facing each other, and each socket plate (3) is provided with a fitting groove (32) at its both ends for fitting with the fitting protrusion (121).
3. The silicon wafer carrying basket according to claim 2, wherein the engaging protrusions (121) are provided in plurality at intervals.
4. The silicon wafer carrying basket according to claim 2, wherein the cross-sectional area of the engaging protrusion (121) on one of the end plates (1) is gradually increased in a direction approaching the other end plate (1).
5. The silicon wafer carrying basket according to claim 1, wherein each of the end plates (1) has an insertion groove (122) on two opposite side walls, and the insertion groove plate (3) has insertion protrusions (33) at two ends thereof for engaging with the insertion grooves (122).
6. The silicon wafer carrying basket according to claim 5, wherein the insertion grooves (122) on one side wall of each end plate (1) are provided in plurality at intervals.
7. Silicon wafer carrying basket according to claim 5, characterized in that the width of the plug-in recess (122) decreases gradually in a direction away from the side wall of the end plate (1).
8. The silicon wafer carrying basket according to any one of claims 1 to 7, wherein each of the end plates (1) is formed in a U-shape, the open end of the end plate (1) is provided with a butting protrusion, and the end plate of the metal basket (100) is provided with a butting groove for fitting with the butting protrusion.
9. The silicon wafer carrying basket according to any one of claims 1 to 7, wherein each of the end plates (1) is formed as a U-shaped plate, the U-shaped plate comprises a transverse portion (11) and two longitudinal portions (12), two of the support members are respectively disposed on the two longitudinal portions (12), the silicon wafer carrying basket further comprises a plurality of support columns (4), and two ends of each of the support columns (4) are respectively disposed on the two transverse portions (11) of the two end plates (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922187872.4U CN210692503U (en) | 2019-12-09 | 2019-12-09 | Silicon wafer bearing flower basket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922187872.4U CN210692503U (en) | 2019-12-09 | 2019-12-09 | Silicon wafer bearing flower basket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210692503U true CN210692503U (en) | 2020-06-05 |
Family
ID=70899771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922187872.4U Expired - Fee Related CN210692503U (en) | 2019-12-09 | 2019-12-09 | Silicon wafer bearing flower basket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210692503U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114311342A (en) * | 2020-10-10 | 2022-04-12 | 昆山莱崎龙精密技术有限公司 | Integrated equipment for processing photovoltaic cell |
| CN114373706A (en) * | 2020-10-14 | 2022-04-19 | 昆山莱崎龙精密技术有限公司 | Automatic material conveying system for photovoltaic cell production |
-
2019
- 2019-12-09 CN CN201922187872.4U patent/CN210692503U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114311342A (en) * | 2020-10-10 | 2022-04-12 | 昆山莱崎龙精密技术有限公司 | Integrated equipment for processing photovoltaic cell |
| CN114373706A (en) * | 2020-10-14 | 2022-04-19 | 昆山莱崎龙精密技术有限公司 | Automatic material conveying system for photovoltaic cell production |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210692503U (en) | Silicon wafer bearing flower basket | |
| EP3501243B1 (en) | Electrical connector | |
| CN103730745B (en) | Electric connector and combination thereof | |
| CN101764305A (en) | Electric connector | |
| CN112018537B (en) | Connector system with wafer | |
| CN207234103U (en) | Connector assembly and its PCB socket, PCB components | |
| CN203774516U (en) | Electric connector and electric connector assembly | |
| CN102157825A (en) | Power supply hole contact part, contact pieces thereof and electric connector | |
| CN106864934B (en) | A kind of article transferring pallet component and its receive pallet and conveyer method | |
| CN216921100U (en) | Wall ceramic tile mounting structure | |
| CN101431197A (en) | Modular board to board connector | |
| CN217134713U (en) | Connector for board-to-board super-long distance | |
| CN201332158Y (en) | Electrical power connector | |
| CN202103190U (en) | Power supply hole contact member, contact chips thereof, and electric connector | |
| CN210195226U (en) | Formwork support member for shear wall | |
| CN210074262U (en) | Multi-connector network connector | |
| CN205104633U (en) | D -SUB180 degree connector | |
| CN203734059U (en) | Butt-joint structure for connector | |
| CN219884979U (en) | Material separating device | |
| CN202034531U (en) | Power source contacting part, contacting pieces thereof and electric connector | |
| CN220126609U (en) | Terminal gluing tray component | |
| CN203774513U (en) | Electrical connector | |
| CN214698648U (en) | A quick splicing apparatus for plank | |
| CN216189070U (en) | Plug board conveying mechanism for PCB plug-in machine | |
| CN212991061U (en) | Vertical boat for wafer processing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No. 199, deer mountain road, Suzhou high tech Zone, Jiangsu Province Patentee after: CSI Cells Co.,Ltd. Patentee after: Atlas sunshine Power Group Co.,Ltd. Address before: No. 199, deer mountain road, Suzhou high tech Zone, Jiangsu Province Patentee before: CSI Cells Co.,Ltd. Patentee before: CSI SOLAR POWER GROUP Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200605 Termination date: 20211209 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |