CN210679741U

CN210679741U - 3D prints shower nozzle and has 3D printer of this shower nozzle

Info

Publication number: CN210679741U
Application number: CN201921459589.6U
Authority: CN
Inventors: 李强; 周利锋; 姚钧译; 李春江; 傅豪; 李昊升
Original assignee: 23 Sports Technology (shenzhen) Co Ltd
Current assignee: 23 Sports Technology (shenzhen) Co Ltd
Priority date: 2019-09-03
Filing date: 2019-09-03
Publication date: 2020-06-05
Anticipated expiration: 2029-09-03

Abstract

The utility model discloses a shower nozzle for 3D prints, the shower nozzle can cool off the printing material, including input and output and locate the heat dissipation mechanism between input, the output, heat dissipation mechanism semiconductor refrigeration piece, wherein the printing material gets into from the input and discharges from the output through heat dissipation mechanism, the semiconductor refrigeration piece is attached in one side of heat dissipation mechanism; so that the printing material cooling of passing on the way, adopt the semiconductor refrigeration piece direct or indirect mode to cool down for printing the material, do not need any liquid or solid medium, but continuous operation does not have the pollution sources and does not have rotary part, can not produce gyration effect to thereby can not lead to the shower nozzle to rock the precision that influences the printing in the course of the work. The utility model also provides a 3D printer of having this shower nozzle.

Description

3D prints shower nozzle and has 3D printer of this shower nozzle

[ technical field ] A method for producing a semiconductor device

The utility model relates to a 3D prints the field, concretely relates to 3D prints shower nozzle and has 3D printer of this shower nozzle.

[ background of the invention ]

A 3D printer, also known as a three-dimensional printer (3DP), is a machine that is an additive manufacturing technique, i.e., a rapid prototyping technique, which is based on a digital model file, and manufactures a three-dimensional object by printing a layer of adhesive material on a layer by layer using an adhesive material such as a special wax material, powdered metal, or plastic. With the increasingly strong demand for personalization in modern manufacturing, 3D printing technology has been developed and applied more and more widely in industry and at home. The 3D printer during operation is at first with the raw materials melting and spout from the nozzle, and the three-dimensional object of formation is piled up to certain mode of raw materials installation, and the raw materials need condense fast from the nozzle blowout back to the object of guaranteeing to be processed has certain structural strength and surface quality.

Because the materials need to be melted at high temperature when being printed, and 3D printing is carried out layer by layer, because the melted materials are not cooled in time, the materials are easily extruded mutually after the number of stacked layers is increased, so that printed objects are directly collapsed, and damage is brought to manufacturing production, for example: 3D prints shoe-pad self material cost among the prior art comparatively expensive, if because the cooling leads to the product to become invalid in time, all bring huge loss in the material and the manpower.

Another point is that the shower nozzle that current 3D printed adopts the fan to carry out the heat exchange when cooling down printing material, but only relies on the fan to take away the heat and hardly controls the temperature, prints to the comparatively accurate 3D of part, can't carry out stable accurate control, and the fan is easy to shake at the operation in-process, also does not benefit to the precision that 3D printed.

[ Utility model ] content

In order to overcome the problems, the utility model provides a 3D printer that is used for the shower nozzle that 3D printed and has this shower nozzle.

In order to solve the above problem, the utility model provides a technical scheme as follows: the spray head is used for 3D printing, can cool a printing material and comprises an input end, an output end and a heat dissipation mechanism arranged between the input end and the output end, wherein the printing material enters from the input end and is discharged from the output end through the heat dissipation mechanism, and the semiconductor refrigeration piece is attached to one side of the heat dissipation mechanism; so as to cool the printing material passing along the way.

Preferably, there is at least one output.

Preferably, the heat dissipation mechanism comprises a mounting assembly and a cooling box, wherein at least one side of the cooling box is provided with an opening so that at least one side of the cooling box is exposed, and the semiconductor chilling plate is mounted at the opening of the side under the cooperation of the mounting assembly so as to be close to the area where the printing material flows in the cooling box and cool the printing material.

Preferably, the interior of the cooling box comprises a channel similar to a cavity, an inlet and an outlet, the inlet, the channel and the outlet are communicated in sequence, the printing material enters from the inlet and then is discharged from the outlet through the channel, the inlet and the input end are communicated with each other, and the outlet and the output end are communicated with each other; so as to realize that the printing materials flow in turn from the input end, the inlet, the channel, the outlet and the output end.

Preferably, on the surface of one side of the cooling box and the semiconductor chilling plate, heat dissipation fins are arranged, and the size of the gaps between the heat dissipation fins and the size of the semiconductor chilling plate are matched with each other.

Preferably, the semiconductor refrigeration piece includes cold junction and hot junction, and wherein the cold junction is the one end towards the printing material, and hot junction and heat dissipation fin set up in the homonymy, and the surface vertical direction of heat dissipation fin towards the hot junction.

Preferably, the semiconductor chilling plate may be at least one side of the 3D printed nozzle.

Preferably, the semiconductor refrigeration piece can be a piece or a block, stacked in a single layer or multiple layers, and in any shape of a ring or a square.

For better solution above-mentioned problem, the utility model provides a technical scheme as follows still, is used for the shower nozzle that 3D printed, is applicable to 3D specially and prints the shoe-pad, can carry out cooling to the printing material as follows, and it includes the above-mentioned shower nozzle that is used for 3D to print.

For better solving above-mentioned problem, the utility model provides a still another technical scheme as follows, a 3D printer, including the foretell shower nozzle that is used for 3D to print for construct the product and carry out cooling to the printing material in the shower nozzle simultaneously.

Compared with the prior art, the utility model provides a shower nozzle for 3D prints has following beneficial effect:

1. the utility model provides a 3D prints shower nozzle adopts semiconductor refrigeration piece direct or indirect mode to cool down for the printing material, does not need any liquid or solid medium, can continuous operation, does not have the pollution source and does not have rotary part, can not produce the gyration effect to can not lead to the shower nozzle to rock in the course of the work and thereby influence the precision of printing; the sliding-free part is a solid piece, so that the vibration and noise are avoided during working, the service life is long, and the installation is easy; and the refrigeration parameter is not influenced by the space direction and gravity, and the 3D printing nozzle can also work normally under the condition of large mechanical overload.

Meanwhile, the semiconductor refrigerating piece is a current transduction type piece, high-precision temperature control can be achieved through control of input current, in addition, remote control, program control and computer control are easily achieved through temperature detection and control means, an automatic control system is convenient to form, the temperature difference range of the semiconductor refrigerating piece can be achieved from a positive temperature of 90 ℃ to a negative temperature of 130 ℃, the required cooling value of the required printing material for timely 3D printing is large, and accurate control can also be achieved.

2. And at least one further output end is provided, so that products can be processed simultaneously through a plurality of output ends, and the process and efficiency can be improved if complex workpieces or workpieces with different sizes need to be printed. Therefore, the application range is wide, and the market prospect is good.

3. Further including the cooling box, the benefit that adopts this cooling box lies in, plays a fixed effect to the semiconductor refrigeration piece, and the cooling box also can be equivalent to simultaneously the utility model discloses the head of the shower nozzle that 3D printed, thereby semiconductor refrigeration piece accessible is installed to the cooling box and is realized cooling down the printing material.

4. The cooling box is through setting up import, passageway, export, with the import switch on input simultaneously, export and output communicate with each other to realize printing the material and circulate from input, import, passageway, export, output in proper order.

5. With semiconductor refrigeration piece card between the heat dissipation fin to make semiconductor refrigeration piece and heat dissipation fin set up in turn, make the heat exchange of semiconductor refrigeration piece and heat dissipation fin more efficient, still compromise the advantage of spacing each other simultaneously.

6. Similarly, the semiconductor refrigeration piece includes cold junction and hot junction, sets up the cold junction as the orientation the one end of printing the material is in order to cool down to printing the material, hot junction and heat dissipation fin set up in the homonymy, just the heat dissipation fin is towards the perpendicular surface direction of hot junction, and when the hot junction produced heat, the heat dissipation fin has increased the heat exchange area of heat dissipation fin and hot junction owing to with the perpendicular surface of hot junction to strengthened heat exchange efficiency, further made the cooling heat extraction more timely.

7. The semiconductor refrigeration piece can be for the at least one side of this 3D printed shower nozzle, can be for the multiaspect setting to it is relatively poor to solve the cooling effect, and the accuracy is very low, and causes easily that the printing material has great temperature difference by the different sides when the cooling, if the printing material is lower by the one side temperature of semiconductor refrigeration piece 22 contact, and the another side that deviates from this face probably cools down and is not ideal, thereby influences the structural strength and the surface accuracy of printing the work piece.

8. Although the 3D printing materials required by the 3D printing insole are various, most of the materials are high-molecular polymers serving as main raw materials, such as any one or more polymers of rubber, PU, PVC, TPU, EVA, TPR and ABS, and the materials are individually configured for users in the field of the 3D printing insole, so that the cost of the materials is very high in the field of the 3D printing insole, the printing materials are easy to lose efficacy due to untimely cooling, the loss is brought to enterprises, and the 3D printing nozzle is easy to block, so that the printing efficiency is influenced; thirdly, the object is easy to be directly collapsed; therefore, the three-point problem can be solved in the field of 3D printing insoles by applying the nozzle for 3D printing, and the three-point nozzle has the advantages of good quality control, high efficiency and low cost.

9. This shower nozzle that 3D printed can apply to a 3D printer, brings good refrigeration cooling effect in shower nozzle department for the 3D printer.

[ description of the drawings ]

Fig. 1 is a schematic perspective view of a 3D printing head according to a first embodiment of the present invention.

Fig. 2 is a side view of the first embodiment of the present invention of a head for 3D printing.

Fig. 3 is a cross-sectional view of a head for 3D printing according to a first embodiment of the present invention;

fig. 4 is an exploded schematic view of a head for 3D printing according to a first embodiment of the present invention;

fig. 5 is a schematic structural diagram of a cooling box in a spray head for 3D printing according to a first embodiment of the present invention;

fig. 6 is a schematic structural diagram of a semiconductor refrigeration sheet in a nozzle for 3D printing according to a first embodiment of the present invention;

fig. 7 is another schematic structural diagram of the nozzle for 3D printing according to the first embodiment of the present invention;

fig. 8 is a schematic partial perspective view of a head according to a modification of the present invention for 3D printing;

fig. 9 is a schematic structural diagram of an input end in a nozzle for 3D printing according to a modification of the present invention;

and (3) identification and explanation:

1. an input end; 2. a heat dissipation mechanism; 3. an output end; 21. mounting the component; 22. a semiconductor refrigeration sheet; 221. a hot end; 222. a cold end; a cooling box 23; 231. an inlet; 232. an outlet; 233. a heat dissipating fin; 234. a channel.

[ detailed description ] embodiments

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the present application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and include, for example, either a fixed connection or a removable connection, or an integral connection: may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art

The utility model provides a shower nozzle for 3D prints, be applicable to mainly cooling to the printing material in the shower nozzle on the 3D printing field, the printing material scope that its can cool down is metal material, ABS plastics class, PLA plastic fuse, ceramic powder, resin material, graphite alkene material; thereby accomplish accurate accuse temperature to solve the inconvenience that has now brought through the cooling inaccuracy, thereby helping hand industrial intelligent production, good article accuse when casting 3D prints in the production process.

To facilitate understanding of the improvements of the present invention over the prior art by those skilled in the art, the present invention will be further described with reference to the following examples and accompanying drawings.

The utility model provides an embodiment one mainly explains the structure of shower nozzle for realizing the cooling that 3D printed, specifically as follows:

referring to fig. 1 to 3, a first embodiment of the present invention provides a nozzle device 100 for 3D printing deposition heating material to manufacture parts and components, i.e. for spraying printing material, the nozzle device 100 includes an input end 1, a heat dissipation mechanism 2, and an output end 3, the printing material enters from the input end 1 and is discharged from the output end 3, wherein the heat dissipation mechanism 2 is located between the input end 1 and the output end 3 through which the printing material passes; of which at least 1 output 3 is present.

It can be understood that the printing material mainly enters the heat dissipation mechanism 2 from the input end 1 for cooling and then is output from the output end 3; through the technical scheme, the comprehensive heat dissipation and cooling is achieved for the materials, the problem that the printed objects sink due to the fact that the printed materials are not cooled completely when stacked is solved, and the quality and the reliability of printed products are improved.

Alternatively, the output end 3 of the present embodiment is two, i.e. the dual nozzles described by those skilled in the art, and the advantage of using multiple nozzles is that the process and efficiency can be improved if some complicated workpieces or workpieces with different sizes need to be printed. Exemplary are as follows: the model that needs to print has a large amount of circular arc inclined planes or fretwork to be decorated, can select the dual spray, and output 3 prints the model, and output 3 prints soluble support, and the support is dissolved in the external liquid medium of model after having beaten to the realization obtains glossy holding surface, and is difficult to make the product collapse.

It will be appreciated that the output 3 may be at least one to enable multi-jet printing.

Referring to fig. 3, the input terminal 1 and the output terminal 3 are necessarily conducted with each other, and the heat dissipation mechanism 2 may be located between the input terminal 1 and the output terminal 3 and simultaneously conducted with the input terminal 1 and the output terminal 3, or may be merely sleeved outside the input terminal 1 and the output terminal 3 and not conducted with the input terminal 1 and the output terminal 3; the cooling effect of the printing materials from the input end 1 to the output end 3 can be achieved;

it will be appreciated that the flow of printing material from input 1 to output 3 is exemplary as follows: analogize tap through water, can let tap's water directly cool down through the cooling material that can cool down water, also can adopt the indirect pipeline to tap of cooling material to cool down to when water through this pipeline, the same reason can cool down water.

Referring to fig. 4, the heat dissipation mechanism 2 includes a mounting assembly 21, a semiconductor chilling plate 22, and a cooling box 23, wherein at least one side of the cooling box 23 is provided with an opening (not numbered) to expose at least one side of the cooling box 23, the semiconductor chilling plate 22 is mounted at the opening of the side under the cooperation of the mounting assembly 21, and the semiconductor chilling plate 22 is closely attached to one side of the cooling box 23 to be close to a region where the printing material flows in the cooling box 23, so as to cool the printing material.

Specifically, the manner adopted in this embodiment can be simply understood that the cooling box 23 is originally a sealed body, and is used for receiving the printing substance to flow inside, at least one surface of the cooling box 23 is provided with an opening, the semiconductor chilling plate 22 is used for filling the opening, so that the printing substance can pass through the semiconductor chilling plate 22, and the printing substance can be rapidly cooled in time, and meanwhile, compared with air cooling and water cooling, the technical means does not affect the normal flow of the printing substance and the characteristics of the material of the printing substance, and has strong controllability;

optionally, in this embodiment, the printing material directly passes through the semiconductor chilling plate 22 when the cooling box 23 flows through, so as to cool the printing material; that is, the heat dissipation mechanism 2 is conducted with the input end 1 and the output end 3 at the same time; the method comprises the following specific steps:

referring to fig. 4 and 5, a channel 234 similar to a cavity, an inlet 231 and an outlet 232 are arranged inside the cooling box 23, the inlet 231, the channel 234 and the outlet 232 are sequentially communicated, the printing material is discharged from the outlet 232 through the channel 234 after entering from the inlet 231, and heat dissipation fins 233 are arranged on the surface of one side of the cooling box 23 and the semiconductor chilling plate 22, which is optionally the upper surface in this embodiment; wherein the gaps between the heat dissipating fins 233 and the size of the semiconductor chilling plates 22 are matched with each other; wherein, the inlet 231 is communicated with the input end 1, and the outlet 232 is communicated with the output end 3; so as to realize that the printing materials flow through the input end 1, the inlet 231, the channel 234, the outlet 232 and the output end 3 in sequence.

Therefore, according to the above description, the channel 234, the outlet 232, and the inlet 231 may not be provided, that is, the cooling box 23 is not conducted with the input terminal 1 and the output terminal 3, but is externally embedded between the input terminal 1 and the output terminal 3, and the semiconductor refrigeration sheet 22 is directly attached to the outer wall of the input terminal 1 and the output terminal 3.

The "heat dissipation fins 233" are heat dissipation fins, and are classified as "passive heat dissipation elements" in the field of electronic engineering design. Commonly known as a heat sink, a metal with good thermal conductivity, light weight and easy processing is attached to the heat-generating surface to dissipate heat in a complex heat exchange mode.

Optionally, this heat dissipation fin 233 is towards the vertical direction of printing material direction of delivery to derive the heat that semiconductor refrigeration piece 22 produced from one side, make the heat can not pile up in shower nozzle device 100 department, and heat dissipation fin 233 is mostly aluminium, and copper is formed, and the quality is lighter, can not influence shower nozzle device 100's removal, thereby realizes that shower nozzle device 100 removes more lightly, increases heat radiating surface area, characteristics that the heat effect is good.

It can be understood that the heat dissipation fins 233 provided by the present embodiment are optionally 2 groups, the semiconductor refrigeration pieces 22 are 2-3 pieces, and the gaps between the semiconductor refrigeration pieces 22 and the two groups of heat dissipation fins 233 are matched, so that the semiconductor refrigeration pieces 22 are just inserted into the gaps between the heat dissipation fins 233, and a limiting effect is achieved.

It can be understood that the semiconductor refrigeration piece 22 is clamped between the heat dissipation fins 233, so that the semiconductor refrigeration piece 22 and the heat dissipation fins 233 are alternately arranged, the heat exchange between the semiconductor refrigeration piece 22 and the heat dissipation fins 233 is more efficient, and the advantage of mutual limitation is also taken into consideration.

Referring to fig. 4, fig. 5 and fig. 6, a cold end 222 is a side of the semiconductor chilling plate 22 facing the cooling box 23, and a hot end 221 is a side of the semiconductor chilling plate 22 away from the semiconductor chilling plate;

it can be appreciated that the semiconductor cooling plate 22 has the advantage of no interference with the existing 3D cooling means, and thus the application thereof is not limited in some fields, thereby having high reliability requirements and no refrigerant pollution, and simultaneously making the nozzle device 100 more accurate. The principle is that by using the Peltier (Peltier) effect of semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, and the purpose of refrigeration can be achieved, so that in the field of 3D printing, accurate cooling can be achieved by using the semiconductor refrigeration sheet 22, printing material failure caused by inaccurate cooling cannot be caused, and the normal operation of working procedures and the yield of products are affected.

Please refer to fig. 7, the structure is simplified for illustration and understanding, the above explains the necessary structural features in the first embodiment, in the actual production, no matter the input end 1, the heat dissipation mechanism 2, and the output end 3 are improved, combined and separated, as long as it follows that the printing material enters from the input end 1, passes through the heat dissipation mechanism 2, goes out from the output end 3, the heat dissipation mechanism 2 is set to be that the semiconductor refrigeration piece 22 is close to at least one side of the channel 234 of the printing material in the heat dissipation mechanism 2, and no matter the printing material is cooled directly or indirectly, the present invention should fall within the scope covered by the present invention.

Further, the present invention also provides an extension based on the first embodiment, a fan (not shown) may be disposed on one side of the hot end 221 of the semiconductor cooling plate 22, and the fan takes out heat from one side of the hot end 221;

in a modification of the first embodiment, the semiconductor chilling plates 22 may be disposed on the upper and lower surfaces of the 3D printing nozzle 100, or even disposed in the upper, lower, left, and right directions, so as to avoid the problems of poor cooling effect, low accuracy, and easy occurrence of large temperature difference between different surfaces of the printing material during cooling, for example, the temperature of the surface of the printing material contacted by the semiconductor chilling plates 22 is low, and the temperature of the other surface deviating from the surface may be undesirably low, thereby affecting the structural strength and surface accuracy of the subsequent printing workpiece;

in other specific embodiments, on the premise of not considering the cost, the semiconductor chilling plate 22 is not used singly, but the channel 234 of the cooling box 23 is manufactured by customizing the semiconductor chilling plate 22, so that the inner wall of the channel 234 is the cold end 222, and the outer wall is the hot end 221, thereby the heat dissipation effect on the printing material is better, and the heat dissipation is uniform.

It will be appreciated that the semiconductor chilling plates 22 are designed to transfer the hot side 221 temperature to the cold side 222, and therefore the cold side is located close to the channel 234 to quickly transfer the heat of the printing substance to the outside;

referring to fig. 8, the present invention further provides a modification of the first embodiment, in which the semiconductor cooling plate 22 may be a plate or a block, stacked in a single layer or multiple layers, and shaped as a ring or a square;

it is understood that the shape and number of layers of the semiconductor cooling plate 22 are not limited, and may be a ring or a square as is common in the art, and the structure may be a single plate or a block, and only the cooling in the above manner is required.

Exemplary are as follows: when the semiconductor chilling plate 22 is annular, the inner wall of the semiconductor chilling plate 22 is a hot end 221, and the outer wall is a cold end 222, wherein the cold end 222 is the side facing the cooling box 23.

Referring to fig. 9, the present invention further provides an extension based on the first embodiment, wherein the output end 3 may be a hard or soft, or a shuttle or a square;

in order to better explain the utility model, a second embodiment of the utility model provides a spray head for 3D printing, and the application field of the spray head for 3D printing is the field of 3D printing insoles;

it can be understood that the 3D printing materials required by the 3D printing insole are various, but most of the materials are mainly made of high molecular polymers, such as any one or more polymers of rubber, PU, PVC, TPU, EVA, TPR, and ABS, and the materials are individually configured for users in the field of 3D printing insoles, so that the cost of the materials is very high in the field of 3D printing insoles, the printing materials are prone to losing effectiveness due to untimely cooling, and the loss is brought to enterprises, and the blockage of the 3D printing nozzle is prone to being caused, so that the printing efficiency is affected; thirdly, the object is easy to be directly collapsed; therefore, the three-point problem can be solved in the field of 3D printing insoles by applying the nozzle for 3D printing, and the three-point nozzle has the advantages of good quality control, high efficiency and low cost.

In order to better explain the utility model, a third embodiment of the utility model provides a 3D printer, which comprises the spray head for 3D printing, and the 3D printer is used for constructing a product and cooling the printing material in the spray head;

it will also be understood by those skilled in the art that the devices or structures described herein may be combined or substituted by other elements, combinations thereof or modifications, such as moving positions of various components; or the products formed by the components are integrally arranged; or a detachable design; any kind of circuit device/equipment/device with specific functions can be formed by the combined components, and the corresponding components of the present invention are also within the protection scope of the present invention.

The above is only a preferred embodiment of the present invention, and should not be limited to the present invention, and any modifications, equivalent replacements, and improvements made within the principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A spray head for 3D printing can cool a printing material, and is characterized by comprising an input end, an output end and a heat dissipation mechanism arranged between the input end and the output end, wherein the heat dissipation mechanism is a semiconductor refrigeration piece, the printing material enters from the input end and is discharged from the output end through the heat dissipation mechanism, and the semiconductor refrigeration piece is attached to one side of the heat dissipation mechanism; so as to cool the printing material passing along the way.

2. The nozzle for 3D printing according to claim 1, wherein there is at least one output.

3. The nozzle for 3D printing according to claim 1, wherein the heat dissipation mechanism comprises a mounting assembly and a cooling box, at least one side of the cooling box is provided with an opening to expose at least one side of the cooling box, and the semiconductor chilling plate is mounted at the opening of the side under the cooperation of the mounting assembly so as to be close to an area where the printing material flows in the cooling box to cool the printing material.

4. The nozzle for 3D printing according to claim 3, wherein the cooling box comprises a channel similar to a cavity, an inlet and an outlet, the inlet, the channel and the outlet are communicated in sequence, the printing material enters from the inlet and is discharged from the outlet through the channel, the inlet and the input end are communicated with each other, and the outlet and the output end are communicated with each other; so as to realize that the printing materials flow in turn from the input end, the inlet, the channel, the outlet and the output end.

5. The head for 3D printing according to claim 4, wherein heat dissipation fins are provided on the surface of one side of the cooling box and the semiconductor chilling plate, and the space between the heat dissipation fins and the size of the semiconductor chilling plate are matched with each other.

6. The nozzle for 3D printing according to claim 5, wherein the semiconductor chilling plate comprises a cold end and a hot end, wherein the cold end is the end facing the printing material, the hot end and the heat dissipation fins are arranged on the same side, and the surface of the heat dissipation fins facing the hot end is vertical.

7. The nozzle for 3D printing according to claim 5, wherein the semiconductor chilling plate is at least one side of the 3D printing nozzle.

8. The spray head for 3D printing according to any one of claims 1 to 7, wherein the semiconductor chilling plate can be a plate or a block, stacked in a single layer or multiple layers, and shaped in any one of a ring shape and a square shape.

9. A shower nozzle for 3D prints, specially adapted 3D prints shoe-pad, can carry out cooling to the printing material, and it includes the shower nozzle for 3D prints of any one of claim 1 ~ 7.

10. A3D printer, comprising the nozzle for 3D printing as claimed in any one of claims 1 to 7, wherein the nozzle is used for cooling a printing material in the nozzle while constructing a product.