CN210679186U - Ceramic plate breaking device for large semiconductor - Google Patents
Ceramic plate breaking device for large semiconductor Download PDFInfo
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- CN210679186U CN210679186U CN201921227622.2U CN201921227622U CN210679186U CN 210679186 U CN210679186 U CN 210679186U CN 201921227622 U CN201921227622 U CN 201921227622U CN 210679186 U CN210679186 U CN 210679186U
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- chute
- clamping plate
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Abstract
The utility model relates to the technical field of porcelain plate cutting equipment, in particular to a device for breaking a large semiconductor into small blocks by hands, which comprises a bottom plate, wherein the upper surface of the bottom plate is horizontally arranged, and a vertical plate which is vertically arranged is arranged on the bottom plate; the left side of the vertical plate is provided with a left chute which is arranged up and down, a lower spring is arranged below the left chute, a left lower clamping plate is arranged in the left chute, the lower spring supports the left lower clamping plate, an upper spring is arranged above the left chute, a left upper clamping plate is arranged in the left chute, and the upper spring pulls the left upper clamping plate; the right side and the left side are symmetrically arranged; the middle of the bottom plate is provided with a protrusion in the front-back direction. Has the advantages of correct fracture part, lower rejection rate and low labor intensity.
Description
Technical Field
The utility model belongs to the technical field of the porcelain plate cutting equipment technique and specifically relates to a bold for semiconductor porcelain plate break into fritter device off with fingers and thumb.
Background
The semiconductor refrigerating piece comprises a porcelain plate and crystal grains on the porcelain plate, the porcelain plate used by the semiconductor refrigerating piece is formed by dividing a large porcelain plate, the large porcelain plate is of a planar structure, a dividing groove is formed in the dividing position of the large semiconductor porcelain plate by a laser machine, and then the dividing groove is broken off to form the porcelain plate required by the semiconductor refrigerating piece.
In the prior art, a device for breaking a large semiconductor porcelain plate with a dividing groove is not provided, the semiconductor porcelain plate is manually divided by hands, two sides of the dividing groove of the large porcelain plate are respectively held by two hands of a person and broken by two hands, the large porcelain plate is broken from the dividing groove to form a small porcelain plate, and therefore the broken part is easy to deviate from the dividing groove, the rejection rate is high, and labor is wasted.
Disclosure of Invention
The purpose of the utility model is to overcome the defects and provide a device for breaking off the large semiconductor porcelain plate into small blocks with correct fracture parts, low rejection rate and low labor intensity.
The technical scheme of the utility model be realized like this, a bold is porcelain plate for semiconductor breaks into the fritter device off with the fingers and thumb, characterized by: the vertical plate type solar water heater comprises a bottom plate, wherein the upper surface of the bottom plate is horizontally arranged, and a vertical plate which is vertically arranged is arranged on the bottom plate;
the left side of the vertical plate is provided with a left chute which is arranged up and down, a lower spring is arranged below the left chute, a left lower clamping plate is arranged in the left chute, the lower spring supports the left lower clamping plate, an upper spring is arranged above the left chute, a left upper clamping plate is arranged in the left chute, and the upper spring pulls the left upper clamping plate;
the right side of the vertical plate is provided with a right chute which is arranged up and down, a lower spring is arranged below the right chute, a right lower clamping plate is arranged in the right chute, the lower spring supports the right lower clamping plate, an upper spring is arranged above the right chute, a right upper clamping plate is arranged in the right chute, and the upper spring pulls the right upper clamping plate;
the middle of the bottom plate is provided with a protrusion in the front-back direction.
Furthermore, a connecting bridge is arranged between the left upper splint and the right upper splint;
further, the cross section of the protrusion is triangular.
Further, a rubber layer is arranged on the bulges.
Furthermore, the contact part of the left lower splint and the left upper splint is provided with a rubber gasket, and the contact part of the right lower splint and the right upper splint is provided with a rubber gasket.
Furthermore, the upper surface of the bottom plate also comprises an upper layer plate and a lower layer plate, the upper layer plate and the lower layer plate are connected through screws, and the protrusions are arranged on the upper layer plate.
The utility model has the advantages that: the device for breaking the large semiconductor into small blocks by using the porcelain plate has the advantages of correct fracture part, lower rejection rate and low labor intensity.
Drawings
Fig. 1 is a schematic front structural view of the present invention.
Fig. 2 is a schematic structural view of the side of the present invention.
Wherein: 1. the bottom plate 2, the riser 3, left spout 4, lower spring 5, left lower plate 6, go up spring 7, left upper plate 8, right spout 9, right lower plate 10, right upper plate 11, arch 12, connecting bridge 13, rubber layer 14, rubber gasket 15, upper plate 16, lower floor's board 17, screw 18, big flitch 19, cut apart the groove.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
As shown in fig. 1 and 2, a device for breaking a large semiconductor porcelain plate into small blocks is characterized in that: the device comprises a bottom plate 1, wherein the upper surface of the bottom plate is horizontally arranged, and a vertical plate 2 which is vertically arranged is arranged on the bottom plate;
the left side of the vertical plate is provided with a left chute 3 which is arranged up and down, a lower spring 4 is arranged below the left chute, a left lower clamping plate 5 is arranged in the left chute, the lower spring supports the left lower clamping plate, an upper spring 6 is arranged above the left chute, a left upper clamping plate 7 is arranged in the left chute, and the upper spring pulls the left upper clamping plate;
the right side of the vertical plate is provided with a right chute 8 which is arranged up and down, a lower spring 4 is arranged below the right chute, a right lower clamping plate 9 is arranged in the right chute, the lower spring supports the right lower clamping plate, an upper spring 6 is arranged above the right chute, a right upper clamping plate 10 is arranged in the right chute, and the upper spring pulls the right upper clamping plate;
the middle of the bottom plate is provided with a protrusion 11 in the front-back direction.
The utility model discloses during the use, can place big porcelain plate 18 that has the cut-apart groove between left punch holder and left lower plate, between right punch holder and the right lower plate, and cut-apart groove 19 and the projection coincidence below the arch, press left punch holder and right punch holder simultaneously, make left punch holder and left lower plate, right punch holder and right lower plate centre gripping big porcelain plate and move downwards, 19 positions of cut-apart groove of big porcelain plate are being pushed up to the arch, can break off with the fingers and thumb from cutting apart the groove big porcelain plate, it is correct to have the fracture position, the disability rate is lower, the advantage that intensity of labour is little.
Further, a connecting bridge 12 is arranged between the left upper clamping plate and the right upper clamping plate.
The utility model discloses set up like this, press the action that connects the bridge and can realize pressing left punch holder and right punch holder simultaneously to the centre gripping of the left and right sides is unanimous, and the result of use is better.
Further, the cross section of the protrusion is triangular.
Therefore, the breaking effect is better.
Further, the projection is provided with a rubber layer 13 thereon.
Further, the contact part of the left lower clamping plate and the left upper clamping plate is provided with a rubber gasket 14, and the contact part of the right lower clamping plate and the right upper clamping plate is provided with a rubber gasket.
The product damage rate produced by the arrangement is lower.
Furthermore, the upper surface of the bottom plate also comprises an upper layer plate 15 and a lower layer plate 16, the upper layer plate and the lower layer plate are connected through screws 17, and the protrusions are arranged on the upper layer plate.
Can adjust bellied position like this, realize the big porcelain plate of breaking off with the fingers and thumb when centre gripping big porcelain plate elasticity degree is better, the adjustment is used, and is more convenient.
The above description is only an embodiment of the present invention, but the structural features of the present invention are not limited thereto, and any changes or modifications within the field of the present invention by those skilled in the art are covered within the scope of the present invention.
Claims (6)
1. The utility model provides a bold is porcelain plate breaks into fritter device off with fingers and thumb for semiconductor which characterized by: the vertical plate type solar water heater comprises a bottom plate, wherein the upper surface of the bottom plate is horizontally arranged, and a vertical plate which is vertically arranged is arranged on the bottom plate;
the left side of the vertical plate is provided with a left chute which is arranged up and down, a lower spring is arranged below the left chute, a left lower clamping plate is arranged in the left chute, the lower spring supports the left lower clamping plate, an upper spring is arranged above the left chute, a left upper clamping plate is arranged in the left chute, and the upper spring pulls the left upper clamping plate;
the right side of the vertical plate is provided with a right chute which is arranged up and down, a lower spring is arranged below the right chute, a right lower clamping plate is arranged in the right chute, the lower spring supports the right lower clamping plate, an upper spring is arranged above the right chute, a right upper clamping plate is arranged in the right chute, and the upper spring pulls the right upper clamping plate;
the middle of the bottom plate is provided with a protrusion in the front-back direction.
2. The apparatus for breaking a bulk semiconductor porcelain plate into small pieces according to claim 1, wherein: and a connecting bridge is arranged between the left upper splint and the right upper splint.
3. The apparatus for breaking a bulk semiconductor porcelain plate into small pieces according to claim 1 or 2, wherein: the cross section of the bulge is in a triangular state.
4. The apparatus for breaking a bulk semiconductor porcelain plate into small pieces according to claim 3, wherein: the projection is provided with a rubber layer.
5. The apparatus for breaking a bulk semiconductor porcelain plate into small pieces according to claim 4, wherein: the position that left lower splint and left upper plate contacted has the rubber gasket, the position that right lower splint and right upper plate contacted have the rubber gasket.
6. The apparatus for breaking a bulk semiconductor porcelain plate into small pieces according to claim 1 or 2, wherein: the upper surface of the bottom plate also comprises an upper layer plate and a lower layer plate, the upper layer plate and the lower layer plate are connected through screws, and the protrusions are arranged on the upper layer plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921227622.2U CN210679186U (en) | 2019-08-01 | 2019-08-01 | Ceramic plate breaking device for large semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921227622.2U CN210679186U (en) | 2019-08-01 | 2019-08-01 | Ceramic plate breaking device for large semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210679186U true CN210679186U (en) | 2020-06-05 |
Family
ID=70900502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921227622.2U Active CN210679186U (en) | 2019-08-01 | 2019-08-01 | Ceramic plate breaking device for large semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210679186U (en) |
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2019
- 2019-08-01 CN CN201921227622.2U patent/CN210679186U/en active Active
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