CN210670817U

CN210670817U - Copper plating device is used in HDI circuit board production

Info

Publication number: CN210670817U
Application number: CN201921782326.9U
Authority: CN
Inventors: 劉之鍇
Original assignee: Hongtu Yinghai Technology Shenzhen Co Ltd
Current assignee: Hongtu Yinghai Technology Shenzhen Co Ltd
Priority date: 2019-10-23
Filing date: 2019-10-23
Publication date: 2020-06-02
Anticipated expiration: 2029-10-23

Abstract

The utility model relates to a HDI circuit board production technical field just discloses a copper facing device is used in HDI circuit board production, the on-line screen storage device comprises a base, the top of base is seted up flutedly, the inside movable mounting of recess has the board of placing, the collecting vat has been seted up at the top of placing the board, the inner diapire fixed mounting of collecting vat has the bracing piece, the top of base just is located the equal fixed mounting in the left and right sides of placing the board has the dead lever, two the centre gripping groove has all been seted up to one side that the dead lever is relative, two the equal fixed mounting in interior roof of centre gripping groove has a centre gripping spring, two the equal fixed mounting in bottom of centre gripping spring has supporting rod, two the bottom fixed mounting. This copper plating equipment is used in HDI circuit board production places the board through the setting, and two copper plating heads can move to the right side upwards downwards or left in the place ahead of mounting panel and carry out nimble copper plating to the circuit board, have effectively improved the copper facing efficiency of HDI circuit board.

Description

Copper plating device is used in HDI circuit board production

Technical Field

The utility model relates to a HDI circuit board production technical field specifically is a copper facing device is used in HDI circuit board production.

Background

HDI boards are the english shorthand for High Density interconnects, High Density Interconnect (HDI) manufacturing is the fastest growing field in the printed wiring board industry, large ASICs and FPGAs with smaller device pitch and more I/O pins and embedded passive devices have shorter and shorter rise times and higher frequencies, all of which require smaller PCB feature sizes.

The HDI circuit board needs copper plating on the circuit board in the production process, and the copper plating layer has the effect of protecting the thin chemical copper which is just deposited and preventing the chemical copper from being corroded by acid after being oxidized, but the clamping effect of the traditional copper plating device is general when the traditional copper plating device works, even the circuit board needs to be held by hand to be plated with copper, and the copper plating position of the copper plating device needs to be flexibly changed in the copper plating process, so the copper plating device for producing the HDI circuit board is provided.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a copper facing device is used in HDI circuit board production possesses the centre gripping fastening and makes things convenient for advantages such as copper plating, and it is general to have solved traditional copper facing device centre gripping effect in work, still needs handheld circuit board to carry out the copper facing even to need the problem of nimble change copper facing device's copper facing position at copper-plated in-process.

(II) technical scheme

In order to realize the purpose of clamping and fastening and facilitating copper plating, the utility model provides the following technical scheme: a copper plating device for HDI circuit board production comprises a base, wherein a groove is formed in the top of the base, a placing plate is movably mounted in the groove, a collecting groove is formed in the top of the placing plate, a supporting rod is fixedly mounted on the inner bottom wall of the collecting groove, fixing rods are fixedly mounted on the top of the base and positioned on the left side and the right side of the placing plate, clamping grooves are formed in the opposite sides of the two fixing rods, clamping springs are fixedly mounted on the inner top walls of the two clamping grooves, clamping rods are fixedly mounted at the bottom ends of the two clamping springs, clamping plates are fixedly mounted at the bottom ends of the two clamping rods, a mounting plate is fixedly mounted at the top of the base and positioned on the back of the placing plate, a sliding groove is formed in the front of the mounting plate, a mounting block is movably mounted at the front of the sliding groove, and copper plating, the left and right sides of installation piece just is located the equal fixed mounting in front of mounting panel has a pivot, two the reset torsion spring has all been cup jointed in the outside of pivot, two the equal movable mounting in one side that the pivot deviates from has the connecting rod, the slot has all been seted up to the left and right sides at bracing piece top, two the equal movable mounting in inside of slot has the sucking disc, two the equal fixed mounting in bottom of sucking disc has the elastic rubber ball, two the bottom of sucking disc and the equal fixed mounting in left and right sides that is located the elastic rubber ball have the joint pole, two the draw-in groove has all been seted up to the left and right sides of diap.

Preferably, the number of the collecting grooves is three, and the height of the supporting rod is smaller than that of the collecting grooves.

Preferably, the height of the fixed rod is greater than that of the placing plate, and the bottom ends of the two clamping rods are in mutual contact with the placing plate.

Preferably, the clamping plate is L-shaped, and the height of the mounting plate is greater than that of the fixing rod.

Preferably, two equal fixed mounting in one side that the copper plating head deviates from mutually has handheld handle, the spout is located the top of placing the board.

Preferably, two equal fixed mounting in the front of installation piece in the opposite one side of reduction torsion spring, two the bottom of elastic rubber ball all with the interior diapire fixed connection of slot, joint pole movable mounting is in the inside of draw-in groove.

(III) advantageous effects

Compared with the prior art, the utility model provides a copper facing device is used in HDI circuit board production possesses following beneficial effect:

the copper plating device for HDI circuit board production comprises a placing plate, wherein two clamping rods are required to be upwards pulled to drive two clamping springs to upwards move when a circuit board is required to be subjected to copper plating, so that the clamping plates can upwards move and clamp the circuit board below the clamping plates, the circuit board is clamped between the clamping plates and the placing plate to be clamped tightly, then the circuit board is slightly downwards pressed to suck the bottom of the circuit board at the top of a sucker, the sucker is pressed downwards if the force is excessive in the copper plating process, the sucker presses down an elastic rubber ball when the sucker is inserted into a slot, the two clamping rods can also respectively move in two clamping grooves, and the elastic rubber ball can buffer the impact force of pressing downwards to avoid the circuit board damage caused by excessive force, then, the two copper plating heads can be held by hands to respectively carry out copper plating on the circuit board at two sides, and the two copper plating heads can move upwards, downwards or leftwards and rightwards in front of the mounting plate to carry out flexible copper plating on the circuit board, so that the copper plating efficiency of the HDI circuit board is effectively improved.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a top view of the mounting plate of the present invention;

fig. 3 is an enlarged view of the structure at a position of the present invention.

In the figure: the device comprises a base 1, a groove 2, a placing plate 3, a collecting groove 4, a supporting rod 5, a fixing rod 6, a clamping groove 7, a clamping spring 8, a clamping rod 9, a clamping plate 10, a mounting plate 11, a sliding groove 12, a mounting block 13, a copper plating head 14, a rotating shaft 15, a reset torsion spring 16, a connecting rod 17, a slot 18, a sucking disc 19, an elastic rubber ball 20, a clamping rod 21 and a clamping groove 22.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, a copper plating device for producing an HDI circuit board comprises a base 1, a groove 2 is formed in the top of the base 1, a placing plate 3 is movably mounted in the groove 2, a collecting tank 4 is formed in the top of the placing plate 3, three supporting rods 5 are fixedly mounted on the inner bottom wall of the collecting tank 4, the height of each supporting rod 5 is smaller than that of the collecting tank 4, fixing rods 6 are fixedly mounted on the top of the base 1 and positioned on the left side and the right side of the placing plate 3, clamping grooves 7 are formed in the opposite sides of the two fixing rods 6, clamping springs 8 are fixedly mounted on the inner top walls of the two clamping grooves 7, clamping rods 9 are fixedly mounted at the bottom ends of the two clamping springs 8, the height of the fixing rods 6 is larger than that of the placing plate 3, the bottom ends of the two clamping rods 9 are mutually contacted with the placing plate 3, and a clamping plate 10 is, a mounting plate 11 is fixedly mounted at the top of the base 1 and positioned at the back of the placing plate 3, a clamping plate 10 is in an L shape, the height of the mounting plate 11 is greater than that of the fixing rod 6, a chute 12 is formed in the front of the mounting plate 11, a mounting block 13 is movably mounted at the front of the chute 12, copper plating heads 14 are movably mounted at the left side and the right side of the mounting block 13, a hand-held handle is fixedly mounted at one side of each of the two copper plating heads 14, the chute 12 is positioned above the placing plate 3, rotating shafts 15 are fixedly mounted at the left side and the right side of the mounting block 13 and positioned at the front of the mounting plate 11, reset torsion springs 16 are sleeved at the outer sides of the two rotating shafts 15, connecting rods 17 are movably mounted at one sides of the two rotating shafts 15, slots 18 are formed in the left side and the right side of the top of the supporting rod 5, suckers 19, clamping rods 21 are fixedly arranged at the bottoms of the two suckers 19 and at the left side and the right side of the elastic rubber balls 20, clamping grooves 22 are formed at the left side and the right side of the inner bottom wall of the two slots 18, one opposite side of the two reset torsion springs 16 is fixedly arranged on the front surface of the mounting block 13, the bottoms of the two elastic rubber balls 20 are fixedly connected with the inner bottom wall of the slots 18, the clamping rods 21 are movably arranged in the clamping grooves 22, when a circuit board needs to be copper-plated, the two clamping rods 9 need to be pulled upwards to enable the two clamping rods 9 to drive the clamping springs 8 to move upwards, so that the clamping plate 10 can move upwards and enable the circuit board to be clamped below the clamping plate 10, and thus the circuit board is clamped between the clamping plate 10 and the placing plate 3 to enable the circuit board to be clamped tightly, then the circuit board is slightly pressed downwards to enable the bottom of the circuit board to be, and if excessive force is exerted in the copper plating process, the sucker 19 can be pressed downwards, when the sucker 19 is inserted into the slot 18, the sucker 19 can press the elastic rubber ball 20 downwards, the two clamping rods 21 can move in the two clamping grooves 22 respectively, when the sucker 19 is pressed downwards, the impact force of downward pressing can be buffered by the elastic rubber ball 20, the circuit board is prevented from being damaged due to excessive force, then the circuit board can be subjected to copper plating on two sides by holding the two copper plating heads 14 respectively, the two copper plating heads 14 can move upwards, downwards or leftwards and rightwards in front of the mounting plate 11 to carry out flexible copper plating on the circuit board, and the copper plating efficiency of the HDI circuit board is effectively improved.

When the circuit board is used, when the circuit board needs to be subjected to copper plating, firstly, the two clamping rods 9 need to be pulled upwards, so that the two clamping rods 9 can drive the clamping springs 8 to move upwards, the clamping plate 10 can move upwards and clamp the circuit board below the clamping plate 10, the circuit board is clamped between the clamping plate 10 and the placing plate 3, the circuit board can be clamped tightly, then the circuit board is slightly pressed downwards, the bottom of the circuit board is sucked at the top of the sucking disc 19, if the force is excessive in the copper plating process, the sucking disc 19 can be pressed downwards, when the sucking disc 19 is inserted into the slot 18, the sucking disc 19 can press the elastic rubber ball 20 downwards, the two clamping connecting rods 21 can also move in the two clamping grooves 22 respectively, and when the sucking disc 19 is pressed downwards, the impact force of the elastic rubber ball 20 which is pressed downwards can avoid the circuit board damage caused by the excessive force, then, the two copper plating heads 14 can be held by hands to respectively carry out copper plating on the circuit board at two sides, and the two copper plating heads 14 can move upwards, downwards or leftwards and rightwards in front of the mounting plate 11 to carry out flexible copper plating on the circuit board.

In summary, according to the copper plating device for producing the HDI circuit board, by arranging the placing plate 3, when the circuit board needs to be subjected to copper plating, firstly, two clamping rods 9 need to be pulled upwards, so that the two clamping rods 9 can drive the clamping springs 8 to move upwards, the clamping plate 10 can move upwards and clamp the circuit board below the clamping plate 10, so that the circuit board is clamped between the clamping plate 10 and the placing plate 3, the circuit board can be clamped tightly, then the circuit board is slightly pressed downwards, the bottom of the circuit board is sucked at the top of the suction cup 19, and if the force is excessive in the copper plating process, the suction cup 19 is pressed downwards, when the suction cup 19 is inserted into the slot 18, the suction cup 19 presses the elastic rubber ball 20, and the two clamping rods 21 can move respectively in the two clamping slots 22, when the suction cup 19 is pressed downwards, the impact force of the pressing downwards can be buffered by the elastic rubber ball 20, so as to avoid the circuit board being damaged due to excessive force, then, the two copper plating heads 14 can be held by hands to respectively perform copper plating on the circuit board at two sides, the two copper plating heads 14 can move upwards, downwards or leftwards and rightwards in front of the mounting plate 11 to perform flexible copper plating on the circuit board, copper plating efficiency of the HDI circuit board is effectively improved, and the problems that a traditional copper plating device is common in clamping effect during work, even the circuit board needs to be held by hands to perform copper plating, and the copper plating position of the copper plating device needs to be flexibly changed in the copper plating process are solved.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a copper facing device is used in production of HDI circuit board, includes base (1), its characterized in that: the novel clamping device is characterized in that a groove (2) is formed in the top of the base (1), a placing plate (3) is movably mounted in the groove (2), a collecting groove (4) is formed in the top of the placing plate (3), a supporting rod (5) is fixedly mounted on the inner bottom wall of the collecting groove (4), fixing rods (6) are fixedly mounted on the top of the base (1) and positioned on the left side and the right side of the placing plate (3), clamping grooves (7) are formed in one opposite side of the two fixing rods (6), clamping springs (8) are fixedly mounted on the inner top walls of the two clamping grooves (7), clamping rods (9) are fixedly mounted at the bottoms of the two clamping springs (8), a clamping plate (10) is fixedly mounted at the bottom of the two clamping rods (9), and a mounting plate (11) is fixedly mounted on the top of the base (1) and positioned on the back of the, the front of mounting panel (11) has been seted up spout (12), the front movable mounting of spout (12) has installation piece (13), the equal movable mounting in the left and right sides of installation piece (13) has copper to plate first (14), the equal fixed mounting in the front that the left and right sides of installation piece (13) just is located mounting panel (11) has pivot (15), two reset torsion spring (16) have all been cup jointed in the outside of pivot (15), two the equal movable mounting in one side that pivot (15) deviate from mutually has connecting rod (17), slot (18) have all been seted up to the left and right sides at bracing piece (5) top, the equal movable mounting in the inside of two slot (18) has sucking disc (19), two the equal fixed mounting in bottom of sucking disc (19) has elastic rubber ball (20), two the equal fixed mounting in the left and right sides that the bottom of sucking disc (19) just is located elastic rubber ball (20) has joint pole (21), clamping grooves (22) are formed in the left side and the right side of the inner bottom wall of each of the two slots (18).

2. The copper plating device for producing the HDI circuit board as claimed in claim 1, wherein: the number of the collecting grooves (4) is three, and the height of the supporting rods (5) is smaller than that of the collecting grooves (4).

3. The copper plating device for producing the HDI circuit board as claimed in claim 1, wherein: the height of the fixed rod (6) is larger than that of the placing plate (3), and the bottom ends of the two clamping rods (9) are in mutual contact with the placing plate (3).

4. The copper plating device for producing the HDI circuit board as claimed in claim 1, wherein: the clamping plate (10) is L-shaped, and the height of the mounting plate (11) is larger than that of the fixing rod (6).

5. The copper plating device for producing the HDI circuit board as claimed in claim 1, wherein: two equal fixed mounting in one side that copper plating head (14) deviate from mutually has handheld handle, spout (12) are located the top of placing board (3).

6. The copper plating device for producing the HDI circuit board as claimed in claim 1, wherein: two equal fixed mounting in the front of installation piece (13) in the opposite one side of reset torsion spring (16), two the bottom of elasticity rubber ball (20) all with the interior diapire fixed connection of slot (18), joint rod (21) movable mounting is in the inside of draw-in groove (22).