CN210670779U - Frequency conversion electric control integrated board, PCB layout structure thereof and air conditioner - Google Patents

Frequency conversion electric control integrated board, PCB layout structure thereof and air conditioner Download PDF

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Publication number
CN210670779U
CN210670779U CN201921447707.1U CN201921447707U CN210670779U CN 210670779 U CN210670779 U CN 210670779U CN 201921447707 U CN201921447707 U CN 201921447707U CN 210670779 U CN210670779 U CN 210670779U
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device region
regional
power input
region
output device
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刘超凡
李豪
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Guangdong Kaili HVAC Co.,Ltd.
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Abstract

The utility model discloses an automatically controlled intergral template of frequency conversion and PCB layout structure thereof, an air conditioner, including PCB circuit board main part, it is regional to be provided with electronic components overall arrangement in the PCB circuit board main part, the overall arrangement is regional including power input output device, high-power device is regional, vary voltage module region and micro control device are regional, high-power device sets up in the regional left part of overall arrangement, power input output device is regional, vary voltage module region and micro control device are regional to be set up in the regional right part of overall arrangement, and power input output device is regional to be set up in the regional upper right portion of overall arrangement, micro control device is regional to be set up in the regional right lower part of overall arrangement, vary voltage module region sets up between power input output device region and micro control. The utility model discloses a PCB is rationally distributed, and electronic components in each module can not produce the interference, and the heat dispersion of the automatically controlled intergral template of frequency conversion is good.

Description

Frequency conversion electric control integrated board, PCB layout structure thereof and air conditioner
Technical Field
The utility model relates to an air conditioner technical field, concretely relates to automatically controlled intergral template of frequency conversion and PCB layout structure, air conditioner thereof.
Background
With the increasing demand of people on living quality, the market demand of the variable frequency air conditioner is larger and larger. The structure of the variable frequency electric control Board of the variable frequency air conditioner is complex, which has higher and higher design requirements for a Printed Circuit Board (PCB) of the variable frequency electric control Board. Electronic components contained on the variable-frequency electric control board are various and large in quantity, and unreasonable layout of the electronic components can cause signal interference among different components, so that equipment cannot run reliably. The split plates are usually adopted in the current market to realize the frequency conversion technology, so that the whole frequency conversion air conditioner needs a plurality of electric control plates, the space requirement is large, the wiring is complex, the price is high, the product standardization is not facilitated, and a lot of troubles are brought to factories, after-sales products and users.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an automatically controlled intergral template of frequency conversion and PCB layout structure, air conditioner thereof aims at solving among the prior art unable rationally distributed electronic components's problem on the automatically controlled intergral template of frequency conversion.
The utility model provides a PCB layout structure of automatically controlled integrated board of frequency conversion, including PCB circuit board main part, it is regional to be provided with electronic components overall arrangement in the PCB circuit board main part, the overall arrangement is regional including power input output device region, high-power device region, vary voltage module region and micro-control device region, high-power device region set up in the regional left part of overall arrangement, power input output device region vary voltage module region with micro-control device region set up in the regional right part of overall arrangement, just power input output device region set up in the regional upper right portion of overall arrangement, micro-control device region set up in the regional right lower part of overall arrangement, vary voltage module region set up in power input output device region with micro-control device is between the region.
Further, a plurality of mounting holes are arranged in the high-power device area.
Furthermore, a bridge stack, a fast recovery diode, an IGBT module and an IPM module are sequentially arranged in the high-power device region from top to bottom.
Further, the IPM modules include a first IPM module for driving a compressor and a second IPM module for driving a fan, and the first IPM module and the second IPM module are sequentially arranged from top to bottom.
Further, an electrolytic capacitor device area, a driving control device area and a low-voltage direct current output device area are included in the transformation module area, the driving control device area is arranged on the right side of the electrolytic capacitor device area, and the low-voltage direct current output device area is arranged on the lower side of the electrolytic capacitor device area.
Further, power input port and rectification filter device are set up in the power input output device region, power input port set up in the regional right side of power input output device, rectification filter device set up in the regional left side of power input output device.
Furthermore, the PCB circuit board main body comprises a top plate and a bottom plate, and power supply wiring and signal wiring are uniformly distributed in the top plate and the bottom plate.
Further, the layout area is arranged on the upper side of the top plate.
The utility model also provides an automatically controlled intergral template of frequency conversion, including the PCB layout structure of the automatically controlled intergral template of foretell frequency conversion.
The utility model also provides an air conditioner, including the automatically controlled intergral template of foretell frequency conversion.
The utility model has the advantages that:
the utility model discloses a frequency conversion automatically controlled intergral template and PCB layout structure, air conditioner through in the PCB layout structure of frequency conversion automatically controlled intergral template, will easily generate heat components and parts unified to be placed in the high-power device region, and set up the high-power device region in the left side of the layout region of PCB circuit board main part; the power input and output device area, the transformation module area and the micro control device area are arranged on the right side of the layout area of the PCB main body, and the power input and output device area and the micro control device area are separated through the transformation module area, so that electronic components in the micro control device area are prevented from being interfered by strong electricity; through foretell PCB layout structure, realize the reasonable layout of electronic components on the automatically controlled intergral template of frequency conversion, easily the heat dissipation, and the electronic components in each module can not produce the interference, reaches good circuit performance and heat dispersion.
Drawings
Fig. 1 is a schematic diagram of a PCB layout structure of a variable-frequency electronic control integrated board according to an embodiment of the present invention.
Description of reference numerals:
1: a PCB circuit board main body; 2: a power input output device region; 3: a high power device region; 301: mounting holes; 302: bridge rectifier; 303: a fast recovery diode; 304: an IGBT module; 305: a first IPM module; 306: a second IPM module; 4: a voltage transformation module area; 401: an electrolytic capacitor device region; 402: a drive control device region; 403: a low voltage DC output device region; 5: a micro-control device region.
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "left", "right", "upper", "lower" and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
The technical solutions between the embodiments of the present invention can be combined with each other, but it is necessary to use the basis that those skilled in the art can realize the combination, and when the technical solutions are contradictory or can not be realized, the combination of the technical solutions should be considered to be absent, and the present invention is not within the protection scope of the present invention.
Referring to fig. 1, an embodiment of the present invention provides a PCB layout structure of a variable frequency electrically-controlled integrated board, including a PCB circuit board main body 1, the PCB circuit board main body 1 is provided with an electronic component layout area which comprises a power input and output device area 2, a high-power device area 3, a voltage transformation module area 4 and a micro control device area 5, the high-power device region 3 is arranged at the left part of the layout region, the power input and output device region 2, the voltage transformation module region 4 and the micro-control device region 5 are arranged at the right part of the layout region, and the power input output device region 2 is disposed at the upper right portion of the layout region, the micro control device region 5 is disposed at the lower right portion of the layout region, the voltage transformation module region 4 is disposed between the power input/output device region 2 and the micro control device region 5.
In this embodiment, the components arranged in the high-power device region 3 are high-power components, which generate heat seriously when in use, and such components which easily generate heat are uniformly placed in the high-power device region 3, so as to conveniently connect a heat sink to the region corresponding to the high-power device region 3, and the heat sink can timely transfer heat in the high-power device region 3, so as to prevent the PCB from being overheated. The power input/output device region 2, the voltage transformation module region 4, and the micro control device region 5 generate relatively insignificant heat and are uniformly disposed in the right portion of the layout region. The input of the power input and output device area 2 is high-voltage alternating current, and the current is large, the frequency is high, and the interference is strong. The current in the above-mentioned micro-control device region 5 is a low voltage direct current. The power input and output device region 2 and the micro control device region 5 are separated through the voltage transformation module region 4, so that the power input and output device region 2 is positioned at the upper right part of the layout region, the micro control device region 5 is arranged at the lower right part of the layout region, a strong current region corresponding to the power input and output device region 2 and a weak current region corresponding to the micro control device region 5 are separated as far as possible on the frequency conversion electric control integrated plate, and the interference of the power input and output device region 2 on components of the micro control device region 5 is reduced to the minimum.
In the PCB layout structure of the variable-frequency electric control integrated board, components which are easy to generate heat are uniformly placed in the high-power device area 3, and the high-power device area 3 is arranged on the left side of the layout area of the PCB main body 1; the power input and output device region 2, the transformation module region 4 and the micro control device region 5 are arranged on the right side of the layout region of the PCB main body 1, and the transformation module region 4 separates the power input and output device region 2 from the micro control device region 5 so as to prevent electronic components in the micro control device region 5 from being interfered by strong electricity; through foretell PCB layout structure, realize the reasonable layout of electronic components on the automatically controlled intergral template of frequency conversion, easily the heat dissipation, and the electronic components in each module can not produce the interference, reaches good circuit performance and heat dispersion.
In one embodiment, a plurality of mounting holes 301 are provided in the high power device region 3. A heat sink is arranged above the high-power device region 3, and a plurality of mounting holes 301 are used for passing through screws to fix the high-power device on the heat sink, so that the device is tightly attached to the heat sink. The heat sink is not shown in the drawings, and after the heat sink is mounted, the heat sink covers the surface of the high-power device region 3, so that heat generated by elements in the high-power device region 3 can be quickly taken away.
In one embodiment, the bridge stack 302, the fast recovery diode 303, the IGBT module 304, and the IPM module are sequentially disposed from top to bottom in the high power device region 3. The high-power device region 3 is a long and narrow rectangle, and the bridge stack 302, the fast recovery diode 303, the IGBT module 304, and the IPM module are sequentially arranged from top to bottom, so that a radiator is correspondingly arranged in the region, and heat dissipation is performed in time. The structural arrangement of this embodiment is favorable to improving the heat dispersion of automatically controlled intergral template of frequency conversion.
The bridge stack 302 is used for rectifying alternating current into direct current; the fast recovery diode 303 has a single-phase conduction function, so that high voltage can be stabilized at two ends of the electrolytic capacitor and does not flow back; the IGBT module 304 functions as a fast switch, and by turning on or off (controlled by the microcontroller in the micro control device region 5), adjusts the duty ratio of the charging time of the electrolytic capacitor in the electrolytic capacitor device region 401 with the current to change the voltage of the high voltage direct current at both ends of the electrolytic capacitor; the IPM modules include a first IPM module 305 for driving a compressor and a second IPM module 306 for driving a fan, wherein the first IPM module 305 and the second IPM module 306 are arranged in order from top to bottom.
In one embodiment, an electrolytic capacitor device area 401, a driving control device area 402 and a low voltage dc output device area 403 are included in the transformer module area 4, the driving control device area 402 is disposed on the right side of the electrolytic capacitor device area 401, and the low voltage dc output device area 403 is disposed on the lower side of the electrolytic capacitor device area 401.
In this embodiment, the electrolytic capacitor device area 401 includes a plurality of electrolytic capacitors, and fig. 1 shows an example of 4 electrolytic capacitors, the number of the electrolytic capacitors is not limited by the present invention, and the number of the electrolytic capacitors is set according to specific situations in practical applications. Electrolytic capacitor's bulky quality is big, places electrolytic capacitor at the middle part of vary voltage module region 4, also puts at the central point of the automatically controlled intergral template of whole frequency conversion in fact, is favorable to keeping the focus of the automatically controlled intergral template of whole frequency conversion between two parties like this, is favorable to assembling the balance. The drive control device area 402 includes control devices such as fans, switches, and valves. The low-voltage dc current output device region 403 converts the high-voltage dc current output from the electrolytic capacitor device region 401 into a low-voltage dc current for output.
In one embodiment, a power input port and a rectifying and filtering device are arranged in the power input and output device region 2, the power input port is arranged on the right side of the power input and output device region 2, and the rectifying and filtering device is arranged on the left side of the power input and output device region 2.
In this embodiment, the input of the power input port is high-voltage ac, and the high-voltage ac is rectified, filtered, sampled, fed back and stabilized, and then output to the transformer module region 4.
In one embodiment, the micro-control device area 5 includes a plurality of micro-control devices for sending control information to control devices such as compressors, fans, switches, valves, etc.
In one embodiment, the PCB main body 1 includes a top plate and a bottom plate, and power traces and signal traces are uniformly distributed in the top plate and the bottom plate.
In one embodiment, the layout area is disposed on an upper side of the top plate. Electronic components on the frequency conversion electric control integrated plate all adopt single-side patch plug-in units, and all the components are placed on the upper side of the top plate, so that the production process is simplified, and the production cost is reduced.
In one embodiment, the left side of the high power device region 3 is further provided with another device placement region, and some other devices which cannot be classified as the power input and output device region 2, the high power device region 3, the voltage transformation module region 4 or the micro control device region 5 can be placed in the other device placement region.
The utility model also provides an automatically controlled intergral template of frequency conversion, including the PCB layout structure of the automatically controlled intergral template of foretell frequency conversion.
In the frequency conversion electric control integrated board of the embodiment, the PCB layout structure is adopted, components which are easy to generate heat are uniformly placed in the high-power device area 3, and the high-power device area 3 is arranged on the left side of the layout area of the PCB main body 1; the power input and output device region 2, the transformation module region 4 and the micro control device region 5 are arranged on the right side of the layout region of the PCB main body 1, and the transformation module region 4 separates the power input and output device region 2 from the micro control device region 5 so as to prevent electronic components in the micro control device region 5 from being interfered by strong electricity; through foretell PCB layout structure, realize the reasonable layout of electronic components on the automatically controlled intergral template of frequency conversion, easily the heat dissipation, and the electronic components in each module can not produce the interference, reaches good circuit performance and heat dispersion.
In an embodiment, use the utility model discloses automatically controlled intergral template of frequency conversion can turn into high voltage direct current with commercial power high voltage alternating current, then passes through the vary voltage and becomes littleer low pressure direct current, controls according to following flow: the commercial power high-voltage alternating current input from the power input port of the power input/output device region 2 is rectified and filtered by the rectifying and filtering device of the power input/output device region 2, the high-voltage alternating current is converted into high-voltage direct current, then sampling is carried out, the high-voltage direct current is input into the electrolytic capacitor device region 401 of the voltage transformation module region 4 after feedback and voltage stabilization, a part of the high-voltage direct current output from the electrolytic capacitor device region 401 is input into the low-voltage direct current output device region 403 of the voltage transformation module region 4, the high-voltage direct current is converted into low-voltage direct current to be output, the low-voltage direct current is input into the micro control device region 5, the low-voltage direct current is used for supplying power to the micro control device, a part of the high-voltage direct current output from the electrolytic capacitor device region 401 is input into the first IPM module 305, and a part of high-voltage direct current is input into the valve and the switch control device and is used for controlling the opening/closing of the valve and the switch.
The utility model also provides an air conditioner, including the automatically controlled intergral template of foretell frequency conversion.
The air conditioner of this embodiment adopts foretell automatically controlled intergral template of frequency conversion, and electronic components's on the automatically controlled intergral template of frequency conversion reasonable layout easily dispels the heat, and electronic components in each module can not produce the interference, reaches good circuit performance and heat dispersion to make the space demand to frequency conversion air conditioner little, simplify the wiring degree of difficulty, and be favorable to the standardization of product, be favorable to production and after sale.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the same way in the protection scope of the present invention.

Claims (10)

1. The utility model provides a PCB layout structure of automatically controlled integrated board of frequency conversion, its characterized in that, includes PCB circuit board main part, it is regional to be provided with electronic components layout in the PCB circuit board main part, the layout is regional including power input output device region, high-power device region, vary voltage module region and micro control device region, high-power device region set up in the regional left part of layout, power input output device region vary voltage module region with micro control device region set up in the regional right part of layout, just power input output device region set up in the regional upper right portion of layout, micro control device region set up in the regional right lower part of layout, vary voltage module region set up in power input output device region with between the micro control device region.
2. The PCB layout structure of a variable frequency electrically controlled integrated board of claim 1, wherein a plurality of mounting holes are disposed in the high power device region.
3. The PCB layout structure of the VFSG integrated board of claim 1, wherein the bridge stack, the fast recovery diode, the IGBT module and the IPM module are sequentially arranged from top to bottom in the high power device region.
4. The PCB layout structure of inverter electrically controlled integrated board of claim 3, wherein the IPM modules include a first IPM module for driving a compressor and a second IPM module for driving a fan, the first and second IPM modules being arranged in a top-to-bottom order.
5. The PCB layout structure of the variable-frequency and electrically-controlled integrated board as claimed in claim 1, wherein the variable-voltage module region comprises an electrolytic capacitor device region, a driving control device region and a low-voltage DC current output device region, the driving control device region is disposed at the right side of the electrolytic capacitor device region, and the low-voltage DC current output device region is disposed at the lower side of the electrolytic capacitor device region.
6. The PCB layout structure of the variable-frequency and electrically-controlled integrated board as claimed in claim 1, wherein a power input port and a rectifying and filtering device are arranged in the power input and output device region, the power input port is arranged on the right side of the power input and output device region, and the rectifying and filtering device is arranged on the left side of the power input and output device region.
7. The PCB layout structure of the variable-frequency electric-control integrated board as claimed in claim 1, wherein the PCB circuit board body comprises a top board and a bottom board, and power supply lines and signal lines are uniformly distributed in the top board and the bottom board.
8. The PCB layout structure of the electrically controlled and variable frequency integrated board according to claim 7, wherein the layout area is disposed on the upper side of the top board.
9. A variable-frequency electrically-controlled integrated board, comprising the PCB layout structure of any one of claims 1 to 8.
10. An air conditioner, characterized by comprising the variable-frequency electrically-controlled integrated board as claimed in claim 9.
CN201921447707.1U 2019-08-29 2019-08-29 Frequency conversion electric control integrated board, PCB layout structure thereof and air conditioner Active CN210670779U (en)

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Application Number Priority Date Filing Date Title
CN201921447707.1U CN210670779U (en) 2019-08-29 2019-08-29 Frequency conversion electric control integrated board, PCB layout structure thereof and air conditioner

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Application Number Priority Date Filing Date Title
CN201921447707.1U CN210670779U (en) 2019-08-29 2019-08-29 Frequency conversion electric control integrated board, PCB layout structure thereof and air conditioner

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112672584A (en) * 2020-11-05 2021-04-16 珠海格力电器股份有限公司 Structure of electric cabinet and electrical equipment
CN113473697A (en) * 2021-07-13 2021-10-01 广东汇芯半导体有限公司 Frequency conversion controller
WO2023115773A1 (en) * 2021-12-24 2023-06-29 广东美的制冷设备有限公司 Electric control board, air conditioner outdoor unit, and air conditioner

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112672584A (en) * 2020-11-05 2021-04-16 珠海格力电器股份有限公司 Structure of electric cabinet and electrical equipment
CN113473697A (en) * 2021-07-13 2021-10-01 广东汇芯半导体有限公司 Frequency conversion controller
CN113473697B (en) * 2021-07-13 2024-06-11 广东汇芯半导体有限公司 Variable frequency controller
WO2023115773A1 (en) * 2021-12-24 2023-06-29 广东美的制冷设备有限公司 Electric control board, air conditioner outdoor unit, and air conditioner

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Address after: No. 1 by villagers' group of helongsha, Shengli village, Lishui Town, Nanhai District, Foshan City, Guangdong Province

Patentee after: Guangdong Kaili HVAC Co.,Ltd.

Address before: No. 1 by villagers' group of helongsha, Shengli village, Lishui Town, Nanhai District, Foshan City, Guangdong Province

Patentee before: GUANGDONG CHIGO HEATING AND VENTILATION EQUIPMENT Co.,Ltd.