CN210670543U - Loudspeaker and loudspeaker module - Google Patents

Loudspeaker and loudspeaker module Download PDF

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Publication number
CN210670543U
CN210670543U CN201921854884.1U CN201921854884U CN210670543U CN 210670543 U CN210670543 U CN 210670543U CN 201921854884 U CN201921854884 U CN 201921854884U CN 210670543 U CN210670543 U CN 210670543U
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voice coil
loudspeaker
speaker
module
heat
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CN201921854884.1U
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陈静
颜嘉甫
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Beijing Xiaomi Mobile Software Co Ltd
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Beijing Xiaomi Mobile Software Co Ltd
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Abstract

The present disclosure relates to a loudspeaker and a loudspeaker module, the loudspeaker comprises a frame, a vibration system and a magnetic circuit system, wherein the vibration system and the magnetic circuit system are arranged in the frame, the vibration system comprises a voice coil, the magnetic circuit system comprises a plurality of magnets, a magnetic gap is formed by the plurality of magnets, and the voice coil is arranged in the magnetic gap; and the voice coil is provided with a heat conduction layer. This disclosed speaker is through being equipped with the heat-conducting layer on the voice coil loudspeaker voice coil, accelerates to dispel the heat on the coil through this heat-conducting layer, and the protection voice coil loudspeaker voice coil is not burnt out or is burnt out, can promote the performance of speaker moreover, satisfies the intelligent audio frequency efficiency who matches higher output voltage to further promote the performance such as broadcast tone quality, volume of speaker.

Description

Loudspeaker and loudspeaker module
Technical Field
The present disclosure relates to the field of electroacoustic product technology, and in particular, to a speaker and a speaker module.
Background
The micro-speaker is an important acoustic component of the portable electronic device, is used for completing the conversion between an electric signal and a sound signal, and is an energy conversion device. The highest temperature that the voice coil of the existing loudspeaker can endure is generally 100 ℃ -120 ℃, and in the actual application process at present, the problem that the voice coil is burnt out, burnt or scattered due to overhigh temperature exists in the working process of the loudspeaker, so that the loudspeaker plays noise or the loudspeaker is directly damaged, and the function of the loudspeaker is invalid.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present disclosure provides a speaker and a speaker module with a novel structure to solve some or all of the above technical problems.
In order to achieve the purpose, the technical scheme adopted by the disclosure is as follows:
according to a first aspect of the embodiments of the present disclosure, there is provided a speaker, including a frame, and a vibration system and a magnetic circuit system arranged in the frame, wherein the vibration system includes a voice coil, the magnetic circuit system includes a plurality of magnets, the plurality of magnets form a magnetic gap, and the voice coil is arranged in the magnetic gap; and the voice coil is provided with a heat conduction layer.
Optionally, the voice coil is formed by a plurality of wire rod coiling, the heat-conducting layer covers every wire rod of voice coil loudspeaker voice coil.
Optionally, the heat conducting layer covers at least the outer surface of the voice coil.
Optionally, after the voice coil is assembled in the magnetic gap, the exposed surface of the voice coil covers the heat conducting layer.
Optionally, the thermally conductive layer is a graphene coating.
Optionally, the thickness of the heat conducting layer is not higher than 0.02 mm.
According to a second aspect of the embodiments of the present disclosure, there is provided a speaker module including a module case in which the speaker as described in any one of the above is accommodated.
Optionally, the module housing comprises an upper housing and a lower housing, wherein the inner surfaces of the upper housing and the lower housing are respectively provided with a heat conducting layer.
Optionally, the outer surfaces of the upper housing and the lower housing are provided with the heat conductive layer.
Optionally, the thermally conductive layer is a graphene coating.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects: this disclosed speaker is through being equipped with the heat-conducting layer on the voice coil loudspeaker voice coil, accelerates to dispel the heat on the coil through this heat-conducting layer, and the protection voice coil loudspeaker voice coil is not burnt out or is burnt out, can promote the performance of speaker moreover, satisfies the intelligent audio frequency efficiency who matches higher output voltage to further promote the performance such as broadcast tone quality, volume of speaker.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
Fig. 1 is a schematic diagram of the overall structure of a speaker according to an exemplary embodiment of the present disclosure;
FIG. 2 is a schematic diagram of an exploded view of a loudspeaker according to an exemplary embodiment of the present disclosure;
3 FIG. 33 3 is 3 a 3 schematic 3 cross 3- 3 sectional 3 view 3 taken 3 along 3 the 3 line 3 A 3- 3 A 3 in 3 FIG. 31 3; 3
Fig. 4 is a schematic diagram of a structure of a voice coil in a speaker according to an exemplary embodiment of the present disclosure;
FIG. 5 is a schematic cross-sectional view taken along line B-B of FIG. 4;
fig. 6 is a schematic diagram illustrating an overall structure of a speaker module according to an exemplary embodiment of the present disclosure;
fig. 7 is an exploded schematic view of a speaker module according to an exemplary embodiment of the disclosure.
Detailed Description
The present disclosure will be described in detail below with reference to specific embodiments shown in the drawings. These embodiments do not limit the disclosure, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the disclosure.
The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
In the following, some embodiments of the present disclosure will be described in detail with reference to the accompanying drawings, and features in the following examples and embodiments may be combined with each other without conflict.
As shown in fig. 1 to 3, a speaker 10 according to an embodiment of the present disclosure includes a frame 1, and a vibration system and a magnetic circuit system provided in the frame 1. The frame 1 comprises a structural frame body 11 and a base 12 matched with the structural frame body 11, wherein the structural frame body 11 and the base 12 are combined to form an accommodating space for accommodating a vibration system and a magnetic circuit system.
This magnetic circuit includes magnetic conduction board 21 and sets up a plurality of magnet 22 on magnetic conduction board 21, and a plurality of magnet 22 form the magnetic gap, and this a plurality of magnet 22 include main magnet and limit magnet, and this main magnet and limit magnet arrange wantonly according to the design demand, do not specifically limit here.
The vibration system includes a voice coil 31 and a diaphragm 32. The voice coil 31 is formed by winding a plurality of wires, the voice coil 31 performs reciprocating magnetic line cutting motion in the magnetic gap according to the size and the direction of alternating current passing through the winding wire, and the diaphragm 32 vibrates along with the reciprocating motion of the voice coil 31 to drive air to generate, so that energy conversion between electric sound is completed.
In one embodiment, the diaphragm 32 includes a ring 321 fixed on the structural frame 11 and a dome 322 fixed in the center of the ring 321. The hinge 321 can be adhered to the upper side of the structural frame 11 by glue, and the base 12 is fixed to the lower side of the structural frame 11, so as to form a sealed box-like structure. The loudspeaker 10 may be provided in any shape, for example: a rectangular parallelepiped, a cube, a cylindrical shape, or other irregular shapes, etc., and is not particularly limited herein.
As shown in fig. 1 to 5, the voice coil 31 of the present disclosure is disposed in the magnetic gap. The voice coil 31 is provided with a heat conducting layer 33, the heat conducting layer 33 is made of a heat conducting and dissipating material, and can assist in dissipating heat on the voice coil 31, so as to protect the voice coil 31 of the speaker 10 from being burned out and burnt down when the operating temperature of the speaker 10 is raised.
In the embodiment of the present disclosure, the heat conducting layer 33 is preferably a graphene coating, and specifically, may be formed by spraying and then drying a graphene water-based paint. Wherein Graphene (Graphene) is formed by sp from carbon atoms2The hybrid tracks form a hexagonal honeycomb lattice two-dimensional carbon nanomaterial. Graphene has very good heat conduction performance, the heat conduction coefficient of single-layer graphene is as high as 5300W/mK, and the graphene is a carbon material with the highest heat conduction coefficient. Meanwhile, the graphene has strong solubility, and can be sprayed on other materials or devices after being dissolved, so that the heat conduction and heat dissipation effects are achieved. Of course, the heat conducting layer 33 of the present disclosure is not limited to graphene, and other materials with better heat conducting performance may also be selected.
In one embodiment, the thermally conductive layer 33 covers each wire of the voice coil 31. In this embodiment, before a plurality of wires are wound into turns to form the voice coil 31, each wire is subjected to graphene paint spraying so that the voice coil 31 entirely covers the heat conductive layer 33.
In another embodiment, the heat conducting layer 33 covers at least the outer surface of the voice coil 31. In this embodiment, the voice coil 31 is formed by winding a wire into turns, and then graphene is sprayed on all surfaces of the voice coil 31, so that all surfaces of the voice coil 31 are covered with the heat conductive layer 33.
In another embodiment, after the voice coil 31 is fitted to the magnetic gap, the surface of the voice coil 31 exposed to the outside covers the heat conductive layer 33. In this embodiment, the exposed surface of the voice coil 31 refers to the portion of the surface of the voice coil 31 that is not covered. Since the voice coil 31 is assembled between the plurality of magnets 22, a part of the side surface is opposite to the magnets 22 and the gap between the side surface and the magnets 22 is small, so that the surface of the voice coil 31 opposite to the magnets 22 is shielded, and graphene spraying is performed on the exposed surface of the voice coil 31 to form the heat conducting layer 33, which is beneficial to heat dissipation of the voice coil 31.
In the present disclosure, since the graphene water-based paint is light and thin, the thickness of the heat conductive layer 33 may be set to not more than 0.02mm, and thus the influence on the space inside the speaker 10 is very small and almost negligible.
In addition, the speaker 10 further includes an FPC (Flexible Printed Circuit) 13 connected to the voice coil 31, and the FPC13 is electrically connected to an external device through the speaker 10, thereby supplying power to the speaker 10.
According to the loudspeaker, the heat conducting layer is arranged on the voice coil, so that heat on the coil is quickened to be dissipated through the heat conducting layer, and the voice coil is protected from being burnt out or burnt; the tolerable highest temperature of the loudspeaker can be improved, and when the loudspeaker is driven by the high output voltage of the intelligent audio power amplifier, the loudspeaker can still work normally; moreover, the performance of the loudspeaker can be improved, and the intelligent audio effect of matching higher output voltage is met, so that the performances of the loudspeaker such as playing tone quality and volume are further improved.
As shown in fig. 6 and 7, according to still another aspect of the embodiment of the present disclosure, there is also provided a speaker module 100, the speaker module 100 including a module housing 101, the module housing 101 accommodating therein a speaker 10. The structure of the speaker 10 is shown in the above embodiments, and will not be described herein.
The module housing 101 is a closed structure with a sound cavity, and the speaker 10 is disposed therein to improve the sound quality and sound feeling. In this disclosure, this speaker module 100 has ultra-thin structure, has excellent acoustic performance and stronger sound simultaneously, can satisfy slim electronic equipment's requirement, and application scope is wider. The method can be particularly applied to electronic products such as mobile phones, tablet computers, personal digital assistants and the like.
The module housing 101 of the present disclosure includes an upper housing 111 and a lower housing 112, and the upper housing 111 and the lower housing 112 are assembled in cooperation to form a receiving space for receiving the speaker 10. A heat conductive layer (not shown) is provided on each of the inner surfaces of the upper case 111 and the lower case 112, and the inner surfaces of the upper case 111 and the lower case 112 are inner wall surfaces forming the housing space. This disclosure can accelerate the heat dissipation of the inside of the speaker module 100 by providing a heat conducting layer on the inner surface of the module case 101, and can reduce the temperature of the speaker module 100 as a whole, thereby reducing the surface temperature at which the user grips the position.
In order to further improve the heat dissipation efficiency inside the speaker module 100, the outer surfaces of the upper housing 111 and the lower housing 112 are also provided with heat conductive layers. In the present disclosure, the thermally conductive layer is preferably coated with graphene. Due to the fact that the graphene has strong solubility, the graphene which can be dissolved can be sprayed on the upper shell 111 and the lower shell 112, and therefore the heat conduction and heat dissipation effects are achieved. Of course, the heat conducting layer of the present disclosure is not limited to graphene, and other materials with better heat conducting performance may also be selected.
In addition, the speaker module 111 further includes a Flexible Printed Circuit (FPC) 102 connected to the speaker 10, and the FPC102 is electrically connected to an external device through the speaker module, so as to supply power to the speaker 10.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. A loudspeaker is characterized by comprising a basin frame, a vibration system and a magnetic circuit system, wherein the vibration system and the magnetic circuit system are arranged in the basin frame; and the voice coil is provided with a heat conduction layer.
2. The speaker of claim 1, wherein the voice coil is wound from a plurality of wires, and the heat conductive layer covers each wire of the voice coil.
3. The speaker of claim 1, wherein the thermally conductive layer covers at least an outer surface of the voice coil.
4. The loudspeaker of claim 1, wherein an exposed surface of said voice coil covers said thermally conductive layer after said voice coil is assembled in said magnetic gap.
5. The loudspeaker of any one of claims 1 to 4, wherein the thermally conductive layer is a graphene coating.
6. A loudspeaker according to claim 1, wherein the thickness of the thermally conductive layer is no greater than 0.02 mm.
7. A loudspeaker module comprising a module housing, the loudspeaker of any one of claims 1 to 6 being housed within the module housing.
8. The speaker module of claim 7, wherein the module housing comprises an upper housing and a lower housing, wherein the inner surfaces of the upper housing and the lower housing are each provided with a thermally conductive layer.
9. The speaker module as recited in claim 8, wherein the outer surfaces of the upper housing and the lower housing are provided with the thermally conductive layer.
10. A loudspeaker module according to claim 8 or 9, wherein the thermally conductive layer is a graphene coating.
CN201921854884.1U 2019-10-30 2019-10-30 Loudspeaker and loudspeaker module Active CN210670543U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921854884.1U CN210670543U (en) 2019-10-30 2019-10-30 Loudspeaker and loudspeaker module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921854884.1U CN210670543U (en) 2019-10-30 2019-10-30 Loudspeaker and loudspeaker module

Publications (1)

Publication Number Publication Date
CN210670543U true CN210670543U (en) 2020-06-02

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Country Status (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111372173A (en) * 2020-03-13 2020-07-03 歌尔股份有限公司 Voice coil and loudspeaker

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111372173A (en) * 2020-03-13 2020-07-03 歌尔股份有限公司 Voice coil and loudspeaker
WO2021179726A1 (en) * 2020-03-13 2021-09-16 歌尔股份有限公司 Voice coil and loudspeaker

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