CN210668299U

CN210668299U - Installation mechanism of wafer mapping sensor

Info

Publication number: CN210668299U
Application number: CN201922224671.7U
Authority: CN
Inventors: 刘洪亮; 卢俊男; 梁明亮
Original assignee: Beijing Jingyi Automation Equipment Co Ltd
Current assignee: Beijing Jingyi Automation Equipment Co Ltd
Priority date: 2019-12-12
Filing date: 2019-12-12
Publication date: 2020-06-02
Anticipated expiration: 2029-12-12

Abstract

The utility model relates to a semiconductor auxiliary assembly field provides the installation mechanism of wafer mapping sensor. This installation mechanism includes: the bearing seat assembly comprises a bearing seat plate, a linear slide rail and a pair of mounting holes, wherein the linear slide rail is arranged below the bearing seat plate; the push plate is provided with a chute which extends along the length direction of the push plate and inclines towards the width direction of the push plate; the driving mechanism is connected with the push plate; the sliding block is fixedly provided with a first connecting shaft and is arranged in the chute, the sliding block is connected with the linear slide rail in a sliding manner, and the sliding block is provided with a pair of long slotted holes; the pair of driving rotating arm assemblies comprise driving rotating arms, each driving rotating arm is provided with a rotating end and a mounting end, the rotating ends are fixedly provided with second connecting shafts, and the driving rotating arms are mounted in the long slotted holes of the sliding blocks through the corresponding second connecting shafts; a pair of spindle assemblies; and the mounting rotating arms are connected with the rotating shaft assembly and are used for mounting the sensor. The utility model discloses can avoid rotation space and wafer place space to intersect, lead to appearing the problem with wafer collision accident.

Description

Installation mechanism of wafer mapping sensor

Technical Field

The utility model relates to a semiconductor auxiliary assembly technical field especially relates to installation mechanism of wafer mapping sensor.

Background

At present, a wafer loader (Loadport) of semiconductor accessory equipment basically comprises a wafer mapping function, the quantity and the state of wafers are detected through a pair of sensors, and due to action requirements, a mounting mechanism of the sensors is required to realize conversion between a front working position and a rear working position in the working process. In the prior art, there are two main types of mounting mechanisms that can change the position of the sensor. One is that the installation mechanism drives the sensor to directly move back and forth to change the requirement of the working position; the other is that the mounting mechanism drives the sensor to rotate so as to meet the requirement of changing the working position.

However, in the scheme of moving the sensor back and forth to change the requirement of the working position, the sensor mounting bracket is long, and the distance between the actuating end and the driving end is too far, so that the rigidity of the whole mechanism is poor, the sensor is easy to shake in the working process, and the detection result is wrong. In the scheme of driving the sensor to rotate to meet the requirement of changing the working position, the sensor is usually mounted on a cross arm, the cross arm is driven by two rotating arms to complete the rotating action, the rotating space of the cross arm is intersected with the space where the wafer is located, and the wafer is easy to collide with.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the embodiment of the utility model provides an installation mechanism of wafer mapping sensor can avoid rotatory space and the space that the wafer is located crossing, leads to appearing the problem with wafer collision accident.

According to the utility model discloses installation mechanism of wafer mapping sensor, include:

the bearing seat assembly comprises a bearing seat plate and a linear slide rail arranged on the lower surface of the bearing seat plate along the width direction of the bearing seat plate, and the bearing seat plate is provided with a mounting hole at each of two sides of the linear slide rail;

the push plate is provided with a chute which extends along the length direction of the push plate and inclines towards the width direction of the push plate;

the driving mechanism is connected with one end of the push plate in the length direction;

the slide block is fixedly provided with a first connecting shaft, one end of the first connecting shaft, which is far away from the slide block, is provided with a first roller, the slide block is installed in the chute through the first roller, the slide block is connected with the linear slide rail in a sliding manner, and two ends of the slide block, which are positioned in the length direction, are respectively provided with a long slot hole extending along the length direction;

each driving rotating arm assembly comprises a driving rotating arm, the driving rotating arm is provided with a rotating end and a mounting end, the rotating end is fixedly provided with a second connecting shaft, one end, far away from the driving rotating arm, of the second connecting shaft is provided with a second roller, and the driving rotating arm is mounted in the long slotted hole of the sliding block through the corresponding second roller;

a pair of spindle assemblies;

the sensor mounting device comprises a pair of mounting rotating arms, wherein each mounting rotating arm comprises a rotating end and a mounting end, the rotating ends of the mounting rotating arms are connected with the mounting ends of the driving rotating arms through rotating shaft assemblies, and the mounting ends of the mounting rotating arms are used for mounting sensors.

The utility model discloses installation mechanism of wafer mapping sensor, the length direction round trip movement of push pedal is followed to flexible drive push pedal through actuating mechanism, first running roller through on chute and the slider drives the slider and removes along the width direction of push pedal on linear slide rail, the second running roller on through slotted hole on the slider and the drive rocking arm this moment, convert the slider into the rotation of drive rocking arm along push pedal width direction's slip, and then convert into the rotation of two installation rocking arms, can satisfy the installation mechanism of this wafer mapping sensor in the course of the work before, the operating position's of two back differences conversion requirement, the installation rocking arm rotates the in-process, the rotatory region of installation rocking arm separates with wafer place region, the hidden danger of wafer collision occurence of failure has been eliminated.

According to an embodiment of the present invention, the rotating shaft assembly includes a rotating shaft and a bearing fixedly sleeved on the rotating shaft, a bearing end cover is provided at an upper end of the bearing, an inner circumference of the bearing end cover is blocked at an outer ring of the bearing, and one end of the rotating shaft close to the bearing end cover is fixedly connected to a rotating end of the mounting rotating arm; one end of the rotating shaft, which is close to the bearing, is fixedly connected with the mounting end of the driving rotating arm, and the outer ring of the bearing is fixed in the mounting hole of the bearing seat plate.

According to the utility model discloses an embodiment, the installation end of drive rocking arm is equipped with the mount pad, the pivot is close to the fixed cartridge of one end of bearing is in the mount pad.

According to an embodiment of the present invention, the bearing seat plate is provided with a limiting post for limiting the mounting rotating arm towards one side of the wafer area.

According to the utility model discloses an embodiment, the installation rocking arm is used for the installation the one end of sensor is established to the bending segment of bending towards the region area bending of wafer place.

According to the utility model discloses an embodiment, the slotted hole on the slider be with the open slot that the tip of drive rocking arm communicates, the surface of second running roller with the internal face of open slot is tangent.

According to an embodiment of the present invention, the first roller and the second roller are rolling bearings.

According to the utility model discloses an embodiment, actuating mechanism passes through the supporting seat and installs the lower surface of bearing plate, actuating mechanism's length direction follows the length direction of bearing plate.

According to the utility model discloses an embodiment, actuating mechanism is for driving actuating cylinder, it is equipped with the guard shield to drive actuating cylinder dustcoat.

According to an embodiment of the present invention, the pair of mounting holes is arranged in a central symmetry manner with respect to an axis of the linear slide rail;

the push plate comprises a horizontal plate and a vertical plate arranged on one side of the horizontal plate, the chute is arranged on the horizontal plate, and the driving mechanism is connected with the vertical plate.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a mounting mechanism of a wafer mapping sensor according to an embodiment of the present invention after being integrally mounted;

FIG. 2 is an exploded schematic view of FIG. 1;

fig. 3 is a schematic cross-sectional view of a rotating shaft assembly in a mounting mechanism of a wafer mapping sensor according to an embodiment of the present invention;

fig. 4 is a schematic diagram illustrating a split view of a bearing housing assembly in a mounting mechanism of a wafer mapping sensor according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a driving arm assembly in a mounting mechanism of a wafer mapping sensor according to an embodiment of the present invention.

Reference numerals:

1: a bearing housing assembly; 2: a first mounting rotating arm; 3: a rotating shaft assembly; 4: a second mounting rotating arm; 5: a drive tumbler assembly; 6: a slider; 7: a first roller; 8: pushing the plate; 9: a supporting seat; 10: a drive mechanism; 11: a rotating shaft; 12: a bearing end cap; 13: a bearing; 14: a bearing seat plate; 15: a linear slide rail; 16: a limiting column; 17: driving the rotating arm; 18: a mounting seat; 19: the area where the wafer is located; 20: and a second roller.

Detailed Description

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the embodiments of the present invention can be understood in specific cases by those skilled in the art.

In embodiments of the invention, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because it has a circular shape. The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide. The silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon. The polysilicon is melted by the wafer manufacturer, and then seeded in the melt, which is then slowly pulled out to form a cylindrical monocrystalline silicon ingot, which is called "crystal growth" because the silicon ingot is formed by the gradual growth of a seed crystal defined by the orientation of one crystal plane in the molten silicon feedstock. The silicon crystal bar is cut, milled, sliced, chamfered, polished, laser etched and packed to form the basic material of integrated circuit factory, i.e. silicon wafer.

The embodiment of the utility model provides an installation mechanism of wafer mapping sensor, as shown in fig. 1 to 5, including bearing frame subassembly 1, push pedal 8, actuating mechanism 10, slider 6, a pair of drive rocking arm subassembly 5, a pair of pivot subassembly 3 and a pair of installation rocking arm. Wherein, specifically:

the bearing seat assembly 1 comprises a bearing seat plate 14 and a linear slide rail 15 arranged on the lower surface of the bearing seat plate 14 along the width direction of the bearing seat plate 14, wherein the bearing seat plate 14 is provided with a mounting hole at each of two sides of the linear slide rail 15, specifically, in order to adapt to a compact space outside an area 19 where a wafer is located, in the embodiment, the bearing seat plate 14 is in a strip shape, the length of the bearing seat plate 14 can be adapted to the diameter of the area 19 where the wafer is located, and the length of the bearing seat plate 14 can be adapted to the diameter of the area 19 where the wafer is located, or the length of the bearing seat plate 14 can be smaller than the diameter of the area 19 where the wafer is; in order to optimize the structure of the bearing seat plate 14, the linear slide rail 15 is preferably disposed in the middle of the lower surface of the bearing seat plate 14, and of course, the linear slide rail 15 may be disposed at other positions on the lower surface of the bearing seat plate 14; the pair of mounting holes can be staggered with the positions of the linear slide rails 15 so as to avoid interference between mounting parts in the mounting holes and the linear slide rails 15; in this embodiment, the pair of mounting holes are respectively disposed on two sides of the linear slide rail 15 in the sliding direction.

Push pedal 8 is equipped with and extends and towards the chute of its width direction slope along its length direction, and the chute link up push pedal 8, forms the slotted hole on push pedal 8, also can be the rectangular hole certainly, does not do the restriction to the concrete shape in hole, through set up the chute of slope on push pedal 8 for when push pedal 8 moved along length direction, can produce the displacement along push pedal 8 width direction through the chute.

The driving mechanism 10 is connected to one end of the push plate 8 in the length direction, and the push plate 8 is driven by the driving mechanism 10 to move back and forth along the length direction.

Slider 6 has set firmly first connecting axle, the surface of the axial perpendicular to slider 6 of first connecting axle, for example, when slider 6 level set up, then the vertical setting of first connecting axle, first connecting axle is kept away from the one end of slider 6 is equipped with first running roller 7, slider 6 passes through first running roller 7 is installed in the chute, when push pedal 8 removes, first running roller 7 rolls along chute place direction in the chute to drive slider 6 and slide along linear slide rail 15, through setting up first running roller 7, can reduce the frictional force between slider 6 and the chute, guarantee that slider 6's slip is more smooth and easy, slider 6 with linear slide rail 15 sliding connection, the both ends branch that slider 6 is located its length direction is equipped with the long slotted hole that extends along its length direction.

Each driving rotating arm assembly 5 comprises a driving rotating arm 17, the driving rotating arm 17 can be in a strip shape, a block shape and the like, the driving rotating arm 17 is provided with a rotating end and a mounting end, the rotating axis of the rotating end is perpendicular to the surface of the driving rotating arm 17, the rotating end is fixedly provided with a second connecting shaft, the axis of the second connecting shaft and the rotating axis of the rotating end are coaxially arranged, one end, far away from the driving rotating arm 17, of the second connecting shaft is provided with a second roller 20, the driving rotating arm 17 is mounted in a long slotted hole of the sliding block 6 through the corresponding second roller 20, the second roller 20 is connected with the sliding block 6, the second roller 20 is driven to roll along the long slotted hole through the movement of the sliding block 6 and move in the rolling process, and thrust is applied to the driving rotating arm 17 to drive the driving rotating arm 17 to rotate along the sliding. In addition, the friction can be reduced by the second roller 20 rolling along the long groove hole. Further, it should be noted that the length of the long slot needs to be greater than the outer diameter of the second roller 20, so as to ensure that the second roller 20 can have a moving space in the long slot, and avoid interference.

Each installation rocking arm is equipped with rotation end and installation end, the rotation end of installation rocking arm pass through pivot subassembly 3 with the installation end of drive rocking arm 17 is connected, the installation end of installation rocking arm is used for installing the sensor, and the rotation end of installation rocking arm is fixed connection with the installation end of drive rocking arm 17 to when drive rocking arm 17 rotates, the installation rocking arm rotates along with it in step, makes the installation rocking arm rotate towards being close to or keeping away from wafer place region 19. By selecting the length parameter of the drive arm 17, the range of rotation of the drive arm 17 is determined to ensure that the mounting arm does not interfere with the area 19 in which the wafer is located when it is rotated towards the area 19 in which the wafer is located. The pair of mounting rotating arms are a first mounting rotating arm 2 and a second mounting rotating arm 4 respectively.

The utility model discloses installation mechanism of wafer mapping sensor, the length direction round trip movement of push pedal 8 is followed to flexible drive push pedal 8 through actuating mechanism 10, first running roller 7 through on chute and the slider 6 drives slider 6 and removes along the width direction of push pedal 8 on linear slide 15, pass through slotted hole on the slider 6 and drive second running roller 20 on the rocking arm 17 this moment, convert slider 6 into the rotation of driving rocking arm 17 along the slip of push pedal 8 width direction, and then convert into the rotation of two installation rocking arms, can satisfy this installation mechanism of wafer mapping sensor before in the course of the work, the conversion requirement of the operating position of two back differences, the installation rocking arm rotates the in-process, the rotatory region of installation rocking arm separates with wafer place region 19, the hidden danger of wafer occurence of failure has been eliminated.

According to an embodiment of the present invention, the rotating shaft assembly 3 specifically includes a rotating shaft 11 and a bearing 13 fixedly sleeved on the rotating shaft 11, the bearing 13 may be a rolling bearing, a bearing end cap 12 is disposed at an upper end of the bearing 13, the bearing end cap 12 is disposed to facilitate positioning of the bearing 13, an inner peripheral block of the bearing end cap 12 is disposed at an outer ring of the bearing 13, and one end of the rotating shaft 11 close to the bearing end cap 12 is fixedly connected to a rotating end of the mounting rotating arm; the one end that pivot 11 is close to bearing 13 with the mounting end fixed connection of drive rocking arm 17, the outer lane of bearing 13 is fixed in the mounting hole of bearing seat board 14 to with pivot subassembly 3 and bearing seat board 14 fixed connection, and do not influence pivot subassembly 3 and rotate, specifically, the outer lane of bearing 13 is owing to fix in the mounting hole, thereby its position is fixed for the mounting hole, and the fixed cover of inner circle of bearing 13 is established on pivot 11, therefore when pivot 11 rotated, and the bearing 13 inner circle rotated along with pivot 11.

In order to facilitate installation, according to the utility model discloses an embodiment, the installation end of drive rocking arm 17 is equipped with mount pad 18, is equipped with the jack on the mount pad 18, pivot 11 is close to the fixed cartridge of one end of bearing 13 is in the jack of mount pad 18 for pivot 11 and mount pad 18 fixed connection, of course, can also set up other fixed knot on the mount pad 18 to be convenient for pivot 11 is fixed.

In order to limit the rotation limit position of the mounting rotating arm and ensure that the mounting rotating arm does not intersect with the region 19 where the wafer is located, according to an embodiment of the present invention, the bearing seat plate 14 is respectively provided with a limiting post 16 for limiting the mounting rotating arm towards one side of the region 19 where the wafer is located, the limiting post 16 can be formed by extending a protrusion upwards on the bearing seat plate 14, and can also be formed by fixing the fixing means such as protrusion welding, bonding and the like on the bearing seat plate 14.

In order to facilitate the sensor to be closer to the region 19 where the wafer is located, thereby facilitating data collection, according to an embodiment of the present invention, the mounting rotating arm is used for mounting one end of the sensor is set to be a bending section bending towards the region 19 where the wafer is located, specifically, a bending angle of the bending section needs to be set according to specific needs, and the angle is preferably greater than 90 degrees and less than 180 degrees.

In order to facilitate the installation of the second roller 20 of the driving rotating arm 17 on the slider 6 from the side of the slider 6, according to the utility model discloses an embodiment, the slotted hole on the slider 6 can be for with the open slot that the tip of the driving rotating arm 17 communicates, and the second roller 20 of the driving rotating arm 17 is put into the open slot from the opening part of open slot, and it is more convenient to install, certainly, it needs to explain that the slotted hole also can not establish the opening, the surface of the second roller 20 with the internal face of open slot is tangent, and the second roller 20 of being convenient for keeps steady when rolling along the open slot, can not appear rocking.

According to the utility model discloses an embodiment, first running roller 7 and second running roller 20 all can be antifriction bearing, and antifriction bearing sets up conveniently.

The utility model discloses a further embodiment, first connecting axle and first running roller 7 can be replaced with gyro wheel bearing, and second connecting axle and second running roller 20 also can be replaced with gyro wheel bearing, and gyro wheel bearing takes a root axis certainly, is fixed with the bearing on the axle, and gyro wheel bearing can regard as first connecting axle or second connecting axle from the axle of taking.

To facilitate the installation of the driving mechanism 10, according to an embodiment of the present invention, the driving mechanism 10 is installed on the lower surface of the bearing seat plate 14 through the supporting seat 9. Further, the longitudinal direction of the drive mechanism 10 is along the longitudinal direction of the bearing seat plate 14, so that the arrangement facilitates reduction in the dimension in the width direction of the bearing seat plate 14, facilitates more compact design of the structure, and also relaxes the dimension limitation of the drive mechanism 10.

According to the utility model discloses an embodiment, actuating mechanism 10 can be for driving actuating cylinder, can use the clean cylinder that meets the requirements, it is equipped with the guard shield to drive actuating cylinder dustcoat, through the mounted position that will drive actuating cylinder as for the enclosure space, can reduce the risk that the gas leakage pollutes clean environment.

Of course, it is understood that the driving mechanism 10 includes, but is not limited to, a driving cylinder, and other driving mechanisms 10 such as a motor, an electric push rod, etc. are within the scope of the present invention.

In order to keep the two mounting arms balanced on the bearing plate 14, according to an embodiment of the present invention, the mounting holes are symmetrically disposed about the axis of the linear slide 15, and specifically, the linear slide 15 is disposed in the middle of the lower surface of the bearing plate.

The push plate 8 comprises a horizontal plate and a vertical plate arranged on one side of the horizontal plate to form an L shape, the chute is arranged on the horizontal plate, a sliding block 6 which is convenient to be positioned on the horizontal plate is connected with the chute, and the driving mechanism 10 is connected with the vertical plate and is convenient to be connected with the driving mechanism 10.

The utility model discloses an action principle: referring to fig. 1 and 2, the driving cylinder stretches and retracts to drive the push plate 8 to move left and right, the slide block 6 is driven to move back and forth on the linear slide rail 15 through the chute and the roller bearing on the slide block 6, the front and back sliding of the slide block 6 is converted into the rotation of the driving rotating arm assembly 5 through the long slotted hole on the slide block 6 and the roller bearing on the driving rotating arm assembly 5, and further converted into the rotation of two mounting rotating arms, so that the conversion requirements of the mounting mechanism of the wafer mapping sensor at two different front and back working positions in the working process can be met, and in the action process, the positioning accuracy of the sensor at the working position can be ensured through the limiting column 16 on the bearing seat; after the whole installation is finished, the driving cylinder part below the bearing seat component 1 can be sealed through mechanisms such as the protective cover, so that the driving cylinder is isolated from a working space, and gas pollution to a working area is avoided.

The above embodiments are merely illustrative, and not restrictive, of the present invention. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that various combinations, modifications or equivalent substitutions may be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention, and all of the technical solutions should be covered by the scope of the claims of the present invention.

Claims

1. A mounting mechanism for a wafer mapping sensor, comprising:

a pair of spindle assemblies;

2. The mounting mechanism of the wafer mapping sensor as claimed in claim 1, wherein the rotation shaft assembly includes a rotation shaft and a bearing fixedly sleeved on the rotation shaft, a bearing cap is disposed at an upper end of the bearing, an inner circumference of the bearing cap is blocked at an outer ring of the bearing, and an end of the rotation shaft close to the bearing cap is fixedly connected to a rotation end of the mounting rotation arm; one end of the rotating shaft, which is close to the bearing, is fixedly connected with the mounting end of the driving rotating arm, and the outer ring of the bearing is fixed in the mounting hole of the bearing seat plate.

3. The mounting mechanism for the wafer mapping sensor as claimed in claim 2, wherein the mounting end of the driving rotating arm is provided with a mounting seat, and one end of the rotating shaft close to the bearing is fixedly inserted into the mounting seat.

4. The mounting mechanism of the wafer mapping sensor as claimed in claim 1, wherein the side of the bearing seat plate facing the wafer area is respectively provided with a limiting column for limiting the mounting rotating arm.

5. The mounting mechanism for a wafer mapping sensor as claimed in claim 1, wherein the mounting arm is configured to mount a bend segment at an end of the sensor that bends toward an area where a wafer is located.

6. The mounting mechanism of the wafer mapping sensor as claimed in claim 1, wherein the slot on the slider is an open slot communicating with the end of the driving rotation arm, and the outer surface of the second roller is tangential to the inner wall surface of the open slot.

7. The mounting mechanism for a wafer mapping sensor of claim 1 wherein the first roller and the second roller are both rolling bearings.

8. The mounting mechanism of the wafer mapping sensor as claimed in claim 2, wherein the driving mechanism is mounted on the lower surface of the bearing seat plate through a support base, and the length direction of the driving mechanism is along the length direction of the bearing seat plate.

9. The mounting mechanism for a wafer mapping sensor of claim 8 wherein the drive mechanism is a drive cylinder, the drive cylinder housing having a shroud.

10. The mounting mechanism for a wafer mapping sensor of claim 1, wherein the pair of mounting holes are arranged in a central symmetry with respect to the axis of the linear slide;