CN210666083U - Wafer, lens module and electronic equipment - Google Patents

Abstract

The utility model relates to a wafer, camera lens module and electronic equipment belongs to electronic equipment technical field. A plurality of wafer-level lenses are arranged on the wafer; a plurality of first cutting lines, a plurality of second cutting lines, a plurality of third cutting lines and a plurality of fourth cutting lines are arranged on the wafer, each first cutting line is perpendicular to each second cutting line, and each third cutting line is perpendicular to each fourth cutting line; each wafer level lens is arranged in the octagonal lens formed by the first cutting line, the second cutting line, the third cutting line and the fourth cutting line. The wafer is cut into the octagonal lens along the cutting line, and the size of the circumscribed circle of the lens is reduced while the size of the wafer-level lens is not influenced by each octagonal lens, so that the space occupied by the lens is reduced, and the miniaturization effect of the lens is further enhanced.

Description

Wafer, lens module and electronic equipment

Technical Field

The present disclosure relates to the field of electronic devices, and in particular, to a wafer, a lens module, and an electronic device.

Background

With the development of electronic device technology, electronic devices with full-screen have become a trend of industry development, and in order to realize a larger screen ratio, the miniaturization of the lens module is more and more concerned by people. The lens module comprises a circular lens barrel and a lens, wherein the lens is arranged in the circular lens barrel, and the lens is fixed through the circular lens barrel. Therefore, the key point of the miniaturization of the lens module is to miniaturize the lens without affecting the imaging of the lens.

At present, an important technology for the miniaturization of the lens is a wafer level lens technology, namely, the lens is made into a circular shape; however, in order to improve the efficiency of manufacturing the lens, a plurality of wafer level lenses are generally manufactured on one wafer, and the plurality of lenses are obtained by dicing the wafer. The wafer level lenses are arranged on the wafer in a matrix mode, when the wafer is cut, the wafer is generally cut along the horizontal direction and the vertical direction, square or rectangular lenses are obtained through cutting, and the lenses comprise the wafer level lenses and a part of wafers.

SUMMERY OF THE UTILITY MODEL

The embodiment of the disclosure provides a wafer, a lens module and an electronic device, and solves the problem that the miniaturization effect of a wafer level lens technology on a lens is low. The technical scheme is as follows:

according to an aspect of the embodiments of the present disclosure, a wafer is provided, on which a plurality of wafer-level lenses are disposed;

a plurality of first cutting lines, a plurality of second cutting lines, a plurality of third cutting lines and a plurality of fourth cutting lines are arranged on the wafer, each first cutting line is perpendicular to each second cutting line, and each third cutting line is perpendicular to each fourth cutting line;

each wafer level lens is arranged in the octagonal lens formed by the first cutting line, the second cutting line, the third cutting line and the fourth cutting line.

In the embodiment of the disclosure, a plurality of wafer-level lenses are arranged on a wafer; each wafer level lens is arranged in an octagonal lens consisting of a first cutting line, a second cutting line, a third cutting line and a fourth cutting line, and the first cutting line, the second cutting line, the third cutting line and the fourth cutting line enable the wafer to be cut into octagonal lenses by the cutting machine more quickly; and the size of the outer circle of the lens is reduced while the size of the wafer level lens is not influenced by the octagonal lens, so that the space occupied by the lens is reduced, and the miniaturization effect of the lens is enhanced.

In another possible implementation manner, the arrangement manner of the plurality of wafer-level lenses on the wafer is a quincunx arrangement; and the included angle between each first cutting line and each third cutting line is 45 degrees.

In the embodiment of the disclosure, the arrangement mode of the plurality of wafer level lenses on the wafer is plum blossom-shaped arrangement, so that the wafer level lenses can avoid cutting lines, unnecessary wafer level lenses are prevented from being prepared on the wafer, and the process cost is effectively reduced.

In another possible implementation, the octagonal lens is in the shape of a regular octagon.

In the embodiment of the disclosure, a plurality of wafer-level lenses are arranged on a wafer; each wafer level lens is arranged in a regular octagonal lens consisting of a first cutting line, a second cutting line, a third cutting line and a fourth cutting line, and the size of the circumscribed circle of the lens is the minimum while the size of the wafer level lens is not influenced by the regular octagonal lens, so that the occupied space of the lens is reduced to the maximum extent, and the effect of enhancing the miniaturization of the lens is optimal.

In another possible implementation, each wafer-level lens is an optical lens.

In the embodiment of the disclosure, the wafer level lens is an optical lens, and when the optical lens is an aspheric lens, the optical lens has a better curvature radius and a higher resolution, so that the imaging quality of the optical lens is improved.

In another possible implementation manner, a light shielding layer is disposed on a lens area of the octagonal lens except for the wafer-level lens.

In the embodiment of the disclosure, the light shielding layer is arranged on the lens area except the wafer level lens on the octagonal lens, so that the generation of glare can be prevented, meanwhile, the interference of light rays in other areas on the imaging of the wafer level lens is reduced, and the imaging quality of the wafer level lens is improved.

In another possible implementation manner, the material of the light shielding layer is chromium dioxide.

In another possible implementation, the material of the wafer is optical glass.

In the disclosed embodiment, the optical glass has good optical properties such as light transmittance and refractive index; in addition, the optical glass also has good high temperature resistance and corrosion resistance.

According to another aspect of the embodiments of the present disclosure, a lens module is provided, where the lens module includes a body, a barrel, and an octagonal lens, where the octagonal lens is an octagonal lens obtained by cutting the wafer according to any one of the above descriptions;

the octagonal lens and the lens barrel are both arranged on the body, and the octagonal lens is horizontally arranged in the lens barrel;

the lens cone is used for fixing the octagonal lens;

the octagonal lens is used for optically imaging the scenery.

In the embodiment of the disclosure, the size of the octagonal lens is reduced while the size of the wafer-level lens is not affected, and the size of the circumscribed circle of the lens is reduced, so that the occupied space of the lens is reduced.

In another possible implementation, the octagonal lens is in the shape of a regular octagon;

the diameter of the lens barrel is the same as the diameter of the circumcircle of the octagonal lens.

In the embodiment of the disclosure, the size of the circumscribed circle of the regular octagonal lens is reduced while the size of the wafer-level lens is not influenced, the size of the circumscribed circle of the regular octagonal lens is minimum, and the occupied space of the octagonal lens can be reduced to the maximum extent; because the regular octagonal lens is horizontally arranged in the lens cone, when the occupied space of the octagonal lens is the minimum, the size of the lens cone is the minimum, so that the size of the whole lens module is reduced the most, and the miniaturization effect of the lens module is optimal.

According to another aspect of the embodiments of the present disclosure, an electronic device is provided, which includes a housing and the lens module set described in any one of the above.

The lens module is arranged on the shell.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

FIG. 1 is a schematic diagram illustrating a wafer structure according to an exemplary embodiment;

FIG. 2 is a schematic diagram illustrating the construction of an octagonal lens in accordance with an exemplary embodiment;

fig. 3 is a schematic structural diagram illustrating a lens module according to an exemplary embodiment;

fig. 4 is a schematic structural diagram of an electronic device according to an exemplary embodiment.

10 wafer

11 octagonal lens

111 wafer level lens

112 light-shielding layer

12 first cutting line

13 second cut line

14 third cutting line

15 fourth cutting line

20 lens module

21 lens barrel

30 electronic device

31 shell

Detailed Description

To make the objects, technical solutions and advantages of the present disclosure more apparent, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

Fig. 1 is a schematic diagram illustrating a structure of a wafer 10, wherein a plurality of wafer level lenses 111 are disposed on the wafer 10 according to an exemplary embodiment;

a plurality of first cutting lines 12, a plurality of second cutting lines 13, a plurality of third cutting lines 14 and a plurality of fourth cutting lines 15 are arranged on the wafer 10, each first cutting line 12 is perpendicular to each second cutting line 13, and each third cutting line 14 is perpendicular to each fourth cutting line 15;

each wafer level lens 111 is disposed in the octagonal lens 11 formed by the first scribe line 12, the second scribe line 13, the third scribe line 14, and the fourth scribe line 15.

Introduction of wafer 10: the shape of the wafer 10 may be a perfect circle or an ellipse; the size of the wafer 10 may be 6 inches, 8 inches, or 12 inches; in the embodiment of the present disclosure, the shape and size of the wafer 10 are not particularly limited, and may be set and changed as needed. For example, the wafer 10 may be a perfect circle with a 12 inch diameter. In another possible implementation manner, a platform is disposed on the wafer 10, and during the production process of the wafer 10, the wafer 10 is placed in the fixed tray, and the platform on the wafer 10 can increase the stability of the wafer 10 in the fixed tray, thereby increasing the safety during the production process.

The material of the wafer 10 may be glass, such as optical glass; it may also be a plastic, such as an optical plastic, or a mixed material of glass and plastic. When the material of the wafer 10 is optical glass, the optical glass has good optical properties such as light transmittance and refractive index; in addition, the optical glass also has good high temperature resistance and corrosion resistance.

In one possible implementation, a plurality of wafer level lenses 111 are disposed on the wafer 10; the wafer level lenses 111 may be arranged in a matrix on the wafer 10. The wafer-level lens 111 is circular, and the diameter of the circular wafer-level lens 111 may be 1mm, 1.1mm, or 1.2 mm. For example, the wafer level lens 111 having a circular shape is set to have a diameter of 1.2 mm.

A plurality of first cutting lines 12, a plurality of second cutting lines 13, a plurality of third cutting lines 14 and a plurality of fourth cutting lines 15 are arranged on the wafer 10, each first cutting line 12 is perpendicular to each second cutting line 13, and each third cutting line 14 is perpendicular to each fourth cutting line 15; each wafer level lens 111 is disposed in the octagonal lens 11 formed by the first scribe line 12, the second scribe line 13, the third scribe line 14, and the fourth scribe line 15.

It should be noted that the positional relationship between the plurality of first cut lines 12 is parallel, and the positional relationship between the plurality of second cut lines 13 is parallel; the position relationship among the plurality of third cutting lines 14 is parallel, and the position relationship among the plurality of fourth cutting lines 15 is parallel; the first cutting lines 12 and the second cutting lines 13 are perpendicular to each other, and the distance between two adjacent first cutting lines 12 is the same or different; when the distance between two adjacent first cutting lines 12 is the same, the distance between two adjacent first cutting lines 12 should be larger than the diameter of the wafer level lens 111, and when the diameter of the wafer level lens 111 is 1.2mm, the distance between two adjacent first cutting lines 12 may be 1.3mm, or 1.4mm, or 1.5 mm. For example, the distance between two adjacent first cutting lines 12 is 1.4 mm.

The distance between two adjacent second cutting lines 13 is the same, and can also be different; when the distance between two adjacent second scribe lines 13 is the same, the distance between two adjacent second scribe lines 13 should be larger than the diameter of the wafer level lens 111, and when the diameter of the wafer level lens 111 is 1.2mm, the distance between two adjacent second scribe lines 13 may be 1.3mm, or 1.4mm, or 1.5 mm. For example, a distance between two adjacent second cut lines 13 is set to be 1.4 mm.

When the distance between two adjacent first scribe lines 12 is the same as the distance between two adjacent second scribe lines 13, the plurality of first scribe lines 12 and the plurality of second scribe lines 13 can cut the wafer 10 into square lenses; the wafer level lens 111 is disposed on a square lens. It is emphasized that the diameter of the wafer level lens 111 is smaller than the diameter of the square inscribed circle, i.e. the size of the square inscribed circle defines the size of the wafer level lens 111.

The third cut line 14 and the fourth cut line 15 are perpendicular to each other, and it should be noted that an included angle between the third cut line 14 and the first cut line 12 may be 40 degrees, 45 degrees, or 50 degrees. For example, the angle between the third cut line 14 and the first cut line 12 is 40 degrees. Since the third cutting line 14 and the fourth cutting line 15 are perpendicular to each other, the included angle between the first cutting line 12 and the fourth cutting line 15 is 50 degrees, and correspondingly, the included angle between the second cutting line 13 and the third cutting line 14 is 50 degrees, and the included angle between the second cutting line 13 and the fourth cutting line 15 is 40 degrees.

It is emphasized that, in order not to affect the size of the wafer level mirror 111, the diameter of the largest circle in the octagon composed of the first scribe line 12, the second scribe line 13, the third scribe line 14, and the fourth scribe line 15 is the same as the diameter of the inscribed circle of the first scribe line 12 and the vertically reversed composed square.

In one possible implementation, the wafer 10 may be cut by using a cutting die, and the cutting machine may be a professional cutting die cutting machine or a water jet cutting machine. The cutting machine cuts the wafer 10 into octagonal lenses along a plurality of first cutting lines 12, second cutting lines 13, third cutting lines 14 and fourth cutting lines 15.

In another possible implementation manner, a first cutting groove is arranged on each first cutting line 12, a second cutting groove is arranged on each second cutting line 13, a third cutting groove is arranged on each third cutting line 14, and a fourth cutting groove is arranged on each fourth cutting line 15; the dicing machine dice the wafer 10 into octagonal lenses along the first, second, third and fourth dicing grooves.

In the embodiment of the present disclosure, a plurality of wafer level lenses 111 are disposed on the wafer 10; each wafer level lens 111 is arranged in the octagonal lens 11 formed by the first cutting lines 12, the second cutting lines 13, the third cutting lines 14 and the fourth cutting lines 15, and the first cutting lines 12, the second cutting lines 13, the third cutting lines 14 and the fourth cutting lines 15 enable the cutting machine to cut the wafer 10 into the octagonal lenses rapidly; and the size of the octagonal lens 11 does not influence the size of the wafer level lens 111, and simultaneously, the size of the circumscribed circle of the lens is reduced, so that the space occupied by the lens is reduced, and the miniaturization effect of the lens is enhanced.

In another possible implementation, with continued reference to fig. 1, a plurality of wafer level lenses 111 are disposed on the wafer 10; the wafer level lenses 111 are arranged on the wafer 10 in a quincunx manner, and an included angle between each first cutting line 12 and each third cutting line 14 is 45 degrees.

It should be noted that, since each third cut line 14 and each fourth cut line 15 are perpendicular to each other, the angle between each first cut line 12 and each fourth cut line 15 is also 45 degrees. In addition, since each first cut line 12 is perpendicular to each second cut line 13, and the included angle between each first cut line 12 and each third cut line 14 is 45 degrees, the included angle between each second cut line 13 and each third cut line 14 is also 45 degrees. Likewise, the angle between each second cut line 13 and each fourth cut line 15 is also 45 degrees.

Each wafer level lens 111 is disposed in the octagonal lens 11 formed by the first scribe line 12, the second scribe line 13, the third scribe line 14, and the fourth scribe line 15. In this case, the shape of the octagonal lens 11 is equivalent to the shape of a square lens formed by the first cutting line 12 and the second cutting line 13 with four corners removed.

In the embodiment of the present disclosure, the arrangement of the plurality of wafer level lenses 111 on the wafer 10 is a quincunx arrangement, so that the wafer level lenses 111 can avoid the cutting lines, and unnecessary wafer level lenses 111 are not prepared on the wafer 10, thereby effectively reducing the process cost.

In another possible implementation, referring to fig. 2, the octagonal lens 11 is in the shape of a regular octagon. At this time, the side lengths of the octagonal lenses 11 are the same, the inscribed circle of the regular octagon is overlapped with the inscribed circle of the square, and the size of the circumscribed circle of the regular octagon is the smallest compared with the size of the circumscribed circle of other octagons, so that the space occupied by the regular octagon is the smallest.

In the embodiment of the present disclosure, a plurality of wafer level lenses 111 are disposed on the wafer 10; each wafer level lens 111 is arranged in the regular octagonal lens 11 formed by the first cutting line 12, the second cutting line 13, the third cutting line 14 and the fourth cutting line 15, and the size of the circumscribed circle of the lens is the smallest while the size of the wafer level lens 111 is not influenced by the regular octagonal lens 11, so that the occupied space of the lens is reduced to the greatest extent, and the effect of enhancing the miniaturization of the lens is the best.

In one possible implementation, each wafer level lens 111 is an optical lens.

The optical lens is an essential component in a machine vision system, directly influences the quality of imaging quality and influences the realization and effect of an algorithm. The optical lens may be a convex lens or a concave lens. The material of the optical lens is the same as that of the wafer 10, and may be glass, such as optical glass; it may also be a plastic, such as an optical plastic, or a mixed material of glass and plastic. The lens (a general term for the convex lens and the concave lens) may be an aspherical lens or a spherical lens; spherical lenses are those that have a constant curvature from the center to the edge of the lens, while aspherical lenses have a continuously varying curvature from the center to the edge.

In a possible implementation manner, the optical lens is an aspheric lens, and the aspheric lens has a better curvature radius at this time, so that good aberration correction can be maintained, and the aspheric lens has a higher resolution, so that the imaging quality of the optical lens is improved.

In the embodiment of the present disclosure, the wafer level lens 111 is an optical lens, and when the optical lens is an aspheric lens, the optical lens has a better curvature radius and a higher resolution, so that the imaging quality of the optical lens is improved.

In another possible implementation, with continued reference to fig. 2, a light-shielding layer 112 is disposed on the octagonal lens 11 in a lens area other than the wafer-level lens 111. The material of the light shielding layer 112 may be a metal, such as tungsten. In another possible implementation manner, the material of the light shielding layer 112 is chromium dioxide, which is a metal oxide.

In the embodiment of the present disclosure, the light shielding layer 112 is disposed on the lens area of the octagonal lens 11 except the wafer level lens 111, so as to prevent glare, reduce interference of light rays in other areas on imaging of the wafer level lens 111, and improve imaging quality of the wafer level lens 111.

Fig. 3 is a schematic structural diagram of a lens module 20 according to an exemplary embodiment. The lens module 20 includes a body, a barrel 21 and an octagonal lens 11, wherein the octagonal lens 11 is obtained by cutting a wafer 10 in any one of the octagonal lens 11;

the octagonal lens 11 and the lens cone 21 are both arranged on the body, and the octagonal lens 11 is horizontally arranged in the lens cone 21;

a lens barrel 21 for fixing the octagonal lens 11;

an octagonal mirror plate 11 for optically imaging a scene.

In the embodiment of the present disclosure, the size of the octagonal lens 11 does not affect the size of the wafer-level lens 111, and the size of the circumscribed circle of the lens is reduced, so that the occupied space of the lens is reduced, because the octagonal lens 11 is horizontally disposed in the lens barrel 21, when the occupied space of the octagonal lens 11 is reduced, the size of the lens barrel 21 is reduced correspondingly, and further the size of the whole camera module 20 is reduced, thereby enhancing the miniaturization effect of the camera module 20.

In another possible implementation, the octagonal lens 11 is in the shape of a regular octagon; the diameter of the lens barrel 21 is the same as the diameter of the circumscribed circle of the octagonal lens 11.

In the embodiment of the present disclosure, the size of the circumscribed circle of the regular octagonal lens 11 is reduced while the size of the wafer-level lens 111 is not affected, and the circumscribed circle size of the regular octagonal lens 11 is relatively reduced by 36%, which is reduced most, so that the occupied space of the octagonal lens 11 is reduced to the maximum extent; since the regular octagonal lens 11 is horizontally disposed in the lens barrel 21, when the occupied space of the octagonal lens 11 is the minimum, the size of the lens barrel 21 is the minimum, so that the size of the whole camera module 20 is reduced to the maximum, and the effect of miniaturizing the camera module 20 is the best.

Fig. 4 is a schematic structural diagram of an electronic device 30 according to an exemplary embodiment. The electronic device 30 includes a housing 31 and the camera module 20 of any one of the above;

the camera module 20 is disposed on the housing 31.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. A wafer is characterized in that a plurality of wafer-level lenses are arranged on the wafer;

a plurality of first cutting lines, a plurality of second cutting lines, a plurality of third cutting lines and a plurality of fourth cutting lines are arranged on the wafer, each first cutting line is perpendicular to each second cutting line, and each third cutting line is perpendicular to each fourth cutting line;

each wafer level lens is arranged in the octagonal lens formed by the first cutting line, the second cutting line, the third cutting line and the fourth cutting line.

2. The wafer of claim 1, wherein the plurality of wafer level lenses are arranged in a quincunx arrangement on the wafer; and the included angle between each first cutting line and each third cutting line is 45 degrees.

3. The wafer of claim 1, wherein the octagonal lens is regular octagonal in shape.

4. The wafer of claim 1, wherein each wafer level lens is an optical lens.

5. The wafer of claim 1, wherein a light shielding layer is disposed on a lens area of the octagonal lens except for a wafer level lens.

6. The wafer according to claim 5, wherein the material of the light shielding layer is chromium dioxide.

7. The wafer of claim 1, wherein the material of the wafer is optical glass.

8. A lens module, characterized in that the lens module comprises a body, a lens barrel and an octagonal lens, wherein the octagonal lens is obtained by cutting the wafer according to any one of claims 1-7;

the octagonal lens and the lens barrel are both arranged on the body, and the octagonal lens is horizontally arranged in the lens barrel;

the lens cone is used for fixing the octagonal lens;

the octagonal lens is used for optically imaging the scenery.

9. The lens module as claimed in claim 8, wherein the octagonal lens has a regular octagon shape;

the diameter of the lens barrel is the same as the diameter of the circumcircle of the octagonal lens.

10. An electronic device, comprising a housing and the lens module of any one of claims 8-9;

the lens module is arranged on the shell.

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