CN210629956U - Flexible double-layer circuit board and lamp strip using same - Google Patents
Flexible double-layer circuit board and lamp strip using same Download PDFInfo
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- CN210629956U CN210629956U CN201921147966.2U CN201921147966U CN210629956U CN 210629956 U CN210629956 U CN 210629956U CN 201921147966 U CN201921147966 U CN 201921147966U CN 210629956 U CN210629956 U CN 210629956U
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- 239000002184 metal Substances 0.000 claims abstract description 96
- 229910052751 metal Inorganic materials 0.000 claims abstract description 96
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- 238000003466 welding Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 239000011889 copper foil Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 4
- 229920002799 BoPET Polymers 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims 4
- 238000005520 cutting process Methods 0.000 description 14
- 239000000047 product Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
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- 239000013589 supplement Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The utility model discloses a flexible double-layer circuit board and a lamp belt applying the same, wherein the flexible double-layer circuit board comprises a first insulating film layer, a first metal foil layer, a second insulating film layer, a second metal foil layer and a third insulating film layer which are arranged from top to bottom in sequence; the first insulating film layer comprises a plurality of subunits, the subunits are distributed along the length direction of the first insulating film layer, each subunit is provided with a row of first windows and a row of second windows, and the positions of the first windows and the positions of the second windows are mutually corresponding; at least one end of each subunit is provided with a third opening window and a fourth opening window, and the positions of the third opening window and the fourth opening window are mutually corresponding; the first metal foil layer is provided with a plurality of metal conducting blocks for forming conducting circuits; the first windowing, the second windowing, the third windowing and the fourth windowing are all located on the corresponding metal conducting blocks. Therefore, the condition that the product is not used well due to the fact that the routing is broken at the edge of the bonding pad can be avoided.
Description
Technical Field
The utility model relates to a flexible double-deck circuit board and use its lamp area.
Background
At present, the circuit board industry gradually adopts a die cutting process to replace the traditional etching process to manufacture a flexible circuit board. The die cutting process can overcome the defect of great environmental pollution caused by the etching process, realize zero emission of production and reduce the production cost. As disclosed in patent application publication No. CN102159032A, a process for manufacturing a flexible printed circuit board using a die cutter is comprised of the steps of: step one, processing the printed circuit into a die cutting tool; step two, cutting out the printed circuit on the metal foil adhesive tape by using a printed circuit die cutting mould by using a die cutting machine, and removing the metal foil waste of the non-printed circuit; thirdly, coating a layer of weak-adhesion film on the metal foil adhesive tape with the die-cut printed circuit; removing the metal foil adhesive tape release layer, and transferring the die-cut printed circuit on the flexible substrate; and fifthly, punching the appearance of the printed circuit board and the circuit via hole according to the printed circuit to obtain the flexible printed circuit board. In the second step, in the actual production process, the die-cut printed circuit usually includes a pad for bonding connection with the electronic component and a trace of the conductive circuit.
The lamp strip is one of the most product fields applying the flexible circuit board. The lamp area is because the condition of walking the line at pad edge fracture easily appears in the use for various reasons to lead to the lamp pearl not bright, make the life of product decline.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to solve one of the technical problem that exists among the prior art at least, provide a flexible double-layer circuit board and use its lamp area, can solve and walk the line easy at the cracked problem in pad edge, improve the electric intercommunication performance of circuit board.
11. According to a first aspect of the present invention, a flexible double-layer circuit board is provided, which comprises a first insulating film layer, a first metal foil layer, a second insulating film layer, a second metal foil layer and a third insulating film layer sequentially arranged from top to bottom;
the first insulating film layer comprises a plurality of subunits, the subunits are distributed along the length direction of the first insulating film layer, each subunit is provided with a row of first windows and a row of second windows, and the positions of the first windows and the positions of the second windows are mutually corresponding; at least one end of each subunit is provided with a pair of a third windowing and a fourth windowing;
the first metal foil layer is provided with a plurality of metal conducting blocks for forming conducting circuits;
the second metal foil layer is provided with a first power line and a second power line which penetrate through two ends of the second metal foil layer in the length direction;
the first windowing, the second windowing, the third windowing and the fourth windowing are arranged on the corresponding metal conducting blocks;
in each subunit, a first guide hole is correspondingly arranged at the position of the third opening window and the first opening window positioned at the foremost end, a second guide hole is correspondingly arranged at the position of the fourth opening window and the second opening window positioned at the rearmost end, and the first guide hole and the second guide hole both penetrate through the first metal foil layer and the second insulating film layer;
the first power line is electrically connected with the first guide hole, and the second power line is electrically connected with the second guide hole.
According to the utility model discloses the flexible double-layer circuit board that the first aspect provided has following beneficial effect at least: when first insulating rete sets up on first metal foil layer, first windowing and second windowing expose the metal on the first metal foil layer respectively and switch on the piece, form anodal pad and negative pole pad, set up the pad in the metal switches on the piece in other words, the metal switches on the piece and plays the effect that switches on the circuit simultaneously, can improve the reliability that electronic components and switch on the circuit interconnection switch on like this, avoid appearing walking the line and lead to the condition emergence of product use failure at the edge fracture of pad, and the first insulating rete can strengthen the flex resistance ability of circuit board, play good guard action to the circuit that switches on. The double-layer circuit board of this embodiment also realizes the interconnection and conduction of the conducting circuit on the first metal foil layer and the power circuit on the second metal foil layer through the first and second vias penetrating through the first metal foil layer and the second insulating film layer.
In an embodiment of the flexible double-layer circuit board, the first insulating film layer, the second insulating film layer, and the third insulating film layer are PET films or PI films.
In an embodiment of the flexible double-layer circuit board, the first metal foil layer and the second metal foil layer are any one of a copper foil, an aluminum-plated copper foil, an iron foil, and an iron-plated copper foil.
In an embodiment of the flexible double-layer circuit board, the first insulating film layer, the first metal foil layer, the second insulating film layer, the second metal foil layer and the third insulating film layer are respectively bonded together by thermosetting glue.
In an embodiment of the flexible double-layer circuit board, the thermosetting adhesive is an epoxy thermosetting adhesive, an oily acrylic thermosetting adhesive or a water-based acrylic thermosetting adhesive.
In an embodiment of the flexible double-layer circuit board, solder paste is applied in the first window, the second window, the third window and the fourth window.
According to the utility model discloses a second aspect provides a lamp area, including foretell flexible double-layer circuit board and set up a plurality of LED lamp bodies on this flexible double-layer circuit board, the anodal leg setting of every LED lamp body is in first windowing, and the negative pole leg setting of every LED lamp body is in the second windowing.
According to the utility model discloses the lamp area that the second aspect provided has following beneficial effect at least: the corresponding setting of anodal leg and the negative pole leg of LED lamp body is in first windowing and second windowing, realizes LED lamp body and first metal foil layer or the electrically conductive intercommunication of second metal foil layer, the utility model discloses a flexible double-layer circuit board can avoid appearing walking the line and lead to the condition emergence of product poor use at pad edge fracture, and the flex resistance ability of circuit board can be strengthened on first insulating rete moreover, plays good guard action to the circuit that switches on, has improved LED lamp body leg and the reliability of switching on circuit electrical connection greatly from this, improves the life in lamp area. In addition, the flexible double-layer circuit board is provided with a plurality of subunits, and the lamp strip can be cut according to the length of actual needs.
In the embodiment of the lamp strip, the lamp strip further comprises a plurality of current-limiting resistors, the anode welding leg of each LED lamp body is arranged in the first window, and the cathode welding leg of each LED lamp body is arranged in the second window.
In the embodiment of the lamp strip, the LED lamp body is a patch LED, and the LED lamp body is mounted in the first window and the second window by the positive electrode fillet and the negative electrode fillet through SMT reflow soldering.
In the embodiment of the light strip, the LED lamp bodies in each subunit of the flexible double-layer circuit board are connected in series through the conducting circuit of the first metal foil layer.
Drawings
The present invention will be further described with reference to the accompanying drawings and examples;
fig. 1 is a partial perspective view of a double-layer flexible circuit board according to an embodiment of the present invention;
fig. 2(a) - (e) are plan structure diagrams of a first insulating film layer, a first metal foil layer, a second insulating film layer, a second metal foil layer and a third insulating film layer of the double-layer flexible circuit board shown in fig. 1 in sequence;
fig. 3 is a partial perspective view of a double-layer flexible circuit board according to an embodiment of the present invention;
fig. 4 is a schematic view of a first metal foil layer structure of the double-layer flexible printed circuit shown in fig. 3 according to the present invention;
fig. 5 is a schematic view of a longitudinal cross-sectional structure of a light strip according to an embodiment of the present invention.
Detailed Description
This section will describe in detail the embodiments of the present invention, preferred embodiments of the present invention are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can intuitively and vividly understand each technical feature and the whole technical solution of the present invention, but they cannot be understood as the limitation of the protection scope of the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the directions such as up, down, front, back, left, right, etc. are based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or electronic component indicated must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
Referring to fig. 1 and fig. 2(a) - (e), the embodiment of the present invention provides a flexible double-layer circuit board, which includes a first insulating film layer 11, a first metal foil layer 12, a second insulating film layer 13, a second metal foil layer 14 and a third insulating film layer 15, which are sequentially arranged from top to bottom.
Referring to fig. 2a, in the present embodiment, the first insulating film layer 11 includes a plurality of sub-units 10, the sub-units 10 are distributed along a length direction of the first insulating film layer 11, each sub-unit 10 has a row of first windows 111 and a row of second windows 112, and positions of the first windows 111 and the second windows 112 correspond to each other. Further, at least one end of each sub-unit 10 is provided with a pair of a third opening window 113 and a fourth opening window 114, and the positions of the third opening window 113 and the fourth opening window 114 are corresponding to each other. The front end and the rear end of each subunit 10 are respectively provided with a pair of third opening windows 113 and fourth opening windows 114.
The first metal foil layer 12 is provided with a plurality of metal conduction blocks 121 for forming a conduction circuit, and when the first insulating film layer 11 covers the first metal foil layer 12, the first windowing 111, the second windowing 112, the third windowing 113 and the fourth windowing 114 are all located on the corresponding metal conduction blocks 121.
Referring to fig. 2(b) and fig. 2(c), in the present embodiment, a first via 16 is correspondingly disposed at the first opening 111 and each third opening 113 at the foremost end of each sub-unit 10, a second via 17 is correspondingly disposed at the second opening 112 and each fourth opening 114 at the rearmost end of each sub-unit 10, and both the first via 16 and the second via 17 penetrate through the first metal foil layer 12 and the second insulating film layer 13.
Referring to fig. 2(d), the second metal foil layer 14 is provided with a first power line 141 and a second power line 142 penetrating through both ends of the second metal foil layer 14 in the length direction, the first power line 141 is electrically connected to the first via 16, and the second power line 142 is electrically connected to the second via 17.
In this embodiment, when the first insulating film layer 11 is disposed on the first metal foil layer 12, the first window 111 and the second window 112 expose the metal conduction block 121 on the first metal foil layer 12 to form a positive electrode pad and a negative electrode pad, and when the electronic component is attached to the flexible double-layer circuit board, the positive electrode pad and the negative electrode pad of the electronic component can be connected and conducted to the conduction circuit on the first metal foil layer 12 through the first window 111 and the second window 112, respectively. The utility model discloses being equivalent to set up the pad in metal switches on piece 121, metal switches on piece 121 and plays the effect that switches on the circuit simultaneously, can improve electronic components like this and the reliability that switches on circuit interconnection, avoids appearing walking the line and results in the condition emergence of product poor use at pad edge fracture, and the flex resistance ability of circuit board can be strengthened to first insulating film layer 11 in addition, plays good guard action to switching on the circuit.
In addition, the third opening window 113 and the fourth opening window 114 of this embodiment are the joint position of the positive output solder pin and the negative output solder pin of the power cord, this flexible double-layer circuit board contains a plurality of subunits 10, the third opening window 113 and the fourth opening window 114 are arranged at the front end and/or the rear end of each subunit 10, the user can cut the length of the circuit board as required, the cutting position is the junction between a plurality of subunits 10, during installation and use, it is enough to connect the positive output solder pin and the negative output solder pin of the power cord at the corresponding positions of the third opening window 113 and the fourth opening window 114.
The flexible double-layer circuit board of the embodiment realizes the interconnection and conduction between the power circuit on the second metal foil layer 14 and the external power line and the interconnection and conduction between the conducting circuit on the first metal foil layer 12 and the power circuit on the second metal foil layer 14 through the first via hole 16 and the second via hole 17 penetrating through the first metal foil layer 12 and the second insulating film layer 13.
Referring to fig. 1, a specific arrangement form of the plurality of metal conduction blocks 121 in this embodiment may be that the plurality of metal conduction blocks 121 are designed to be rectangular, and are arranged in two rows and asymmetrically distributed, the first open window 111 and the third open window 113 are distributed on one row of metal conduction blocks 121, and the second open window 112 and the fourth open window 114 are distributed on the other row of metal conduction blocks 121.
Fig. 3 is a schematic structural diagram of a flexible double-layer circuit board according to another embodiment of the present invention. As shown in fig. 4, the flexible double-layer circuit board in this embodiment includes metal conductive blocks in two shapes of a quadrilateral shape and a Z shape
121, each of the quadrangular metal via blocks 121 and each of the zigzag metal via blocks 121 constitute a via line.
Optionally, the first window 111, the second window 112, the third window 113, and the fourth window 114 may be designed to be rectangular, circular, oblong, oval, or the like, and may be specifically set according to the type of the electronic component. For example, in fig. 2(a), the window for attaching to the LED lamp body 21 and the window for connecting to the power supply line output terminal are designed to be long circular, and the window for attaching to the resistor is designed to be circular.
Alternatively, the first insulating film layer 11, the second insulating film layer 13, and the third insulating film layer 15 may be a PET film or a PI film.
Alternatively, the first metal foil layer 12 and the second metal foil layer 14 may be a copper foil, an aluminum-plated copper foil, an iron foil, or an iron-plated copper foil.
Optionally, the first insulating film layer 11, the first metal foil layer 12, the second insulating film layer 13, the second metal foil layer 14 and the third insulating film layer 15 are bonded together by thermosetting glue. The thermosetting adhesive can be epoxy thermosetting adhesive, oily acrylic thermosetting adhesive or water-based acrylic thermosetting adhesive.
Optionally, the solder paste 18 is applied in the first window 111, the second window 112, the third window 113, and the fourth window 114, and is used for SMT attachment with an electronic component or an external power line.
The utility model discloses a flexible double-deck circuit board accessible cross cutting technology makes: firstly, pre-attaching the first metal foil layer 12 and the second insulating film layer 13, and cutting off redundant metal foils on the first metal foil layer 12 by using a cutting die to form a conducting circuit consisting of a plurality of metal conducting blocks 121; punching holes in the first metal foil layer 12 and the second insulating film layer 13 through a cutting die to obtain a first guide hole 16 and a second guide hole 17; punching a hole on the first insulating film layer 11 through a cutting die to obtain a first window, a second window, a third window and a fourth window; aligning and attaching the first insulating film layer 11 to the first metal foil layer 12 and the second insulating film layer 13; pre-attaching the second metal foil layer 14 and the third insulating film layer 15, and cutting off redundant metal foils on the first metal foil layer 14 by using a cutting die to obtain a first power line 141 and a second power line 142; and aligning and laminating the second metal foil layer 14 and the third insulating film layer 15 with the first insulating film layer 11, the first metal foil layer 12 and the second insulating film layer 13 to obtain the flexible double-layer circuit board.
Referring to fig. 5, the embodiment of the present invention further provides a lamp strip using the above flexible double-layer circuit board, where the lamp strip includes the above flexible double-layer circuit board and a plurality of LED lamp bodies 21 disposed on the flexible double-layer circuit board, and the LED lamp bodies 21 are disposed at positions indicated by reference numeral 101 in fig. 1. The positive electrode leg of every LED lamp body 21 sets up in first windowing 111, the negative electrode leg of every LED lamp body 21 sets up in second windowing 112, realize the electrically conductive intercommunication of the metal conduction block 121 of LED lamp body 21 and first metal foil layer 12, be equivalent to the positive electrode pad and the negative electrode pad setting of circuit board in metal conduction block 121, metal conduction block 121 plays the effect of conducting wire simultaneously, can avoid appearing walking the line like this and lead to the condition emergence of product poor use at the edge fracture of pad, and the flex resistance ability of circuit board can be strengthened to first insulating film layer 11, play good guard action to the circuit that conducts, improved LED lamp body 21 leg and the reliability of conducting wire electrical connection greatly from this, improve the life in lamp area. In addition, the flexible double-layer circuit board is provided with a plurality of subunits 10, so that the lamp strip can be cut according to the length of actual needs.
The lamp strip is further provided with a plurality of current limiting resistors 22, the current limiting resistors 22 are arranged at positions indicated by reference numeral 102 in fig. 1, a positive electrode leg of each current limiting resistor 22 is arranged in the first window 111, a negative electrode leg of each current limiting resistor 22 is arranged in the second window 112, and the legs of the current limiting resistors 22 are in conductive communication with the metal conduction blocks 121 in the first metal foil layer 12 through the first window 111 and the second window 112.
In this embodiment, the LED lamp body 21 and the current limiting resistor 22 in each sub-unit 10 of the flexible double-layer circuit board are connected in series with each other through the conducting line of the first metal foil layer 12.
Optionally, the LED lamp body 21 is a chip LED, and the current limiting resistor 22 is a chip resistor. The chip LED and the chip resistor are respectively and correspondingly mounted in the first window 111 and the second window 112 through the positive electrode welding leg and the negative electrode welding leg of the chip LED and the chip resistor through SMT reflow soldering. Specifically, solder paste 18 may be applied in advance in the first and second windows, and then the interconnection of the solder legs and the vias may be performed by reflow soldering.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
Claims (10)
1. A flexible double-layer circuit board is characterized in that: the insulation film comprises a first insulation film layer, a first metal foil layer, a second insulation film layer, a second metal foil layer and a third insulation film layer which are sequentially arranged from top to bottom;
the first insulating film layer comprises a plurality of subunits, the subunits are distributed along the length direction of the first insulating film layer, each subunit is provided with a row of first windows and a row of second windows, and the positions of the first windows and the positions of the second windows are mutually corresponding; at least one end of each subunit is provided with a pair of a third windowing and a fourth windowing;
the first metal foil layer is provided with a plurality of metal conducting blocks for forming conducting circuits;
the second metal foil layer is provided with a first power line and a second power line which penetrate through two ends of the second metal foil layer in the length direction;
the first windowing, the second windowing, the third windowing and the fourth windowing are arranged on the corresponding metal conducting blocks;
in each subunit, a first guide hole is correspondingly arranged at the position of the third opening window and the first opening window positioned at the foremost end, a second guide hole is correspondingly arranged at the position of the fourth opening window and the second opening window positioned at the rearmost end, and the first guide hole and the second guide hole both penetrate through the first metal foil layer and the second insulating film layer;
the first power line is electrically connected with the first guide hole, and the second power line is electrically connected with the second guide hole.
2. The flexible double-layer circuit board of claim 1, wherein: the first insulating film layer, the second insulating film layer and the third insulating film layer are PET films or PI films.
3. The flexible double-layer circuit board of claim 1, wherein: the first metal foil layer and the second metal foil layer are any one of copper foil, aluminum-plated copper foil, iron foil and iron-plated copper foil.
4. The flexible double-layer circuit board of claim 1, wherein: the first insulating film layer, the first metal foil layer, the second insulating film layer, the second metal foil layer and the third insulating film layer are bonded together through thermosetting glue respectively.
5. The flexible double-layer circuit board of claim 4, wherein: the thermosetting adhesive is epoxy thermosetting adhesive, oily acrylic thermosetting adhesive or water-based acrylic thermosetting adhesive.
6. The flexible double-layer circuit board of claim 1, wherein: and solder paste is applied in the first windowing, the second windowing, the third windowing and the fourth windowing.
7. A light strip, its characterized in that: the flexible double-layer circuit board comprises the flexible double-layer circuit board as claimed in any one of claims 1 to 6 and a plurality of LED lamp bodies arranged on the surface of the flexible double-layer circuit board, wherein the positive electrode welding foot of each LED lamp body is arranged in the corresponding first window, and the negative electrode welding foot of each LED lamp body is arranged in the corresponding second window.
8. A light strip according to claim 7, wherein: the surface of the flexible double-layer circuit board is also provided with a plurality of current-limiting resistors, the positive electrode welding leg of each current-limiting resistor is arranged in the corresponding first window, and the negative electrode welding leg of each current-limiting resistor is arranged in the corresponding second window.
9. A light strip according to claim 7, wherein: the LED lamp body is a surface mounted LED, and the LED lamp body enables the positive electrode welding leg and the negative electrode welding leg of the LED lamp body to be correspondingly mounted in the first window and the second window through SMT reflow soldering.
10. A light strip according to claim 7, wherein: the LED lamp bodies in each subunit of the flexible double-layer circuit board are connected in series through the conducting circuit of the first metal foil layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921147966.2U CN210629956U (en) | 2019-07-19 | 2019-07-19 | Flexible double-layer circuit board and lamp strip using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921147966.2U CN210629956U (en) | 2019-07-19 | 2019-07-19 | Flexible double-layer circuit board and lamp strip using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210629956U true CN210629956U (en) | 2020-05-26 |
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ID=70760478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921147966.2U Expired - Fee Related CN210629956U (en) | 2019-07-19 | 2019-07-19 | Flexible double-layer circuit board and lamp strip using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210629956U (en) |
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2019
- 2019-07-19 CN CN201921147966.2U patent/CN210629956U/en not_active Expired - Fee Related
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Granted publication date: 20200526 |