CN210626536U - Ultrahigh frequency signal sensor - Google Patents

Ultrahigh frequency signal sensor Download PDF

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Publication number
CN210626536U
CN210626536U CN201921532618.7U CN201921532618U CN210626536U CN 210626536 U CN210626536 U CN 210626536U CN 201921532618 U CN201921532618 U CN 201921532618U CN 210626536 U CN210626536 U CN 210626536U
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sensor main
main part
main body
sensor
circuit board
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CN201921532618.7U
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Chinese (zh)
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史友龙
施鹏
许大伟
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Nanjing Weisheng Automation Technology Co Ltd
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Nanjing Weisheng Automation Technology Co Ltd
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Abstract

The utility model discloses a superfrequency signal sensor, including circuit board, sensor main part, heat dissipation mechanism and mounting structure, heat dissipation mechanism is all installed to the inside top of sensor main part and bottom, the inside shielding magnetic shoe that is provided with of lateral wall of sensor main part, the both sides of sensor main part all evenly are provided with the connector lug, the internally mounted of sensor main part has the circuit board, and the treater is installed to the one end of circuit board. The utility model discloses a fix heat radiation fins respectively on the top and the bottom of the inside both sides of sensor main part, the preformed groove sets up respectively on the inside top of sensor main part and bottom, cooling fan all fixes in the inside of preformed groove, the dust screen is fixed respectively on the top and the bottom of sensor main part, heat radiation fins derives the inside heat of sensor main part fast, start cooling fan, blow off the inside heat of sensor main part, the dust screen plays dirt-proof effect simultaneously, prevent that the dust from getting into in the sensor main part.

Description

Ultrahigh frequency signal sensor
Technical Field
The utility model relates to a sensor technical field specifically is a superfrequency signal sensor.
Background
In modern industrial production, especially automatic production, various sensors are used to monitor and control various parameters in the production process, so as to make the equipment work in a normal state or an optimal state and make the product achieve the best quality, and an ultrahigh frequency signal sensor is widely used, but the existing ultrahigh frequency signal sensor has many problems or defects:
firstly, the traditional ultrahigh frequency signal sensor has poor heat dissipation performance, and internal electronic elements are easy to age in advance;
secondly, the traditional ultrahigh frequency signal sensor is inconvenient to maintain the interior of the sensor and use;
third, the conventional uhf signal sensor does not have a guard structure.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a superfrequency signal sensor to solve the heat dispersion that proposes among the above-mentioned background art poor, be not convenient for maintain the inside of sensor and do not possess protective structure's problem.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a superfrequency signal sensor, includes circuit board, sensor main part, heat dissipation mechanism and mounting structure, heat dissipation mechanism is all installed to the inside top of sensor main part and bottom, the inside shielding magnetic shoe that is provided with of lateral wall of sensor main part, the both sides of sensor main part all evenly are provided with the connector lug, the internally mounted of sensor main part has the circuit board, and the one end of circuit board installs the treater, the connecting seat is all installed to the both sides of circuit board, the pilot lamp panel is installed to the one end of sensor main part, and installs the display screen to the sensor main part one end of pilot lamp panel top, key panel is installed to sensor main part one end of pilot lamp panel below, mounting structure is installed to the other end of sensor main.
Preferably, four corners of sensor main part all are provided with the guard plate, and evenly be fixed with buffer spring between guard plate and the sensor main part, and the guard plate passes through to constitute buffer structure between buffer spring and the sensor main part.
Preferably, heat radiation fins, preformed grooves, dust screens and cooling fans are sequentially arranged in the heat radiation mechanism, the heat radiation fins are respectively fixed at the top and the bottom of two sides in the sensor main body, the preformed grooves are respectively arranged at the top and the bottom in the sensor main body, the cooling fans are all fixed in the preformed grooves, and the dust screens are respectively fixed at the top and the bottom of the sensor main body.
Preferably, the heat dissipation fins are symmetrically distributed about a vertical center line of the sensor main body, and a shell of the heat dissipation fan is communicated with the inside of the reserved groove.
Preferably, first pilot hole, apron, assembly bolt, spout and second pilot hole have set gradually in mounting structure's inside, and the spout sets up respectively in the top and the bottom of sensor main part one end, and the inside both sides of spout all are provided with the second pilot hole, are provided with the apron between the spout, and the both sides of apron top and bottom all are provided with first pilot hole.
Preferably, the first assembling hole corresponds to the second assembling hole in position, and the sliding groove is fixedly connected with the cover plate through an assembling bolt.
Compared with the prior art, the beneficial effects of the utility model are that: the ultrahigh frequency signal sensor has reasonable structure and the following advantages:
(1) the heat dissipation fan is started to blow out the heat inside the sensor main body, and meanwhile, the dustproof net plays a dustproof role to prevent dust from entering the sensor main body;
(2) the sliding grooves are respectively arranged at the top and the bottom of one end of the sensor main body, the two sides inside the sliding grooves are respectively provided with the second assembling holes, the cover plate is arranged between the sliding grooves, the two sides of the top end and the bottom end of the cover plate are respectively provided with the first assembling holes, meanwhile, the first assembling holes correspond to the second assembling holes in position, the sliding grooves and the cover plate are fixedly connected through the assembling bolts, and when the inside of the sensor main body breaks down, the assembling bolts are opened, the cover plate is drawn out, and the maintenance is more convenient;
(3) all be provided with the guard plate through four corners at the sensor main part, and evenly be fixed with buffer spring between guard plate and the sensor main part, the guard plate passes through and constitutes buffer structure between buffer spring and the sensor main part, is provided with the shielding magnetic shoe in the lateral wall inside of sensor main part simultaneously, and buffer spring and guard plate mutually support, improve the anti ability of falling of this device, and the shielding magnetic shoe increases the interference killing feature.
Drawings
Fig. 1 is a schematic front view of a cross-sectional structure of the present invention;
fig. 2 is a schematic front view of the sensor body of the present invention;
fig. 3 is a schematic front view of the heat dissipation mechanism of the present invention;
fig. 4 is a rear view schematic diagram of the mounting structure of the present invention.
In the figure: 1. a protection plate; 2. a buffer spring; 3. a connecting seat; 4. a circuit board; 5. a sensor body; 6. a processor; 7. a connector lug; 8. a heat dissipation mechanism; 801. heat dissipation fins; 802. reserving a groove; 803. a dust screen; 804. a heat radiation fan; 9. shielding the magnetic shoe; 10. a display screen; 11. an indicator panel; 12. a key panel; 13. a mounting structure; 1301. a first assembly hole; 1302. a cover plate; 1303. assembling a bolt; 1304. a chute; 1305. and a second assembly hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides an embodiment: an ultrahigh frequency signal sensor comprises a circuit board 4, a sensor main body 5, a heat dissipation mechanism 8 and a mounting structure 13, wherein the heat dissipation mechanism 8 is mounted at the top end and the bottom end inside the sensor main body 5;
the heat dissipation mechanism 8 is internally provided with heat dissipation fins 801, a reserved groove 802, a dust screen 803 and a heat dissipation fan 804 in sequence, the heat dissipation fins 801 are fixed at the top end and the bottom end of two sides in the sensor main body 5 respectively, the reserved groove 802 is arranged at the top end and the bottom end in the sensor main body 5 respectively, the heat dissipation fans 804 are fixed in the reserved groove 802 respectively, the heat dissipation fans 804 can be 2008 micro fans, and the dust screen 803 is fixed at the top end and the bottom end of the sensor main body 5 respectively;
the radiating fins 801 are symmetrically distributed about the vertical center line of the sensor main body 5, and the shell of the radiating fan 804 is communicated with the inside of the reserved groove 802;
the heat dissipation fins 801 rapidly guide out heat inside the sensor main body 5, the heat dissipation fan 804 is started to blow out the heat inside the sensor main body 5, and meanwhile, the dust screen 803 plays a role in dust prevention to prevent dust from entering the sensor main body 5;
the four corners of the sensor main body 5 are provided with protection plates 1, buffer springs 2 are uniformly fixed between the protection plates 1 and the sensor main body 5, and the protection plates 1 and the sensor main body 5 form a buffer structure through the buffer springs 2;
the buffer spring 2 and the protection plate 1 are matched with each other, so that the anti-falling capacity of the device is improved, and the anti-interference capacity is improved by shielding the magnetic shoe 9;
a shielding magnetic shoe 9 is arranged inside the side wall of the sensor main body 5, connector lugs 7 are uniformly arranged on both sides of the sensor main body 5, a circuit board 4 is arranged inside the sensor main body 5, a processor 6 is arranged at one end of the circuit board 4, connecting seats 3 are arranged on both sides of the circuit board 4, an indicator panel 11 is arranged at one end of the sensor main body 5, a display screen 10 is arranged at one end of the sensor main body 5 above the indicator panel 11, a key panel 12 is arranged at one end of the sensor main body 5 below the indicator panel 11, and an installation structure 13 is arranged at the other end of the sensor main body 5;
a first assembly hole 1301, a cover plate 1302, an assembly bolt 1303, a sliding groove 1304 and a second assembly hole 1305 are sequentially arranged in the mounting structure 13, the sliding groove 1304 is respectively arranged at the top and the bottom of one end of the sensor main body 5, the second assembly hole 1305 is arranged on two sides in the sliding groove 1304, the cover plate 1302 is arranged between the sliding grooves 1304, and the first assembly holes 1301 are arranged on two sides of the top end and the bottom end of the cover plate 1302;
the first assembly hole 1301 corresponds to the second assembly hole 1305 in position, and the sliding groove 1304 is fixedly connected with the cover plate 1302 through an assembly bolt 1303;
when a failure occurs in the sensor body 5, the mounting bolt 1303 is opened, and the cover plate 1302 is pulled out, so that the maintenance is more convenient.
The working principle is as follows: when in use, the heat dissipation fins 801 rapidly guide out the heat inside the sensor body 5, the heat dissipation fan 804 is started to blow out the heat inside the sensor body 5, meanwhile, the dust screen 803 plays a role of dust prevention, so that dust is prevented from entering the sensor body 5, the first assembly holes 1301 are formed at both sides of the top end and the bottom end of the cover plate 1302, meanwhile, the first assembly hole 1301 corresponds to the second assembly hole 1305 in position, the sliding groove 1304 is fixedly connected with the cover plate 1302 through the assembly bolt 1303, when the inside of the sensor main body 5 breaks down, the assembling bolt 1303 is opened, the cover plate 1302 is drawn out, the maintenance is more convenient, the protection plate 1 forms a buffer structure with the sensor main body 5 through the buffer spring 2, simultaneously at sensor main part 5's lateral wall inside shielding magnetic shoe 9 that is provided with, buffer spring 2 and guard plate 1 mutually support, improve this device's anti ability of falling, shield magnetic shoe 9 and increase the interference killing feature.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (6)

1. The utility model provides a superfrequency signal sensor, includes circuit board (4), sensor main part (5), heat dissipation mechanism (8) and mounting structure (13), its characterized in that: the top end and the bottom end inside the sensor main body (5) are both provided with a heat dissipation mechanism (8), a shielding magnetic shoe (9) is arranged inside the side wall of the sensor main body (5), connector lugs (7) are uniformly arranged on both sides of the sensor main body (5), a circuit board (4) is arranged inside the sensor main body (5), and one end of the circuit board (4) is provided with a processor (6), both sides of the circuit board (4) are provided with connecting seats (3), one end of the sensor main body (5) is provided with an indicator panel (11), and one end of the sensor main body (5) above the indicator light panel (11) is provided with a display screen (10), a key panel (12) is arranged at one end of the sensor main body (5) below the indicator panel (11), and the other end of the sensor main body (5) is provided with a mounting structure (13).
2. A uhf signal sensor according to claim 1, characterized in that: four corners of sensor main part (5) all are provided with guard plate (1), and evenly be fixed with between guard plate (1) and sensor main part (5) buffer spring (2), constitute buffer structure between guard plate (1) through buffer spring (2) and sensor main part (5).
3. A uhf signal sensor according to claim 1, characterized in that: the inside of heat dissipation mechanism (8) has set gradually heat radiation fins (801), reserve tank (802), dust screen (803) and cooling fan (804), heat radiation fins (801) are fixed respectively at the top and the bottom of the inside both sides of sensor main part (5), reserve tank (802) set up respectively at the inside top and the bottom of sensor main part (5), cooling fan (804) are all fixed in the inside of reserve tank (802), the top and the bottom at sensor main part (5) are fixed respectively in dust screen (803).
4. A uhf signal sensor according to claim 3, characterized in that: the radiating fins (801) are symmetrically distributed about the vertical center line of the sensor main body (5), and the shell of the radiating fan (804) is communicated with the inside of the reserved groove (802).
5. A uhf signal sensor according to claim 1, characterized in that: the sensor is characterized in that a first assembly hole (1301), a cover plate (1302), an assembly bolt (1303), a sliding groove (1304) and a second assembly hole (1305) are sequentially arranged inside the mounting structure (13), the sliding groove (1304) is respectively arranged at the top and the bottom of one end of the sensor main body (5), the second assembly hole (1305) is respectively arranged on two sides inside the sliding groove (1304), the cover plate (1302) is arranged between the sliding groove (1304), and the first assembly hole (1301) is arranged on two sides of the top end and the bottom end of the cover plate (1302).
6. An uhf signal sensor according to claim 5, wherein: the first assembly hole (1301) corresponds to the second assembly hole (1305), and the sliding groove (1304) is fixedly connected with the cover plate (1302) through an assembly bolt (1303).
CN201921532618.7U 2019-09-16 2019-09-16 Ultrahigh frequency signal sensor Active CN210626536U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921532618.7U CN210626536U (en) 2019-09-16 2019-09-16 Ultrahigh frequency signal sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921532618.7U CN210626536U (en) 2019-09-16 2019-09-16 Ultrahigh frequency signal sensor

Publications (1)

Publication Number Publication Date
CN210626536U true CN210626536U (en) 2020-05-26

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ID=70765202

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921532618.7U Active CN210626536U (en) 2019-09-16 2019-09-16 Ultrahigh frequency signal sensor

Country Status (1)

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CN (1) CN210626536U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112584607A (en) * 2020-12-06 2021-03-30 无锡英诺赛思科技有限公司 Gallium nitride semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112584607A (en) * 2020-12-06 2021-03-30 无锡英诺赛思科技有限公司 Gallium nitride semiconductor device

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