CN210625589U

CN210625589U - Scanning module and three-dimensional sensing device comprising same

Info

Publication number: CN210625589U
Application number: CN201921009242.1U
Authority: CN
Inventors: 洪昌黎; 陈帛钧
Original assignee: Advanced Mems Co Ltd
Current assignee: Advanced Mems Co Ltd
Priority date: 2019-07-01
Filing date: 2019-07-01
Publication date: 2020-05-26
Anticipated expiration: 2029-07-01

Abstract

The utility model discloses a scanning module, it contains a base plate, a laser source, a mirror and a beam shaping unit shake. The substrate comprises a first plane and a second plane which are connected in an inclined way, and an included angle which is larger than 45 degrees and not larger than 60 degrees is defined between the first plane and the second plane. The laser light source is arranged on the substrate. The galvanometer is arranged on the second plane of the substrate. The beam shaping unit is arranged on the substrate and is positioned between the laser light source and the vibrating mirror. The utility model discloses in addition provide a three-dimensional sensing device, it contains scanning module and a receiving module. The scanning module emits a scanning light. The receiving module can receive a reflected light ray of the scanning light ray reflected by an object to be detected.

Description

Scanning module and three-dimensional sensing device comprising same

Technical Field

The utility model relates to a scanning module and contain its three-dimensional sensing device.

Background

Three-dimensional sensing is a measurement technique for detecting the shape or appearance of an environment, a real object, and the like, and is applicable to a variety of fields such as industry, medicine, biology, and the like.

However, referring to fig. 1, the characteristics of the conventional three-dimensional sensing apparatus, such as the minimum sensing distance D, the sensing range E, the resolution, and the overall volume, are limited by the configuration between the scanning module TX and the receiving module RX or the type of the components used in the scanning module TX, which is difficult to be improved.

Referring to fig. 2, even though there is an attempt to improve the minimum sensing distance of the three-dimensional sensing device, for example, the projection light path is changed by tilting the whole scanning module TX or adding a lens element (not shown) in the scanning module TX, the overall volume of the three-dimensional sensing device is inevitably increased, and the assembly and positioning difficulty of the three-dimensional sensing device is increased.

Therefore, it is an objective of the present invention to provide a solution to the above-mentioned drawbacks. It is to be noted that the technical contents described above are intended to help the understanding of the problems to be solved by the present invention, and are not necessarily disclosed or known in the art.

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to provide a scanning module, which can shift the scanning range without additional supporting structure or secondary optical element; another object of the present invention is to provide a three-dimensional sensing device, which can include the aforementioned scanning module, so as to reduce the minimum sensing distance and the overall size thereof.

To achieve the above object, the present invention provides a scanning module, which comprises a substrate, a laser source, a vibrating mirror and a beam shaping unit. The substrate comprises a first plane and a second plane. The first plane and the second plane are connected in an inclined mode, and an included angle is defined between the first plane and the second plane and is larger than 45 degrees and not larger than 60 degrees. The laser light source is arranged on the substrate. The galvanometer is arranged on the second plane of the substrate. The beam shaping unit is arranged on the substrate and is positioned between the laser light source and the vibrating mirror.

In an implementation aspect, the included angle between the first plane and the second plane of the scanning module of the present invention is greater than 45 ° and not greater than 50 °.

In an embodiment, the substrate of the scanning module of the present invention further includes a third plane, the third plane is perpendicular to the first plane, and the laser source is disposed on the third plane.

In an embodiment, the substrate of the scanning module of the present invention further includes a positioning mark disposed on at least one of the first plane, the second plane and the third plane.

In an embodiment, the positioning mark of the scanning module of the present invention is a structure of a recess, a protrusion, a through hole or a printed pattern.

In an implementation aspect, the laser source of the scanning module of the present invention is disposed on the first plane.

In an embodiment, the beam shaping unit of the scanning module of the present invention includes a lens portion and a frame portion integrally formed.

In an implementation aspect, the mirror that shakes that the scanning module has of the utility model is a one-dimensional mirror that shakes or a two-dimensional mirror that shakes.

In one embodiment, the galvanometer of the present invention is a micro-electromechanical system (MEMS) scanning galvanometer.

The utility model provides a three-dimensional sensing device can contain the scanning module and a receiving module of above-mentioned any kind. The receiving module is positioned at one side of the scanning module and is used for receiving a reflected light ray which is emitted by the scanning module and reflected by the object to be detected.

In order to make the aforementioned objects, features and advantages more comprehensible and practical for those skilled in the art, several preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings.

Drawings

FIG. 1 is a schematic diagram of a three-dimensional sensing device and a sensing range thereof;

FIG. 2 is a schematic diagram of another three-dimensional sensing device and a sensing range thereof;

fig. 3A is a schematic diagram illustrating a comparison between the sensing ranges of the three-dimensional sensing device of the present invention and the three-dimensional sensing device shown in fig. 1;

fig. 3B is a schematic sensing diagram of the three-dimensional sensing device of the present invention;

fig. 4 is a schematic diagram of a scan module according to a preferred embodiment of the present invention;

fig. 5 is a schematic diagram of a scanning module according to another preferred embodiment of the present invention;

fig. 6 is a schematic view of the scanning module of the present invention having positioning marks;

fig. 7A is a schematic diagram of a positioning mark of the scanning module of the present invention;

fig. 7B is a schematic view of another positioning mark of the scanning module of the present invention; and

fig. 8 is a schematic diagram of the change between the tilt angle of the galvanometer and the depth resolution of the scanning module according to the present invention.

Description of the symbols

10 three-dimensional sensing device

20 scanning module

30 receiving module

100 substrate

110 first plane

120 second plane

130 third plane

200 laser light source

210 laser

300 galvanometer

400 beam shaping unit

410 lens part

420 frame part

Angle A

D minimum sensible distance

D1 sensing distance

E sensing range

L scanning light

P object to be measured

R scan range

R1 scanning Range

R2 field of view range

R3 sensing Range

RL reflected light

RX receiving module

TX scanning module

M positioning mark

W projection light swing angle

V normal

Detailed Description

Specific embodiments according to the present invention will be specifically described below; however, without departing from the spirit of the invention, the invention may be practiced in many different forms of embodiments, and the scope of the invention should not be construed as limited by the description set forth herein. In addition, the technical contents of the various implementation aspects in the above-mentioned disclosure can also be regarded as the technical contents of the embodiments, or as possible variations of the embodiments. In addition, as used herein, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise, and when the words "comprise" or "comprises" are used in this specification to specify the presence of stated features, elements or components, etc., but do not preclude the presence or addition of one or more other features, elements or components, etc. In addition, the orientations (such as front, back, up, down, two sides, inside, outside, etc.) are relative and can be defined according to the using state of the scanning module, rather than indicating or implying that the scanning module has a specific orientation, is constructed or operated in a specific orientation; the orientation is therefore not to be construed as limiting the invention.

The utility model discloses a scanning module 20 can be applied to in multiple sensing devices such as environment scanning, product detection, and for the convenience of explanation the utility model discloses an effect that scanning module 20 can reach, following embodiment is with being applied to in the three-dimensional sensing device as the example, but is not limited to this. First, as shown in fig. 3A to 3B, the three-dimensional sensing device 10 of the present invention using the scanning module 20 at least includes the scanning module 20 and the receiving module 30, which are optically coupled, that is, the scanning module 20 can emit a scanning light L, and the receiving module 30 of the optical coupling can receive a reflected light RL generated by the scanning light L reflected by an object P to be measured. For this purpose, the receiving module 30 is disposed adjacent to the scanning module 20 at a side of the scanning module 20, and the distance between the two is sufficient for the two to achieve the optical coupling. Therefore, as long as the receiving module 30 can receive the reflected light RL, the adjacent or optical coupling relationship is obtained. In addition, the two are not limited to be located on the same horizontal plane, and the height difference between the two can still achieve optical coupling.

In detail, the scanning light L emitted by the scanning module 20 can be oscillated (swung) to form a scanning range R1, and the receiving module 30 includes a camera having a field of view (FOV) range R2, wherein the scanning range R1 and the FOV range R2 can generate a sensing range R3, and the portion of the sensing range R3 where valid detection data can be obtained through testing is the valid processing range of the three-dimensional sensing device 10. In the sensing range R3, the vertical distance from the intersection of the scanning range R1 and the field of view range R2 closest to the three-dimensional sensing device 10 is the minimum sensing distance, or simply referred to as the sensing distance D1.

When the scanning module 20 of the present invention is applied to the three-dimensional sensing device 10, the three-dimensional sensing device 10 has a smaller sensing distance D1 and a larger sensing range R3. The scan module 20 may have other elements according to different application devices, and the description and drawing will be omitted because it is not the focus of the present embodiment and does not affect the description of the technical contents of the present embodiment.

As shown in fig. 4, a schematic diagram of the scanning module 20 of the present invention may include a substrate 100, a laser source 200, a galvanometer 300, and a beam shaping unit 400, and the technical contents of the components are described in order as follows.

Substrate 100 may include printed circuit (plastic) substrates, ceramic substrates, metal plates, and the like, of the type known in the art. The substrate 100 of the scan module 20 of the present invention may be an aluminum alloy substrate, and may be fixed to a housing (not shown) to protect the components on the substrate 100. In a preferred embodiment, referring to fig. 4 to 6, the substrate 100 may include a first plane 110, a second plane 120 and a third plane 130. The second plane 120 is inclined with respect to the first plane 110 and connected to the first plane 110, and the third plane 130 is connected to the first plane 110 perpendicularly to the first plane 110. That is, the second plane 120 and the third plane 130 are disposed at both sides of the first plane 110. The first plane 110 and the second plane 120 have an included angle a (an angle of the second plane 120 rotated counterclockwise from the first plane 110) therebetween, which may be greater than 45 °, but not greater than 50 ° or not greater than 60 °. Depending on the device, the normal V of the third plane 130 may pass through the second plane 120 (as shown in fig. 4) or be parallel to the second plane 120 (as shown in fig. 5), which facilitates the configuration of other components.

The laser source 200 may be a laser diode (e.g., a surface emitting laser or an edge emitting laser) or other light emitting devices (as shown in fig. 3B) capable of emitting laser 210, and is disposed on the third plane 130. The galvanometer 300 is disposed on the second plane 120, and thus has a placing angle of the included angle a rotating counterclockwise from the first plane 110, and the galvanometer 300 is a Micro Electro Mechanical Systems (MEMS) scanning galvanometer, and can be generally divided into a one-dimensional galvanometer oscillating on one axis or a two-dimensional galvanometer oscillating on two axes. In the present embodiment, the galvanometer 300 is a one-dimensional galvanometer, and when the laser source 200 projects the laser 210 onto the galvanometer 300, the galvanometer 300 is rapidly oscillated on an axis to form a projected light oscillation angle W (as shown in fig. 3B), which may be, for example, between plus or minus 45 °, so that the laser 210 projected onto the galvanometer 300 is reflected to generate a scanning range R1. For the specific content of the galvanometer 300, reference may be made to U.S. patent application publication No. US2017/0044003a1, U.S. patent publication No. US 7,329,930, U.S. patent No. US 9,219,219, and the galvanometer 300 may be a mems scanning chip sold by the applicant, but is not limited thereto.

The beam shaping unit 400 includes a lens disposed on the first plane 110 and located between the laser source 200 and the vibrating mirror 300, so that the laser 210 (as shown in fig. 3B) emitted from the laser source 200 is collimated and integrated into a beam by the beam shaping unit 400 and then emitted to the vibrating mirror 300. In addition, the beam shaping unit 400 is preferably disposed perpendicular to the first plane 110 to be perpendicular to the incident laser light 210.

In addition, the substrate 100 may also have only the first plane 110 and the second plane 120, and the laser source 200 may be directly disposed on the substrate 100 or on the first plane 110 (not shown), and still emit the laser 210 to the beam shaping unit 400 and then to the galvanometer 300.

Referring to fig. 3A to 4, the laser 210 reflected by the oscillating galvanometer 300 with the inclined angle a generates a scanning range R1 that intersects with the field of view range R2 more. That is, since the scanning range R1 is shifted toward the receiving module 30 compared to the scanning range R of fig. 1, the scanning module 20 of the present invention can have a smaller sensing distance D1 and a larger sensing range R3. Through the above arrangement, the scanning module 20 (or the receiving module 30) can achieve the desired effect without being tilted, so that when the scanning module 20 and the receiving module 30 are disposed on the same plane, the occupied space can be further effectively reduced, and thus when the three-dimensional sensing device 10 is applied, the overall volume of the three-dimensional sensing device 10 is effectively reduced.

Referring to fig. 6, the substrate 100 further includes at least one alignment mark (or fiducial) M disposed on at least one of the first plane 110, the second plane 120, and the third plane 130, and may be a protrusion (not shown), a recess, a through hole, or a printed pattern, and the shape thereof may include a circle, a rectangle, a triangle, a diamond, a cross, etc. For example, as shown in fig. 7A, the positioning mark M may be an elliptical hole; or a plurality of straight line patterns as shown in fig. 7B. By setting the positioning mark M, the scanning module 20 can automatically assemble internal components through an external recognition imaging system and a mechanical device (e.g., a robot), such as disposing the galvanometer 300 on the second plane 120, disposing the beam shaping unit 400 on the first plane 110, and so on (not shown). In this way, the scan module 20 can be manufactured in an automated manner with high consistency and high calibration efficiency. In other words, if there are other ways to achieve the effect of automatic assembly, it is also possible to match one of the components, and the three planes do not need to have the positioning marks M.

Taking the galvanometer 300 disposed on the second plane 120 as an example, the automated assembly process of the scanning module 20 may include: identifying the position of the positioning mark M on the second plane 120 in the assembly space; identifying the position of the galvanometer 300 in the assembly space; and the assembly is performed after the positional relationship between the positioning mark M and the galvanometer 300 is calculated. Further comprising: the positioning marks and the galvanometer 300 on the second plane 120 are identified again to check and verify whether the assembly is defective. In response to the automated assembly process, in an embodiment, the beam shaping unit 400 further includes a lens portion 410 and a frame portion 420 (as shown in fig. 5) that are integrally formed, so that the frame portion 420 is clamped or buckled when the beam shaping unit 400 is moved by a mechanical device, thereby preventing the lens portion 410 from being damaged, and the beam shaping unit 400 can be more precisely placed and fixed on the first plane 110.

Referring to fig. 8, the effect of different tilting angles (included angle a) of the galvanometer 300 on the resolution of three-dimensional imaging has been tested. Each curve shown in the figure represents an included optical axis, which is defined as: an angle between the optical axis of the scanning module 20 and the optical axis of the receiving module 30, wherein the relationship between the angle a and the optical axis angle is: the included angle a is 45 ° + (included angle of optical axis)/2, so that the included angles of the optical axes of the six curves in the figure are 0 °, 2.5 °, 5 °, 7.5 °, 10 ° and 12.5 ° in sequence from top to bottom, which also represents the inclination angle (included angle a) of the galvanometer 300: 45 ° (45 ° +0 °), 46.25 ° (45 ° +2.5 °/2), 47.5 ° (45 ° +5 °/2), 48.75 ° (45 ° +7.5 °/2), 50 ° (45 ° +10 °/2) and 51.25 ° (45 ° +12.5 °/2); the optical axis included angle of 0 degree indicates that the two optical axes are parallel and have no stagger. From the test results, it can be seen that the larger the placing angle of the galvanometer 300 (i.e. the larger the included angle a between the first plane 110 and the second plane 120), the better resolution is obtained. For example, when the galvanometer 300 is tilted by 51.25 °, compared with the tilting by 46.25 ° or 47.5 °, no matter whether the object to be measured is located at a distance of 400mm or 800mm, the image sensed by the receiving module 30 has the best depth resolution (depth resolution).

Then, as can be seen from another test result, the distance between the scanning module 20 and the receiving module 30 affects the effective processing range (as shown in the sensing range R3 of fig. 3A) of the three-dimensional sensing device 10, so that the tilt angle of the galvanometer 300 needs to be adjusted according to the distance between the scanning module 20 and the receiving module 30 to maintain the maximum effective processing range and the better resolution; in other words, the galvanometer 300 may have different preferred tilt angles (rather than the larger the better) at different separation distances, so that the three-dimensional sensing device 10 has a larger effective processing range.

In summary, the present invention discloses a scanning module 20, which includes a tilted galvanometer 300, and thus has a larger sensing range R3, better resolution and a smaller minimum sensing distance D when applied to a three-dimensional sensing device 10. Meanwhile, the scanning module 20 is not tilted, so that the occupied space can be further reduced, and the three-dimensional sensing device 10 has a smaller overall volume when being applied. In addition, the positioning mark M can also enable the scanning module 20 to be assembled automatically, thereby improving the consistency and the calibration efficiency.

The above-mentioned embodiments are only intended to illustrate the embodiments of the present invention and to explain the technical features of the present invention, and are not intended to limit the scope of the present invention. Any modifications or equivalent arrangements which may be readily devised by those skilled in the art are intended to be included within the scope of the present invention as defined by the appended claims.

Claims

1. A scan module, comprising:

a substrate including a first plane and a second plane, wherein the first plane and the second plane are connected in an inclined manner, and an included angle is defined between the first plane and the second plane, and the included angle is greater than 45 degrees and not greater than 60 degrees;

a laser source disposed on the substrate;

a vibrating mirror arranged on the second plane of the substrate; and

and the beam shaping unit is arranged on the substrate and is positioned between the laser light source and the galvanometer.

2. The scan module of claim 1, wherein the included angle is greater than 45 ° and not greater than 50 °.

3. The scan module of claim 1, wherein the substrate further comprises a third plane, the third plane is perpendicular to the first plane, and the laser source is disposed on the third plane.

4. The scan module of claim 3, wherein the substrate further comprises at least one positioning mark disposed on at least one of the first plane, the second plane and the third plane.

5. The scan module of claim 4, wherein the positioning mark is a depression, a protrusion, a through hole or a printed pattern.

6. The scan module of claim 1, wherein the substrate further comprises at least one positioning mark disposed on at least one of the first plane and the second plane.

7. The scan module of claim 6, wherein the positioning mark is a depression, a protrusion, a through hole or a printed pattern.

8. The scan module of claim 1, wherein the laser light source is disposed on the first plane.

9. The scan module of claim 1, wherein the beam shaping unit comprises a lens portion and a frame portion integrally formed.

10. The scan module of claim 1, wherein the galvanometer is a one-dimensional galvanometer or a two-dimensional galvanometer.

11. The scan module of claim 1, wherein the galvanometer is a micro-electromechanical system (MEMS) scanning galvanometer.

12. A three-dimensional sensing device, comprising:

a scanning module according to any one of claims 1 to 11, for emitting a scanning light; and

and the receiving module is positioned at one side of the scanning module and used for receiving a reflected light ray of the scanning light ray reflected by an object to be detected.