CN210625003U - Semiconductor refrigerating sheet assembly convenient to assemble and disassemble - Google Patents
Semiconductor refrigerating sheet assembly convenient to assemble and disassemble Download PDFInfo
- Publication number
- CN210625003U CN210625003U CN201921714618.9U CN201921714618U CN210625003U CN 210625003 U CN210625003 U CN 210625003U CN 201921714618 U CN201921714618 U CN 201921714618U CN 210625003 U CN210625003 U CN 210625003U
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- China
- Prior art keywords
- semiconductor
- assembly
- connector
- base
- fixed slot
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 71
- 238000005057 refrigeration Methods 0.000 claims abstract description 29
- 239000011248 coating agent Substances 0.000 claims description 7
- 239000011247 coating layer Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Abstract
The utility model relates to a refrigeration piece technical field, in particular to semiconductor refrigeration piece subassembly convenient to equipment and dismantlement, including semiconductor subassembly and connector, the connector includes base and upper cover, the upper surface undercut of base forms the fixed slot, two lateral walls that the base is relative dig and are equipped with the connector, the connector is linked together with the fixed slot, the lower surface downwardly extending of upper cover forms the fixed block, fixed block and fixed slot phase-match, semiconductor subassembly and base are connected in the fixed slot through the connecting wire card. The utility model discloses a setting of connector can block the connecting wire and establish, has reduced the installation step of semiconductor refrigeration piece to the connecting wire that can protect the semiconductor refrigeration piece when dismantling does not receive the damage, makes the semiconductor refrigeration piece can dismantle and maintain, the effectual replacement cost that reduces the semiconductor refrigeration piece, and saved the required time of installation semiconductor refrigeration piece.
Description
Technical Field
The utility model relates to a refrigeration piece technical field, in particular to semiconductor refrigeration piece subassembly convenient to equipment and dismantlement.
Background
The semiconductor refrigerating plate, also called thermoelectric refrigerating plate, is a heat pump. Its advantages are no slide part, limited space, high reliability and no pollution of refrigerant. By using the Peltier effect of the semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, and the aim of refrigeration can be fulfilled. The refrigerating technology which generates negative thermal resistance is characterized by no moving parts and higher reliability.
There are following problems among the prior art, semiconductor refrigeration piece on the market now need carry out the connection of connecting wire when installing and dismantling, and the step that the connecting wire is connected is too loaded down with trivial details, and because the connecting wire is thin, the condition of disconnection appears easily in the in-process of connecting, has caused the waste of a large amount of time cost to cause the damage of connecting wire easily when dismantling, make semiconductor refrigeration piece can't carry out the reutilization, need a large amount of replacement costs.
Disclosure of Invention
Therefore, the semiconductor refrigerating sheet assembly convenient to assemble and disassemble is required to be provided, the connecting steps of the connecting lines of the semiconductor refrigerating sheets are reduced through the arrangement of the connector, a large amount of time is effectively saved, the semiconductor refrigerating sheets can be freely disassembled and maintained, and a large amount of replacement cost is saved.
In order to realize the above-mentioned purpose, the utility model provides a semiconductor refrigeration piece subassembly convenient to equipment and dismantlement, including semiconductor subassembly and connector, the connector includes base and upper cover, the upper surface undercut of base forms the fixed slot, two lateral walls that the base is relative dig and are equipped with the connector, the connector is linked together with the fixed slot, the lower surface downwardly extending of upper cover forms the fixed block, fixed block and fixed slot phase-match, the semiconductor subassembly outwards extends there is the connecting wire, semiconductor subassembly and base are connected in the fixed slot through the connecting wire card. The utility model discloses a setting of connector can block the connecting wire and establish, has reduced the installation step of semiconductor refrigeration piece to the connecting wire that can protect the semiconductor refrigeration piece when dismantling does not receive the damage, makes the semiconductor refrigeration piece can dismantle and maintain, the effectual replacement cost that reduces the semiconductor refrigeration piece, and saved the required time of installation semiconductor refrigeration piece.
Furthermore, a guide slope is laid at the joint of the fixing groove and the connecting port. The direction slope plays good guide effect, can let the connecting wire that needs connect get into the base more easily, saves a large amount of time.
Further, the outer wall coating of base has the one deck insulating coating layer, insulating coating layer is rubber insulating coating layer. The insulating coating can prevent the electric leakage of the connector from causing damage to the semiconductor or the internal parts.
Furthermore, anti-skidding teeth are dug in the fixing block and the fixing groove. The antiskid tooth can be fixed the connecting wire, and the prevention is connecting enough to lead to the phenomenon that the connecting wire drops to take place.
Further, the side downwardly extending of fixed block is equipped with the buckle, the lateral wall of fixed slot is inwards sunken to form with buckle assorted draw-in groove, the fixed block is fixed with the fixed slot through buckle and draw-in groove. The clamping groove and the buckle can enable the connector to be more conveniently disassembled and assembled, installation steps of the connector are reduced, and a large amount of installation time is saved.
Furthermore, an upper panel is covered on the upper surface of the semiconductor assembly, and a lower panel is bonded on the lower surface of the semiconductor assembly. Two panels can be effectual protect semiconductor component to make the temperature of refrigeration piece distribute more evenly, prevent the local overheat of refrigeration piece.
Furthermore, the upper cover and the lower cover are both rectangular. The rectangular upper cover and the rectangular lower cover can be assembled better, and the assembly work efficiency is improved.
Furthermore, the semiconductor assembly is rectangular, and the width of the semiconductor assembly is smaller than the width of the upper cover and the width of the lower cover. The semiconductor component is easier to be embedded into the upper cover and the lower cover, and a supporting position is reserved for the supporting buckle, so that the phenomenon that the supporting buckle cannot support due to insufficient force points is prevented.
Furthermore, the upper cover is a rectangular upper cover, and the upper cover is made of PVC plastic. Can be effectual keep apart the electric current, the condition of prevention connecting piece electric leakage takes place, and the protection internals does not receive the damage.
Further, the fixed block is a trapezoidal fixed block with a large upper part and a small lower part. The trapezoidal structure makes fixed block and fixed slot align more easily, has practiced thrift a large amount of time.
Different from the prior art, the technical scheme has the following beneficial effects:
the utility model discloses a setting of connector can block the connecting wire and establish, has reduced the installation step of semiconductor refrigeration piece to the connecting wire that can protect the semiconductor refrigeration piece when dismantling does not receive the damage, makes the semiconductor refrigeration piece can dismantle and maintain, the effectual replacement cost that reduces the semiconductor refrigeration piece, and saved the required time of installation semiconductor refrigeration piece.
Drawings
Fig. 1 is a schematic structural view of a semiconductor refrigerating sheet assembly convenient to assemble and disassemble according to the present invention;
FIG. 2 is a schematic structural view of an upper cover in the embodiment;
FIG. 3 is a schematic structural diagram of a base in an embodiment;
FIG. 4 is a schematic view showing an assembly of the connector according to the embodiment;
fig. 5 is a detailed view of the structure of the connector in the embodiment.
Description of reference numerals:
1. the semiconductor module comprises a semiconductor component, 2, a connector, 201, an upper cover, 202, a base, 203, a fixing block, 204, a fixing groove, 205, a connecting port, 206, a guide slope, 207, an anti-slip tooth, 208, an insulating coating layer, 209, a buckle, 210, a clamping groove, 3, an upper panel, 4, a lower panel, 5 and connecting wires.
Detailed Description
To explain technical contents, structural features, and objects and effects of the technical solutions in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1 to 5, the semiconductor refrigeration sheet assembly convenient to assemble and disassemble of the present embodiment includes a semiconductor assembly 1 and a connector 2, the connector 2 includes a base 202 and an upper cover 201, the base 202 is rectangular, an outer wall of the base 202 is coated with an insulating coating 208, the insulating coating 208 wraps the periphery and the bottom of the base 202, the insulating coating 208 is a rubber insulating coating 208, an upper surface of the base 202 is recessed downward to form a rectangular fixing groove 204, the bottom of the fixing groove 204 is provided with saw-toothed anti-slip teeth 207, two opposite side walls of the base 202 are dug with two connectors 205, the connectors 205 are circular, the two connectors 205 have the same size and height, the connectors 205 are communicated with the fixing groove 204, a guide slope 206 is laid between the connectors 205 and the bottom of the fixing groove 204, the guide slope 206 has an angle of forty-five degrees, so that the guide can be more easily introduced into the inside of the fixing groove 204, thereby simplifying the installation process. The shape of the upper cover 201 is rectangular, the upper cover 201 is made of PVC plastic, the lower surface of the upper cover 201 extends downwards to form a fixing block 203, the fixing block 203 is a trapezoidal fixing block 203 with a large upper part and a small lower part, the fixing block 203 is matched with a fixing groove 204, and the lower surface of the fixing block 203 is provided with anti-skid teeth 207 which are the same as the bottom surface of the fixing groove 204 in a chiseled mode. The inclined plane top downwardly extending of fixed block 203 is equipped with buckle 209, the vertical downward setting of buckle 209, the inside sunken fixed slot 204 that forms and buckle 209 assorted of lateral wall of fixed slot 204, fixed slot 204 is rectangle fixed slot 204, fixed block 203 is fixed with fixed slot 204 through buckle 209 and draw-in groove 210.
In this embodiment, the semiconductor device 1 is a rectangular semiconductor device 1, the upper surface of the semiconductor device 1 is covered with an upper panel 3, the upper panel 3 is a rectangular upper panel 3, the width of the upper panel 3 is greater than that of the semiconductor device 1, a lower panel 4 is adhered to the lower surface of the semiconductor device 1, the lower panel 4 has the same size as the upper panel 3, the upper panel 3 and the lower panel 4 are both made of ceramic materials, two connecting wires 5 extend outwards from the side surface of the semiconductor device 1, and the semiconductor device 1 and the base 202 are clamped in the fixing grooves 204 through the connecting wires 5 for connection.
In specific use, the upper surface of the upper panel 3 is attached to a heat sink, the lower surface of the lower panel 4 is attached to the surface of an electrical appliance to be temperature controlled, the end of a connecting wire 5 extending from the semiconductor component 1 is placed into the fixing groove 204 through the connecting port 205 at one side of the base 202, the connecting wire 5 of the electrical appliance to be connected is placed into the fixing groove 204 through the connecting port 205 at the other side of the base 202, the upper cover 201 is aligned with the fixing groove 204 of the base 202 through the fixing block 203, the upper cover 201 is covered and the buckle 209 is clamped into the clamping groove 210, the anti-skid teeth 207 at the lower surface of the fixing block 203 are engaged with the anti-skid teeth 207 at the bottom of the fixing groove 204, the connecting wire 5 is fixed, the fixing block 203 is separated from the fixing groove 204 during disassembly and maintenance, and then the connecting wire 5 of the semiconductor component 1 and the connecting wire 5 of, the disassembly can be carried out.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrases "comprising … …" or "comprising … …" does not exclude the presence of additional elements in a process, method, article, or terminal that comprises the element. Further, herein, "greater than," "less than," "more than," and the like are understood to exclude the present numbers; the terms "above", "below", "within" and the like are to be understood as including the number.
Although the embodiments have been described, once the basic inventive concept is known, other changes and modifications can be made to the embodiments by those skilled in the art, so that the above embodiments are only examples of the present invention, and not intended to limit the scope of the present invention, and all the modifications of the equivalent structure or equivalent flow path using the contents of the specification and the drawings of the present invention, or directly or indirectly using other related technical fields are also included in the scope of the present invention.
Claims (10)
1. The utility model provides a semiconductor refrigeration piece subassembly convenient to equipment and dismantlement which characterized in that: including semiconductor component and connector, the connector includes base and upper cover, the upper surface undercut of base forms the fixed slot, two lateral walls that the base is relative dig and are equipped with the connector, the connector is linked together with the fixed slot, the lower surface downwardly extending of upper cover forms the fixed block, fixed block and fixed slot phase-match, the outside extension of semiconductor component has the connecting wire, semiconductor component passes through the connecting wire card with the base and establishes and be connected in the fixed slot.
2. A semiconductor chilling plate assembly for easy assembly and disassembly according to claim 1 wherein: and a guide slope is laid at the joint of the fixing groove and the connecting port.
3. A semiconductor chilling plate assembly for easy assembly and disassembly according to claim 1 wherein: the outer wall coating of base has one deck insulating coating layer, insulating coating layer is rubber insulating coating layer.
4. A semiconductor chilling plate assembly for easy assembly and disassembly according to claim 1 wherein: and anti-skidding teeth are dug on the lower surface of the fixing block and the bottom surface of the fixing groove.
5. A semiconductor chilling plate assembly for easy assembly and disassembly according to claim 1 wherein: the side downwardly extending of fixed block is equipped with the buckle, the lateral wall of fixed slot is inwards sunken to form with buckle assorted draw-in groove, the fixed block is fixed through buckle and draw-in groove with the fixed slot.
6. A semiconductor chilling plate assembly for easy assembly and disassembly according to claim 1 wherein: the upper surface of the semiconductor component is covered with an upper panel, and the lower surface of the semiconductor component is bonded with a lower panel.
7. A semiconductor refrigeration wafer assembly for ease of assembly and disassembly as set forth in claim 6 wherein: the upper panel and the lower panel are both rectangular.
8. A semiconductor refrigeration wafer assembly for ease of assembly and disassembly as set forth in claim 6 wherein: the semiconductor assembly is rectangular, and the width of the semiconductor assembly is smaller than the widths of the upper panel and the lower panel.
9. A semiconductor chilling plate assembly for easy assembly and disassembly according to claim 1 wherein: the upper cover is a rectangular upper cover, and the upper cover is made of PVC plastic.
10. A semiconductor chilling plate assembly for easy assembly and disassembly according to claim 1 wherein: the fixed block is a trapezoidal fixed block with a large upper part and a small lower part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921714618.9U CN210625003U (en) | 2019-10-14 | 2019-10-14 | Semiconductor refrigerating sheet assembly convenient to assemble and disassemble |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921714618.9U CN210625003U (en) | 2019-10-14 | 2019-10-14 | Semiconductor refrigerating sheet assembly convenient to assemble and disassemble |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210625003U true CN210625003U (en) | 2020-05-26 |
Family
ID=70759602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921714618.9U Active CN210625003U (en) | 2019-10-14 | 2019-10-14 | Semiconductor refrigerating sheet assembly convenient to assemble and disassemble |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210625003U (en) |
-
2019
- 2019-10-14 CN CN201921714618.9U patent/CN210625003U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A semiconductor refrigeration chip component that is easy to assemble and disassemble Granted publication date: 20200526 Pledgee: Agricultural Bank of China Limited Xiamen Lianqian Branch Pledgor: P&N TECHNOLOGY (XIAMEN) CO.,LTD. Registration number: Y2024980003573 |