CN210609604U - Packaging module with microphone and earphone - Google Patents
Packaging module with microphone and earphone Download PDFInfo
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- CN210609604U CN210609604U CN201921427340.7U CN201921427340U CN210609604U CN 210609604 U CN210609604 U CN 210609604U CN 201921427340 U CN201921427340 U CN 201921427340U CN 210609604 U CN210609604 U CN 210609604U
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Abstract
The utility model discloses a packaging module with a microphone and an earphone, wherein, the packaging module with the microphone comprises a substrate, a microphone, an electronic element unit and a packaging piece; the substrate has a circuit wiring therein; the microphone is arranged on the substrate and is electrically connected with the substrate; a sound receiving hole is formed in the position, corresponding to the microphone, of the substrate; the electronic element unit is arranged on the substrate and is electrically connected with the substrate; the package is connected to the substrate and covers the substrate, the microphone, and the electronic element unit. The utility model discloses technical scheme is through directly setting up microphone and electronic component unit on the base plate for the microphone need not additionally to set up the electricity and connects the line just can realize being connected with the electricity of electronic component unit, has reached and has saved space, and the function of reducing size simultaneously, encapsulates base plate, microphone and electronic component unit through the packaging part, has guaranteed the gas tightness of microphone, has improved the acoustic performance of complete machine.
Description
Technical Field
The utility model relates to an acoustoelectric technology field, in particular to encapsulation module and earphone with microphone.
Background
With the development of markets such as various smart phones, smart bracelets, smart watches, smart sound boxes, TWS (True wireless stereo) earphones and the like, the demand for product functions is more and more, the number of required functional chips is more and more, so that the requirements for device space in the product design stage are more and more strict, the space occupied by the sizes of various devices in the common PCB design is large, and particularly, in the TWS earphone scheme design, devices such as MEMS (micro electro Mechanical Systems ) microphones, acceleration sensors and the like are respectively placed in a very limited space and are connected to a system mainboard through an FPC (flexible circuit board), so that the stacking of the whole product is large, the size is large, and the assembly is complex; meanwhile, the TWS earphone has a high requirement on the acoustic effect, and the MEMS microphone needs to be subjected to airtight sealing treatment, so that the microphone sound leakage can be caused, the acoustic effect of the earphone is influenced, and the experience effect of a user is influenced.
The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a packaging module with microphone aims at solving the big problem of product size, improves the acoustic performance of complete machine.
In order to achieve the above object, the present invention provides a package module with a microphone, which includes a substrate, a microphone, an electronic component unit and a package; the substrate is provided with a circuit wiring therein; the microphone is arranged on the substrate and is electrically connected with the substrate; a sound receiving hole is formed in the position, corresponding to the microphone, of the substrate; the electronic element unit is arranged on the substrate and is electrically connected with the substrate; the package is connected to the substrate and covers the substrate, the microphone, and the electronic element unit.
In an embodiment of the present invention, a surface of the substrate on which the microphone is disposed serves as a front surface, a surface of the substrate opposite to the front surface serves as a back surface, and the sound receiving hole is a through hole penetrating through the front surface and the back surface of the substrate; the package cover is attached to the front side of the substrate.
In an embodiment of the present invention, the microphone has a sound receiving portion located at the bottom, the microphone cover is disposed at the sound receiving hole, and the sound receiving portion corresponds to the sound receiving hole.
The utility model discloses an in the embodiment, the electronic component unit is in including setting up the positive bluetooth chip of base plate, audio frequency processing chip and power management chip, the audio frequency processing chip passes through the base plate with bluetooth chip electricity is connected, the power management chip with the base plate electricity is connected, the microphone passes through the base plate with bluetooth chip electricity is connected.
The utility model discloses an in the embodiment, the electronic component unit is still including setting up connector, acceleration sensor and the audio frequency identification chip at the back of base plate, the audio frequency identification chip passes through the base plate with the chip electricity is handled to the audio frequency, acceleration sensor passes through the base plate with bluetooth chip electricity is connected.
In an embodiment of the present invention, a memory is bonded on the bluetooth chip, and the memory is electrically connected to the substrate through a bonding wire.
In an embodiment of the present invention, the bonding wire is a gold wire or a copper wire.
In an embodiment of the present invention, the microphone patch is mounted on the substrate; and/or the electronic element unit patch is mounted on the substrate.
The utility model also provides an earphone, include casing, loudspeaker and have the encapsulation module of microphone, loudspeaker with the encapsulation module that has the microphone all sets up in the casing, the sound inlet hole has on the casing, the sound inlet hole corresponds the sound inlet hole sets up. The packaging module comprises a substrate, a microphone, an electronic element unit and a packaging piece; the substrate is provided with a circuit wiring therein; the microphone is arranged on the substrate and is electrically connected with the substrate; a sound receiving hole is formed in the position, corresponding to the microphone, of the substrate; the electronic element unit is arranged on the substrate and is electrically connected with the substrate; the package is connected to the substrate and covers the substrate, the microphone, and the electronic element unit.
In an embodiment of the present invention, the package module with the microphone is fixed to the housing by a buckle.
The utility model discloses technical scheme is through directly setting up microphone and electronic component unit on the base plate for the microphone need not additionally to set up the electricity and connects the line just can realize being connected with the electricity of electronic component unit, has reached and has saved space, and the function of reducing size simultaneously, encapsulates base plate, microphone and electronic component unit through the packaging part, has guaranteed the gas tightness of microphone, has improved the acoustic performance of complete machine.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of a package module with a microphone according to the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
110 | |
| 200 | Microphone (CN) | 310 | Bluetooth |
| 320 | |
330 | |
| 340 | Audio |
350 | Connector with a |
| 360 | |
370 | |
| 380 | |
400 | Package member |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a encapsulation module with microphone.
In the embodiment of the present invention, as shown in fig. 1, the package module with a microphone includes a substrate 100, a microphone 200, an electronic component unit (not shown), and a package 400; the substrate 100 has circuit wiring (not shown) therein; the microphone 200 is disposed on the substrate 100 and electrically connected to the substrate 100; a sound receiving hole 110 is arranged at the position of the substrate 100 corresponding to the microphone 200, and the sound receiving hole 110 is communicated with the microphone 200 and the outside; the electronic element unit is arranged on the substrate 100 and electrically connected with the substrate 100; the package 400 is connected to the substrate 100, and covers the substrate 100, the microphone 200, and the electronic element unit.
The microphone 200 is directly disposed on the substrate 100 to electrically connect the microphone 200 and the substrate 100, and further electrically connect the microphone 200 and the electronic component unit, so that the microphone 200 is electrically connected without an additional electrical connection wire, the mounting space of the microphone 200 is saved, and the overall size of the product is reduced.
The microphone 200 and the electronic element unit are arranged on the substrate 100, and then packaged by the package 400, so that the microphone 200 and the electronic element unit are protected in a sealed manner, the air tightness of the microphone 200 is ensured, and the acoustic performance of the whole machine is improved.
It can be understood that the microphone 200 is a structure for receiving external sound, and the substrate 100 is provided with a sound receiving hole 110 corresponding to the position of the microphone 200, so that the microphone 200 can smoothly receive sound from the outside, thereby implementing the function of the microphone 200 of the package module.
In practical applications, the specific position of the sound receiving hole 110 may be determined according to practical situations, as long as it is ensured that the microphone 200 can be communicated with the outside, for example, the sound receiving hole may be disposed in the middle of the substrate 100 and may also be disposed at the side of the substrate 100. in an embodiment of the present invention, the sound receiving hole 110 is preferably disposed at the side of the substrate 100 in consideration of the reasonableness of the position layout of the electronic component unit.
The specific packaging material of the package 400 may be determined according to the actual situation, such as a plastic packaging material, a silicone packaging material, or a resin packaging material.
The utility model discloses technical scheme is through directly setting up microphone 200 and electronic component unit on base plate 100 for microphone 200 need not additionally to set up the electricity and just can realize being connected with the electricity of electronic component unit, has reached and has saved space, and the function of reducing size simultaneously, passes through packaging part 400 encapsulation with base plate 100, microphone 200 and electronic component unit, has guaranteed microphone 200's gas tightness, has improved the acoustic performance of complete machine.
Further, referring to fig. 1, a side of the substrate 100 where the microphone 200 is disposed is a front side, a side of the substrate 100 opposite to the front side is a back side, and the sound-absorbing hole 110 is a through hole penetrating through the front side and the back side of the substrate 100; the package 400 is attached to the front surface of the substrate 100. The sound receiving hole 110 is formed through the front and back surfaces of the substrate 100, so that the microphone 200 can smoothly receive external sounds through the sound receiving hole 110, thereby implementing functions performed by the microphone 200, such as voice control, voice call, and the like. The front surface of the substrate 100 is covered by the package 400 so that the microphone 200 is packaged in the package 400, ensuring the airtightness of the microphone 200.
Further, referring to fig. 1, the microphone 200 has a sound-receiving portion (not shown) at the bottom, and the microphone 200 is covered at the sound-receiving hole 110, the sound-receiving portion being disposed corresponding to the sound-receiving hole 110. At this time, the side of the microphone 200 facing the substrate 100 is provided with a sound receiving portion corresponding to the sound receiving hole 110, so that all the sound entering from the sound receiving hole 110 can be received by the sound receiving portion, and the accuracy and the integrity of sound receiving of the microphone 200 are improved.
Further, referring to fig. 1, the electronic component unit includes a bluetooth chip 310, an audio processing chip 320, and a power management chip 330 disposed on the front surface of the substrate 100, and an audio recognition chip 340 disposed on the back surface of the substrate 100; the audio processing chip 320 is electrically connected to the bluetooth chip 310 through the substrate 100, the audio recognition chip 340 is electrically connected to the audio processing chip 320 through the substrate 100, the power management chip 330 is electrically connected to the substrate 100, and the microphone 200 is electrically connected to the bluetooth chip 310 through the substrate 100. At this time, the bluetooth chip 310 is equivalent to a main controller in the package module, the audio recognition chip 340 is used for recognizing external sounds, then transmitting recognized audio signals to the audio processing chip 320, the audio processing chip 320 processes the received audio signals, and sends the processed audio signals to the bluetooth chip 310, and the bluetooth chip 310 sends corresponding control signals according to the processed audio signals.
The power management chip 330 mainly manages power, such as turning on/off. The microphone 200 is electrically connected with the bluetooth chip 310, the microphone 200 transmits the received external sound to the bluetooth chip 310, and the bluetooth chip 310 transmits the sound to other receiving terminals through other corresponding components, so as to implement a voice communication function.
Further, referring to fig. 1, the electronic component unit further includes a connector 350 and an acceleration sensor 360 disposed on the rear surface of the substrate 100, and the acceleration sensor 360 is electrically connected to the bluetooth chip 310 through the substrate 100. The connector 350 functions as a plug and a receptacle. The acceleration sensor 360 is mainly used to detect the acceleration of the motion of the package module, and the acceleration sensor 360 can detect the number of steps of a user using the package module.
Further, referring to fig. 1, a memory 370 is adhered to the bluetooth chip 310, and the memory 370 is electrically connected to the substrate 100 through a bonding wire 380. The memory 370 is mainly used for storing data, and in practical applications, the memory 370 is preferably a flash chip, and the flash chip can rapidly store and erase data. The bonding wire 380 may be a gold wire or a copper wire.
In an embodiment of the present invention, referring to fig. 1, the microphone 200 is mounted on the substrate 100. The microphone 200 is mounted and fixed to the substrate 100 by a Surface Mount Technology (SMT) to achieve electrical connection between the microphone 200 and the substrate 100.
In an embodiment of the present invention, referring to fig. 1, the electronic component unit is mounted on the substrate 100. The electronic component unit is mounted and fixed on the substrate 100 by a Surface Mount Technology (SMT) to realize electrical connection between the electronic component unit and the substrate 100, and thus, electrical connection between each component.
The utility model discloses still provide an earphone, this earphone involucrum body, loudspeaker and the encapsulation module that has the microphone, this encapsulation module that has the microphone's concrete structure refers to above-mentioned embodiment, because this earphone has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, no longer gives unnecessary details one by one here. Wherein, loudspeaker and the encapsulation module that has the microphone all set up in the casing, have the sound inlet on this casing, and this sound receiving hole 110 corresponds the sound inlet setting for microphone 200 can receive external sound smoothly.
Furthermore, the packaging module with the microphone is fixed with the shell in a buckling mode, and disassembly and assembly are facilitated.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. A packaged module having a microphone, comprising:
a substrate having circuit wiring therein;
the microphone is arranged on the substrate and is electrically connected with the substrate; a sound receiving hole is formed in the position, corresponding to the microphone, of the substrate;
an electronic element unit disposed on the substrate and electrically connected to the substrate; and
a package connected to the substrate and covering the substrate, the microphone, and the electronic element unit.
2. The package module with a microphone according to claim 1, wherein the substrate has a face on which the microphone is disposed as a front face, and a face of the substrate opposite to the front face as a back face, and the sound-absorbing hole is a through hole penetrating through the front face and the back face of the substrate; the package cover is attached to the front side of the substrate.
3. The package module with a microphone according to claim 2, wherein the microphone has a sound-collecting portion at a bottom, the microphone cover is disposed at the sound-collecting hole, and the sound-collecting portion is disposed corresponding to the sound-collecting hole.
4. The package module with a microphone according to claim 2, wherein the electronic component unit includes a bluetooth chip, an audio processing chip, and a power management chip disposed on a front surface of the substrate, the audio processing chip is electrically connected to the bluetooth chip through the substrate, the power management chip is electrically connected to the substrate, and the microphone is electrically connected to the bluetooth chip through the substrate.
5. The package module with a microphone according to claim 4, wherein the electronic element unit further includes a connector, an acceleration sensor, and an audio recognition chip provided on a back surface of the substrate, the audio recognition chip being electrically connected to the audio processing chip through the substrate, the acceleration sensor being electrically connected to the Bluetooth chip through the substrate.
6. The package module with a microphone according to claim 4, wherein a memory is bonded to the Bluetooth chip, and the memory is electrically connected to the substrate through a bonding wire.
7. The package module with microphone of claim 6, wherein the bonding wires are gold or copper wires.
8. The package module with a microphone of claim 1, wherein the microphone patch is mounted to the substrate; and/or the electronic element unit patch is mounted on the substrate.
9. An earphone, comprising a housing, a speaker and the packaging module with the microphone according to any one of claims 1 to 8, wherein the speaker and the packaging module with the microphone are both disposed in the housing, and the housing has a sound inlet hole corresponding to the sound inlet hole.
10. The headset of claim 9, wherein the packaging module with the microphone is snap-fit to the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921427340.7U CN210609604U (en) | 2019-08-29 | 2019-08-29 | Packaging module with microphone and earphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921427340.7U CN210609604U (en) | 2019-08-29 | 2019-08-29 | Packaging module with microphone and earphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210609604U true CN210609604U (en) | 2020-05-22 |
Family
ID=70693338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921427340.7U Active CN210609604U (en) | 2019-08-29 | 2019-08-29 | Packaging module with microphone and earphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210609604U (en) |
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2019
- 2019-08-29 CN CN201921427340.7U patent/CN210609604U/en active Active
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