CN210607621U

CN210607621U - Microwave detection module

Info

Publication number: CN210607621U
Application number: CN201921997907.4U
Authority: CN
Inventors: 邹高迪; 邹新
Original assignee: Gaodi Zou
Current assignee: Gaodi Zou
Priority date: 2019-11-18
Filing date: 2019-11-18
Publication date: 2020-05-22
Anticipated expiration: 2029-11-18

Abstract

The utility model provides a microwave detection module, wherein microwave detection module includes a radiation source base plate and a reference foundation plate, wherein the radiation source base plate is provided with a first copper layer and a second copper layer that covers with two-sided copper-clad structure, wherein the reference foundation plate is provided with a copper layer that covers, wherein the second copper layer that covers is electrically conducted and extends to the lateral margin of radiation source base plate, wherein in the state that the second copper layer that covers closely pastes to the copper layer, the second copper layer that covers in the lateral margin of radiation source base plate by the electrically conductive fixed in the copper layer, avoided in the first copper layer that covers with the process step that the surface treatment process formed the anti-oxidant metal protection layer between the copper layer that covers, be favorable to reducing the dielectric loss ground of radiation gap and improve the quality factor and the transmission and reception efficiency of microwave detection module, improved the uniformity of radiation gap simultaneously, the impedance matching of the microwave detection module in batch production is facilitated.

Description

Microwave detection module

Technical Field

The utility model relates to an antenna field, in particular to microwave detection module.

Background

Electronic technology is an important mark of recent scientific development, and develops rapidly since birth, corresponding electronic products are involved in various fields of life and work, and a circuit board is used as a support body of electronic components in the electronic products and used for forming connection of a preset circuit between the electronic components, exists in almost every electronic product, is a key electronic interconnecting piece of the electronic products, and has a mature and diversified process system formed in the manufacturing process. The microwave detector is an electronic module for realizing detection and feedback of a moving object by utilizing electromagnetic waves based on the Doppler effect principle, and the structure and the manufacturing process of a corresponding circuit board are indispensable in the structure and the manufacturing process of the microwave detector.

Since electronic products operating using electromagnetic waves may involve national and personal information security and information order, corresponding standards and legal provisions are made internationally and in different countries and regions for electronic products operating using electromagnetic waves, an unlicensed ism (industrial scientific medical) frequency band, as defined by ITU-R (ITU radio communication Sector) for use by organizations such as industry, science and medicine, is based on a generation mechanism of electromagnetic waves, in order to enable the microwave detector to normally operate under corresponding standards and legal regulations, in the manufacturing process of the microwave detector, the manufacturing process of the corresponding circuit board must be capable of making the microwave detector satisfy a certain impedance matching, and has a better consistency to further make the corresponding microwave detector suitable for mass production.

However, although the manufacturing process of the existing circuit board is well-established, the process steps are numerous, and for the microwave detector, some essential process steps in the manufacturing process of the existing circuit board are just the process steps which limit the impedance matching and consistency of the microwave detector. Specifically, in the conventional circuit board manufacturing process, under the combined consideration of material cost and electrical performance, copper is mainly used as a conductive substrate, but copper is easily oxidized when exposed to air, and particularly in the case of a double-sided copper-clad circuit board, a second-sided copper-clad layer is oxidized after a first reflow process, so that a surface treatment process becomes an essential process step in the circuit board manufacturing process, such as a surface treatment process of tin spraying, tin depositing, silver depositing, electroless gold depositing, electrogilding, and the like, to protect a corresponding conductive substrate from oxidation and maintain conductivity and solderability of the surface of the corresponding conductive substrate, and in the case of a microwave detector, such as the microwave detector adopting a flat antenna structure, wherein the microwave detector includes a radiation source provided as a copper-clad layer, and a reference ground also provided as a copper-clad layer and spaced from the radiation source, wherein a radiation gap of the microwave detector is formed between the radiation source and the reference ground, and the radiation gap directly affects the microwave detector. Based on the existing circuit board manufacturing process, a copper-clad layer is integrated in a circuit board substrate by adopting a laminated board process and is used as a reference ground of the microwave detector, so that the radiation gap of the microwave detector has better consistency, and the microwave detector can meet corresponding impedance matching based on the radiation gap with higher consistency in batch production. However, the cost of the laminated plate process is high, and the existing microwave detector adopting the flat antenna structure mainly adopts a multi-substrate structure scheme with relatively reasonable and low cost.

Specifically, as shown in fig. 1, the microwave detector of the prior multi-substrate structure includes a radiation source substrate 10P and a reference ground substrate 20P, wherein the radiation source substrate 10P has two copper-clad layers 101P in a double-sided copper-clad structure, wherein the ground reference substrate 20P is provided with a copper-clad layer 201P, wherein one of the copper-clad layers 101P of the radiation source substrate 10P is fixed to the copper-clad layer 201P of the ground reference substrate 20P by a reflow process, the microwave detector uses the other copper-clad layer 101P of the radiation source substrate 10P as a radiation source, and uses the copper-clad layer 201P of the ground reference substrate 20P as a ground reference, wherein a radiation gap of the microwave detector is formed between the copper clad layer 101P of the radiation source substrate 10P as the radiation source and the copper clad layer 201P of the ground reference substrate 20P as the ground reference. As can be seen from the foregoing, the surface treatment process is an essential process step in the conventional circuit board manufacturing process, that is, at least one surface treatment layer 30P is attached to each of the two copper-clad layers 101P of the radiation source substrate 10P and the copper-clad layer of the reference ground substrate 20P, including but not limited to a tin layer, a nickel layer, a silver layer, a gold layer, and other metal layers, so that the copper clad layer 101P of the radiation source substrate 10P opposite to the radiation source can be conductively soldered and protected from oxidation with the copper clad layer 201P of the reference ground substrate 20P, however, a conductive solder layer 40P is formed between the copper clad layer 101P of the radiation source substrate 10P opposite to the radiation source and the copper clad layer 201P of the reference ground substrate 20P, i.e., the conductive solder layer 40P is simultaneously formed in the radiation gap of the microwave detector. It can be understood that, based on the cost consideration of the existing circuit board surface treatment process, the surface treatment layer 30P of the present microwave detector is mainly a tin layer, or a gold-deposited layer on the basis of a nickel-plated layer, so as to improve the conductivity of the surface treatment layer 30P while satisfying the requirements of oxidation resistance and corrosion resistance of the surface treatment layer 30P by using a gold-deposited layer, and is isolated between the copper-clad layer and the gold-deposited layer by a nickel layer so as to avoid the corrosion reaction between copper and gold, wherein nickel is a metal having ferromagnetism and has a large loss of electric field energy when being in the electric field of the radiation gap, that is, the material of the conductive welding layer 40P has a large dielectric loss relative to copper, so that the conductive welding layer 40P becomes a main factor affecting the microwave detector in the production process of the microwave detector, and the conductive welding layer 40P is formed as a result of at least two surface treatment processes and one welding process, uniformity of thickness and dielectric loss thereof is difficult to be secured and uniformity of impedance matching of the microwave detector cannot be secured in mass production of the microwave detector.

Therefore, in fact, based on the existing manufacturing process of the microwave detector adopting the multi-substrate structure scheme, in order to satisfy the corresponding impedance matching and enable the microwave detector to normally work under the corresponding standard and legal rules, additional testing and manual adjustment of the circuit structure of each produced microwave detector are often required to satisfy the corresponding impedance matching, even if the properties of the formed conductive welding layer 30P are fixed and not adjustable, the consistency of the performance parameters of each microwave detector after being manually adjusted to satisfy the corresponding impedance matching requirements is still difficult to guarantee, which is particularly shown in that the consistency of the radiation receiving efficiency, the working frequency and the quality factor of each microwave detector is difficult to guarantee, and the conductive welding layer 40P with a certain thickness and high dielectric loss also increases the dielectric loss of the radiation gap, therefore, the quality factor of the microwave detector manufactured based on the existing manufacturing process of the microwave detector adopting the multi-substrate structure scheme is generally low, and the corresponding anti-interference performance is difficult to guarantee.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a microwave detection module, wherein microwave detection module has a radiation gap, wherein microwave detection module's manufacturing method when adopting many base plate structure schemes, avoided in the radiation gap forms anti-oxidant metal protection layer, is favorable to reducing radiation gap's dielectric loss ground improves microwave detection module quality factor (being Q value) and transmission and reception efficiency under operating condition.

An object of the utility model is to provide a microwave detection module, wherein microwave detection module's manufacturing method has avoided in the radiation gap forms anti-oxidant metal protection layer, has improved microwave detection module quality factor and emission receiving efficiency under operating condition are favorable to improving microwave detection module's gain and sensitivity and with the constriction microwave detection module's the mode of work frequency point bandwidth improves microwave detection module's interference killing feature.

Another object of the present invention is to provide a microwave detecting module, wherein the manufacturing method of the microwave detecting module is different from the manufacturing process of the existing circuit board, so as to avoid the process step of forming the anti-oxidation metal protection layer by the surface treatment process, and simplify the manufacturing method of the microwave detecting module.

Another object of the present invention is to provide a microwave detection module, wherein the manufacturing method of the microwave detection module avoids the process step of forming the anti-oxidation metal protection layer by the surface treatment process while adopting the multi-substrate structure scheme, and further reduces the manufacturing cost of the microwave detection module.

Another object of the present invention is to provide a microwave detection module, wherein the microwave detection module includes a reference ground substrate and a radiation source substrate, wherein the radiation source substrate adopts two-sided copper-clad structure to be provided with two and covers the copper layer, wherein the reference ground substrate is provided with one and covers the copper layer, wherein through with the reference ground substrate cover the copper layer with one of them of radiation source substrate cover the copper layer and electrically conduct fixed mode mutually, in another of radiation source substrate cover the copper layer with the reference ground substrate cover and form between the copper layer the radiation gap is formed with the manufacturing microwave detection module.

Another object of the present invention is to provide a microwave detecting module, wherein through will the ground reference base plate cover the copper layer with one of them of radiation source base plate cover the copper layer with the direct fixed mode mutually of naked copper technology, avoided in the radiation gap forms anti-oxidant metal protection layer.

Another object of the present invention is to provide a microwave detection module, wherein through will the ground reference base plate cover the copper layer with one of them of radiation source base plate cover the copper layer with the direct fixed mode mutually of naked copper technology, improved the uniformity in radiation gap is favorable to the impedance matching of microwave detection module.

Another object of the utility model is to provide a microwave detection module, wherein through will the ground reference base plate cover the copper layer with one of them of radiation source base plate cover the copper layer with the direct fixed mode mutually of naked copper technology, reduced the dielectric loss in radiation gap is favorable to improving the quality factor of microwave detection module under operating condition and with the constriction the mode of the frequency bandwidth is frequently carried out in the work of microwave detection module improves the anti-interference performance of microwave detection module.

Another object of the present invention is to provide a microwave detection module, wherein it is different from the manufacturing process of the existing circuit board, the manufacturing method of the microwave detection module avoids adopting the surface treatment process in the radiation source substrate cover the copper layer with refer to the ground substrate the copper layer forms the process step of the anti-oxidation metal protection layer, then refer to the ground substrate cover the copper layer with one of them of radiation source substrate the copper layer is allowed to be directly fixed mutually with the bare copper process.

Another object of the present invention is to provide a microwave detection module, wherein through the OSP process in the radiation source substrate the copper-clad layer with the reference ground substrate the copper-clad layer forms the mode of the OSP protective layer, is favorable to be in the extension keeps corresponding in the cycle of the manufacturing method of the microwave detection module the electric conductive property of the copper-clad layer.

Another object of the present invention is to provide a microwave detection module, wherein through the OSP process in the radiation source substrate the copper-clad layer with the reference ground substrate the copper-clad layer forms the mode of the OSP protective layer the extension keeps corresponding in the cycle of the manufacturing method of the microwave detection module the conductive performance of the copper-clad layer is the same as the conductive performance of the radiation gap formed oxidation-resistant metal protective layer.

Another object of the present invention is to provide a microwave detection module, wherein one of the radiation source substrates covers the copper layer and is fixed in with the mode of side spot welding cover the copper layer, in order to be favorable to maintaining the correspondence of naked copper technology or OSP technology in the cycle of the manufacturing method of the microwave detection module cover the copper layer and not be oxidized, thereby ensure the correspondence of naked copper technology or OSP technology cover the electric conductive property on copper layer.

Another object of the present invention is to provide a microwave detection module, wherein one of the radiation source substrates covers the copper layer and is fixed in with the mode of side spot welding the copper layer is covered to the reference ground substrate, is favorable to maintaining the correspondence of naked copper technology or OSP technology in the period of the manufacturing method of the microwave detection module it is not oxidized to cover the copper layer, then is different from the manufacturing process of the current circuit board, the manufacturing method of the microwave detection module allows to avoid forming the process step of the anti-oxidant metal protection layer through the surface treatment process.

Another object of the present invention is to provide a microwave detection module, wherein the manufacturing method of the microwave detection module adopts the laser welding process to be in one of the radiation source substrates cover the copper layer with the mode welded fastening of side spot welding in the reference ground substrate cover the copper layer, in order to be favorable to shortening the period of the manufacturing method of the microwave detection module, thereby being favorable to maintaining the correspondence of bare copper process or OSP process in the period of the manufacturing method of the microwave detection module the copper layer is not oxidized.

Another object of the utility model is to provide a microwave detection module, wherein the radiation source base plate with the ground reference base plate cover that the copper layer is fixed mutually and cover the copper layer and be electrically conductive extend to the lateral margin of radiation source base plate, so that this of radiation source base plate cover the copper layer can with the ground reference base plate cover under the copper layer attached state mutually, in the lateral margin of radiation source base plate will with the mode of side spot welding this of radiation source base plate covers the copper layer and is fixed in the ground reference base plate cover the copper layer, thereby be favorable to reducing the dielectric loss in radiation gap and improvement the uniformity in radiation gap.

Another object of the present invention is to provide a microwave detection module, wherein the radiation source substrate and the ground reference substrate cover that the copper layer is fixed mutually and is covered the copper layer and is extended to with the mode of metallization via hole is electrically conductive the lateral margin of radiation source substrate.

Another object of the utility model is to provide a microwave detection module, wherein one of them of radiation source base plate cover the copper layer and be fixed in with the mode of side spot welding cover the copper layer with reference ground base plate, another of radiation source base plate the size that covers the copper layer is set up to be less than the radiation source base plate size, in order to reduce in the lateral margin of radiation source base plate with the solder joint that the mode of side spot welding formed with another of radiation source base plate cover the probability that the copper layer directly switched on.

Another object of the utility model is to provide a microwave detection module, wherein will the reference ground base plate cover the copper layer with one of them of radiation source base plate cover the copper layer electrically conductive fixed and form mutually behind the microwave detection module, further in the reference ground base plate cover the exposed part on copper layer with another of radiation source base plate cover the copper layer and set up a protection film, in order to ensure microwave detection's anti-oxidant and anti-corrosion performance.

According to an aspect of the utility model, the utility model provides a microwave detection module, microwave detection module includes:

a radiation source substrate, wherein the radiation source substrate has a first side and a second side, wherein the first side of the radiation source substrate is provided with a first copper-clad layer, and the second side of the radiation source substrate is provided with a second copper-clad layer, wherein the first copper-clad layer is provided with a feeding point, wherein the feeding point is arranged offset from a physical center point of the first copper-clad layer; and

a reference ground substrate, wherein the reference ground substrate has a first side and a second side, wherein the first side of the reference ground substrate is provided with a copper-clad layer, wherein the second copper-clad layer is conductively extended and fixed to a side edge of the radiation source substrate, wherein in a state where the second copper-clad layer is attached to the copper-clad layer of the reference ground substrate, the second copper-clad layer is conductively fixed to the copper-clad layer of the reference ground substrate at the side edge of the radiation source substrate, wherein the feeding point passes through the radiation source substrate, the second copper-clad layer, the copper-clad layer of the reference ground substrate and the reference ground substrate are conductively extended to the second side of the reference ground substrate, wherein the first copper-clad layer of the radiation source substrate is conductively connected to the copper-clad layer of the reference ground substrate.

In an embodiment, the second copper-clad layer has a plurality of side pads extending along the side edge of the radiation source substrate, wherein the side pads are fixed to the side edge of the radiation source substrate and are spot-welded to the copper-clad layer of the ground reference substrate.

In an embodiment, the side pads are arranged to be formed and fixed in the form of metallized vias to the side edges of the radiation source substrate to extend conductively from the second copper clad layer.

In an embodiment, a dimension of the first copper clad layer of the radiation source substrate in a direction corresponding to the side edge of the radiation source substrate on which the side pad is formed is set smaller than a dimension of the radiation source substrate.

In one embodiment, a zero potential line passing through the physical center point of the first copper-clad layer and perpendicular to the connection line of the physical center point of the first copper-clad layer and the feeding point passes through the side pad.

In one embodiment, the side pads are formed between the first copper-clad layer and the second copper-clad layer in the form of metalized vias and are conductively connected to the first copper-clad layer.

In one embodiment, the first copper-clad layer of the radiation source substrate is provided with a grounding point, wherein the grounding point is in the form of a metalized via and extends to the second copper-clad layer of the radiation source substrate to be electrically connected with the copper-clad layer of the reference ground substrate.

In an embodiment, the grounding point is disposed at a physical center point of the first copper-clad layer of the radiation source substrate.

In an embodiment, the second copper-clad layer of the radiation source substrate and the copper-clad layer of the reference ground substrate are directly attached in a bare copper manner, wherein the first copper-clad layer of the radiation source substrate and the bare copper-clad layer of the reference ground substrate are respectively covered with a protective film.

In one embodiment, the first copper-clad layer and the second copper-clad layer and the copper-clad layer of the reference ground substrate are respectively covered with an OSP protective layer, wherein the OSP protective layer of the first copper-clad layer of the radiation source substrate and the OSP protective layer of the exposed copper-clad layer of the reference ground substrate are respectively covered with a protective film.

Drawings

Fig. 1 is a schematic side sectional view of a microwave detector manufactured in a multi-substrate structure scheme according to a conventional circuit board manufacturing process.

Fig. 2 is a schematic perspective view of a microwave detection module according to an embodiment of the present invention.

Fig. 3 is a schematic side view and cross-sectional view of the microwave detection module according to the above embodiment of the present invention.

Fig. 4 is an exploded view of the microwave detection module according to the above embodiment of the present invention.

Fig. 5 is a partially exploded and enlarged schematic view of the microwave detection module according to the above embodiment of the present invention.

Fig. 6 is a schematic perspective view of the microwave detection module according to a modified embodiment of the above-mentioned embodiments of the present invention.

Fig. 7 is a schematic perspective view of the microwave detection module according to a modified embodiment of the above-mentioned embodiment of the present invention.

Fig. 8 is a schematic side cross-sectional view of the microwave detection module according to a modified embodiment of the above-mentioned embodiment of the present invention.

Fig. 9 is an exploded view of the microwave detection module according to the above modified embodiment of the present invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in a generic and descriptive sense only and not for purposes of limitation, as the terms are used in the description to indicate that the referenced device or element must have the specified orientation, be constructed and operated in the specified orientation, and not for the purposes of limitation.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

Referring to fig. 2 and 3 of the specification drawings of the present invention, according to the present invention, a structure of a microwave detection module is illustrated, wherein fig. 2 illustrates a three-dimensional structure of the microwave detection module, and fig. 3 illustrates a side-view sectional structure of the microwave detection module. Specifically, the microwave detection module adopts a multi-substrate structure scheme, wherein the microwave detection module comprises a radiation source substrate 10 and a reference ground substrate 20, wherein the radiation source substrate 10 has a first side 101 and a second side 102, wherein the radiation source substrate 10 is provided with a first copper-clad layer 11 and a second copper-clad layer 12 on the first side 101 and the second side 102 respectively in a double-sided copper-clad structure, wherein the reference ground substrate 20 has a first side 201 and a second side 202, wherein the reference ground substrate 20 is provided with a copper-clad layer 21 on the first side 201, wherein the second copper-clad layer 12 of the radiation source substrate 10 is conductively fixed on the copper-clad layer 21 of the reference ground substrate 20, so as to form a radiation source of the microwave detection module on the first copper-clad layer 11 of the radiation source substrate 10 and form a reference ground of the microwave detection module on the copper-clad layer 21 of the reference ground substrate 20, and a radiation gap of the microwave detection module is formed between the first copper-clad layer 11 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20, wherein the first copper-clad layer 11 of the radiation source substrate 10 is provided with a feeding point 110, wherein the feeding point 110 is disposed offset from a physical center point of the first copper-clad layer 11 and extends from the first copper-clad layer 11 of the radiation source substrate 10 through the radiation source substrate 10, from the second copper-clad layer 12 of the radiation source substrate 10, from the copper-clad layer 21 of the reference ground substrate 20 and from the reference ground substrate 20 to the second side 202 of the reference ground substrate 20 in an electrically conductive manner, such that when the first copper-clad layer 11 of the radiation source substrate 10 is fed with an alternating electrical signal having a corresponding frequency from the second side 202 of the reference ground substrate 20 through the feeding point 110, the first copper-clad layer 11 transmits electromagnetic beams corresponding to respective frequencies in response to the copper-clad layer 21 of the reference ground substrate 20.

In particular, in this embodiment of the present invention, unlike the existing circuit board manufacturing process, the first copper-clad layer 11 and the second copper-clad layer 12 of the radiation source substrate 10, and the copper-clad layer 21 of the reference ground substrate 20 are not subjected to a surface treatment process step for forming an oxidation-resistant metal protection layer, which simplifies the process steps and facilitates cost reduction, and accordingly, the second copper-clad layer 12 of the radiation source substrate 10 is prevented from forming an oxidation-resistant metal protection layer during the conductive fixing process of the copper-clad layer 21 of the reference ground substrate 20, thereby facilitating reduction of dielectric loss between the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 and ensuring dielectric loss between the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 during the mass production of the microwave detection module The nature that causes, be in this embodiment of the utility model, define in radiation source base plate 10 first cover copper layer 11 with reference ground base plate 20 cover between the copper layer 21 the radiation gap is not formed with anti-oxidant metal protection layer, is favorable to reducing the dielectric loss ground in radiation gap improves the quality factor and the transmission and reception efficiency of microwave detection module under operating condition to be favorable to with the narrowing the mode of the frequency point bandwidth of the work of microwave detection module improves the interference killing feature of microwave detection module, improved simultaneously the uniformity in radiation gap is favorable to batch production the impedance matching of microwave detection module.

That is, in this embodiment of the present invention, the second copper-clad layer 12 of the radiation source substrate 10 does not form an additional oxidation-resistant metal protection layer in the radiation gap defined between the first copper-clad layer 11 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 during the conductive fixing process of the copper-clad layer 21 of the reference ground substrate 20, thereby being beneficial to maintaining the thickness of the radiation gap of the microwave detection module and the stability of the medium in the radiation gap, i.e. reducing the dielectric loss of the radiation gap and maintaining the consistency of the dielectric loss of the radiation gap, during the batch manufacturing process of the microwave detection module.

Specifically, in this embodiment of the present invention, the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 are directly fixed to each other in a bare copper process, including but not limited to, fixing by spot welding and mechanical fixing of a mechanical clamping structure, such as screw fixing, to achieve fixing between the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 in a bare copper process, that is, the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 are fixed together in a state of direct attached contact without a surface treatment process step for forming an oxidation-resistant metal protection layer, wherein the leveling property and good conductive property of the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 based on a bare copper state, the thickness of the radiation gap can be reduced and stably maintained, and the dielectric loss of a medium in the radiation gap can be reduced and stably maintained, so that the dielectric loss of the radiation gap is reduced, the consistency of the dielectric loss of the radiation gap is maintained, namely, the consistency of impedance matching of the microwave detection module is improved, the quality factor of the microwave detection module in a working state is improved, and the anti-interference performance of the microwave detection module is improved in a mode of narrowing the working frequency point bandwidth of the microwave detection module.

With further reference to fig. 4 and 5 of the drawings accompanying the present application, the microwave detection module according to the above embodiment of the present invention is illustrated, wherein fig. 4 and 5 illustrate the decomposition structure and partial decomposition structure of the microwave detection module, respectively, wherein the second copper-clad layer 12 of the radiation source substrate 10 is welded and fixed to the copper-clad layer 21 of the reference ground substrate 20 in a side spot welding manner, such that the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 can be fixed together in a state of direct attached contact, and in the process of welding and fixing the second copper-clad layer 12 of the radiation source substrate 10 to the copper-clad layer 21 of the reference ground substrate 20, a reflow process of integral heating is allowed to be avoided, and the second copper-clad layer 12 of the radiation source substrate 10 and the reference copper-clad layer 21 directly fixed by a bare copper process are maintained The copper-clad layer 21 of the ground reference substrate 20 is not oxidized, that is, the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20, which are fixed in the bare copper process, are not oxidized during the production cycle of the microwave detection module. Unlike the existing circuit board manufacturing process, in the process of solder-fixing the second copper-clad layer 12 of the radiation source substrate 10 to the copper-clad layer 21 of the reference ground substrate 20, the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 are not oxidized and are allowed to be directly fixed in a bare copper process, thereby allowing process steps of forming an oxidation-resistant metal protection layer by a surface treatment process to be avoided.

Specifically, in this embodiment of the present invention, the second copper-clad layer 12 of the radiation source substrate 10 is conductively extended and fixed at the side edge 103 of the radiation source substrate 10, so that the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 can be welded to the side edge 103 of the radiation source substrate 10 by spot welding in a state of direct contact, so as to fix the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 to the copper-clad layer 21 of the reference ground substrate 20.

It is worth mentioning that, in a state where the second copper clad layer 12 of the radiation source substrate 10 and the copper clad layer 21 of the reference ground substrate 20 are directly attached and contacted, since the side edge 103 of the radiation source substrate 10 is welded to the second copper coating layer 12 of the radiation source substrate 10 and the copper coating layer 21 of the reference ground substrate 20 by spot welding, it is avoided that the first and second copper coating layers 11 and 12 of the radiation source substrate 10 and the copper coating layer 21 of the reference ground substrate 20 are entirely heated and it is possible to ensure that the first and second copper coating layers 11 and 12 of the radiation source substrate 10 and the copper coating layer 21 of the reference ground substrate 20 are not oxidized in the process of the second copper coating layer 12 of the radiation source substrate 10 being welded to the copper coating layer 21 of the reference ground substrate 20.

Further, the second copper clad layer 12 of the radiation source substrate 10 is conductively extended and fixed to a side edge 103 of the radiation source substrate 10 to form a plurality of side pads 121, wherein the side pads 121 are formed and fixed to the side edge 103 of the radiation source substrate 10 in a process of metallizing via holes, such that the side pads 121 and the copper clad layer 21 of the reference ground substrate 20 are spot-welded at the side edge 103 of the radiation source substrate 10 to fix the second copper clad layer 12 of the radiation source substrate 10 and the copper clad layer 21 of the reference ground substrate 20 to the copper clad layer 21 of the reference ground substrate 20 in a state that the second copper clad layer 12 of the radiation source substrate 10 and the copper clad layer 21 of the reference ground substrate 20 can be in direct adhesive contact.

It is worth mentioning that the side pads 121 are formed and fixed on the side edge 103 of the radiation source substrate 10 by a via-metallization process to have an arc-shaped structure, wherein the arc-shaped structure of the side pads 121 facilitates increasing the welding area based on a certain welding spot size, i.e. facilitates obtaining stronger welding strength and smaller welding spot size when welding the side pads 121 and the copper clad layer 21 of the reference ground substrate 20 by spot welding.

Preferably, the utility model discloses a laser welding process with the mode welding of spot welding the side pad 121 with the ground reference base plate 20 cover copper layer 21, wherein owing to the high efficiency of laser welding process, shortened will radiation source base plate 10 the second covers copper layer 12 welded fastening in reference ground base plate 20 cover copper layer 21's process step, be favorable to shortening the manufacturing the cycle of microwave detection module is in order to further be favorable to maintaining naked copper process in the microwave detection module manufacturing cycle radiation source base plate 10 first cover copper layer 11 with the second covers copper layer 12 and reference ground base plate 20 cover copper layer 21 and not oxidized. And due to the consistency and stability of the laser welding process, it is further advantageous to obtain a stable and consistent conductive fixation between the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 when the side pads 121 and the copper-clad layer 21 of the reference ground substrate 20 are welded in a spot welding manner using the laser welding process.

In particular, in this embodiment of the present invention, the first copper-clad layer 11 of the radiation source substrate 10 has a size smaller than that of the radiation source substrate 10, and specifically, the size of the first copper-clad layer 11 of the radiation source substrate 10 in the direction corresponding to the side edge 103 of the radiation source substrate 10, where the side pad 121 is formed, is set smaller than that of the radiation source substrate 10, so as to reduce the probability that a solder joint formed by side edge spot welding on the side edge 103 of the radiation source substrate 10 is in conduction with the first copper-clad layer 11 of the radiation source substrate 10.

Further, in this embodiment of the present invention, the first copper-clad layer 11 of the radiation source substrate 10 is conductively connected to the copper-clad layer 21 of the reference ground substrate 20, so as to further reduce the impedance of the microwave detection module and improve the anti-interference performance of the microwave detection module in a manner of narrowing the bandwidth of the working frequency point of the microwave detection module.

Specifically, the first copper-clad layer 11 of the radiation source substrate 10 is further provided with a grounding point 111, wherein the grounding point 111 extends through the radiation source substrate 10 to the second copper-clad layer 12 of the radiation source substrate 10 in a conductive manner, so as to form a low-impedance and consistent conductive connection between the grounding point 111 and the copper-clad layer 21 of the reference substrate 20 by virtue of the low-impedance and consistent conductive fixation between the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference substrate 20.

Further, the grounding point 111 forms a low-impedance and consistent conductive connection between the first copper-clad layer 11 and the second copper-clad layer 12 of the radiation source substrate 10 through the radiation source substrate 10 by a via-metallization process, so as to further ensure the low-impedance and consistent conductive connection between the grounding point 111 and the copper-clad layer 21 of the reference ground substrate 20 of the first copper-clad layer 11 of the radiation source substrate 10.

Preferably, the grounding point 111 is disposed at a physical center point of the first copper clad layer 11 of the radiation source substrate 10, that is, a zero potential point of the first copper clad layer 11 of the radiation source substrate 10 in an operating state of the microwave detection module, so as to reduce the impedance of the microwave detection module and ensure the feeding stability of the microwave detection module at the feeding point 110. It is understood that, in the operating state of the microwave detection module, the first copper-clad layer 11 of the radiation source substrate 10 has a zero-potential line, where the zero-potential line is a region on the first copper-clad layer 11 of the radiation source substrate 10, which passes through the physical center point of the first copper-clad layer 11 and is perpendicular to the connection line between the feeding point 110 and the physical center point of the first copper-clad layer 11. That is, on the zero-potential line of the first copper-clad layer 11 of the radiation source substrate 10, the electrical connection between the first copper-clad layer 11 and the second copper-clad layer 12 of the radiation source substrate 10 can maintain the feeding stability of the microwave detection module at the feeding point 110.

Therefore, with further reference to fig. 6 and 7 of the drawings accompanying the present disclosure, in some embodiments of the present disclosure, the first copper-clad layer 11 of the radiation source substrate 10 is conductively extended to the second copper-clad layer 12 by the zero-potential line through a via-metallization process, and the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 are formed by welding through corresponding via-metallization.

That is, corresponding to fig. 6, the side pads 121 are formed on the extension lines of the zero potential lines of the first copper clad layer 11 of the radiation source substrate 10 and allow electrically conductive connection with the first copper clad layer 11 of the radiation source substrate 10, i.e., the side pads 121 are formed directly on the zero potential lines of the first copper clad layer 11 in a process of metallizing via holes without reducing the size of the first copper clad layer 11 of the radiation source substrate 10 with respect to the radiation source substrate 10.

Similarly, when a metallization hole 104 is formed in the radiation source substrate 10 by a metallization via process in extension of the zero-potential line or the zero-potential line of the first copper clad layer 11, it is also allowed to form a conductive fixation between the second copper clad layer 12 of the radiation source substrate 10 and the copper clad layer 21 of the reference ground substrate 20 in the metallization hole 104 by soldering, and it is not limited whether the first copper clad layer 11 of the radiation source substrate 10 is conductively connected to the metallization hole 104, corresponding to fig. 7.

In particular, in this embodiment of the present invention, after the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 are directly fixed by a bare copper process, a protective film 30 is further covered on the first copper-clad layer 11 of the radiation source substrate 10 and the exposed copper-clad layer 21 of the reference ground substrate 20, so as to protect the first copper-clad layer 11 of the radiation source substrate 10 and the exposed copper-clad layer 21 of the reference ground substrate 20 from being oxidized and corroded by covering the first copper-clad layer 11 of the radiation source substrate 10 and the exposed copper-clad layer 21 of the reference ground substrate 20 with the protective film 30, thereby maintaining the stability of the microwave detection module.

It should be noted that the protection film 30 may be formed by using a conformal coating, or an insulating oil, or an ink, and preferably a conformal coating, such as a silicone conformal coating, so as to maintain the radiation gain and the low impedance characteristic of the microwave detection module by using an electrical characteristic that the conformal coating has a relatively low dielectric loss and dielectric constant relative to the ink while protecting the first copper-clad layer 11 of the radiation source substrate 10 and the exposed copper-clad layer 21 of the reference ground substrate 20 from oxidation and corrosion.

It will be understood by those skilled in the art that the microwave detection module is capable of transmitting an electromagnetic beam corresponding to a corresponding frequency when the microwave detection module is excited by an alternating electrical signal with a corresponding frequency provided by a circuit matched with the microwave detection module, in particular when the second side 202 of the reference ground substrate 20 is electrically excited by an alternating electrical signal with a corresponding frequency through the feeding point 110 to the first copper-clad layer 11 of the radiation source substrate 10, wherein in some embodiments of the present invention, a corresponding circuit matched with the microwave detection module is directly disposed on the second side 202 of the reference ground substrate 20, wherein without affecting the first copper-clad layer 11 and the second copper-clad layer 12 of the radiation source substrate 10 of the microwave detection module before being manufactured, and the copper-clad layer 21 of the reference ground substrate 20, or the conductive phase of the microwave detection module is fixed, the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 are not affected, and the first copper-clad layer 11 of the radiation source substrate 10 and the reference ground substrate 20 are exposed, on the premise of the copper-clad layer 21, the corresponding circuit matched with the microwave detection module is arranged on the second surface 202 of the reference ground substrate 20, and the invention has various embodiments, which is not limited by the invention.

Referring to fig. 7 and 8 of the drawings attached to the present specification, according to the present invention, the microwave detection module according to a modified embodiment of the above-described embodiment is illustrated, in which fig. 7 and 8 respectively illustrate a side sectional structure and a decomposition structure of the microwave detection module. In particular, in this variant embodiment of the present invention, the first copper-clad layer 11 and the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 are respectively formed with an OSP protective layer 40 by the OSP process treatment, so as to prolong the conductive performance of the first copper-clad layer 11 and the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 during the conductive fixing process of the second copper-clad layer 12 of the radiation source substrate 10 to the copper-clad layer 21 of the reference ground substrate 20 by the oxidation resistance of the OSP protective layer 40 within a certain time period, so as to maintain the first copper-clad layer 11 and the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 from being oxidized during the microwave detection module manufacturing cycle, thereby being beneficial to the batch production of the microwave detection module.

It is worth mentioning that the process of forming the OSP protection layer 40 by the OSP process is mature and simple, and is low cost, and the thickness of the corresponding OSP protection layer 40 is uniform and allows to have a lower thickness, and at the same time, has good conductivity, so that when the OSP protection layer 40 of the second copper-clad layer 12 of the radiation source substrate 10 and the OSP protection layer 40 of the copper-clad layer 21 of the reference ground substrate 20 are fixed in a state of being attached to each other, an oxidation-resistant metal protection layer is not formed between the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20, and has a consistent lower thickness and a consistent lower dielectric loss compared to the existing circuit board manufacturing process. In addition, in the batch manufacturing process of the microwave detection module, the uniformity of the thickness of the radiation gap of the microwave detection module and the stability of the medium in the radiation gap are favorably maintained, namely, the dielectric loss of the radiation gap is favorably reduced and the uniformity of the dielectric loss of the radiation gap is favorably maintained.

Also, in this variant embodiment of the present invention, the second copper-clad layer 12 of the radiation source substrate 10 is welded and fixed to the copper-clad layer 21 of the reference ground substrate 20 by means of side spot welding, and specifically, the second copper-clad layer 12 of the radiation source substrate 10 is conductively extended and fixed to the side edge 103 of the radiation source substrate 10 by means of a metalized via and a plurality of side pads 121 are formed on the side edge 103 of the radiation source substrate 10, wherein welding the pads 121 and the copper-clad layer 21 of the reference ground substrate 20 by means of spot welding on the side edge 103 of the radiation source substrate 10 can form a stable conductive fixation between the pads 121 and the copper-clad layer 21 of the reference ground substrate 20 since the OSP protective layer 40 can be eliminated during the welding process.

That is, in this modified embodiment of the present invention, the formation of the OSP protection layer 40 is beneficial to maintain the first copper-clad layer 11 and the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 not to be oxidized in the microwave detection module manufacturing cycle, and does not affect the soldering fixation of the second copper-clad layer 12 of the radiation source substrate 10 to the copper-clad layer 21 of the reference ground substrate 20, and at the same time, the thickness of the radiation gap can be stably maintained, and the dielectric loss of the medium in the radiation gap can be reduced and stably maintained, compared with the existing circuit board manufacturing process, thereby being beneficial to reducing the dielectric loss of the radiation gap and maintaining the consistency of the dielectric loss of the radiation gap, i.e. being beneficial to the consistency of the impedance matching of the microwave detection module and improving the quality factor of the microwave detection module to narrow the operation of the microwave detection module And the anti-interference performance of the microwave detection module is improved in a frequency point bandwidth mode.

In particular, in this variant embodiment of the present invention, by forming the OSP protection layer 40, while maintaining the conductivity of the first copper-clad layer 11 and the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 during the conductive fixing process of the second copper-clad layer 12 of the radiation source substrate 10 to the copper-clad layer 21 of the reference ground substrate 20, the side pads 121 and the copper-clad layer 21 of the reference ground substrate 20 are further welded by spot welding using a laser welding process to shorten the process step of welding and fixing the second copper-clad layer 12 of the radiation source substrate 10 to the copper-clad layer 21 of the reference ground substrate 20. That is, in this embodiment of the present invention, while the conductivity of the first copper coating layer 11 and the second copper coating layer 12 of the radiation source substrate 10 and the copper coating layer 21 of the reference ground substrate 20 can be maintained in a prolonged manner, the time consumption of the process step of welding the second copper coating layer 12 of the radiation source substrate 10 to the copper coating layer 21 of the reference ground substrate 20 can be reduced, thereby being more advantageous to maintain the conductivity of the first copper coating layer 11 and the second copper coating layer 12 of the radiation source substrate 10 and the copper coating layer 21 of the reference ground substrate 20 in the production cycle of the microwave detection module, and being more advantageous to maintain the stability and consistency of the microwave detection module during the mass production of the microwave detection module.

Also, in this modified embodiment of the present invention, after the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 formed with the OSP protection layer 40 are fixed, the OSP protection layer 40 of the first copper-clad layer 11 of the radiation source substrate 10 and the OSP protection layer 40 of the exposed copper-clad layer 21 of the reference ground substrate 20 are further covered with the protection film 30, so as to protect the OSP protection layer 40 of the first copper-clad layer 11 of the radiation source substrate 10 and the OSP protection layer 40 of the exposed copper-clad layer 21 of the reference ground substrate 20 from oxidation and corrosion by the coverage of the OSP protection layer 40 of the first copper-clad layer 11 of the radiation source substrate 10 and the OSP protection layer 40 of the exposed copper-clad layer 21 of the reference ground substrate 20 by the protection film 30, thereby protecting the first copper clad layer 11 of the radiation source substrate 10 and the copper clad layer 21 of the reference ground substrate 20 from oxidation and corrosion, and further maintaining the stability of the microwave detection module.

To further describe the present invention, according to the present invention, the manufacturing method of the microwave detecting module is disclosed, wherein the manufacturing method of the microwave detecting module comprises the following steps:

A. a first copper-clad layer 11 and a second copper-clad layer 12 opposite to the first copper-clad layer 11 are arranged on the radiation source substrate 10 in a double-sided copper-clad structure, and a copper-clad layer 21 is arranged on the reference ground substrate 20;

B. conductively extending the second copper clad layer 21 to the side edge 103 of the radiation source substrate 10; and

C. in a state where the second copper clad layer 12 of the radiation source substrate 10 is in close contact with the copper clad layer 21 of the reference ground substrate 20, the second copper clad layer is fixed to the copper clad layer 21 of the reference ground substrate 20 by soldering at the side edge 103 of the radiation source substrate 10.

In some embodiments of the present invention, wherein in the step (a), the first copper-clad layer 11 and the second copper-clad layer 12 of the radiation source substrate 10 and the copper-clad layer 21 of the reference ground substrate 20 are in a bare copper state.

In some embodiments of the present invention, the method of manufacturing the microwave detection module further comprises the steps of:

D. the first copper-clad layer 11 of the radiation source substrate 10 and the exposed copper-clad layer 21 of the reference ground substrate 20 are covered with the protective film 30, respectively.

In some embodiments of the present invention, wherein in the step (a), further comprising the step of:

a1, respectively disposing an OSP protection layer 40 on the first copper clad layer 11 and the second copper clad layer 12 of the radiation source substrate 10 and the copper clad layer 21 of the ground reference substrate 20 by OSP process.

d', the OSP protection layer 40 of the first copper-clad layer 11 of the radiation source substrate 10 and the OSP protection layer 40 of the exposed copper-clad layer 21 of the reference ground substrate 20 are respectively covered with a protection film 30.

In some embodiments of the present invention, according to the step (C), the welding fixing of the second copper-clad layer 12 and the copper-clad layer 21 of the ground reference substrate 20 at the side edge 103 of the radiation source substrate 10 is performed by spot welding.

In some embodiments of the present invention, wherein according to the step (B), the second copper-clad layer 12 is conductively extended to the side edge 103 of the radiation source substrate 10 to form a plurality of side pads 121.

In some embodiments of the present invention, wherein in the step (B), further comprising the step of:

b1, extending the second copper clad layer 12 conductively at the side edge 103 of the radiation source substrate 10 by a via metallization process to form the side pads 121 at the side edge 103 of the radiation source substrate 10.

In some embodiments of the present invention, according to the step (C), the side pad 121 is fixed to the copper-clad layer 21 of the reference ground substrate 20 by spot welding in the side edge 103 of the radiation source substrate 10 by laser welding.

E. a feeding point 110 is disposed on the first copper-clad layer 11 of the radiation source substrate 10, and the first copper-clad layer 11 is extended to the surface of the reference ground substrate 20 opposite to the surface on which the copper-clad layer 21 is disposed at the feeding point 110 in a conductive manner.

In some embodiments of the present invention, according to the step (E), the first copper-clad layer 11 is extended to the surface of the reference ground substrate 20 opposite to the surface provided with the copper-clad layer 21 by a via-metallization process at the feeding point 110.

F. conductively connecting the first copper-clad layer 11 of the radiation source substrate 10 to the copper-clad layer 21 of the ground reference substrate 20.

In some embodiments of the present invention, according to the step (F), a grounding point 111 is disposed on the first copper-clad layer 11 of the radiation source substrate 10 and the grounding point 111 conductively extends the first copper-clad layer 11 to the second copper-clad layer 12.

In some embodiments of the present invention, according to the step (F), the first copper-clad layer 11 is extended to the second copper-clad layer 12 by a via-metallization process at the grounding point 111.

In some embodiments of the present invention, according to the step (F), the grounding point 111 is disposed at a physical center point of the first copper-clad layer 11.

It will be appreciated by persons skilled in the art that the above embodiments are only examples, wherein features of different embodiments may be combined with each other to obtain embodiments which are easily imaginable in accordance with the disclosure of the invention, but which are not explicitly indicated in the drawings.

It will be understood by those skilled in the art that the embodiments of the present invention as described above and shown in the drawings are given by way of example only and are not limiting of the present invention. The objects of the present invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the embodiments without departing from the principles, embodiments of the present invention may have any deformation or modification.

Claims

1. A microwave detection module, comprising:

2. The microwave detection module of claim 1, wherein the second copper-clad layer has a plurality of side pads extending conductively from the side edge of the radiation source substrate, wherein the side pads are secured to the side edge of the radiation source substrate and are spot welded to the copper-clad layer of the ground reference substrate.

3. The microwave detection module of claim 2, wherein the side pads are configured to be formed and secured to the side edges of the radiation source substrate in the form of metallized vias to conductively extend from the second copper clad layer.

4. The microwave detection module of claim 3, wherein a dimension of the first copper clad layer of the radiation source substrate in a direction corresponding to the side edge of the radiation source substrate on which the side pad is formed is set smaller than a dimension of the radiation source substrate.

5. The microwave detection module of claim 3, wherein a zero potential line passing through the physical center point of the first copper-clad layer and perpendicular to the line connecting the physical center point of the first copper-clad layer and the feed point passes through the side pad.

6. The microwave detection module of claim 5, wherein the side pads are formed as metalized vias between the first copper clad layer and the second copper clad layer in conductive communication with the first copper clad layer.

7. The microwave detection module according to any of claims 1-6, wherein the first copper-clad layer of the radiation source substrate is provided with a grounding point, wherein the grounding point is conductively extended to the second copper-clad layer of the radiation source substrate in the form of a metalized via to be conductively connected to the copper-clad layer of the reference ground substrate.

8. The microwave detection module of claim 7, wherein the ground point is disposed at a physical center point of the first copper-clad layer of the radiation source substrate.

9. The microwave detection module of claim 8, wherein the second copper-clad layer of the radiation source substrate and the copper-clad layer of the reference ground substrate are directly attached in the form of bare copper, wherein the first copper-clad layer of the radiation source substrate and the bare copper-clad layer of the reference ground substrate are respectively covered with a protective film.

10. The microwave detection module of claim 8, wherein the first and second copper-clad layers and the copper-clad layer of the reference ground substrate are each coated with an OSP protective layer, wherein the OSP protective layer of the first copper-clad layer of the radiation source substrate and the OSP protective layer of the copper-clad layer of the exposed reference ground substrate are each coated with a protective film.