CN210607321U

CN210607321U - High-speed automatic LED die bonder

Info

Publication number: CN210607321U
Application number: CN201922266649.9U
Authority: CN
Inventors: 黎志文
Original assignee: Shenzhen Baofa Industrial Equipment Co Ltd
Current assignee: Shenzhen Baofa Industrial Equipment Co Ltd
Priority date: 2019-12-17
Filing date: 2019-12-17
Publication date: 2020-05-22
Anticipated expiration: 2029-12-17

Abstract

The utility model discloses a solid brilliant machine of high-speed automatic LED, including notch last silo and notch mounting groove down up, be equipped with solid brilliant device in the mounting groove, two telescoping devices of the diapire fixedly connected with of going up the silo, the equal fixedly connected with wafer frame of the flexible end of two telescoping devices, the diapire fixedly connected with who goes up the silo supports the groove, the both sides inner wall of going up the silo all has the apron through hinge swing joint, support the sealing strip that the equal fixedly connected with of both sides lateral wall in groove matches with the apron, mounting groove upper end inner wall fixedly connected with biax motor, the equal fixedly connected with reel of two output shafts of biax motor, be equipped with the stay cord on the reel, the one end of biax motor and the upper end lateral wall fixed connection of apron are kept away from to the stay cord. The utility model discloses open the apron when solid brilliant, close the apron when not solid brilliant, the protection crystal reduces its influence that receives the dust, improves solid brilliant efficiency.

Description

High-speed automatic LED die bonder

Technical Field

The utility model relates to a solid brilliant machine technical field especially relates to a solid brilliant machine of high-speed automatic LED.

Background

A light emitting diode is a light emitting element that can convert electrical energy into light energy. With the maturity of LED technology, LED products are gradually applied to the fields of illumination, display, etc., and an LED die bonder is a device capable of fixing an LED wafer on an LED support. The existing LED die bonder is generally only provided with a clamp platform for fixing an LED support and a die bonding mechanism for die bonding the LED support on the clamp platform. After the feeding part finishes the feeding, the solid brilliant mechanism of anchor clamps platform cooperation carries out the LED wafer and binds the operation, wait a LED support solid brilliant completion after, the LED support that the solid brilliant completion just can be received to the receiving part, and the feeding part just can convey next LED support to the anchor clamps platform and carry out next round of nation and decide the operation, be equipped with LED support pickup assembly on the solid brilliant machine of traditional LED, this pickup assembly is mainly by the cylinder directly with the support along the guide rail release silo magazine or push the magazine.

In the prior art, when a die bonder is used for operation, a wafer is exposed, and if dust enters the wafer, the working quality and the service life of an LED are affected.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the problem that the wafer can be exposed when the die bonder is used for operation in the prior art, and if dust enters the wafer, the working quality and the service life of the LED can be influenced, and providing a high-speed automatic die bonder for the LED.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a high-speed automatic LED die bonder comprises a feeding groove with an upward notch and a mounting groove with a downward notch, the mounting groove is internally provided with a die bonding device, the bottom wall of the feeding groove is fixedly connected with two telescopic devices, the telescopic ends of the two telescopic devices are fixedly connected with a wafer rack, the bottom wall of the feeding groove is fixedly connected with a supporting groove, the inner walls of the two sides of the feeding groove are movably connected with cover plates through hinges, the side walls of the two sides of the supporting groove are fixedly connected with sealing strips matched with the cover plate, the inner wall of the upper end of the mounting groove is fixedly connected with a double-shaft motor, two output shafts of the double-shaft motor are both fixedly connected with a winding drum, a pull rope is arranged on the winding drum, the one end that biax motor was kept away from to the stay cord and the upper end lateral wall fixed connection of apron, two spacing rings of the upper end inner wall fixed connection of mounting groove, two the spacing ring is located two reels directly over respectively.

Preferably, the inner wall of the mounting groove is fixedly connected with two groups of pulleys, and each group of the two pulleys are respectively abutted to the same pull rope.

Preferably, the bottom wall of the supporting groove is fixedly connected with a hydraulic telescopic rod, and the telescopic end of the hydraulic telescopic rod is fixedly connected with a support stand.

Preferably, the side wall of the cover plate far away from the hinge is provided with a chamfer, and the side wall of the cover plate far away from the hinge is abutted to the side wall of the support groove.

Preferably, the side wall of the upper end of the mounting groove is fixedly connected with a multicolor warning lamp.

Preferably, the side wall of the winding drum is provided with an annular accommodating groove, and the pull rope is positioned in the annular accommodating groove.

Compared with the prior art, the beneficial effects of the utility model are that:

1. when the die bonder is used for die bonding operation, the winding drum can be driven to rotate by the aid of the double-shaft motor, the pull rope is tightened or loosened by the winding drum, the pull rope can drive the cover plate to rotate, or the cover plate falls under the action of gravity and then abuts against the side wall of the supporting groove, so that contact between a lens body and the outside is avoided, dust is reduced to be attached to the lens, and die bonding efficiency is improved;

2. utilize the pulley not only to make the stay cord remove according to certain orbit, avoid the stay cord to influence solid brilliant device normal operation, can make the stay cord conveniently pull the apron to rotate towards the direction of mounting groove steadily moreover to open the apron at the fastest maximum angle, in addition, can drive the support platform through hydraulic telescoping rod and remove automatically, thereby drive the LED on the support platform and remove.

Drawings

Fig. 1 is a schematic structural view of a high-speed automatic LED die bonder according to the present invention;

fig. 2 is a schematic structural diagram at a in fig. 1.

In the figure: the device comprises a feeding groove 1, a mounting groove 2, a die bonding device 3, a telescopic device 4, a wafer frame 5, a support groove 6, a cover plate 7, a sealing strip 8, a double-shaft motor 9, a winding drum 10, a pull rope 11, a limiting ring 12, a pulley 13, a hydraulic telescopic rod 14, a support table 15 and a multi-color warning lamp 16.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-2, a high-speed automatic LED die bonder comprises a feeding chute 1 with an upward notch and a mounting groove 2 with a downward notch, wherein a multi-color warning lamp 16 is fixedly connected to the side wall of the upper end of the mounting groove 2, and displays whether die bonder operation is smoothly performed through the warning lamp, when the die bonder 3 cannot normally work, a worker can be quickly reminded, two sets of pulleys 13 are fixedly connected to the inner wall of the mounting groove 2, each set of two pulleys 13 respectively abut against the same pulling rope 11, the pulling rope 11 can be moved according to a certain track by using the pulleys 13, so as to prevent the pulling rope 11 from influencing the normal operation of the die bonder 3, and the pulling rope 11 can conveniently and stably pull a cover plate 7 to rotate towards the mounting groove 2, so as to open the cover plate 7 at the fastest maximum angle, the die bonder 3 is arranged in the mounting groove 2, and the bottom wall of the feeding chute 1 is, the telescopic ends of the two telescopic devices 4 are fixedly connected with the wafer frames 5, the bottom wall of the feeding groove 1 is fixedly connected with the supporting groove 6, the bottom wall of the supporting groove 6 is fixedly connected with the hydraulic telescopic rod 14, the telescopic end of the hydraulic telescopic rod 14 is fixedly connected with the support table 15, and the support table 15 can be automatically driven to move through the hydraulic telescopic rod 14, so that the LED on the support table 15 is driven to move;

the inner walls of the two sides of the feeding groove 1 are movably connected with cover plates 7 through hinges, magnets can be arranged on the cover plates 7, the inner walls of the mounting grooves 2 are provided with corresponding magnets, the two magnets repel each other, thus when the pull ropes 11 are loosened, the cover plates 7 can quickly abut against the sealing strips 8, the side walls of the cover plates 7 far away from the hinges are provided with chamfers, the side walls of the cover plates 7 far away from the hinges abut against the side walls of the supporting grooves 6, the side walls of the two sides of the supporting grooves 6 are fixedly connected with the sealing strips 8 matched with the cover plates 7, the matching of the cover plates 7 and the sealing strips 8 is utilized to prevent dust from entering the feeding groove 1, so that the safety of crystals is ensured, the inner wall of the upper end of the mounting groove 2 is fixedly connected with a double-shaft motor 9, two output shafts of the double-shaft motor 9 are fixedly connected with winding drums 10, the side walls of the winding drums, be equipped with stay cord 11 on reel 10, the one end that biax motor 9 was kept away from to stay cord 11 and the upper end lateral wall fixed connection of apron 7, two spacing rings 12 of upper end inner wall fixed connection of mounting groove 2, two spacing rings 12 are located two reels 10 respectively directly over can make stay cord 11 stably by the restriction on reel 10 through spacing ring 12, can not break away from on reel 10.

The utility model discloses when carrying out solid brilliant operation, utilize double-shaft motor 9 to drive reel 10 and rotate, thereby tighten up stay cord 11, stay cord 11 can drive apron 7 and rotate, thereby open apron 7, expose telescoping device 4 and wafer frame 5, so that utilize solid brilliant device 3 to solidify it brilliant, gu after brilliant completion, make double-shaft motor 9 antiport, double-shaft motor 9 can set up positive and negative rotation device, make it can positive and negative rotation, drive reel 10 reversal, thereby relax stay cord 11, self at apron 7 is under the action of gravity like this, can be close to sealing strip 8, thereby seal telescoping device 4 and wafer frame 5, avoid the dust to get into the surface that silo 1 attached to the wafer, thereby protect solid brilliant device 3 can carry out solid brilliant operation safely, improve solid brilliant quality.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A high-speed automatic LED die bonder comprises a feeding groove (1) with an upward notch and a mounting groove (2) with a downward notch, wherein a die bonder (3) is arranged in the mounting groove (2), and is characterized in that the bottom wall of the feeding groove (1) is fixedly connected with two expansion devices (4), the expansion ends of the two expansion devices (4) are fixedly connected with a wafer frame (5), the bottom wall of the feeding groove (1) is fixedly connected with a supporting groove (6), the inner walls of the two sides of the feeding groove (1) are movably connected with a cover plate (7) through hinges, the side walls of the two sides of the supporting groove (6) are fixedly connected with sealing strips (8) matched with the cover plate (7), the inner wall of the upper end of the mounting groove (2) is fixedly connected with a double-shaft motor (9), the two output shafts of the double-shaft motor (9) are fixedly connected with a winding drum (10), and a pull, one end of the pull rope (11) far away from the double-shaft motor (9) is fixedly connected with the upper end side wall of the cover plate (7), two limiting rings (12) are fixedly connected to the upper end inner wall of the mounting groove (2), and the two limiting rings (12) are respectively positioned right above the two winding drums (10).

2. The high-speed automatic LED die bonder according to claim 1, wherein two groups of pulleys (13) are fixedly connected to the inner wall of the mounting groove (2), and each two groups of pulleys (13) respectively abut against the same pull rope (11).

3. The high-speed automatic LED die bonder according to claim 1, wherein a hydraulic telescopic rod (14) is fixedly connected to the bottom wall of the supporting groove (6), and a support table (15) is fixedly connected to the telescopic end of the hydraulic telescopic rod (14).

4. The high-speed automatic LED die bonder according to claim 1, wherein a chamfer is arranged on a side wall of the cover plate (7) far away from the hinge, and the side wall of the cover plate (7) far away from the hinge is abutted against a side wall of the support groove (6).

5. The high-speed automatic LED die bonder according to claim 1, wherein a multi-color warning lamp (16) is fixedly connected to the side wall of the upper end of the mounting groove (2).

6. The high-speed automatic LED die bonder as claimed in claim 1, wherein the side wall of the winding drum (10) is provided with an annular accommodating groove, and the pulling rope (11) is located in the annular accommodating groove.