CN210606977U - Lead structure of paster type aluminum electrolytic capacitor - Google Patents

Lead structure of paster type aluminum electrolytic capacitor Download PDF

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Publication number
CN210606977U
CN210606977U CN201921754189.8U CN201921754189U CN210606977U CN 210606977 U CN210606977 U CN 210606977U CN 201921754189 U CN201921754189 U CN 201921754189U CN 210606977 U CN210606977 U CN 210606977U
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China
Prior art keywords
lead
electrolytic capacitor
aluminum electrolytic
bent
rubber cover
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CN201921754189.8U
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Chinese (zh)
Inventor
王伟
张圣涛
许友泉
李兴平
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Shenzhen Huarong Weiye Electronics Co Ltd
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Shenzhen Huarong Weiye Electronics Co Ltd
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Abstract

The utility model discloses a lead structure of a patch type aluminum electrolytic capacitor, which comprises two leads, a rubber cover, an aluminum shell and a core cladding; the lead is bent, and a notch is formed after the lead is bent; the rubber cover is provided with a guide pin hole, and the guide pin hole is provided with an extension hole in the outward direction. The utility model adopts the bent lead wire to replace the plastic seat plate, thereby reducing the processing flow and saving the use of materials; the aluminum electrolytic capacitor can be stably placed on a PCB (printed circuit board) by adopting the H-shaped lead wire for molding, so that the welding quality of the capacitor is ensured; the single-lead annular structure is adopted, so that the welding area is increased, and the welding quality is improved; the aperture of the rubber cover is lengthened, so that the lead is protected, and the bending of the vertical part of the lead is avoided, thereby ensuring the welding quality.

Description

Lead structure of paster type aluminum electrolytic capacitor
Technical Field
The utility model relates to a lead structure of a paster type aluminum electrolytic capacitor.
Background
With the development of circuit integration, and the maturity of automatic patch technology. More and more aluminum electrolytic capacitors adopt an automatic chip mounting mode. The traditional aluminum electrolytic capacitor patch adopts a plastic bottom plate as a base, the problem that the capacitor is stably placed on a circuit board can be well solved by adopting the mode, but the traditional aluminum electrolytic capacitor patch also has more defects, such as the lead needs to be flattened and processed, the mechanical strength of the lead is damaged, and meanwhile, the welding performance is influenced due to the damage of a tin layer on the surface of the lead; the welding effect cannot be ensured due to the limited area of the lead flattening; the plastic bottom plate is added, and the material cost is increased.
There are also some suppliers that use direct wire forming instead of plastic backing plates. As mentioned in the patent publication No. CN206597833U, a method of processing the leads into U-shape is adopted instead of the plastic bottom plate. The similar method has the following problems: (1) the root of the lead is easy to bend due to the lack of protection in the lead processing; (2) a single lead is used as a welding object, and the welding effect after welding is difficult to ensure.
Disclosure of Invention
The utility model aims to solve the technical problem of a lead structure of a paster type aluminum electrolytic capacitor, which can solve the problems.
The utility model discloses a realize through following technical scheme: a lead structure of a patch type aluminum electrolytic capacitor comprises two leads, a rubber cover, an aluminum shell and a core package; the lead is bent, and a notch is formed after the lead is bent; the rubber cover is provided with a guide pin hole, and the guide pin hole is provided with an extension hole in the outward direction.
As a preferred technical scheme, the structure of the lead comprises an iron layer, a copper layer and a tin layer from inside to outside, wherein the thickness of the tin layer is 8-12 mu m; the height of the lead is 1.0-3.0 mm; the two leads are in an H-shaped structure; the distance between two wires of a single wire is controlled between 0.8 mm and 1.8 mm.
As a preferable technical scheme, the lead is a round-head rectangle with a notch after being bent, and the width of the notch is 0.2-2.0 mm.
As a preferable technical scheme, the length of the extension hole is controlled to be between 1.0 and 3.0 mm; the aperture of the extension hole is controlled to be between the aperture of the guide pin hole and the aperture of the guide pin hole plus 0.3 mm; the rubber cover is made of butyl rubber.
The utility model has the advantages that:
(1) the bent lead wire is adopted to replace a plastic seat plate, so that the processing flow is reduced, and the use of materials is saved.
(2) The aluminum electrolytic capacitor can be stably placed on a PCB by adopting the H-shaped lead wire for molding, so that the welding quality of the capacitor is ensured.
(3) And a single-lead annular structure is adopted, so that the welding area is increased, and the welding quality is improved.
(4) The aperture of the rubber cover (2) is lengthened, so that the lead is protected, and the bending of the vertical part of the lead is avoided, thereby ensuring the welding quality.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a front view of the present invention;
fig. 2 is a top view of the present invention.
Detailed Description
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
Any feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
In the description of the present invention, it is to be understood that the terms "one end", "the other end", "the outside", "upper", "inside", "horizontal", "coaxial", "central", "end", "length", "outer end", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, in the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
The use of terms herein such as "upper," "above," "lower," "below," and the like in describing relative spatial positions is for the purpose of facilitating description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
In the present invention, unless otherwise explicitly specified or limited, the terms "set", "coupled", "connected", "penetrating", "plugging", and the like are to be understood in a broad sense, and may be, for example, fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
As shown in fig. 1 and 2, a lead 1, a rubber cover 2, an aluminum case 3, and a core package 4. The aluminum shell wraps the core bag, and the rubber cover is arranged at the upper ends of the aluminum shell and the core bag. After the leads are bent, the two leads are H-shaped, the height of a single lead is controlled to be 1.0-3.0mm, the phenomenon that the internal core package of the capacitor is damaged due to too short leads is avoided, and the phenomenon that the total height of the capacitor is influenced due to too long leads is avoided. The single lead fold is a round-head rectangle with a notch, wherein the width of the notch is 0.2-2.0 mm. Because too small gap width can lead to the difficulty of processing, even lead to the mutual extrusion of lead wire, and too big width can lead to the lead wire to eat the tin not full between, and the gap can't be closed after the welding, influences the welding performance. The distance W between two leads of a single lead is controlled to be 0.8-1.8mm, different widths are determined according to different wire diameters, and the width W is controlled to be 3-4 times of the wire diameter. The length L of the individual leads should be controlled between 0.8 and 1.4 times the diameter of the capacitor body.
The lead wire has a structure from inside to outside, wherein the mass ratio of iron is 40-80%, the mass ratio of copper is 20-60%, and the thickness of the tin layer is 8-12 μm. Correspondingly, a high carbon content steel material may not be used to ensure the ductility of the lead.
The guide pin hole of the rubber cover is specially designed. And the guide pin is lengthened in the outward direction to prevent the guide pin subjected to bending processing from being bent. Correspondingly, the diameter of the reinforced hole should not be smaller than the diameter of the inner hole, so as not to affect the assembly. The length of the reinforced part should be controlled between 1.0-3.0 mm. The pore size should be controlled between (inner pore size) - (inner pore size +0.3 mm). The corresponding rubber cover is made of butyl rubber, and the hardness is ensured to be above 85A.
Example 1: an aluminum electrolytic capacitor with the size of phi 10 x 12 is designed by adopting a lead wire with the wire diameter of 0.6mm, wherein the diameter of the body of the capacitor is 10mm, and the height of the capacitor is 12 mm. The copper content of the lead wire adopted correspondingly is 45%, the iron content is 50%, and the thickness of the tin layer is 12 μm. The individual leads used had a width of 1.6mm and a length of 12 mm. The corresponding lead hole of the rubber cover is lengthened, and the aperture of the lengthened part is 1.35mm and is the same as the lead hole. The height of the extension is 3.0 mm. After the aluminum electrolytic capacitor adopting the design is processed and molded, the aluminum electrolytic capacitor can be directly used as a chip capacitor for reflow soldering.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.

Claims (4)

1. A lead structure of a chip type aluminum electrolytic capacitor is characterized in that: comprises two leads (1), a rubber cover (2), an aluminum shell (3) and a core package (4); the lead (1) is bent, and a notch is formed after the lead (1) is bent; the rubber cover (2) is provided with a guide pin hole, and the guide pin hole is provided with an extension hole in the outward direction.
2. The lead structure of a chip type aluminum electrolytic capacitor as recited in claim 1, wherein: the lead (1) comprises an iron layer, a copper layer and a tin layer from inside to outside, wherein the thickness of the tin layer is 8-12 mu m; the height of the lead (1) is 1.0-3.0 mm; the two leads (1) are in an H-shaped structure; the distance between two leads (1) of a single lead (1) is controlled between 0.8 mm and 1.8 mm.
3. The lead structure of a chip type aluminum electrolytic capacitor as recited in claim 1, wherein: the lead (1) is a round-head rectangle with a notch after being bent, and the width of the notch is 0.2-2.0 mm.
4. The lead structure of a chip type aluminum electrolytic capacitor as recited in claim 1, wherein: the length of the extension hole is controlled to be between 1.0 and 3.0 mm; the aperture of the extension hole is controlled to be between the aperture of the guide pin hole and the aperture of the guide pin hole plus 0.3 mm; the rubber cover (2) is made of butyl rubber.
CN201921754189.8U 2019-08-15 2019-10-18 Lead structure of paster type aluminum electrolytic capacitor Active CN210606977U (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201921324999 2019-08-15
CN201921324999X 2019-08-15

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CN210606977U true CN210606977U (en) 2020-05-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113347806A (en) * 2021-05-31 2021-09-03 中国科学院长春光学精密机械与物理研究所 Ceramic dielectric capacitor protection method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113347806A (en) * 2021-05-31 2021-09-03 中国科学院长春光学精密机械与物理研究所 Ceramic dielectric capacitor protection method
CN113347806B (en) * 2021-05-31 2023-03-24 中国科学院长春光学精密机械与物理研究所 Ceramic dielectric capacitor protection method

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