CN210602331U - Radiation refrigeration structure - Google Patents
Radiation refrigeration structure Download PDFInfo
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- CN210602331U CN210602331U CN201920426003.XU CN201920426003U CN210602331U CN 210602331 U CN210602331 U CN 210602331U CN 201920426003 U CN201920426003 U CN 201920426003U CN 210602331 U CN210602331 U CN 210602331U
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Abstract
The utility model discloses a radiation refrigeration structure, including radiation refrigeration layer, radiation refrigeration layer has the first surface of height fluctuation. The utility model discloses set up one side of radiation refrigeration layer into the surface of height fluctuation, increased the surface area on radiation refrigeration layer, also make more radiation refrigeration bodies relative with the atmosphere in the radiation refrigeration layer, be favorable to increasing unit area's radiation refrigeration efficiency.
Description
Technical Field
The utility model relates to a radiation refrigeration technology field especially relates to a radiation refrigeration structure.
Background
The radiation refrigeration technology is used as a temperature adjusting means without energy consumption, has good practicability, can enable human beings to develop harmoniously in two aspects of environmental protection and energy utilization, and brings great revolution to the energy field.
Electromagnetic radiation is generated by objects having a temperature above absolute zero. The radiation wavelength is different according to different conditions such as material, molecular structure and temperature of the radiation object. In the infrared radiation band, when atoms or atomic groups in molecules are converted from a high-energy vibration state to a low-energy vibration state, the infrared radiation of the 2.5-25 μm band is generated from the nature of radiation. From the analysis of the atmospheric spectral transmittance characteristics by scientists, it is known that the atmospheric layer has different transmittances for electromagnetic waves of different wavelengths, and the wavelength band with a high transmittance is called "atmospheric window", and is, for example, 0.3 to 2.5 μm, 3.2 to 4.8 μm, and 7 to 14 μm. The spectral transmission characteristics of the atmosphere are determined mainly by water vapor, carbon dioxide and ozone in the atmosphere, and changes in their contents cause changes in transmittance, but the distribution of the transmission spectrum does not change much. Therefore, the heat energy of the objects on the ground can be transferred by radiation, and the self heat can be discharged to the outer space with the temperature close to absolute zero through the atmospheric window in the form of electromagnetic waves of 7-14 microns, thereby achieving the purpose of self cooling.
In patent application No. 201780013936.X, a radiation cooling structure and system is disclosed. However, the existing radiation refrigeration structure has the problem of limited refrigeration efficiency, and a radiation refrigeration structure with higher refrigeration efficiency needs to be provided.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide a radiation refrigeration structure with high refrigeration efficiency.
According to an aspect of the present invention, there is provided a radiation refrigeration structure, comprising a radiation refrigeration layer having a first surface with undulation.
In one embodiment, the radiation cooling structure further comprises a protective layer disposed over the first surface, the outer surface of the protective layer being a flat second surface,
the inner surface of the protective layer is partially connected with the first surface, and a gap is formed between the protective layer and the first surface; or the protective layer is not contacted with the first surface at all, and a gap is formed between the protective layer and the first surface.
In one embodiment, the visible light and near infrared light transmittance of the protective layer is more than 80%, and the transmittance of the protective layer to electromagnetic waves in a 7-14 μm waveband is more than 80%.
In one embodiment, the emissivity of the radiation refrigerating layer in the wavelength range of 7-14 μm is 70-100%, the radiation refrigerating layer comprises a substrate and radiation refrigerating particles dispersed in the substrate, and the radiation refrigerating particles are selected from one or more of the following: SiC, SiO2、Si3N4、TiO2、BaSO4、CaCO3The particle size of the radiation refrigeration particles is 1-30 mu m.
In one embodiment, the radiation cooling structure further comprises a substrate having an undulating third surface, and the radiation cooling layer is disposed between the substrate and the protective layer along the contour of the third surface, so that the radiation cooling layer forms an undulating structure.
In one embodiment, the outer surface of the substrate is provided with a plurality of protrusions which are arranged at intervals or continuously, so that the side of the substrate provided with the protrusions forms the third surface, and the width of each protrusion is gradually reduced from the bottom to the top; or the outer surface of the substrate is provided with a plurality of grooves which are arranged at intervals or continuously, so that the side of the substrate provided with the grooves forms the third surface, and the internal width of each groove is gradually increased from the bottom to the top.
In one embodiment, the cross-sectional shape of the protrusion or the groove is arc, triangular, rectangular or trapezoidal.
In one embodiment, the protrusions or the grooves are in the shape of a strip, and the protrusions or the grooves are parallel to each other and uniformly distributed.
In one embodiment, the ratio of the height of the projection to the width of the bottom surface of the projection is (1:20) - (2: 1); or the ratio of the depth of the groove to the width of the opening of the groove is (1:20) - (2: 1).
In one embodiment, a reflective layer is disposed between the substrate and the radiation refrigerating layer, and the reflectivity of the reflective layer to visible light and near infrared light is greater than 60%.
Compared with the prior art, the beneficial effects of the utility model reside in that: the utility model discloses an increase the surface area on radiation refrigeration layer, improved radiation refrigeration structure's refrigeration efficiency.
The above and other features and advantages of the present invention are further described in the following detailed description.
Drawings
Fig. 1 is a schematic cross-sectional view of a first embodiment of a radiation cooling structure of the present invention;
fig. 2 is a schematic cross-sectional view of a second embodiment of the radiation cooling structure of the present invention;
fig. 3 is a schematic cross-sectional view of a third embodiment of the radiation cooling structure of the present invention;
fig. 4 is a schematic cross-sectional view of a first embodiment of a substrate of the present invention;
FIG. 5 is an enlarged partial view of a first embodiment of the substrate of the present invention;
fig. 6 is a schematic cross-sectional view of a second embodiment of the substrate of the present invention;
FIG. 7 is an enlarged partial view of a second embodiment of the substrate of the present invention;
fig. 8 is a schematic cross-sectional view of a third embodiment of the substrate of the present invention;
fig. 9 is a schematic cross-sectional view of a fourth embodiment of the substrate of the present invention;
fig. 10 is an elevation view of one embodiment of a base of the present invention;
fig. 11 is an elevation view of another embodiment of a base of the present invention;
in the figure: 1. a radiation refrigeration layer; 10. a first surface; 2. a protective layer; 20. a second surface; 3. a substrate; 30. a third surface; 300a, a projection; 300b, grooves.
Detailed Description
The present invention will be further described with reference to the following detailed description, and it should be noted that, in the premise of no conflict, the embodiments or technical features described below can be arbitrarily combined to form a new embodiment.
In the description of the present invention, it should be noted that, for the orientation words, if there are terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the orientation and positional relationship indicated are based on the orientation or positional relationship shown in the drawings, and only for the convenience of describing the present invention and simplifying the description, it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and not be construed as limiting the specific scope of the present invention.
It is noted that the terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The utility model provides a radiation refrigeration structure, including radiation refrigeration layer 1, radiation refrigeration layer 1 has the first surface 10 of undulation, as shown in fig. 1-4. The utility model discloses one side that will radiate refrigeration layer 1 sets up to the surface of height fluctuation for the surface area that the surface area of radiation refrigeration layer 1 first surface 10 is greater than the shared planar pattern of first surface 10 has also increased the surface area of radiation refrigeration layer 1, makes more radiation refrigeration bodies relative with the atmosphere in radiation refrigeration layer 1, is favorable to increasing unit area's radiation refrigeration efficiency.
The radiation cooling structure further comprises a protective layer 2, the protective layer 2 is disposed above the first surface 10, and an outer surface of the protective layer 2 is a flat second surface 20, as shown in fig. 1 to 4. Through set up protective layer 2 above first surface 10, can avoid hot-air to flow at the first surface 10 of radiation refrigeration layer 1, avoid the heat increase on radiation refrigeration layer surface that thermal convection arouses, and then guarantee that radiation refrigeration structure has higher refrigeration efficiency. Without the presence of the protective layer 2, the hot air outside the radiant cooling layer 1 may flow between the slopes of the first surface 10, increasing the thermal convection above the radiant cooling layer, affecting the cooling efficiency.
In one embodiment of the radiation cooling structure, the inner surface of the protective layer 2 is partially connected to the first surface 10, or the inner surface of the protective layer 2 is completely out of contact with the first surface 10, thus forming a gap between the protective layer 2 and the first surface 10. For example, as shown in fig. 2, there is gas between the slopes of the first surface 10, but since the gas is enclosed between the protective layer 2 and the first surface 10, the gas can hardly flow between the slopes, so that the direct heat exchange between the radiant cooling layer and the outside hot air can be avoided. When the gap is too large, the air in the gap can slightly flow, so that the heat absorption of the radiation refrigerating layer 1 is increased, and the refrigerating efficiency of the radiation refrigerating layer is affected. When the air gap is too small, the contact area between the protective layer 2 and the radiation refrigerating layer 1 is increased, and hot air can exchange heat with the radiation refrigerating layer 1 through the protective layer 2, so that the refrigerating efficiency of the radiation refrigerating layer is affected. Therefore, the height of the voids is preferably greater than zero, less than or equal to the relief height of the first surface 10.
The radiation refrigerating layer 1 includes a base material and radiation refrigerating particles dispersed in the base material. The radiation refrigeration particles are main substances which play a radiation refrigeration function, and the base material mainly plays a role in dispersing and bearing the radiation refrigeration particles. Preferably, the emissivity of the radiation refrigerating layer 1 in the wavelength range of 7-14 μm is 70-100%.
The radiation refrigeration particles preferably use particles with high emissivity in the 7-14 μm band, and the radiation refrigeration particles can be, but are not limited to, SiC and SiO2、Si3N4、TiO2、BaSO4、CaCO3. Preferably, the radiation refrigeration particles have a particle size of 1 μm to 30 μm. One or more types of radiation refrigerating particles may be included in the radiation refrigerating layer 1.
The base material is preferably a material with better light transmission performance so as to reduce the influence of the base material on the radiation refrigeration effect. In some embodiments, the substrate has a transmittance of greater than 85% visible and near infrared light. In some embodiments, the substrate has a transmittance of greater than 90% for visible and near infrared light. In some embodiments, the substrate has a transmittance of greater than 95% for visible and near infrared light.
In some embodiments, the radiation refrigerating layer 1 has a transmittance of 90% to 95% for visible light and near infrared light.
In some embodiments, the radiation refrigerating layer 1 is a film layer, and the substrate may be, but is not limited to, one or more of PET, PBT, TPX, PC, PE, PP, PVC, PMMA, PS, PVA. The substrate may also be a composite material.
In other embodiments, the radiation-cooling layer 1 is a coating, and the substrate may be, but is not limited to, one or more of acrylic resin, amino resin, epoxy resin, alkyd resin, styrene-acrylic resin, styrene-butadiene resin, polyurethane resin, and fluorine-containing resin.
The protective layer 2 is preferably made of a resin having good light transmission properties. The transmittance of the protective layer 2 to visible light and near infrared light is more than 80%, and the transmittance of the protective layer 2 to electromagnetic waves with the wave band of 7-14 μm is more than 80%. The material of the protective layer 2 may be, but is not limited to, one or more of PET, PBT, TPX, PC, PE, PP, PVC, PMMA, PS, PVA. The material of the protective layer 2 and the substrate in the radiation refrigerating layer 1 may be the same or different.
The other surface of the radiation refrigerating layer 1 opposite to the first surface 10 may be a plane (as shown in fig. 1 or 2) or an undulated surface corresponding to the first surface 10 (as shown in fig. 3).
In the embodiment shown in fig. 3, the radiation refrigeration structure further includes a substrate 3, the substrate 3 has a third surface 30 with an elevation, and the radiation refrigeration layer 1 is disposed between the substrate 3 and the protective layer 2 along the contour of the third surface 30, so that the radiation refrigeration layer 1 forms an elevation structure, that is, the first surface 10 with an elevation is formed, thereby increasing the surface area of the radiation refrigeration layer 1.
The utility model discloses do not restrict the material of basement 3, the material of basement 3 can be but not limited to glass, plastics, metal, timber etc.. Preferably, the substrate 3 may be a material having a high reflectance, such as a metal plate or the like.
It should be noted that the third surface 30 may be integrally formed with the substrate 3, that is, when the substrate 3 is prepared, one surface of the substrate 3 may be formed into a surface with uneven height, and the other surface of the substrate 3 may be a flat surface or a surface parallel to the uneven height; the third surface 30 may also be formed by providing a planar surface with a raised structure, which may be, but is not limited to, adhesive, welding, etc.; the third surface 30 can also be obtained by forming a groove structure on a plane, and the groove can be formed by, but not limited to, cutting, etching, etc.; the third surface 30 may also be scalloped, wavy, etc. The forming manner of the third surface 30 is not exhaustive, and the forming manner of the third surface 30 easily conceived by those skilled in the art is within the protection scope of the present invention.
In a first embodiment of the substrate 3, as shown in fig. 4, the outer surface of the substrate 3 has a plurality of protrusions 300a spaced apart from each other, so that the side of the substrate 3 having the protrusions 300a forms the third surface 30. The cross-sectional shape of each protrusion 300a is not limited to the arc shape shown in the drawings, but may be triangular, rectangular, trapezoidal, and the like. The width of each protrusion 300a is tapered from the bottom to the top so that the first surface 10 of the radiation refrigeration layer 1 faces in a direction away from the third surface 30 when the radiation refrigeration layer 1 is disposed along the third surface 30.
In some embodiments, as shown in fig. 5, the ratio of the height (H) of the projection 300a to the width (L) of the bottom surface thereof is (1:20) to (2: 1). In other preferred embodiments, the ratio of the height (H) of the projection 300a to the width (L) of the bottom surface thereof is (1:10) to (1: 1.5). In yet other more preferred embodiments, the ratio of the height (H) of the projection 300a to the width (L) of the bottom surface thereof is (1:2) to (1: 1).
In a second embodiment of the substrate 3, as shown in fig. 6, the outer surface of the substrate 3 has a plurality of grooves 300b spaced apart from each other, so that the side of the substrate 3 where the grooves 300b are disposed forms the third surface 30. The cross-sectional shape of each groove 300b is not limited to the arc shape shown in the drawings, but may be triangular, rectangular, trapezoidal, and the like. Preferably, the inner width of each groove 300b becomes gradually larger from the bottom to the top, so that the first surface 10 of the radiation refrigerating layer 1 faces a direction away from the third surface 30 when the radiation refrigerating layer 1 is disposed along the third surface 30.
In some embodiments, as shown in fig. 7, the ratio of the depth (H) of the groove 300b to the width (L) of the opening thereof is (1:20) to (2: 1). In other embodiments, the ratio of the depth of the groove 300b to the width of its opening is (1:10) - (1: 1.5). In other embodiments, the ratio of the depth of the groove 300b to the width of the opening thereof is (1:2) to (1: 1).
Further, the groove 300b is a through groove having both ends communicating with the outside.
In a third embodiment of the substrate 3, as shown in fig. 8, the outer surface of the substrate 3 has a plurality of protrusions 300a arranged in series, so that the side of the substrate 3 on which the protrusions 300a are arranged forms the third surface 30.
In the fourth embodiment of the substrate 3, as shown in fig. 9, the outer surface of the substrate 3 has a plurality of continuously disposed grooves 300b, so that the side of the substrate 3 where the grooves 300b are disposed forms the third surface 30.
In some embodiments, the protrusions 300a or the grooves 300b of the outer surface of the substrate 3 have a bar shape, as shown in fig. 10. Preferably, the protrusions 300a or the grooves 300b are parallel to each other and uniformly distributed.
In other embodiments, the protrusions 300b or the grooves 300b on the outer surface of the substrate 3 are distributed in an array, as shown in fig. 11. Preferably, the protrusions 300a or the grooves 300b are uniformly distributed.
In some embodiments, other functional layers are also disposed between the substrate 3 and the radiation refrigerating layer 2.
In some embodiments, an adhesive layer (not shown) is disposed between the substrate 3 and the radiation refrigerating layer 2, and the adhesive layer is used for connecting the substrate 3 and the radiation refrigerating layer 2.
In some embodiments, a reflective layer (not shown) is further disposed between the substrate 3 and the radiation refrigerating layer 2, the reflective layer has a reflectivity of more than 60% to infrared light, and the reflective layer mainly plays a role of reflective heat insulation. The reflective layer can be a metal coating (e.g., Al layer, Ag layer, etc.), ceramic coating (e.g., Al)2O3、TiO2Etc.) or contain reflective particles (e.g. TiO)2、SiO2) The film layer of (2). The preparation method of the reflective layer can refer to the prior art, and the invention is not repeated. Preferably, the reflective layer has a reflectance of visible light and near infrared light of more than 80%.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.
Claims (9)
1. A radiant cooling structure comprising a radiant cooling layer, wherein said radiant cooling layer has an undulating first surface;
the radiation refrigeration structure further comprises a protective layer, the protective layer is arranged above the first surface, and the outer surface of the protective layer is a flat second surface;
the radiation refrigeration structure further comprises a substrate, the substrate is provided with a third surface with an elevation, and the radiation refrigeration layer is arranged between the substrate and the protective layer along the contour of the third surface, so that the radiation refrigeration layer forms the elevation structure.
2. A radiation cooling structure according to claim 1, wherein an inner surface of the protective layer is partially connected to the first surface, the protective layer and the first surface forming a void therebetween; or the protective layer is not contacted with the first surface at all, and a gap is formed between the protective layer and the first surface.
3. A radiation cooling structure as recited in claim 1, wherein said protective layer has a visible and near infrared transmittance greater than 80%, and a transmittance of said protective layer to electromagnetic waves in the 7-14 μm wavelength band greater than 80%.
4. A radiation cooling structure according to claim 1, wherein the emissivity of the radiation cooling layer is 70% to 100% in the wavelength range of 7 μm to 14 μm, the radiation cooling layer comprising a substrate and radiation cooling particles dispersed in the substrate, the radiation cooling particles being selected from one or more of the following: SiC, SiO2、Si3N4、TiO2、BaSO4、CaCO3The particle size of the radiation refrigeration particles is 1-30 mu m.
5. A radiation cooling structure according to claim 1, wherein the outer surface of said substrate has a plurality of protrusions arranged in a spaced or continuous manner, such that the side of said substrate having said protrusions forms said third surface, the width of each of said protrusions being tapered from bottom to top; or the outer surface of the substrate is provided with a plurality of grooves which are arranged at intervals or continuously, so that the side of the substrate provided with the grooves forms the third surface, and the internal width of each groove is gradually increased from the bottom to the top.
6. A radiation cooling structure according to claim 5, wherein the cross-sectional shape of the projection or the groove is arc-shaped, triangular, rectangular or trapezoidal.
7. A radiation cooling structure according to claim 5, wherein said projections or said recesses are strip-shaped, and wherein said projections or said recesses are mutually parallel and evenly distributed.
8. A radiation cooling structure according to claim 5, wherein the ratio of the height of the projection to the width of the bottom face thereof is (1:20) to (2: 1); or the ratio of the depth of the groove to the width of the opening of the groove is (1:20) - (2: 1).
9. A radiation cooling structure according to claim 5, wherein a reflective layer is provided between the substrate and the radiation cooling layer, the reflective layer having a reflectivity for visible and near infrared light of greater than 60%.
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| CN201920426003.XU CN210602331U (en) | 2019-03-29 | 2019-03-29 | Radiation refrigeration structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110030760A (en) * | 2019-03-29 | 2019-07-19 | 宁波瑞凌新能源科技有限公司 | A kind of radiation refrigeration structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110030760A (en) * | 2019-03-29 | 2019-07-19 | 宁波瑞凌新能源科技有限公司 | A kind of radiation refrigeration structure |
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