CN210590547U - Cooling device of film blowing machine - Google Patents

Cooling device of film blowing machine Download PDF

Info

Publication number
CN210590547U
CN210590547U CN201921259571.1U CN201921259571U CN210590547U CN 210590547 U CN210590547 U CN 210590547U CN 201921259571 U CN201921259571 U CN 201921259571U CN 210590547 U CN210590547 U CN 210590547U
Authority
CN
China
Prior art keywords
heat
heat transfer
transfer bottle
air pump
cooling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201921259571.1U
Other languages
Chinese (zh)
Inventor
王逸飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Zhenfei New Packaging Material Co Ltd
Original Assignee
Wuxi Zhenfei New Packaging Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi Zhenfei New Packaging Material Co Ltd filed Critical Wuxi Zhenfei New Packaging Material Co Ltd
Priority to CN201921259571.1U priority Critical patent/CN210590547U/en
Application granted granted Critical
Publication of CN210590547U publication Critical patent/CN210590547U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The utility model provides a cooling device of inflation film manufacturing machine, includes thermal-insulated bucket, several heat transfer bottle and air pump, thermal-insulated bucket include the staving and with staving threaded connection's end cover, the heat transfer bottle is located inside the thermal-insulated bucket, the semiconductor refrigeration piece has been rabbeted in the position that the clearance between the inner wall of staving and the heat transfer bottle is just right, the terminal surface that gives out heat of semiconductor is connected with staving inner wall, the air pump is established on the end cover top. The heat transfer bottle and the air pump are connected through a pipeline. The heat transfer bottle is arranged in the heat insulation barrel and is used for containing nitrogen. The heat release end face of the semiconductor refrigeration sheet is embedded on the inner wall of the barrel body, and the heat in the heat insulation barrel is conducted to the inner wall of the barrel body through the heat release end face, so that the temperature in the heat insulation barrel is convenient to reduce. The air pump is arranged at the top end of the end cover, so that the nitrogen is reduced from being conveyed for a long distance, the temperature of the nitrogen is obviously increased under the influence of the ambient temperature, and the loss of cold energy in the transmission process is reduced. The distances between the heat transfer bottles and the corresponding semiconductor refrigerating sheets are equal, the temperature difference of nitrogen is small, and the influence on the cooling effect is small.

Description

Cooling device of film blowing machine
Technical Field
The utility model belongs to the technical field of the technique that relates to a cooling device of inflation film manufacturing machine is especially related to.
Background
Can produce a large amount of heats in the inflation film manufacturing machine working process and make the plastic film take place to warp, influence production efficiency in order to reduce the deformation of plastic film, need cool off the product of inflation film manufacturing machine.
At present, Chinese patent with publication number CN206426458U discloses a cooling device of a film blowing machine, which comprises a water tank, a gas cylinder filled with nitrogen and an air pump, wherein a semiconductor refrigerating sheet is embedded on the inner wall of the water tank, the hot end surface of the semiconductor refrigerating sheet is embedded in the water tank, the gas cylinder is positioned in the water tank, the gas cylinder is connected with an exhaust pipe and a gas return pipe connected with an exhaust port of a cold air ring of a die head of the film blowing machine, the exhaust pipe is connected with an exhaust nozzle of the air pump, and the exhaust nozzle of the air pump is connected with an exhaust pipe connected with an air inlet connected with the cold air ring; the cooling device of the film blowing machine is small in size.
The semiconductor refrigeration piece is established on the side of water tank for the gas cylinder at middle part is the farthest with the distance of semiconductor refrigeration piece, and the temperature at water tank middle part is higher than the water temperature of marginal part, and the nitrogen gas temperature in the gas cylinder at both ends is less than the nitrogen gas temperature in the gas cylinder at middle part, and the cold and hot inequality of temperature of nitrogen gas influences the cooling effect.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a cooling device of inflation film manufacturing machine, it has that the nitrogen gas difference in temperature is less, influences less advantage to the cooling effect.
The above technical purpose of the present invention can be achieved by the following technical solutions:
the utility model provides a cooling device of inflation film manufacturing machine, including thermal-insulated bucket, several heat transfer bottle and air pump, thermal-insulated bucket include cylindric staving and with staving threaded connection's end cover, the heat transfer bottle is located and is insulated the bucket inside, it has the semiconductor refrigeration piece to scarf joint on the just right position in clearance between the inner wall of staving and the heat transfer bottle, the terminal surface and the staving internal wall connection of giving out heat of semiconductor refrigeration piece, the air pump is established on the end cover top, connect through the intermediate pipe of wearing in inside between the heat transfer bottle, through the intake-tube connection who passes the end cover between heat transfer bottle and the inflation film manufacturing machine, be connected through the outlet duct that passes the end cover between heat transfer bottle and the air pump.
Through adopting above-mentioned technical scheme, heat transfer bottle is arranged in insulating the bucket, and heat transfer bottle is used for holding nitrogen gas, and the air pump is established on insulating the bucket for carry nitrogen gas. The barrel body and the end cover can be connected or disassembled, so that the maintenance of the heat transfer bottle and the bearing device and the nitrogen supplement of the heat transfer bottle are facilitated. The heat release end face of the semiconductor refrigeration sheet is embedded on the inner wall of the barrel body, and the heat in the heat insulation barrel is conducted to the inner wall of the barrel body through the heat release end face, so that the temperature in the heat insulation barrel is convenient to reduce. The air pump is arranged at the top end of the end cover and is close to the heat transfer bottle, so that the nitrogen is conveyed in a long distance, the nitrogen temperature is obviously increased under the influence of the ambient temperature, and the cold loss in the transmission process is reduced. The distances between the heat transfer bottles and the corresponding semiconductor refrigerating sheets are equal, the temperature difference of nitrogen is small, and the influence on the cooling effect is small.
The utility model discloses further set up to: the heat insulation barrel is internally provided with a bearing device, the bearing device comprises a bearing plate and a support frame fixedly connected with the bearing plate, the support frame comprises a main body frame and a limiting frame fixedly connected with the main body frame, the bearing plate is of a hollow structure, the limiting frame is parallel to the bearing plate, the main body frame is perpendicular to the bearing plate, and the heat transfer bottle is arranged on the bearing plate and is parallel to the main body frame.
Through adopting above-mentioned technical scheme, bear the device and be used for stabilizing the position of heat transfer bottle, the hollow out construction's of loading board setting is convenient for bear the device and is put the in-process in aqueous and reduce the resistance of water to the loading board, reduces the condition that water spills over, and the setting of the structure of support frame not only is convenient for the staff to carry and draws and to bear the device and also makes the heat transfer bottle can stably place in thermal-insulated bucket. The structure of the bearing device is convenient for the relevant operation of the bearing device by the working personnel, and the working efficiency of the working personnel is improved.
The utility model discloses further set up to: and a disturbance device is arranged in the limiting frame and comprises a disturbance rod and disturbance blades fixedly connected with the disturbance rod, and the disturbance blades are radially arranged along the disturbance rod and rotate for a certain angle.
Through adopting above-mentioned technical scheme, the disturbance device rotates, drives water and rotates, strengthens the thermal transmission effect between semiconductor refrigeration piece and the water, between water and the heat transfer bottle, reduces the difference in temperature, improves cooling device's cooling effect.
The utility model discloses further set up to: and annular fins are arranged outside the heat transfer bottle.
Through adopting above-mentioned technical scheme, the fin strengthens the heat exchange of heat transfer bottle and water, reduces the difference in temperature of water and nitrogen gas, improves cooling device's cooling effect.
The utility model discloses further set up to: the structure of the heat insulation barrel is double-layer heat insulation aluminum alloy.
Through adopting above-mentioned technical scheme, thermal-insulated bucket has thermal-insulated effect, reduces the inside cold volume loss of thermal-insulated bucket, is convenient for reduce cooling device's energy loss, improves cooling device's work efficiency.
The utility model discloses further set up to: the outer wall of the barrel body close to one end of the end cover is provided with heat dissipation holes, the heat dissipation holes are connected with the oil retaining pieces through bolts, and the top ends of the retaining pieces are connected with the barrel body.
Through adopting above-mentioned technical scheme, the hot terminal surface setting of semiconductor refrigeration piece is on the staving inner wall, and the heat conducts the clearance of double-deck thermal-insulated aluminum alloy through the thermal-insulated aluminum alloy of inlayer in, discharges through the louvre. The staff detects the temperature of the wall surface of the barrel body, when the temperature of the inner wall of the barrel body is overhigh, the bottom end of the baffle plate is rotated, and heat is discharged through the heat dissipation holes; when the temperature of the inner wall of the barrel body is safe, the bottom end of the separation blade is rotated by a worker, so that the separation blade blocks the heat dissipation hole, and the heat dissipation is reduced. The arrangement of the heat dissipation holes is convenient for the barrel body to maintain normal temperature, and the safety of the device is improved.
The utility model discloses further set up to: and heat insulation cotton is arranged outside the heat insulation barrel.
Through adopting above-mentioned technical scheme, thermal-insulated cotton setting has strengthened the heat preservation effect of staving, is convenient for reduce cooling device's energy loss, improves cooling device's work efficiency.
The utility model discloses further set up to: the waterproof membrane is arranged outside the heat insulation cotton, and the thin steel plate used for being connected with the air pump is arranged on the waterproof membrane at the top end part of the end cover.
Through adopting above-mentioned technical scheme, the setting of waterproof membrane reduces the condition of thermal-insulated cotton and air contact, reduces the moist condition of thermal-insulated cotton, prolongs the live time of thermal-insulated cotton, improves cooling device's work efficiency. The arrangement of the thin steel plate reduces the damage of the air pump to the waterproof membrane when the air pump is connected to the top end of the heat insulation barrel, and prolongs the service life of the waterproof membrane.
To sum up, the utility model discloses a beneficial technological effect does:
1. through the arrangement of the heat insulation barrel, the heat transfer bottle, the air pump and the bearing device, the heat transfer bottle is arranged in the heat insulation barrel and is used for containing nitrogen, the bearing device is arranged in the heat insulation barrel and is used for stabilizing the position of the heat transfer bottle, the air pump is arranged on the heat insulation barrel and is used for conveying the nitrogen, and the semiconductor refrigeration sheets corresponding to the gaps of the heat transfer bottle are embedded and connected on the inner wall of the heat insulation barrel, so that the temperature difference of the nitrogen in different heat transfer bottles is small, and the influence on the cooling effect is small;
2. through the setting of disturbance device, the disturbance device includes the disturbance blade of disturbance pole and fixed connection, and the disturbance blade rotates the disturbance pole along the radial setting and the certain angle of rotation of disturbance pole, can increase the flow of water, strengthens between semiconductor refrigeration piece and the water, the thermal transmission between water and the heat transfer bottle, reduces the difference in temperature, is convenient for improve cooling device's cooling effect.
Drawings
FIG. 1 is a schematic view of the overall structure of the embodiment;
FIG. 2 is a schematic diagram of the internal structure of the heat transfer bottle of FIG. 1;
FIG. 3 is a schematic diagram of the structure of FIG. 1 for embodying a load bearing apparatus;
FIG. 4 is a schematic diagram of the structure of FIG. 1 for embodying a perturbation device;
fig. 5 is a schematic view for embodying the heat-insulating tub and its external structure in fig. 1.
In the figure, 1, a heat insulation barrel; 11. a barrel body; 111. heat dissipation holes; 112. a baffle plate; 12. an end cap; 13. a semiconductor refrigeration sheet; 2. a heat transfer bottle; 21. an air inlet pipe; 22. an intermediate pipe; 23. an air outlet pipe; 24. a fin; 3. a carrying device; 31. a carrier plate; 32. a support frame; 321. a main body frame; 322. a limiting frame; 4. an air pump; 41. an exhaust pipe; 5. a perturbation device; 51. a disturbance rod; 52. disturbing the blades; 6. heat insulation cotton; 7. a water-resistant film; 71. a thin steel sheet.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Example (b):
the utility model discloses a cooling device of inflation film manufacturing machine, like figure 1, cool off through carrying the nitrogen gas of lower temperature, including thermal-insulated bucket 1, four heat transfer bottles 2, air pump 4 and bear device 3, thermal-insulated bucket 1 includes staving 11 and threaded connection's end cover 12, and the scarf joint of thermal-insulated 1 inner wall of bucket has semiconductor refrigeration piece 13, and the inner wall of thermal-insulated bucket 1 is level and smooth with the part of 13 contacts of semiconductor refrigeration piece, and semiconductor refrigeration piece 13 is just right with the clearance of heat transfer bottle 2, and end cover 12 top is located to air pump 4. The heat transfer bottle 2, the air pump 4 and the film blowing machine are connected through pipelines. The nitrogen flow direction is as follows: from the heat transfer bottle 2 to the air pump 4. The distribution positions of the semiconductor refrigerating pieces 13 can enable nitrogen to be uniformly cooled, and the cooling effect of the nitrogen is enhanced.
As shown in fig. 1, the heat transfer bottles 2 are connected through the middle pipe 22 penetrating inside, the air inlet end of the middle pipe 22 is close to the top end of the heat transfer bottle 2, the air outlet end of the middle pipe is close to the bottom end of the heat transfer bottle 2, the heat transfer bottle 2 is connected with the film blowing machine through the air inlet pipe 21 penetrating through the end cover 12, the air inlet pipe 21 penetrates into the heat transfer bottle 2 and is close to the bottom of the heat transfer bottle 2, the heat transfer bottle 2 is connected with the air pump 4 through the air outlet pipe 23 penetrating through the end cover 12, the air outlet pipe 23 penetrates into the heat transfer bottle 2 and is close to the top of the heat transfer bottle 2. The arrangement of the middle pipe 22, the air inlet pipe 21 and the air outlet pipe 23 facilitates the circulation of nitrogen in the heat transfer bottle 2, reduces the deposition and difficult circulation of nitrogen in the heat transfer bottle 2, and improves the efficiency of the cooling device.
As shown in fig. 2, fins 24 are arranged outside the heat transfer bottle 2, the fins 24 are vertically and fixedly connected to the side wall of the heat transfer bottle 2 in a circular ring shape, the fins 24 are arranged to enhance the heat transfer effect between water and the side wall of the heat transfer bottle 2, the temperature difference between water and nitrogen is reduced, the heat exchange effect is enhanced, and the working efficiency of the refrigerating device is improved.
As shown in fig. 2 and 3, a bearing device 3 is arranged in the barrel body 11, the bearing device 3 comprises a bearing plate 31 and a supporting frame 32 fixedly connected with the bearing plate 31, the supporting frame 32 comprises a main body frame 321 and a limiting frame 322 fixedly connected with the main body frame 321, the bearing plate 31 is of a hollow structure, the limiting frame 322 is parallel to the bearing plate 31, the main body frame 321 is perpendicular to the bearing plate 31, the heat transfer bottle 2 is placed on the bearing plate 31, the heat transfer bottle 2 is located between the main body frames 321, the limiting frame 322 is close to the heat transfer bottle 2 and used for stabilizing the position of the heat transfer bottle 2, the stability of the heat transfer bottle 2 is improved, the maintenance frequency of the cooling device is reduced.
As shown in fig. 3 and 4, a disturbing device 5 is arranged in the limiting frame 322, the disturbing device 5 is driven by a motor, the disturbing device 5 comprises a disturbing rod 51 and a disturbing blade 52, the disturbing rod 51 is fixedly connected with the disturbing blade 52, and the disturbing blade 52 is radially arranged along the disturbing rod 51 and rotates for a certain angle, so that the disturbing effect of the disturbing device 5 on water is conveniently enhanced, the heat exchange effect is enhanced, and the working efficiency of the cooling device is improved.
As shown in fig. 5, the heat-insulating tub 1 is formed of double-layered heat-insulating aluminum alloy sheets having a hollow space therebetween for receiving air of a relatively high temperature. The terminal surface that releases heat of semiconductor refrigeration piece 13 contacts with the thermal-insulated aluminum alloy plate of inlayer, and the heat conducts on the thermal-insulated aluminum alloy plate from the terminal surface that releases heat to the air between the two-layer thermal-insulated aluminum alloy plate of heating. The arrangement of the double-layer heat-insulation aluminum alloy plate not only disperses the heat transferred by the semiconductor refrigerating sheet 13, but also plays a role in heat insulation and heat preservation on water, reduces the loss of cold energy and improves the working efficiency of the cooling device.
As shown in fig. 5, the outer wall of the barrel 11 near one end of the end cover 12 is provided with heat dissipation holes 111, so that heat dissipation of high-temperature air between two layers of heat-insulating aluminum alloy plates is facilitated, accumulation of heat transferred by the semiconductor refrigerating sheet 13 for a long time on the wall of the heat-insulating barrel is reduced, and the use safety of the cooling device is improved.
As shown in FIG. 5, a blocking piece 112 is disposed at the heat dissipation hole 111, and the top end of the blocking piece 112 is connected to the sidewall of the barrel 11 through a bolt. The temperature of the heat insulation barrel 1 is measured by a worker through a thermometer, and when the heat insulation barrel 1 needs to be radiated, the worker rotates the blocking piece 112 to enable the heat radiation hole 111 to be communicated with the air outside the heat insulation barrel 1; after the heat dissipation is completed, the worker rotates the bottom end of the blocking sheet 112, so that the blocking sheet 112 blocks the heat dissipation hole 111, and the heat dissipation at the heat insulation barrel 1 (see fig. 1) is reduced. The heat dissipation holes 111 are convenient to open and close, and the safety and the operation convenience of the cooling device are improved.
As shown in the figures 1 and 5, the heat insulation cotton 6 is bonded outside the heat insulation barrel 1, the heat insulation cotton 6 is arranged on the outer walls of the barrel body 11 and the end cover 12, the heat insulation cotton 6 strengthens the heat insulation effect when the heat dissipation holes 111 on the heat insulation barrel 1 are closed, and the dissipation of cold energy in the heat insulation barrel 1 is reduced. The waterproof film 7 is bonded outside the heat insulation cotton 6, so that the condition that the heat insulation cotton 6 is wetted by moisture in the air is reduced, the service life of the heat insulation cotton 6 is prolonged, and the working efficiency of the cooling device is improved.
Referring to fig. 1, a thin steel plate 71 is provided on the waterproof film 7 on the top end of the end cap 12, and the air pump 4 is bolted to the end cap 12 through the thin steel plate 71. The air pump 4 is close to the heat transfer bottle 2, so that the condition that the temperature of cold nitrogen is influenced by the surrounding environment during long-distance conveying is reduced, the cold consumption is reduced, and the working efficiency of the cooling device is improved.
The specific implementation mode is as follows: unscrewing the end cover 12, placing the bearing device 3, placing the heat transfer bottle 2, connecting the air inlet pipe 21, the middle pipe 22 and the air outlet pipe 23, adding water into the barrel body 11, screwing the end cover 12, connecting the air pump 4 to the end cover 12 through the thin steel plate 71 by using a bolt, connecting the air outlet pipe 23 and the exhaust pipe 41 to the air pump 4, starting the semiconductor refrigerating sheet 13 and the air pump 4, and after the work is finished, closing the air pump 4 and the semiconductor refrigerating sheet 13.
The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.

Claims (8)

1. The utility model provides a cooling device of inflation film manufacturing machine which characterized in that: comprises a heat-insulating barrel (1), several heat transfer bottle (2) and air pump (4), heat-insulating bucket (1) is including cylindric staving (11) and with staving (11) threaded connection's end cover (12), heat transfer bottle (2) are located inside heat-insulating bucket (1), it has semiconductor refrigeration piece (13) to scarf joint on the position that the clearance between the inner wall of staving (11) and heat transfer bottle (2) is just right, the terminal surface that gives out heat of semiconductor refrigeration piece (13) is connected with the inner wall of staving (11), air pump (4) are established on the top of end cover (12), connect through middle tube (22) of wearing inside between heat transfer bottle (2), connect through intake pipe (21) that pass end cover (12) between heat transfer bottle (2) and the inflation film manufacturing machine, connect through outlet duct (23) that pass end cover (12) between heat transfer bottle (2) and the air pump (4), connect through blast pipe (41) between air pump (4) and the inflation film manufacturing machine.
2. The cooling device of the film blowing machine according to claim 1, characterized in that: the inside of heat-insulating bucket (1) is equipped with load-bearing device (3), load-bearing device (3) including loading board (31) and with loading board (31) fixed connection's support frame (32), support frame (32) including main part frame (321) and with main part frame (321) fixed connection's spacing (322), loading board (31) are hollow out construction, spacing (322) are parallel with loading board (31), main part frame (321) perpendicular to loading board (31), heat transfer bottle (2) are located on loading board (31) and are parallel with main part frame (321).
3. The cooling device of the film blowing machine according to claim 2, characterized in that: be equipped with disturbance device (5) in spacing (322), disturbance device (5) include disturbance pole (51) and fixed connection's disturbance blade (52), and disturbance blade (52) radially set up and rotatory certain angle along disturbance pole (51).
4. The cooling device of the film blowing machine according to claim 1, characterized in that: an annular fin (24) is arranged outside the heat transfer bottle (2).
5. The cooling device of the film blowing machine according to claim 1, characterized in that: the heat insulation barrel (1) is made of double-layer heat insulation aluminum alloy.
6. The cooling device of the film blowing machine according to claim 5, characterized in that: the outer wall of one end, close to the end cover (12), of the barrel body (11) is provided with heat dissipation holes (111), the heat dissipation holes (111) are connected with the blocking piece (112) through bolts, and the top end of the blocking piece (112) is connected with the barrel body (11).
7. The cooling device of the film blowing machine according to claim 6, characterized in that: and heat insulation cotton (6) is arranged outside the heat insulation barrel (1).
8. The cooling device of the film blowing machine according to claim 7, characterized in that: a waterproof membrane (7) is arranged outside the heat insulation cotton (6), and a thin steel plate (71) used for connecting the air pump (4) is arranged on the waterproof membrane (7) at the top end part of the end cover (12).
CN201921259571.1U 2019-08-05 2019-08-05 Cooling device of film blowing machine Active CN210590547U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921259571.1U CN210590547U (en) 2019-08-05 2019-08-05 Cooling device of film blowing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921259571.1U CN210590547U (en) 2019-08-05 2019-08-05 Cooling device of film blowing machine

Publications (1)

Publication Number Publication Date
CN210590547U true CN210590547U (en) 2020-05-22

Family

ID=70715857

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921259571.1U Active CN210590547U (en) 2019-08-05 2019-08-05 Cooling device of film blowing machine

Country Status (1)

Country Link
CN (1) CN210590547U (en)

Similar Documents

Publication Publication Date Title
CN205784091U (en) A kind of highly efficient cooling device of mould
CN206668510U (en) A kind of waste heat recovery system of air compressor
CN207849893U (en) A kind of chemical products cooling device for processing
CN206376997U (en) A kind of high efficiency and heat radiation formula vavuum pump
CN210590547U (en) Cooling device of film blowing machine
CN202119222U (en) Device for heating by recovering waste heat of air compressor
CN204897980U (en) Quench with forced air cooling bucket
CN211876556U (en) Environment-friendly energy-saving drying device
CN212339721U (en) Methanol production circulating water cooling system
CN104776664B (en) Multifunctional refrigeration and insulation can
CN207556061U (en) A kind of food samming fresh-keeping ice house
CN208366106U (en) A kind of equipment cooling tower
CN212822621U (en) Forced cooling device for aluminum alloy casting
CN211872327U (en) Split type multilayer structure shell ball rolling machine
CN208833041U (en) A kind of aerial cooler
CN208939764U (en) A kind of motor evaporation cooling construction
CN105910383A (en) Red wine cabinet based on semiconductor refrigeration pieces
CN111829369A (en) Energy-saving environment-friendly radiator
CN207556054U (en) Semiconductor refrigerating distribution box
CN210664048U (en) Heat exchange device for refrigerator
CN206208056U (en) The dry colling device of dual countercurrent treatment high-temp waste gas
CN205718537U (en) Cooling tower and cooling system
CN216844873U (en) Heat supply energy-saving heating and ventilation equipment for whole machine
CN104534860A (en) Efficient insulation box wall of impregnated paper drying box
CN104499340A (en) Thermal insulation wall unit of impregnated paper drying box

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant