CN210579107U - Earclip type bone listening intelligent earphone - Google Patents
Earclip type bone listening intelligent earphone Download PDFInfo
- Publication number
- CN210579107U CN210579107U CN201920803777.XU CN201920803777U CN210579107U CN 210579107 U CN210579107 U CN 210579107U CN 201920803777 U CN201920803777 U CN 201920803777U CN 210579107 U CN210579107 U CN 210579107U
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- earphone
- column
- listening
- bone
- earclip
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Abstract
The utility model discloses an ear clip type bone-listening intelligent earphone, which comprises an earphone body; the ear clip is connected with the earphone body through a metal connecting component which can rotate around the connecting column; the earphone controller is connected with the earphone connecting wire of the earphone body in a pluggable manner; the bone conduction module is arranged on the earphone body; wherein, metal coupling assembling includes: a first fixing column with one end connected with the ear clip; the connecting column is arranged at the far ear clamp end of the first fixing column; one end of the second fixing column is connected with the earphone body, and the other end of the second fixing column is sleeved on the connecting column; the elastic shell is sleeved on the first fixing column and the second fixing column. Through connecting earphone body and ear clip through metal connecting components, can come laminating concha chamber cartilage position according to different wearers' ear sizes, make the osteoacusis module function on the earphone body reach ideal effect, the ear clip formula increases the stability of wearing moreover, makes the wearer be difficult for dropping in daily activity.
Description
Technical Field
The utility model relates to a bone conduction earphone technical field especially relates to an intelligent earphone is listened to ear clip formula bone.
Background
The existing hearing aids are generally earplug type hearing aids, and when the existing hearing aids are worn, hearing aids are inserted into ears by earplug parts, so that the existing hearing aids are very easy to fall off in the wearing process and have poor fitting effect with the ears, and therefore the existing technology needs to be improved.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides an intelligent earphone is listened to ear clip formula bone solves current earplug audiphone, and it is worn and is packed into the ear and carry out the hearing aid by earplug part, and this just leads to wearing the in-process and very easily drops, moreover with the not good technical problem of ear laminating effect.
According to the utility model discloses an embodiment provides an intelligent earphone is listened to earclip formula bone, wherein, include:
an earphone body;
the ear clip is connected with the earphone body through a metal connecting component capable of rotating around a connecting column;
the earphone controller is connected with the earphone connecting wire of the earphone body in a pluggable manner;
the bone conduction module is arranged on the earphone body;
wherein, the metal coupling assembling includes:
one end of the first fixing column is connected with the ear clip;
the connecting column is arranged at the far ear clamp end of the first fixing column;
one end of the second fixing column is connected with the earphone body, and the other end of the second fixing column is sleeved on the connecting column;
the elastic shell is sleeved on the first fixing column and the second fixing column;
the headphone controller includes:
a controller body;
a circuit board disposed within the controller body;
the bone conduction module is connected with the MCU control chip through the earphone connecting wire;
the voice recognition chip is arranged on the circuit board and connected with the MCU control chip;
the microphone is arranged on the controller body and connected with the MCU control chip;
the low-power-consumption Bluetooth module is arranged on the circuit board and connected with the MCU control chip.
The intelligent earphone is listened to earclip formula bone, wherein, first fixed column includes:
a first fixed column housing;
a plurality of recesses disposed on a distal ear clip end of said first stationary post housing;
the first through hole of spliced pole of setting on first fixed column shell.
The intelligent earphone is listened to earclip formula bone, wherein, the second fixed column includes:
a second fixed column housing;
the spring structure is arranged at the far earphone body end of the second fixed column shell and is positioned in the second fixed column shell, and the front end of the spring structure is matched with each groove;
and the connecting column second through hole is formed in the second fixed column shell.
Ear clip formula bone listen intelligent earphone, wherein, the spring structure includes:
a fixing piece fixedly arranged in the second fixing column shell;
a spring disposed on the fixing plate;
and part of the outer wall is provided with a spring connecting column sleeved with the spring.
The earclip type bone-listening intelligent earphone is characterized in that a circuit board is further provided with 3 keys which are respectively marked as an answering key, a volume increasing key and a volume decreasing key.
The earclip type bone-listening intelligent earphone is characterized in that the circuit board is further provided with a storage module, and the storage module is connected with the MCU control chip.
The intelligent earphone is listened to ear clip formula bone, wherein, still be provided with the pilot lamp on the controller body, the pilot lamp with MCU control chip connects.
Ear clip formula bone listen intelligent earphone, wherein, the bone conduction module includes:
a bone conduction vibrator;
the audio amplification circuit is connected with the microphone and is used for amplifying the sound electric wave signals collected by the microphone;
the filter circuit is connected with the audio amplification circuit and is used for filtering clutter;
and the bone conduction driving chip is connected with the filter circuit and is used for driving the bone conduction vibrator, and the bone conduction driving chip is connected with the bone conduction vibrator.
The utility model provides an ear clip type bone-listening intelligent earphone, which comprises an earphone body; the ear clip is connected with the earphone body through a metal connecting component capable of rotating around a connecting column; the earphone controller is connected with the earphone connecting wire of the earphone body in a pluggable manner; the bone conduction module is arranged on the earphone body; wherein, the metal coupling assembling includes: one end of the first fixing column is connected with the ear clip; the connecting column is arranged at the far ear clamp end of the first fixing column; one end of the second fixing column is connected with the earphone body, and the other end of the second fixing column is sleeved on the connecting column; the elastic shell is sleeved on the first fixing column and the second fixing column; the headphone controller includes: a controller body; a circuit board disposed within the controller body; the bone conduction module is connected with the MCU control chip through the earphone connecting wire; the voice recognition chip is arranged on the circuit board and connected with the MCU control chip; the microphone is arranged on the controller body and connected with the MCU control chip; the low-power-consumption Bluetooth module is arranged on the circuit board and connected with the MCU control chip. Through connecting earphone body and ear clip through metal connecting components, can come laminating concha chamber cartilage position according to different wearers' ear sizes, make the osteoacusis module function on the earphone body reach ideal effect, the ear clip formula increases the stability of wearing moreover, makes the wearer be difficult for dropping in daily activity.
Drawings
Fig. 1 is a schematic structural view of an ear clip type bone listening intelligent earphone according to the present invention;
fig. 2 is a schematic view of a partial structure of an ear clip type bone listening intelligent earphone according to the present invention;
fig. 3a is a schematic structural view of the closed state of the middle ear clip of the intelligent ear clip type bone-listening earphone according to the present invention;
fig. 3b is a schematic cross-sectional view illustrating an expanded state of an ear clip of the intelligent ear-clip type ossiphone earphone of the present invention;
fig. 3c is a schematic structural view of the closed state of the middle ear clip of the intelligent ear clip type bone-listening earphone according to the present invention;
fig. 3d is a schematic cross-sectional view illustrating an expanded state of an ear clip of the intelligent ear-clip type ossiphone earphone of the present invention;
fig. 4 is a block diagram of the ear clip type bone listening intelligent earphone of the present invention.
Detailed Description
The utility model provides an intelligent earphone is listened to ear clip formula bone, for making the utility model discloses a purpose, technical scheme and effect are clearer, clear and definite, and it is right that the following reference is made with the drawing and the example the utility model discloses further detailed description. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Please refer to fig. 1-4, wherein fig. 1 is a schematic structural diagram of an intelligent ear clip type bone-listening earphone according to the present invention; fig. 2 is a schematic view of a partial structure of an ear clip type bone listening intelligent earphone according to the present invention; fig. 3a is a schematic structural view of the closed state of the middle ear clip of the intelligent ear clip type bone-listening earphone according to the present invention; fig. 3b is a schematic cross-sectional view illustrating an expanded state of an ear clip of the intelligent ear-clip type ossiphone earphone of the present invention; fig. 3c is a schematic structural view of the closed state of the middle ear clip of the intelligent ear clip type bone-listening earphone according to the present invention; fig. 3d is a schematic cross-sectional view illustrating an expanded state of an ear clip of the intelligent ear-clip type ossiphone earphone of the present invention; fig. 4 is a block diagram of the ear clip type bone listening intelligent earphone of the present invention. As shown in fig. 1 to 4, the earclip-type bone-listening intelligent earphone comprises:
an earphone body 100;
an ear clip 300 connected to the earphone body 100 through a metal connecting member 200 rotatable around a connecting post;
an earphone controller 400 connected to the earphone connection line 110 of the earphone body 100 in a pluggable manner;
a bone conduction module 500 disposed on the earphone body 100;
wherein the metal connection assembly 200 includes:
a first fixing post 210 having one end connected to the ear clip 300;
a connecting column 220 disposed at the distal ear clip end of the first fixing column 210;
a second fixing post 230 having one end connected to the earphone body 100 and the other end sleeved on the connection post 220;
an elastic housing 240 sleeved on the first fixing post 210 and the second fixing post 230;
the headphone controller 400 includes:
a controller body 410;
a circuit board 420 disposed within the controller body;
the bone conduction module 500 is connected with the MCU control chip 420 through the earphone connecting wire 110;
the voice recognition chip 422 is arranged on the circuit board 420, and the voice recognition chip 422 is connected with the MCU control chip 421;
a microphone 423 arranged on the controller body 410, wherein the microphone 423 is connected with the MCU control chip 421;
the bluetooth low energy module 424 is arranged on the circuit board 420, and the bluetooth low energy module 424 is connected with the MCU control chip 421.
In this embodiment, bluetooth low energy module 424 is connected with the bluetooth module communication in the smart mobile phone (at this moment, can with the smart mobile phone is listened to earclip formula bone and a bluetooth headset is regarded as), when having the phone call on the smart mobile phone, answer the back, after the speech information that bluetooth low energy module 424 received is analyzed sound electric wave signal, turn into the bone conduction mode with sound electric wave signal through bone conduction module 500, directly get into brain auditory nerve through the solid mode of propagation with the vibration, conveniently listen the barrier person and answer the phone.
In the telephone conversation process, voice data of a hearing-impaired person (the user speaks to be a sound wave signal, namely an analog signal) is collected by the microphone 424, the voice data is converted into voice information (data which can be recognized by a machine, namely a digital signal) through the voice recognition chip 422, the voice information is transmitted to the Bluetooth module in the smart phone through the low-power-consumption Bluetooth module 424, and the smart phone sends the voice information to a target terminal which is in conversation, so that voice communication is realized.
Moreover, through being connected earphone body 100 and ear clip 300 adopt metal connecting component 200, can rely on metal connecting component 200 to form interact, this effort can be with the better laminating of the bone conduction module 500 on earphone body 100 cartilage behind the ear come the conduction sound. The resilient structure of the metal connecting assembly 200 has the function of defining an angle, i.e. open (fig. 3a and 3 c) and closed (fig. 3b and 3 d), which is open before being worn, closed when being worn and open when being removed.
In specific implementation, the elastic shell 240 of the ear clip 300 and the metal connecting component 200 is made of elastic soft skin-friendly material (e.g., silicone, resin), and has the functions of protecting and buffering the skin of the back of the ear.
Preferably, as shown in fig. 3a to 3d, in the smart earphone for ear-clip type bone listening, the first fixing pillar 210 includes:
a first stationary column housing 211;
a plurality of recesses 212 disposed on the distal ear clip end of said first stationary post housing 211;
a first through hole 213 provided on the first fixed column housing 211.
The second fixing posts 230 include:
a second stationary column housing 231;
a spring structure 232 disposed at the earphone body end of the second fixed column housing 231 and located in the second fixed column housing, wherein the front end of the spring structure 232 is fitted into each of the grooves 212;
and a connection column second through hole 233 provided on the second connection column housing 231.
In the embodiment of the present invention, the first fixing post 210 is configured to have a plurality of grooves 212, and the second fixing post 230 is configured to have a spring structure 232, so that the cartilage position of the concha cavity can be attached according to the sizes of ears of different users, and the function of the bone conduction module 500 on the earphone body 100 can achieve an ideal effect, and the ear clip type increases the wearing stability, so that the users are not easy to fall off during daily activities.
Preferably, as shown in fig. 3a to 3d, in the smart earclip-type bone-listening headset, the spring structure 232 includes:
a fixing plate 2321 fixedly arranged in the second fixing column housing;
a spring provided on the fixing plate 2322;
a spring connection post 2323 sleeved by the spring is arranged on part of the outer wall.
Set up spring structure 232 through above-mentioned mode, can effectively cooperate with first fixed column 210, realize the rotation of this part of metal connecting assembly 200 to the realization comes the laminating concha chamber cartilage position according to different wearers' ear sizes.
Preferably, as shown in fig. 1 and 4, in the earclip-type bone-listening intelligent earphone, the circuit board 420 is further provided with 3 keys, which are respectively marked as an answering key 4251, a volume increasing key 4252 and a volume decreasing key 4253.
That is, when there is incoming call to the smart phone, the user can answer the call through the answer key 4251 (the same as the answer process of controlling the phone of the smart phone through the bluetooth headset), and the volume can be quickly adjusted to be reduced through the volume increasing key 4252 and the volume reducing key 4253, so that the vibration amplitude of the bone conduction module 500 is controlled, and the use of the user with the hearing impairment is facilitated.
Preferably, as shown in fig. 4, in the earclip-type bone-hearing intelligent earphone, a memory module 426 is further disposed on the circuit board, and the memory module 426 is connected to the MCU control chip 421. By providing the storage module 426 on the circuit board 420, local audio files (such as music audio) can be stored for the hearing-impaired person to use the earclip-type bone-listening smart headset as an audio player for playing in a bone conduction manner.
Preferably, as shown in fig. 4, in the earclip-type bone-hearing smart earphone, an indicator light 427 is further disposed on the controller body 410, and the indicator light 427 is connected to the MCU control chip 421.
Through be provided with pilot lamp 427 on controller body 410, can flicker in order to carry out light suggestion (especially adapted light darker use scene, if use night) when having the incoming call, the suggestion listens barrier person user and has the incoming call.
Preferably, as shown in fig. 1 and 4, in the earclip-type intelligent bone-listening earphone, the bone conduction module 500 includes:
a bone conduction vibrator 510;
an audio amplifier circuit 520 connected to the microphone 423 and configured to amplify the sound wave signal collected by the microphone;
a filter circuit 530 connected to the audio amplifier circuit 520 for filtering out noise;
and a bone conduction driving chip 540 connected to the filter circuit 530 for driving the bone conduction transducer 510, wherein the bone conduction driving chip 540 is connected to the bone conduction transducer 510.
The sound collected by the microphone 400 is converted into a sound wave signal, and then the sound wave signal is amplified by the audio amplifier circuit 520; the amplified sound wave signal is filtered by the filter circuit 530 to remove noise generated in the circuit, the bone conduction driving chip 540 drives the bone conduction vibrator 510 to convert the sound wave signal into a bone conduction vibration signal, and the generated vibration is transmitted to the auditory nerve of the brain through the skin and bones of people. The ear clip type bone-listening intelligent earphone can also be used as a hearing aid, so that the hearing-impaired person can communicate with other people on the spot.
To sum up, the earclip type bone-listening intelligent earphone provided by the utility model comprises an earphone body; the ear clip is connected with the earphone body through a metal connecting component capable of rotating around a connecting column; the earphone controller is connected with the earphone connecting wire of the earphone body in a pluggable manner; the bone conduction module is arranged on the earphone body; wherein, the metal coupling assembling includes: one end of the first fixing column is connected with the ear clip; the connecting column is arranged at the far ear clamp end of the first fixing column; one end of the second fixing column is connected with the earphone body, and the other end of the second fixing column is sleeved on the connecting column; the elastic shell is sleeved on the first fixing column and the second fixing column; the headphone controller includes: a controller body; a circuit board disposed within the controller body; the bone conduction module is connected with the MCU control chip through the earphone connecting wire; the voice recognition chip is arranged on the circuit board and connected with the MCU control chip; the microphone is arranged on the controller body and connected with the MCU control chip; the low-power-consumption Bluetooth module is arranged on the circuit board and connected with the MCU control chip. Through connecting earphone body and ear clip through metal connecting components, can come laminating concha chamber cartilage position according to different wearers' ear sizes, make the osteoacusis module function on the earphone body reach ideal effect, the ear clip formula increases the stability of wearing moreover, makes the wearer be difficult for dropping in daily activity.
It should be understood that the application of the present invention is not limited to the above examples, and that modifications and variations can be made by those skilled in the art based on the above description, for example, the hair band body of the present invention can be a head ornament, and all such modifications and variations are intended to fall within the scope of the appended claims.
Claims (8)
1. An earclip-type bone-listening intelligent earphone, comprising:
an earphone body;
the ear clip is connected with the earphone body through a metal connecting component capable of rotating around a connecting column;
the earphone controller is connected with the earphone connecting wire of the earphone body in a pluggable manner;
the bone conduction module is arranged on the earphone body;
wherein, the metal coupling assembling includes:
one end of the first fixing column is connected with the ear clip;
the connecting column is arranged at the far ear clamp end of the first fixing column;
one end of the second fixing column is connected with the earphone body, and the other end of the second fixing column is sleeved on the connecting column;
the elastic shell is sleeved on the first fixing column and the second fixing column;
the headphone controller includes:
a controller body;
a circuit board disposed within the controller body;
the bone conduction module is connected with the MCU control chip through the earphone connecting wire;
the voice recognition chip is arranged on the circuit board and connected with the MCU control chip;
the microphone is arranged on the controller body and connected with the MCU control chip;
the low-power-consumption Bluetooth module is arranged on the circuit board and connected with the MCU control chip.
2. The earclip-type bone-listening smart headset according to claim 1, wherein the first fixing post comprises:
a first fixed column housing;
a plurality of recesses disposed on a distal ear clip end of said first stationary post housing;
the first through hole of spliced pole of setting on first fixed column shell.
3. The earclip-type bone-listening intelligent earphone according to claim 2, wherein the second fixing post comprises:
a second fixed column housing;
the spring structure is arranged at the far earphone body end of the second fixed column shell and is positioned in the second fixed column shell, and the front end of the spring structure is matched with each groove;
and the connecting column second through hole is formed in the second fixed column shell.
4. An earclip-type bone-listening smart earphone according to claim 3 wherein said spring structure comprises:
a fixing piece fixedly arranged in the second fixing column shell;
a spring disposed on the fixing plate;
and part of the outer wall is provided with a spring connecting column sleeved with the spring.
5. The earclip-type bone-listening intelligent earphone according to claim 1, wherein the circuit board is further provided with 3 keys, which are respectively marked as an answering key, a volume increasing key and a volume decreasing key.
6. The earclip-type bone-listening intelligent earphone according to claim 1, wherein a storage module is further arranged on the circuit board, and the storage module is connected with the MCU control chip.
7. The earclip type bone-listening intelligent earphone according to claim 1, wherein an indicator light is further arranged on the controller body, and the indicator light is connected with the MCU control chip.
8. The earclip-type bone-listening smart headset of claim 1, wherein the bone conduction module comprises:
a bone conduction vibrator;
the audio amplification circuit is connected with the microphone and is used for amplifying the sound electric wave signals collected by the microphone;
the filter circuit is connected with the audio amplification circuit and is used for filtering clutter;
and the bone conduction driving chip is connected with the filter circuit and is used for driving the bone conduction vibrator, and the bone conduction driving chip is connected with the bone conduction vibrator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920803777.XU CN210579107U (en) | 2019-05-30 | 2019-05-30 | Earclip type bone listening intelligent earphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920803777.XU CN210579107U (en) | 2019-05-30 | 2019-05-30 | Earclip type bone listening intelligent earphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210579107U true CN210579107U (en) | 2020-05-19 |
Family
ID=70635507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920803777.XU Expired - Fee Related CN210579107U (en) | 2019-05-30 | 2019-05-30 | Earclip type bone listening intelligent earphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210579107U (en) |
-
2019
- 2019-05-30 CN CN201920803777.XU patent/CN210579107U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200519 |
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| CF01 | Termination of patent right due to non-payment of annual fee |