CN210578134U - Brushless motor casing refrigerates fast - Google Patents
Brushless motor casing refrigerates fast Download PDFInfo
- Publication number
- CN210578134U CN210578134U CN201921459011.0U CN201921459011U CN210578134U CN 210578134 U CN210578134 U CN 210578134U CN 201921459011 U CN201921459011 U CN 201921459011U CN 210578134 U CN210578134 U CN 210578134U
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- CN
- China
- Prior art keywords
- shell
- inner shell
- brushless motor
- semiconductor refrigerating
- wall
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- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 claims abstract description 55
- 238000001816 cooling Methods 0.000 claims abstract description 48
- 238000005057 refrigeration Methods 0.000 claims abstract description 38
- 239000000110 cooling liquid Substances 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 239000000428 dust Substances 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 3
- 210000003205 muscle Anatomy 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 108010085603 SFLLRNPND Proteins 0.000 description 2
- 241000256626 Pterygota <winged insects> Species 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a brushless motor shell refrigerates fast, including inner shell, refrigeration appearance, front shroud, back shroud, cooling circuit and semiconductor refrigeration piece, wherein: semiconductor refrigeration piece spiral array set up in inner shell outer wall just series connection setting between the semiconductor refrigeration piece, the semiconductor refrigeration piece cold junction is inlayed and is set up in inner shell outer wall just semiconductor refrigeration piece hot junction surpasss the setting of inner shell outer wall, the utility model discloses a set up semiconductor refrigeration piece spiral array in inner shell outer wall and set up cooling circuit, can reach and can carry out all-round quick refrigeration to brushless motor inner shell inside, realize the inside equal radiating effect of motor and through establish the shell and set up the shell surface smoothly at the outside ring of inner shell, can prevent that the dust from piling up on the shell, hindering the motor heat dissipation.
Description
Technical Field
The utility model belongs to the technical field of, concretely relates to brushless motor shell refrigerates fast.
Background
The motor is a device for converting electric energy into mechanical energy, and mainly comprises a stator, a rotor, a shell, an end cover and the like. When the motor is used, the motor can generate a large amount of heat, after the heat reaches a certain degree, the motor cannot be used, otherwise, insulation breakdown can occur, and the motor is burnt out. At present, the heat dissipation mode of the motor generally dissipates heat inside the motor through heat dissipation ribs or heat dissipation grooves. However, the brushless motor that dispels the heat through heat dissipation muscle or radiating groove is not used in some use occasions, when brushless motor operational environment dust is big, the tiny particle is many, when the floater is many, the dust is very easily piled up on the motor surface, at this moment heat dissipation muscle and radiating groove not only play the radiating action, easily make the dust pile up on the contrary, thereby hinder the motor heat dissipation and arouse inside high temperature, burn out the motor, come to dispel the heat to motor inside through heat dissipation muscle or radiating groove simultaneously, the radiating efficiency is low, the heat of motor inside can not in time, fast effluvium, make the heat pile up easily, thereby arouse inside high temperature, burn out the motor.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a quick refrigeration brushless motor shell to solve foretell technical problem.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a brushless motor shell refrigerates fast, includes inner shell, refrigeration appearance, front shroud, back shroud, cooling circuit and semiconductor refrigeration piece, wherein:
the semiconductor refrigerating pieces are arranged on the outer wall of the inner shell in a spiral array mode, and the semiconductor refrigerating pieces are arranged in series;
the cold end of the semiconductor refrigerating sheet is embedded in the outer wall of the inner shell, and the hot end of the semiconductor refrigerating sheet exceeds the outer wall of the inner shell;
the cooling loop is partially arranged around the semiconductor chilling plates, and partial paths of the cooling loop around the semiconductor chilling plates correspond to the paths of the semiconductor chilling plates arranged on the outer wall of the inner shell in a spiral array mode;
the cooling loop is of a hollow tubular structure and surrounds part of tube wall of the semiconductor chilling plate to be in contact with the outer wall of the hot end of the semiconductor chilling plate;
the spiral tubular part of the cooling loop is sleeved with an outer shell, and the inner shell is fixedly connected with the outer shell through a connecting column;
the cooling loop part penetrates through the shell and the refrigeration instrument and is arranged in the refrigeration instrument;
a cold trap and a circulating pump are arranged in the refrigeration instrument and are fixedly connected with a cooling loop;
threaded holes are formed in the front end and the rear end of the shell.
Preferably, the inner shell is the same length as the outer shell.
Preferably, the connecting column is arranged in the middle of the inner shell and between the gaps of the semiconductor refrigerating sheets arranged around the inner shell.
Preferably, the front cover plate is provided with a shaft hole penetrating through the plate cover and a connecting hole, and the connecting hole corresponds to a threaded hole arranged at the front end of the shell.
Preferably, the rear cover plate is provided with a wire outlet hole and a connecting hole which penetrate through the plate cover, and the connecting hole corresponds to the threaded hole arranged at the rear end of the shell.
Preferably, the material of the cooling circuit can be graphene or copper.
Preferably, a coolant flows through the cooling circuit.
The utility model discloses a technological effect and advantage: this quick refrigeration brushless motor shell, through set up semiconductor refrigeration piece spiral array in the inner shell outer wall and set up cooling circuit, can reach and to carry out all-round quick refrigeration to brushless motor inner shell inside, realize the inside radiating effect all of motor, can prevent that the inside heat of brushless motor from piling up, thereby arousing inside high temperature, burn out the motor and through establishing the shell and setting up the shell surface smoothly at the outer ring of inner shell, can prevent that the dust from piling up on the shell, hinder the motor heat dissipation.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the specific structure of the present invention;
FIG. 3 is a schematic view of the present invention with the front and rear covers removed;
FIG. 4 is a schematic view of a part of the detailed structure of the present invention;
fig. 5 is a schematic diagram of the arrangement of the semiconductor refrigeration pieces of the present invention;
fig. 6 is a schematic diagram of the arrangement of the semiconductor refrigeration pieces of the present invention;
fig. 7 is a schematic diagram of the specific connection between the inner shell and the outer shell of the present invention.
In the figure: 1-inner shell, 2-outer shell, 3-refrigerator, 4-front cover plate, 5-rear cover plate, 6-cooling circuit, 7-semiconductor refrigerating sheet, 8-connecting column, 9-cold hydrazine, 10-circulating pump, 11-threaded hole, 12-shaft hole, 13-connecting hole and 14-outlet hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to fig. 1 to 7 of the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a quick refrigeration brushless motor casing as shown in 1-7 in the picture, including inner shell 1, shell 2, refrigeration appearance 3, front shroud 4, back shroud 5, cooling circuit 6 and semiconductor refrigeration piece 7, wherein:
the semiconductor refrigerating pieces 7 are arranged on the outer wall of the inner shell 1 in a spiral array mode, the semiconductor refrigerating pieces 7 are arranged in series, and the semiconductor refrigerating pieces 7 in series can be electrically connected with an external direct-current power supply through wire outlet holes 14 which are formed in the rear cover plate 5 and penetrate through the plate cover;
the cold end of the semiconductor refrigerating sheet 7 is embedded in the outer wall of the inner shell 1, and the hot end of the semiconductor refrigerating sheet 7 exceeds the outer wall of the inner shell 1;
the cooling loop 6 is partially arranged around the semiconductor chilling plates 7, and part of the path of the cooling loop 6 around the semiconductor chilling plates 7 corresponds to the path of the semiconductor chilling plates 7 arranged on the outer wall of the inner shell 1 in a spiral array mode;
the cooling loop 6 is of a hollow tubular structure, part of tube wall of the cooling loop 6 surrounding the semiconductor refrigerating sheet 7 is in contact with the outer wall of the hot end of the semiconductor refrigerating sheet 7, and the heat of the hot end of the semiconductor refrigerating sheet 7 can be rapidly taken away by the cooling loop 6;
the spiral tubular part of the cooling loop 6 is sleeved with the outer shell 2, and the inner shell 1 is fixedly connected with the outer shell 2 through a connecting column 8;
the cooling loop 6 partially penetrates through the shell 2 and the refrigeration instrument 3 and is arranged in the refrigeration instrument 3;
a cold trap 9 and a circulating pump 10 are arranged inside the refrigeration instrument 3, the cold trap 9 and the circulating pump 10 are fixedly connected with the cooling loop 6, and the circulating pump 10 can circulate the cooling liquid inside the cooling loop 6;
threaded holes 11 are formed in the front end and the rear end of the shell 2.
Specifically, inner shell 1 is the same with 2 length on the shell just shell 2 is the cylinder structure just 2 outer wall on the shell does not set up heat dissipation muscle and radiating groove and makes 2 surfaces on the shell smooth, can prevent that the dust from piling up on shell 2, hindering brushless motor heat dissipation.
Specifically, the connecting column 8 is arranged in the middle of the inner shell 1, the connecting column 8 is arranged between gaps of the semiconductor refrigerating sheets 7 surrounding the inner shell 1, and the inner shell 1 and the outer shell 2 are stably connected.
Specifically, the front cover plate 4 is provided with a shaft hole 12 and a connecting hole 13 penetrating through the plate cover, the connecting hole 13 corresponds to a threaded hole 11 arranged at the front end of the shell 2, and the front cover plate 4 can be stably connected with the shell 2 by using a screw to penetrate through the connecting hole 13 and the threaded hole 11 arranged at the front end of the shell 2 for threaded connection.
Specifically, the rear cover plate 5 is provided with a wire outlet hole 14 and a connecting hole 13 penetrating through the plate cover, the connecting hole 13 corresponds to a threaded hole 11 formed in the rear end of the housing 2, and the rear cover plate 5 can be stably connected with the housing 2 by using a screw to penetrate through the connecting hole 13 and the threaded hole 11 formed in the rear end of the housing 2 for threaded connection.
Specifically, the front shroud 4 is provided with the shaft hole 12 that runs through the board lid just motor shaft and shaft hole 12 zonulae occludens can prevent that dust and debris from getting into brushless motor inside, back shroud 5 is provided with the wire hole 14 that runs through the board lid, wire hole 14 can make 7 wiring of semiconductor refrigeration piece and the external power source of motor power wiring and series connection just wiring and wire hole 14 zonulae occludens and sets up can prevent that dust, winged insect and debris from getting into inside the brushless motor.
Specifically, the material of the cooling circuit 6 may be graphene or copper, so that the cooling circuit 6 may rapidly cool the hot end of the semiconductor cooling plate 7.
Specifically, cooling liquid circulates inside the cooling circuit 6, and the cooling liquid can circulate inside the cooling circuit 6 through the circulating pump 10 to circulate and refrigerate the hot end of the semiconductor refrigeration sheet 7.
The working principle is as follows: the quick refrigeration brushless motor casing can ensure that a front cover plate 4 and a rear cover plate 5 are stably connected with an outer casing 2 by using screws to penetrate through a connecting hole 13 and threaded holes 11 arranged at the front end and the rear end of the outer casing 2 in a threaded connection way, a semiconductor refrigeration sheet 7 connected in series can be connected with an external direct current power supply, then a refrigeration instrument 3 is started, energy transfer can be generated after direct current is connected, the temperature of the cold end of the semiconductor refrigeration sheet 7 is quickly reduced, the temperature of the inner part of the inner casing 1 can be quickly taken away, the temperature of the hot end of the semiconductor refrigeration sheet 7 can be quickly reduced by a cooling loop 6, the temperature of the hot end of the semiconductor sheet 7 can be taken away by cooling liquid circulating in the cooling loop 6, the cooling liquid in the cooling loop 9 after being heated by the hot end of the semiconductor sheet 7 is cooled by the cooling liquid arranged in the refrigeration instrument, the hot end of the semiconductor refrigerating sheet 7 is continuously cooled by circulating flow in the cooling loop 3, so that the semiconductor refrigerating sheet 7 can continuously cool the inside of the inner shell 1.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (7)
1. The utility model provides a brushless motor shell refrigerates fast, includes inner shell (1), shell (2), refrigeration appearance (3), front shroud (4), back shroud (5), cooling circuit (6) and semiconductor refrigeration piece (7), its characterized in that:
the semiconductor refrigerating pieces (7) are arranged on the outer wall of the inner shell (1) in a spiral array mode, and the semiconductor refrigerating pieces (7) are arranged in series;
the cold end of the semiconductor refrigerating sheet (7) is embedded in the outer wall of the inner shell (1), and the hot end of the semiconductor refrigerating sheet (7) exceeds the outer wall of the inner shell (1);
the cooling loop (6) is partially arranged around the semiconductor refrigerating sheet (7), and partial path of the cooling loop (6) around the semiconductor refrigerating sheet (7) corresponds to the path of the semiconductor refrigerating sheet (7) arranged on the outer wall of the inner shell (1) in a spiral array manner;
the cooling loop (6) is of a hollow tubular structure, and the cooling loop (6) surrounds partial pipe wall of the semiconductor refrigerating sheet (7) and is in contact with the outer wall of the hot end of the semiconductor refrigerating sheet (7);
the spiral tubular part of the cooling loop (6) is sleeved with an outer shell (2), and the inner shell (1) is fixedly connected with the outer shell (2) through a connecting column (8);
the cooling loop (6) partially penetrates through the shell (2) and the refrigeration instrument (3) and is arranged in the refrigeration instrument (3);
a cold trap (9) and a circulating pump (10) are arranged in the refrigeration instrument (3), and the cold trap (9) and the circulating pump (10) are fixedly connected with the cooling loop (6);
threaded holes (11) are formed in the front end and the rear end of the shell (2).
2. A rapid cooling brushless motor housing according to claim 1, characterized in that: the length of the inner shell (1) is the same as that of the outer shell (2).
3. A rapid cooling brushless motor housing according to claim 1, characterized in that: the connecting column (8) is arranged in the middle of the inner shell (1), and the connecting column (8) is arranged between gaps of the semiconductor refrigerating sheets (7) surrounding the inner shell (1).
4. A rapid cooling brushless motor housing according to claim 1, characterized in that: the front cover plate (4) is provided with a shaft hole (12) penetrating through the plate cover and a connecting hole (13), and the connecting hole (13) corresponds to the position of a threaded hole (11) formed in the front end of the shell (2).
5. A rapid cooling brushless motor housing according to claim 1, characterized in that: the rear cover plate (5) is provided with a wire outlet hole (14) and a connecting hole (13) which penetrate through the plate cover, and the connecting hole (13) corresponds to a threaded hole (11) formed in the rear end of the shell (2).
6. A rapid cooling brushless motor housing according to claim 1, characterized in that: the material of the cooling loop (6) can be graphene or copper.
7. A rapid cooling brushless motor housing according to claim 1, characterized in that: the cooling circuit (6) is internally circulated with cooling liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921459011.0U CN210578134U (en) | 2019-09-03 | 2019-09-03 | Brushless motor casing refrigerates fast |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921459011.0U CN210578134U (en) | 2019-09-03 | 2019-09-03 | Brushless motor casing refrigerates fast |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210578134U true CN210578134U (en) | 2020-05-19 |
Family
ID=70642392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921459011.0U Expired - Fee Related CN210578134U (en) | 2019-09-03 | 2019-09-03 | Brushless motor casing refrigerates fast |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210578134U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113285553A (en) * | 2021-07-20 | 2021-08-20 | 江苏金光电机科技有限公司 | Electric machine |
-
2019
- 2019-09-03 CN CN201921459011.0U patent/CN210578134U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113285553A (en) * | 2021-07-20 | 2021-08-20 | 江苏金光电机科技有限公司 | Electric machine |
| CN113285553B (en) * | 2021-07-20 | 2021-11-26 | 江苏金光电机科技有限公司 | Electric machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200519 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |