CN210571712U - Clamp for testing packaged semiconductor device - Google Patents
Clamp for testing packaged semiconductor device Download PDFInfo
- Publication number
- CN210571712U CN210571712U CN201921232804.9U CN201921232804U CN210571712U CN 210571712 U CN210571712 U CN 210571712U CN 201921232804 U CN201921232804 U CN 201921232804U CN 210571712 U CN210571712 U CN 210571712U
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- spacing subassembly
- movable block
- stud
- semiconductor device
- base
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Abstract
The utility model relates to an anchor clamps for encapsulating semiconductor device is experimental, including base and a pair of support, characterized by support vertical fixation is respectively at the both ends of base, and the through-hole has been seted up at the middle part of support, and stud's both ends are connected with the column cap nut after passing the through-hole from inside to outside, has cup jointed a pair of movable block on the stud, and the movable block draws close each other or parts along the upper surface of base during stud is rotatory, is connected with spacing subassembly on the movable block, and spacing subassembly is the stair structure more than two-layer, and the middle part of spacing subassembly is provided with the V-arrangement breach. The utility model discloses the during operation waits to try the device and lays between spacing subassembly, and rotatory column cap nut makes the movable block draw close each other, and spacing subassembly draws close each other thereupon, waits to try the device to be fixed firmly by four point location and put at frock central point. The utility model discloses simple structure, simple to operate, centre gripping are stable and be favorable to improving work efficiency and measuring accuracy.
Description
Technical Field
The utility model relates to a fixing device is used for encapsulating experimental anchor clamps of semiconductor device particularly.
Background
The ceramic or metal packaged semiconductor device is widely applied to the field of military industry or aerospace which is required by high-strength working conditions. To test device reliability, the chip shear strength is tested according to the DPA test standard. When the device is subjected to a shear strength test, the device needs to be fixed by a tool and connected with a workbench, a shearing push broach descends to the position parallel to the edge of a chip, and the chip moves towards the direction of the push broach by the workbench, so that the shearing value of the chip is obtained. The existing tool is connected and fixed with a workbench in a cylinder three-point extrusion mode for facilitating the rotation angle, partial devices, particularly metal round cap packaging devices, can not be assembled at the central position often, and the fixed tool can slide when the anti-shearing force of a chip is too large, so that the test value is inaccurate. In addition, most metal round cap encapsulation device edges all have a prominent brim of a hat, and current frock adopts parallel mutual extrusion fixed mode, does not have the structure of location around, and the slippage is easy in the test process, and the extrusion of energetically moreover probably leads to the device tube shell to warp even influences inside chip bonding structure.
The utility model provides an above-mentioned not enough to prior art, the utility model provides a simple structure, simple to operate, centre gripping are stable and be favorable to improving work efficiency and measuring accuracy's the experimental anchor clamps that are used for encapsulation semiconductor device.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a simple structure, simple to operate, centre gripping are stable and be favorable to improving work efficiency and measuring accuracy's the experimental anchor clamps of being used for encapsulation semiconductor device.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides an anchor clamps for encapsulating semiconductor device is experimental, including base and a pair of support, characterized by support vertical fixation respectively in the both ends of base, the through-hole has been seted up at the middle part of support, stud's both ends are connected with the column cap nut after passing the through-hole from inside to outside, the last a pair of movable block that has cup jointed of stud, the movable block draws close each other or parts along the upper surface of base during stud is rotatory, be connected with spacing subassembly on the movable block, spacing subassembly is the stair structure more than two-layer, the middle part of spacing subassembly is provided with the V-arrangement breach.
Furthermore, the limiting assembly is of a three-layer ladder structure.
Further, the included angle between two sides of the V-shaped notch is 90 degrees.
The utility model discloses the during operation waits to try the device and lays between spacing subassembly, and rotatory column cap nut makes the movable block draw close each other, and spacing subassembly draws close each other thereupon, waits to try the device to be fixed firmly by four point location and put at frock central point.
The utility model discloses simple structure, simple to operate, centre gripping are stable and be favorable to improving work efficiency and measuring accuracy.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of FIG. 1 with the stop assembly removed;
FIG. 3 is a schematic view of the bracket structure of the present invention;
fig. 4 is a schematic structural view of the limiting assembly of the present invention.
In the figure, 1-base; 2-a scaffold; 2.1-through holes; 3-stud bolts; 4-stud nut; 5-moving block; 6-limiting component.
Detailed Description
The present invention will be further described with reference to the following drawings and examples, but the examples should not be construed as limiting the present invention.
As shown in the figure, an anchor clamps for encapsulating semiconductor device is experimental, including base 1 and a pair of support 2, support 2 is the both ends of vertical fixation base 1 respectively, through-hole 2.1 has been seted up at the middle part of support 2, stud 3's both ends are connected with stud nut 4 after passing through-hole 2.1 from inside to outside, stud 3 is last to have cup jointed a pair of movable block 5, movable block 5 draws close each other or parts along base 1's upper surface when stud 3 is rotatory, be connected with spacing subassembly 6 on the movable block 5, spacing subassembly 6 is the stair structure more than two-layer, the middle part of spacing subassembly 6 is provided with the V-arrangement breach.
The preferred embodiments are: in the above scheme, the limiting component 6 is of a three-layer ladder structure.
The preferred embodiments are: in the above scheme, the included angle between the two sides of the V-shaped notch is 90 °.
Those not described in detail in this specification are prior art to the knowledge of those skilled in the art.
Claims (3)
1. A clamp for packaging semiconductor device tests comprises a base (1) and a pair of supports (2), and is characterized in that: support (2) both ends of vertical fixation in base (1) respectively, through-hole (2.1) have been seted up at the middle part of support (2), the both ends of stud (3) are passed through-hole (2.1) back from inside to outside and are connected with stud cap nut (4), a pair of movable block (5) has been cup jointed on stud (3), movable block (5) draw close each other or part each other along the upper surface of base (1) when stud (3) are rotatory, be connected with spacing subassembly (6) on movable block (5), spacing subassembly (6) are ladder structure more than two-layer, the middle part of spacing subassembly (6) is provided with the V-arrangement breach.
2. The jig for testing the packaged semiconductor device according to claim 1, wherein: the limiting assembly (6) is of a three-layer ladder structure.
3. The jig for testing the packaged semiconductor device according to claim 1 or 2, wherein: the included angle of two sides of the V-shaped notch is 90 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921232804.9U CN210571712U (en) | 2019-07-31 | 2019-07-31 | Clamp for testing packaged semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921232804.9U CN210571712U (en) | 2019-07-31 | 2019-07-31 | Clamp for testing packaged semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210571712U true CN210571712U (en) | 2020-05-19 |
Family
ID=70626919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921232804.9U Active CN210571712U (en) | 2019-07-31 | 2019-07-31 | Clamp for testing packaged semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210571712U (en) |
-
2019
- 2019-07-31 CN CN201921232804.9U patent/CN210571712U/en active Active
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