CN210571044U - Infrared detection device of thermopile - Google Patents
Infrared detection device of thermopile Download PDFInfo
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- CN210571044U CN210571044U CN201921396267.1U CN201921396267U CN210571044U CN 210571044 U CN210571044 U CN 210571044U CN 201921396267 U CN201921396267 U CN 201921396267U CN 210571044 U CN210571044 U CN 210571044U
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Abstract
The utility model relates to a thermopile infrared detection device, which comprises a base, an induction element and a signal processing unit which are separately arranged on the base, and a pipe cap arranged on the base; the pipe cap and the base are packaged together to form an accommodating space for accommodating the sensing element and the signal processing unit, and a sensing window is arranged in the pipe cap corresponding to the sensing direction of the sensing element; the sensing element absorbs external infrared radiation through the sensing window and converts the external infrared radiation into an electric signal to be output; the signal processing unit is electrically connected with the sensing element and outputs the electric signal output by the sensing element after conversion processing. The thermopile infrared detection device integrates the signal processing unit in the thermopile infrared detection device, so that an electric signal generated by the sensing element can be directly converted, the detection precision is improved, the remote infrared detection can be realized, and the stability is good.
Description
Technical Field
The utility model relates to an infrared detection field, more specifically say, relate to a thermopile infrared detection device.
Background
The thermopile infrared sensor realizes infrared detection by utilizing the temperature gradient effect between a hot junction area and a cold junction area. Specifically, when external infrared radiation irradiates an absorption region of the thermopile infrared sensor, the absorption region absorbs the infrared radiation and converts the infrared radiation into heat energy, a temperature gradient is generated in a hot junction region and a cold junction region of the absorption region, and the temperature gradient is converted into a voltage signal through the seebeck effect of a thermocouple material and is output.
The existing thermopile infrared sensors are all thermopile infrared sensors with single sensing chips, the sensors have low detection precision, can only detect infrared radiation at a very limited distance, and cannot detect or detect very weak remote human body detection signals. And because the induction chip is very small, each focusing point of the lens cannot be accurately focused on the induction chip, and the detection precision of the sensor is further reduced.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lies in, to the above-mentioned defect of prior art, provide a thermopile infrared detection device.
The utility model provides a technical scheme that its technical problem adopted is: constructing a thermopile infrared detection device, which comprises a base, an induction element and a signal processing unit which are separately arranged on the base, and a pipe cap arranged on the base;
the pipe cap and the base are packaged together to form an accommodating space which can be used for accommodating the induction element and the signal processing unit, and an induction window is arranged in the pipe cap corresponding to the induction direction of the induction element;
the sensing element absorbs external infrared radiation through the sensing window and converts the external infrared radiation into an electric signal to be output;
the signal processing unit is electrically connected with the sensing element and outputs the electric signal output by the sensing element after conversion processing.
In one embodiment, further comprising: the heat sink is sleeved on the periphery of the pipe cap to reduce the influence of the ambient temperature.
In one embodiment, the heat sink comprises an aluminum sleeve that is fitted over the periphery of the cap with interference.
In one embodiment, further comprising: the focusing unit is arranged in the sensing direction of the sensing element to focus an external infrared radiation signal to the sensing surface of the sensing element.
In one embodiment, the focusing unit comprises a fresnel lens;
the Fresnel lens cover is arranged on the periphery of the pipe cap.
In one embodiment, the base comprises: a support facing the cap and protruding the base surface;
the sensing element and the signal processing unit are disposed on the support.
In one embodiment, further comprising: and the insulating parts are arranged between the induction element and the supporting part and between the signal processing unit and the supporting part so as to insulate and isolate the induction element from the supporting part and the signal processing unit from the supporting part.
In one embodiment, the insulator comprises a ceramic shim or a silicon shim.
In one embodiment, the signal processing unit includes: the device comprises a substrate and an analog front-end chip arranged on the substrate;
the substrate is arranged on the support;
and the analog front-end chip receives the electric signal output by the induction element, converts the electric signal and outputs the converted electric signal.
In one embodiment, the analog front-end chip is packaged on the substrate by COB.
Implement the utility model discloses a thermopile infrared detection device has following beneficial effect: the thermopile infrared detection device comprises a base, an induction element and a signal processing unit which are separately arranged on the base, and a pipe cap arranged on the base; the pipe cap and the base are packaged together to form an accommodating space for accommodating the sensing element and the signal processing unit, and a sensing window is arranged in the pipe cap corresponding to the sensing direction of the sensing element; the sensing element absorbs external infrared radiation through the sensing window and converts the external infrared radiation into an electric signal to be output; the signal processing unit is electrically connected with the sensing element and outputs the electric signal output by the sensing element after conversion processing. The thermopile infrared detection device integrates the signal processing unit in the thermopile infrared detection device, so that an electric signal generated by the sensing element can be directly converted, the detection precision is improved, the remote infrared detection can be realized, and the stability is good.
Drawings
The invention will be further explained with reference to the drawings and examples, wherein:
fig. 1 is a schematic structural diagram of a thermopile infrared detection apparatus provided in an embodiment of the present invention;
fig. 2 is a partial structural plan view of a thermopile infrared detection apparatus provided in the embodiment of the present invention.
Detailed Description
For a clearer understanding of the technical features, objects, and effects of the present invention, reference will now be made to the accompanying drawings.
Referring to fig. 1, a schematic structural diagram of a thermopile infrared detection apparatus according to an embodiment of the present invention is provided. This infrared detection device of thermopile can reduce the influence of external circuit noise, can also simplify external circuit, can also avoid the enlargiing of noise simultaneously, increases output signal's voltage owner, can realize farther apart from the detection, and the detection precision is higher.
Specifically, as shown in fig. 1, the thermopile infrared detection device includes a base 10, a sensing element 20 and a signal processing unit 30 separately disposed on the base 10, and a cap 40 disposed on the base 10.
The cap 40 is packaged with the base 10 to form a receiving space for receiving the sensing element 20 and the signal processing unit 30, and the cap 40 is provided with a sensing window 41 corresponding to a sensing direction of the sensing element 20.
In some embodiments, the sensing element 20 absorbs the external infrared radiation through the sensing window 41 and converts the external infrared radiation into an electrical signal to be output. Specifically, when the external infrared radiation irradiates the thermopile infrared detection device, the external infrared radiation enters the cap 40 through the sensing window 41 and is projected onto the sensing surface of the sensing element 20, the absorption region on the sensing surface of the sensing element 20 absorbs the external infrared radiation and converts it into corresponding heat energy, the converted heat energy generates a temperature gradient corresponding to the heat energy in the hot junction region and the cold junction region, and the temperature gradient is converted into a corresponding electrical signal through the sensing element 20 and is output, the electrical signal is directly transmitted to the signal processing unit 30 electrically connected to the sensing element 20, and the electrical signal is converted and output by the signal processing unit 30.
Further, the utility model discloses before the signal of telecommunication that inductive element 20 exported not exported external circuit, directly carry out corresponding conversion processing by integrated signal processing unit 30 in the infrared detection device of thermopile earlier and export again, can effectively reduce the influence of external circuit noise, simplify external circuit, avoid noise amplification, increase the voltage of this output signal of telecommunication, realize more distant detection.
In the embodiment of the present invention, this base 10 includes: a support 11 facing the cap 40 and protruding from the surface of the base 10; the sensing element 20 and the signal processing unit 30 are disposed on the support 11. It will be appreciated that the support 11 is specifically directed towards the top of the cap 40 (i.e. the end at which the sensing window 41 is located). Furthermore, the surface of the supporting member 11 contacting the sensing element 20 and the signal processing unit 30 is a platform, and the size of the platform is referred to as the placement of the sensing element 20 and the signal processing unit 30, i.e. the size of the platform is greater than or equal to the peripheral size of the sensing element 20 and the signal processing unit 30, so that the sensing element 20 and the signal processing unit 30 can be stably disposed on the platform surface of the supporting member 11.
Further, the supporting member 11 and the base 10 of the embodiment of the present invention are an integral structure.
Further, the base 10 of the embodiment of the present invention further includes: and an insulating member 70 disposed between the sensing element 20 and the supporting member 11, and between the signal processing unit 30 and the supporting member 11, for insulating the sensing element 20 from the supporting member 11 and insulating the signal processing unit 30 from the supporting member 11. Alternatively, the insulating member 70 may include one or two, and in the case of one insulating member 70, the sensing element 20 and the signal processing unit 30 are disposed on the insulating member 70; when there are two insulating members 70, the sensing element 20 and the signal processing unit 30 are respectively disposed on the corresponding insulating members 70.
Optionally, the insulator 70 includes, but is not limited to, a ceramic spacer or a silicon spacer. The insulating member 70 can insulate the sensing element 20 from the base 10, insulate the signal processing unit 30 from the base 10, and dissipate heat.
Further, the insulating member 70 may be attached to a surface of the supporting member 11 facing the top of the cap 40 by SMT, or the insulating member 70 may be directly attached to a surface of the supporting member 11 facing the top of the cap 40 by double-sided adhesive. Of course, it is understood that the insulating member 70 may be attached to the supporting member 11 in other ways as long as the insulating member 70 is fixed to the supporting member 11.
Further, the sensing element 20 may be attached to the insulating member 70 by SMT, or the sensing element 20 may be directly attached to the insulating member 70 by double-sided adhesive. Of course, it is understood that the sensing element 20 can be attached to the insulator 70 in other ways as long as the sensing element 20 is fixed to the insulator 70.
Further, the signal processing unit 30 may be attached to the insulating member 70 by using SMT, or the signal processing unit 30 may be directly attached to the insulating member 70 by using double-sided adhesive. Of course, it is understood that the signal processing unit 30 can be attached to the insulating member 70 in other manners as long as the signal processing unit 30 can be fixed on the insulating member 70.
Optionally, as shown in fig. 1, the base 10 further includes a first pin 12 and a second pin 13 separately disposed and insulated from each other. As shown in fig. 1, one ends of the first pins 12 and the second pins 13 penetrating into the accommodating space formed by the cap 40 are respectively connected to the signal processing unit 30, so as to output the signal converted and processed by the signal processing unit 30 to an external circuit. Further, the first pins 12 and the second pins 13 are integrated with the base 10. It should be noted that fig. 1 only shows the case of two pins, and in practical applications, the pins on the base 10 may be determined according to the actual requirements of the circuit or the requirements of the product, such as three, four, five, etc.
Optionally, in the embodiment of the present invention, the base 10 is a metal package base 10. Further, the dock 10 may be a TO dock 10, for example, the dock 10 may be a TO46, a TO5, a TO39, or the like. The TO base 10 can be used TO improve thermal balance and reduce thermal interference.
In this embodiment, the sensing window 41 is provided on the top of the cap 40. Alternatively, the sensing window 41 includes a filter for blocking the set light, and the filter is disposed on the inner side of the cap 40. Further, the outer circumference size of the filter is larger than the inner circumference size of the sensing window 41. The size of the sensing window 41 is based on the sensing area of the sensing element 20, that is, the inner circumference of the sensing window 41 is not smaller than the sensing area of the sensing element 20. Alternatively, the optical filter may be fixed to the cap 40 by conductive paste, or may be fixed to the cap 40 by interference fit.
In other embodiments, the optical filter may be replaced by a silicon chip without optical filtering, and when a silicon chip without optical filtering is disposed at the sensing window 41, glue may be generally dispensed on the sensing surface of the sensing element 20, and filter particles mixed in the glue block the set light.
In this embodiment, the cap 40 is preferably a hollow cylindrical shape, a square shape, or a rectangular parallelepiped shape. In some other embodiments, the tube cap 40 may also be in the shape of a hollow truncated cone, and the sensing window 41 is disposed on the top surface of the truncated cone. The cap 40 is formed in a hollow truncated cone shape, so that the sensing element 20 can sense more light. It should be noted that the cap 40 may be designed to have other irregular shapes as long as the cap covers the periphery of the sensing element 20.
Further, the cap 40 is an opaque metal cap 40, and the metal cap 40 and the base 10 can form a sealed package structure, so as to package the sensing element 20 and the signal processing unit 30 in a sealed space formed by the metal cap 40 and the base 10, thereby preventing the sensing element 20 from being interfered by light and preventing the sensing element 20 from being damaged by foreign objects. In this embodiment, pipe cap 40 can also set up to flat window structure or skew window structure, specifically can confirm according to the customer end demand, the utility model discloses do not specifically limit.
Further, the thermopile infrared detection device further comprises: and a heat sink 50 fitted around the periphery of the cap 40 to reduce the influence of the ambient temperature. Optionally, the heat sink 50 includes an aluminum sleeve that is disposed around the periphery of the cap 40 with interference fit. As shown in fig. 2, the aluminum sleeve is disposed around the cap 40. Through establishing round aluminium cover at the outer peripheral edge cover of pipe cap 40, can increase thermopile infrared detection device's heat capacity to reduce ambient temperature and to thermopile infrared detection device's influence, make thermopile infrared detection device's stability better, further improve thermopile infrared detection device's detection precision.
Further, as shown in fig. 2, the signal processing unit 30 according to the embodiment of the present invention includes: a substrate 32, and an Analog front end chip 31 (AFE) chip) provided on the substrate 32. Wherein the base plate 32 is disposed on the support 11; the analog front-end chip 31 receives the electrical signal output by the sensing element 20, converts the electrical signal, and outputs the converted electrical signal.
Alternatively, the substrate 32 may be a PCB board.
Further, the analog front-end chip 31 is packaged on the substrate 32 by COB. It can be understood that the utility model discloses an at thermopile infrared detection device's internal integration AFE chip to adopt COB encapsulated mode to encapsulate AFE chip on the PCB board, can make the signal of telecommunication that inductive element 20 produced directly get into the AFE chip, directly carry out ADC processing by the AFE chip, increase 1000 times or more with the signal of telecommunication that produces, and then realized reducing the influence of external circuit noise, simplified external circuit's purpose. Meanwhile, as the AFE chip is used for ADC processing and then output, and is packaged on the PCB in a COB mode, the cost can be effectively reduced; furthermore, before the thermopile infrared detection device outputs signals to an external circuit, the signals are amplified inside the thermopile infrared detection device, so that the amplification of noise is avoided, the voltage of the output signals is increased, the detection of longer distance is realized, and the detection precision of the thermopile infrared detection device is improved.
Further, the thermopile infrared detection device further comprises: a focusing unit 60 disposed in the sensing direction of the sensing element 20 to focus the external infrared radiation signal onto the sensing surface of the sensing element 20.
Alternatively, the focusing unit 60 includes a fresnel lens, and the fresnel lens is covered on the outer periphery of the cap 40. Specifically, as shown in fig. 1, the fresnel lens covers not only the tube cap 40, but also an aluminum sleeve that is sleeved on the outer periphery of the tube cap 40. It should be noted that, the fresnel lens provided by the embodiment of the present invention is set according to the packaging height, the sealing structure, etc. of the thermopile infrared detection device, and it is a part of the thermopile infrared detection device, and is sold as a set with other parts as a part of the finished thermopile infrared detection device. By arranging the Fresnel lens, the infrared radiation signals focused by the lens can be fully focused on the sensing surface of the sensing element 20, the infrared radiation signals of the sensing surface can be better received, the detection of a greater element distance can be realized, and the accurate focusing effect can be further achieved.
Further, as shown in fig. 1, the fresnel lens may be disposed in a convex state, or may be disposed in a platform or a truncated cone, which is not limited in the present invention.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and implement the present invention accordingly, which can not limit the protection scope of the present invention. All equivalent changes and modifications made within the scope of the claims of the present invention shall fall within the scope of the claims of the present invention.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are considered to be within the scope of the invention as defined by the following claims.
Claims (10)
1. The thermopile infrared detection device is characterized by comprising a base (10), an induction element (20) and a signal processing unit (30) which are separately arranged on the base (10), and a pipe cap (40) arranged on the base (10);
the pipe cap (40) and the base (10) are packaged together to form a containing space which can be used for containing the induction element (20) and the signal processing unit (30), and the pipe cap (40) is provided with an induction window (41) corresponding to the induction direction of the induction element (20);
the sensing element (20) absorbs external infrared radiation through the sensing window (41) and converts the external infrared radiation into an electric signal to be output;
the signal processing unit (30) is electrically connected with the induction element (20) and outputs the electric signal output by the induction element (20) after conversion processing.
2. The thermopile infrared detection device of claim 1, further comprising: and the heat sink (50) is sleeved on the periphery of the pipe cap (40) to reduce the influence of the ambient temperature.
3. The thermopile infrared detection device according to claim 2, characterized in that the heat sink element (50) comprises an aluminum sleeve, which is fitted with interference over the circumference of the cap (40).
4. The thermopile infrared detection device of claim 1, further comprising: and the focusing unit (60) is arranged in the sensing direction of the sensing element (20) to focus an external infrared radiation signal to the sensing surface of the sensing element (20).
5. Thermopile infrared detection device according to claim 4, characterized in that the focusing unit (60) comprises a Fresnel lens;
the Fresnel lens covers the periphery of the pipe cap (40).
6. Thermopile infrared detection device according to claim 1, characterized in that said base (10) comprises: a support (11) facing the cap (40) and projecting from the surface of the base (10);
the inductive element (20) and the signal processing unit (30) are arranged on the support (11).
7. The thermopile infrared detection device of claim 6, further comprising: and an insulating member (70) disposed between the sensing element (20) and the support member (11), between the signal processing unit (30) and the support member (11), and insulating the sensing element (20) from the support member (11) and insulating the signal processing unit (30) from the support member (11).
8. Thermopile infrared detection device according to claim 7, characterized in that the insulating member (70) comprises a ceramic or silicon pad.
9. Thermopile infrared detection device according to claim 6, characterized in that the signal processing unit (30) comprises: a substrate (32) and an analog front-end chip (31) provided on the substrate (32);
the base plate (32) is arranged on the support (11);
the analog front-end chip (31) receives the electric signal output by the induction element (20), converts the electric signal and outputs the converted electric signal.
10. Thermopile infrared detection device according to claim 9, characterized in that the analog front-end chip (31) is COB-packaged on the substrate (32).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921396267.1U CN210571044U (en) | 2019-08-22 | 2019-08-22 | Infrared detection device of thermopile |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921396267.1U CN210571044U (en) | 2019-08-22 | 2019-08-22 | Infrared detection device of thermopile |
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| CN210571044U true CN210571044U (en) | 2020-05-19 |
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| CN201921396267.1U Active CN210571044U (en) | 2019-08-22 | 2019-08-22 | Infrared detection device of thermopile |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111900244A (en) * | 2020-07-01 | 2020-11-06 | 上海烨映电子技术有限公司 | Insulating plate heat-carrying electric pile sensor component and manufacturing method thereof |
| CN113138028A (en) * | 2021-03-24 | 2021-07-20 | 深圳市谷德科技有限公司 | Infrared thermopile sensor and temperature measurement device, system and method |
-
2019
- 2019-08-22 CN CN201921396267.1U patent/CN210571044U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111900244A (en) * | 2020-07-01 | 2020-11-06 | 上海烨映电子技术有限公司 | Insulating plate heat-carrying electric pile sensor component and manufacturing method thereof |
| CN113138028A (en) * | 2021-03-24 | 2021-07-20 | 深圳市谷德科技有限公司 | Infrared thermopile sensor and temperature measurement device, system and method |
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