CN210552489U

CN210552489U - Eps cystosepiment cooling device

Info

Publication number: CN210552489U
Application number: CN201921591832.XU
Authority: CN
Inventors: 张磊
Original assignee: Wuhan Bojun Energy Saving Thermal Insulation Material Co Ltd
Current assignee: Wuhan Bojun Energy Saving Thermal Insulation Material Co Ltd
Priority date: 2019-09-23
Filing date: 2019-09-23
Publication date: 2020-05-19
Anticipated expiration: 2029-09-23

Abstract

The utility model relates to an Eps foam board cooling device, which comprises a base and a top board, wherein the top of the base is connected with the bottom of the top board through four support columns; a lifting plate is arranged between the base and the top plate, an air cylinder is arranged at the top of the top plate, and a piston rod of the air cylinder penetrates through the top plate to be connected with the top of the lifting plate; the bottom of the lifting plate is connected with the top of the upper die through four elastic telescopic rods, and the top of the base is provided with a lower die at a position opposite to the upper die; and the upper die and the lower die are both internally provided with a cooling water pipe. The utility model has the advantages that: the cooling device for the Eps foam plate is simple in structure, and the cooling water pipes are arranged in the upper die and the lower die, so that all parts of the Eps foam plate can be cooled, the cooling effect is good, and the production quality of the Eps foam plate can be improved; meanwhile, the elastic telescopic rod can prevent the Eps foam board from being damaged by pressing due to larger impact force when the upper die is pressed on the Eps foam board.

Description

Eps cystosepiment cooling device

Technical Field

The utility model relates to a Eps cystosepiment production facility field especially relates to an Eps cystosepiment cooling device.

Background

The production process of the Eps foam board needs to use a cooling device to cool and mold the Eps foam board, and the existing cooling device has a complex structure and poor cooling efficiency, so that the production quality of the Eps foam board is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that an Eps cystosepiment cooling device is provided, solve the not enough of prior art.

The utility model provides an above-mentioned technical problem's technical scheme as follows: an Eps foam plate cooling device comprises a base and a top plate, wherein the top of the base is connected with the bottom of the top plate through four support columns; a lifting plate is arranged between the base and the top plate, an air cylinder is arranged at the top of the top plate, and a piston rod of the air cylinder penetrates through the top plate to be connected with the top of the lifting plate; the bottom of the lifting plate is connected with the top of an upper die through four elastic telescopic rods, and a lower die is arranged at the position, opposite to the upper die, of the top of the base; and the upper die and the lower die are internally provided with a cooling water pipe, and the two cooling water pipes are respectively connected with the two cooling mechanisms.

The utility model has the advantages that: the cooling device for the Eps foam plate is simple in structure, and the cooling water pipes are arranged in the upper die and the lower die, so that all parts of the Eps foam plate can be cooled, the cooling effect is good, and the production quality of the Eps foam plate can be improved; meanwhile, the elastic telescopic rod can prevent the Eps foam board from being damaged by pressing due to larger impact force when the upper die is pressed on the Eps foam board.

Further: four through holes are formed in the lifting plate, and the four supporting columns penetrate through the four through holes respectively and are connected with the lifting plate in a sliding mode.

The beneficial effects of the further scheme are as follows: the lifting plate can be stably lifted.

Further: the elastic telescopic rod comprises a sleeve and an inner rod; the sleeve is arranged at the bottom of the lifting plate, the inner rod is arranged at the top of the upper die, and the inner rod is telescopically sleeved in the sleeve; the inner rod is positioned on one part outside the sleeve and is sleeved with a spring, one end of the spring is connected with the sleeve, and the other end of the spring is connected with the upper die.

The beneficial effects of the further scheme are as follows: the elastic telescopic rod is simple in structure and good in elastic performance.

Further: four leveling support legs are installed at the bottom of the base, and a level bubble is installed at the top of the top plate.

The beneficial effects of the further scheme are as follows: the Eps foam board cooling device can be leveled through the leveling feet, and whether the Eps foam board cooling device is leveled or not can be observed through the leveling bubbles.

Further: two handles are installed at the top of the top plate.

The beneficial effects of the further scheme are as follows: the handle may conveniently carry the Eps foam board cooling device.

Further: the cooling mechanism comprises a water storage tank, a heat exchanger and a circulating water pump; the water storage tank is connected with one end of the cooling water pipe through a water inlet pipe, the heat exchanger is connected with the other end of the cooling water pipe through a water drain pipe, the water storage tank is connected with the heat exchanger through a circulating water pipe, and the circulating water pipe is provided with the circulating water pump.

The beneficial effects of the further scheme are as follows: the cooling mechanism is simple in structure and good in cooling effect.

Further: the heat exchanger is a plate heat exchanger.

The beneficial effects of the further scheme are as follows:

drawings

FIG. 1 is a schematic structural view of an Eps foam board cooling device according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a cooling mechanism according to an embodiment of the present invention;

in the figure: 1. a base; 2. a top plate; 3. a support pillar; 4. a lifting plate; 5. a cylinder; 6. an elastic telescopic rod; 61. a sleeve; 62. an inner rod; 63. a spring; 7. an upper die; 8. a lower die; 9. a cooling water pipe; 10. a cooling mechanism; 101. a water storage tank; 102. a heat exchanger; 103. a water circulating pump; 104. a water inlet pipe; 105. a drain pipe; 106. a circulating water pipe; 11. a through hole; 12. leveling the support leg; 13. a level bubble; 14. a handle.

Detailed Description

The principles and features of the present invention are described below in conjunction with the following drawings, the examples given are only intended to illustrate the present invention and are not intended to limit the scope of the present invention.

Example one

As shown in fig. 1-2, an Eps foam plate cooling device comprises a base 1 and a top plate 2, wherein the top of the base 1 is connected with the bottom of the top plate 2 through four support columns 3; a lifting plate 4 is arranged between the base 1 and the top plate 2, an air cylinder 5 is arranged at the top of the top plate 2, and a piston rod of the air cylinder 5 penetrates through the top plate 2 to be connected with the top of the lifting plate 4; the bottom of the lifting plate 4 is connected with the top of an upper die 7 through four elastic telescopic rods 6, and a lower die 8 is arranged at the position, opposite to the upper die 7, of the top of the base 1; and the upper die 7 and the lower die 8 are internally provided with a cooling water pipe 9, and the two cooling water pipes 9 are respectively connected with two cooling mechanisms 10.

When the cooling device is used, the Eps foam plate is placed on the lower die 8, then the lifting plate 4 is driven to descend through the air cylinder 5, the lifting plate drives the upper die to descend, the Eps foam plate is pressed between the upper die and the lower die, and then cold water is supplied to the cooling water pipe through the cooling mechanism, so that the Eps foam plate is cooled and formed.

Example two

Four through holes 11 are arranged on the lifting plate 4, and the four support columns 3 respectively penetrate through the four through holes 11 and are in sliding connection with the lifting plate 4.

EXAMPLE III

The elastic telescopic rod 6 comprises a sleeve 61 and an inner rod 62; the sleeve 61 is arranged at the bottom of the lifting plate 4, the inner rod 62 is arranged at the top of the upper die 7, and the inner rod 62 is telescopically sleeved in the sleeve 61; a spring 63 is sleeved on a part of the inner rod 62 outside the sleeve 61, one end of the spring 63 is connected with the sleeve 61, and the other end is connected with the upper die 7.

Example four

Four leveling support legs 12 are arranged at the bottom of the base 1, and a leveling bubble 13 is arranged at the top of the top plate 2.

EXAMPLE five

Two handles 14 are mounted on top of the top plate 2.

EXAMPLE six

The cooling mechanism 10 comprises a water storage tank 101, a heat exchanger 102 and a circulating water pump 103; the water storage tank 101 is connected with one end of the cooling water pipe 9 through a water inlet pipe 104, the heat exchanger 102 is connected with the other end of the cooling water pipe 9 through a water outlet pipe 105, the water storage tank 101 and the heat exchanger 102 are connected through a circulating water pipe 106, and a circulating water pump 103 is arranged on the circulating water pipe 106.

The heat exchanger 102 is a plate heat exchanger.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.

Claims

1. The cooling device for the Eps foam plate is characterized by comprising a base (1) and a top plate (2), wherein the top of the base (1) is connected with the bottom of the top plate (2) through four support columns (3); a lifting plate (4) is arranged between the base (1) and the top plate (2), an air cylinder (5) is installed at the top of the top plate (2), and a piston rod of the air cylinder (5) penetrates through the top plate (2) to be connected with the top of the lifting plate (4); the bottom of the lifting plate (4) is connected with the top of an upper die (7) through four elastic telescopic rods (6), and a lower die (8) is arranged at the position, opposite to the upper die (7), of the top of the base (1); and the upper die (7) and the lower die (8) are internally provided with a cooling water pipe (9), and the two cooling water pipes (9) are respectively connected with two cooling mechanisms (10).

2. The Eps foam board cooling device of claim 1, wherein the lifter plate (4) is provided with four through holes (11), and the four support columns (3) respectively pass through the four through holes (11) to be slidably connected with the lifter plate (4).

3. The Eps foam plate cooling device according to claim 1, wherein the elastic telescopic rod (6) comprises a sleeve (61) and an inner rod (62); the sleeve (61) is arranged at the bottom of the lifting plate (4), the inner rod (62) is arranged at the top of the upper die (7), and the inner rod (62) is telescopically sleeved in the sleeve (61); the inner rod (62) is located on one part outside the sleeve (61) and is sleeved with a spring (63), one end of the spring (63) is connected with the sleeve (61), and the other end of the spring (63) is connected with the upper die (7).

4. The Eps foam slab cooling device of claim 1, wherein four leveling feet (12) are mounted at the bottom of the base (1) and leveling vials (13) are mounted at the top of the top plate (2).

5. An Eps foam board cooling device according to claim 1, wherein two handles (14) are mounted on top of the top board (2).

6. The Eps foam plate cooling arrangement of claim 1, wherein the cooling mechanism (10) comprises a water storage tank (101), a heat exchanger (102) and a circulating water pump (103); the water storage tank (101) is connected with one end of the cooling water pipe (9) through a water inlet pipe (104), the heat exchanger (102) is connected with the other end of the cooling water pipe (9) through a water discharge pipe (105), the water storage tank (101) is connected with the heat exchanger (102) through a circulating water pipe (106), and the circulating water pump (103) is arranged on the circulating water pipe (106).

7. The Eps foam sheet cooling arrangement of claim 6, wherein the heat exchanger (102) is a plate heat exchanger.