CN210551638U

CN210551638U - IC cutting device

Info

Publication number: CN210551638U
Application number: CN201921358881.9U
Authority: CN
Inventors: 孟令辉; 杨洪剑; 李一康; 张立昌; 李俊辰
Original assignee: Suzhou Harmontronics Intelligent Technology Co ltd
Current assignee: Suzhou Harmontronics Intelligent Technology Co ltd
Priority date: 2019-08-21
Filing date: 2019-08-21
Publication date: 2020-05-19
Anticipated expiration: 2029-08-21

Abstract

The utility model discloses a IC cutting device, including frame, fixed plate, first backup pad, second backup pad, first drive arrangement, apron, pilot pin installation piece, second drive arrangement, third drive arrangement, cut the slider, go up the briquetting, go up the cut-off knife, lower cut-off knife, take material from jam plate, gyro wheel, first elastic element, second elastic element, cut the track, the utility model discloses a IC cutting device can accomplish IC's pay-off automatically and cut, need not manual operation and pay-off and cut the integration together, has reduced the cost of labor, labour saving and time saving to do not have two module complex problems, make the product pay-off and cut and link up the convenience, the product cuts efficiently, and the qualification rate after IC cuts is high.

Description

IC cutting device

Technical Field

The utility model relates to a IC production and processing field especially relates to an IC cutting device.

Background

In the IC production process, at first need cut IC from the material area, then get into subsequent work such as bending, the contact pin, at traditional in-process, IC cuts all manual operation, it is manual with IC to peel off from the material area, this kind of mode of cutting wastes time and energy, the cost of labor is high, also can lead to the product percent of pass to reduce, slowly cutting device has replaced manual operation, but often pay-off module and cutting module part, make equipment compact inadequately, and can not compatible various model products, material transmission process is complicated, two module docks inconveniently, some problems can appear in the butt joint process, influence work efficiency and product quality.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome above-mentioned prior art not enough, provide a IC cutting device, the device can accomplish IC's pay-off automatically and cut, need not manual operation and pay-off and cut the integration together, make equipment structure compact, reduced the cost of labor, labour saving and time saving to can be compatible the IC of various models, the product cuts efficiently, the qualification rate after the IC cuts is high.

The utility model discloses a solve the technical scheme that its technical problem adopted and be: an IC cutting device comprises a frame, a fixing plate, a first supporting plate, a second supporting plate, a first driving device, a cover plate, a positioning needle mounting block, a second driving device, a third driving device, a cutting slide block, an upper pressing block, an upper cutter, a lower cutter, a material belt self-locking plate, a roller, a first elastic element, a second elastic element and a cutting track, wherein the fixing plate is fixed on the frame, the first driving device is fixed on the frame, the second supporting plate is connected with the first driving device and can slide on the frame, the second driving device is fixed on the second supporting plate, the positioning needle mounting block is connected with the second driving device, the positioning needle is fixed on the positioning needle mounting block, thus, the first driving device can drive the positioning needle to move horizontally, and the second driving device can drive the positioning needle to move vertically, the material belt self-locking plate is arranged in the frame and connected with the bottom of the frame through a first elastic element, the roller is fixed on the positioning pin mounting block, so that the roller can move along with the positioning pin mounting block, the roller is always kept above the material belt self-locking plate, the material belt self-locking plate can be extruded by downward movement, the cover plate is fixed on the fixed plate and leaves a gap through which materials can pass with the fixed plate, the first support plate is fixed on the frame, the cutting track is fixed on the first support plate, the third drive device is fixed on the first support plate, the cutting slide block is connected with the third drive device and moves on the cutting track, the upper cutting knife is connected with the cutting slide block, the upper pressing block is connected with the cutting slide block through the second elastic element, so that the third drive device can drive the upper pressing block and the upper cutting knife to vertically move, the lower cutter is fixed on the frame.

Specifically, IC cutting device still includes the waste material way, the waste material says and is fixed in on the fixed plate, the accessible is taken to the waste material says and retrieves.

Specifically, the IC cutting device further comprises a material belt cutter, the material belt cutter is fixed on the cutting sliding block, the third driving device drives the cutting sliding block to move up and down and simultaneously drives the material belt cutter to move up and down, the cutting of the waste material belt is completed, and the waste material belt is convenient to recycle.

The utility model discloses a working process of IC cutting device does: the second driving device drives the positioning needle mounting block to drive the positioning needle and the roller to move downwards, when the positioning needle is inserted into the feeding hole, the roller presses the material belt self-locking plate downwards, the first elastic element is pressed tightly to loosen the material belt which is extruded and fixed by the cover plate and the material belt self-locking plate, the first driving device drives the positioning needle to move horizontally to feed the material belt forwards, the material to be cut is sent to the lower cutter, the second driving device drives the positioning needle mounting block to move upwards, the positioning needle leaves the material belt hole, the roller leaves the material belt self-locking plate, the first elastic element rebounds back to press and fix the material belt by the material belt self-locking plate and the cover plate, the third driving device drives the cutting slide block to drive the upper pressing block and the upper cutter to move downwards, the upper pressing block contacts with the material and presses the material, the second elastic element is pressed tightly, the upper cutter and the lower cutter cut the material, after cutting is finished, the third driving device drives, the second elastic element rebounds, the upper pressing block resets, one action cycle is completed, the material belt cutter can move downwards along with the cutting slide block to cut the material belt, and the cut material belt falls into the waste material channel to be recycled.

Drawings

FIG. 1 is a front view of an IC trimming apparatus of the present invention;

FIG. 2 is a rear view of an IC trimming apparatus according to the present invention;

FIG. 3 is a left side view of an IC trimming apparatus of the present invention;

FIG. 4 is a top view of an IC trimming apparatus according to the present invention;

3 FIG. 3 5 3 is 3 a 3 cross 3- 3 sectional 3 view 3 taken 3 along 3 line 3 A 3- 3 A 3 of 3 an 3 IC 3 trimming 3 apparatus 3 according 3 to 3 the 3 present 3 invention 3; 3

1. A first elastic element; 2. a material belt self-locking plate; 3. a frame; 4. a first driving device; 5. a fixing plate; 6. a cover plate; 7. a positioning pin; 8. a positioning pin mounting block; 9. a second driving device; 10. a third driving device; 11. cutting the sliding block; 12. pressing the blocks; 13. mounting a cutter; 14. a lower cutter; 15. a waste channel; 16. a first support plate; 17. a second support plate; 18. a material belt cutter; 19. cutting a track; 20. a roller; 21. a second elastic element.

Detailed Description

For better understanding of the technical solution of the present invention, a preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

As shown in fig. 1, fig. 2, fig. 3, fig. 4, and fig. 5, the IC cutting device of the present invention comprises a frame 3, a fixing plate 5, a first supporting plate 16, a second supporting plate 17, a first driving device 4, a cover plate 6, a positioning pin 7, a positioning pin mounting block 8, a second driving device 9, a third driving device 10, a cutting slider 11, an upper pressing block 12, an upper cutting knife 13, a lower cutting knife 14, a material belt self-locking plate 2, a roller 20, a first elastic element 1, a second elastic element 21, and a cutting rail 19, wherein the fixing plate 5 is fixed on the frame 3, the first driving device 4 is fixed on the frame 3, the second supporting plate 17 is connected with the first driving device 4 and can slide on the frame 3, the second driving device 9 is fixed on the second supporting plate 17, the positioning pin mounting block 8 is connected with the second driving device 9, the positioning pin 7 is fixed on the positioning pin mounting block 8, thus, the first driving device 4 can drive the positioning needle 7 to move horizontally, the second driving device 9 can drive the positioning needle 7 to move vertically, the material belt self-locking plate 2 is arranged in the frame 3 and is connected with the bottom of the frame 3 through the first elastic element 1, the roller 20 is fixed on the positioning needle mounting block 8, so that the roller 20 can move along with the positioning needle mounting block 8, the roller 20 is always kept above the material belt self-locking plate 2 and can extrude the material belt self-locking plate 2 by moving downwards, the cover plate 6 is fixed on the fixing plate 5 and leaves a gap through which materials can pass with the fixing plate 5, the first supporting plate 16 is fixed on the frame 3, the cutting track 19 is fixed on the first supporting plate 16, the third driving device 10 is fixed on the first supporting plate 16, the cutting slide block 11 is connected with the third driving device 10 and moves on the cutting track 19, the upper cutting knife 13 is connected with the cutting slide block 11, the upper pressing block 12 is connected with the cutting slide block 11 through the second elastic element, thus, the third driving device 10 can drive the upper pressing block 12 and the upper cutter 13 to move vertically, and the lower cutter 14 is fixed on the frame 3.

As shown in FIG. 1, the utility model discloses a IC cutting device still includes waste material way 15, and waste material way 15 is fixed in on the fixed plate 5, and waste material area accessible waste material way 15 is retrieved.

As shown in fig. 3, the utility model discloses a IC cutting device still includes material area cutter 18, and material area cutter 18 is fixed in and cuts on slider 11, and the drive of third drive arrangement 10 drives material area cutter 18 up-and-down motion when cutting slider 11 up-and-down motion, accomplishes cutting the abandonment material area, convenient the recovery.

Finally, it should be noted that: it should be understood that the above examples are only for clearly illustrating the present invention and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious changes and modifications may be made without departing from the scope of the present invention.

Claims

1. An IC cutting device is characterized by comprising a rack, a fixing plate, a first supporting plate, a second supporting plate, a first driving device, a cover plate, a positioning pin mounting block, a second driving device, a third driving device, a cutting slide block, an upper pressing block, an upper cutter, a lower cutter, a material belt self-locking plate, a roller, a first elastic element, a second elastic element and a cutting track, wherein the fixing plate is fixed on the rack, the first driving device is fixed on the rack, the second supporting plate is connected with the first driving device and can slide on the rack, the second driving device is fixed on the second supporting plate, the positioning pin mounting block is connected with the second driving device, the positioning pin is fixed on the positioning pin mounting block, the self-locking plate is arranged in the rack and is connected with the bottom of the rack through the first elastic element, the gyro wheel is fixed in on the pilot pin installation piece, the apron is fixed in on the fixed plate, first backup pad is fixed in the frame, cut the track and be fixed in on the first backup pad, third drive arrangement is fixed in on the first backup pad, cut the slider with third drive arrangement connects and move on cutting the track, go up the cut-off knife with it connects to cut the slider, go up the briquetting and pass through second elastic element with it connects to cut the slider, the cut-off knife is fixed in down in the frame.

2. The IC trimming apparatus according to claim 1, further comprising a waste chute, the waste chute being secured to the mounting plate.

3. The IC cutting apparatus as claimed in claim 1, further comprising a tape cutter fixed to said cutting slider.