CN210524141U - Device for processing transparent dielectric material by static pressure water assisted nanosecond laser - Google Patents
Device for processing transparent dielectric material by static pressure water assisted nanosecond laser Download PDFInfo
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- CN210524141U CN210524141U CN201921601224.2U CN201921601224U CN210524141U CN 210524141 U CN210524141 U CN 210524141U CN 201921601224 U CN201921601224 U CN 201921601224U CN 210524141 U CN210524141 U CN 210524141U
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Abstract
The utility model relates to a device of supplementary nanosecond laser beam machining transparent dielectric material of static pressure water belongs to the material micro-machining field. The device consists of a liquid pressure supply system, a liquid storage and discharge system, a workpiece clamping system and a laser processing system. The liquid pressure supply system and the liquid storage and discharge system are fixedly connected to a working platform of the laser processing system, and the workpiece clamping system is fixedly connected to the upper part of the liquid storage and discharge system. The water in the water feeding tank is pressurized through the high-pressure resistant injector, so that a contact surface is generated between the transparent medium material and the water, the laser absorption rate of the transparent medium material at the contact interface is improved, the plasma diffusion in a processing area is limited, and the processing efficiency is improved. Has the advantages that: the problem of low laser absorption rate of the transparent medium is solved, and the machinability of the laser processing transparent medium material is improved; the applied local pressure limits the diffusion of plasma, can effectively improve the processing efficiency and effectively reduce the pollution to the processing surface.
Description
Technical Field
The utility model relates to a material micro-machining field, in particular to supplementary nanosecond laser beam machining transparent dielectric material's of static pressure water device. The utility model discloses not only can promote the machinability who utilizes nanosecond laser processing transparent medium material, through applying local pressure restriction plasma diffusion moreover, improve corresponding machining efficiency. The utility model is suitable for a have transparent dielectric material's of transmission characteristic nanosecond laser beam machining to the nanosecond laser, have potential application prospect in fields such as optics, precision finishing.
Background
Transparent dielectric materials such as fused quartz, sapphire and the like are very important optical materials and have very important application in the fields of aerospace, precision optics and the like. However, such optical materials tend to be hard and brittle, making their processing difficult. Although the nanosecond laser processing is widely applied to materials such as metals, because the optical materials often have the characteristic of penetrating nanosecond laser, the absorption rate of the optical materials to the nanosecond laser is extremely low, and the nanosecond laser cannot be used for directly and effectively processing the transparent dielectric materials. In order to realize nanosecond laser processing of the transparent medium material, adding a colored material or a chemical reagent on the back of the transparent medium is a frequently adopted method, so that although the nanosecond laser processing of the transparent medium material can be realized, the colored material or the chemical reagent can be also severely ablated or generate a chemical reaction in the processing process, and the processing surface of the transparent medium material is polluted. Therefore, how to realize the low-pollution and high-efficiency nanosecond laser processing of the transparent dielectric material is a problem which needs to be solved urgently in the nanosecond laser processing of the transparent dielectric material.
Disclosure of Invention
An object of the utility model is to provide a supplementary nanosecond laser beam machining transparent medium material's of static pressure water device has solved the unable processing of utilization nanosecond laser beam machining transparent medium material or the problem that machining efficiency is low that prior art exists.
The above object of the utility model is realized through following technical scheme:
the device for processing the transparent dielectric material by the aid of the static pressure water and the nanosecond laser comprises a liquid pressure supply system 1, a liquid storage and discharge system 2, a workpiece clamping system 3 and a laser processing system 4, wherein the liquid pressure supply system 1 is fixedly connected to a processing platform 403 of the laser processing system 4, the liquid storage and discharge system 2 is connected with the liquid pressure supply system 1, and the workpiece clamping system 3 is connected with the liquid storage and discharge system 2.
The liquid pressure supply system 1 is: bottom plate 101 fixed connection is on processing platform 403, the bottom of mounting one 102, the bottom of support 105 and the bottom of mounting two 107 are fixed connection respectively on bottom plate 101, the left end fixed connection of connecting plate one 103 is on the upper portion of mounting one 102, electric putter 104 left end fixed connection is on connecting plate one 103 right-hand member, electric putter 104 cylinder liner is put on support 105, connecting plate two 106 left end fixed connection is at electric putter 104's telescopic link rightmost end, connecting plate two 106 right-hand members and high pressure resistant syringe 108 push rod end face contact, high pressure resistant syringe 108 fixed connection is on mounting two 107, crossover sub one 109 left end fixed connection is in the exit of high pressure resistant syringe 108, crossover sub one 109 right-hand member fixed connection is at the basin 201 right side lateral wall of liquid storage and discharge system 2.
The liquid storage and discharge system 2 is: the bottom of the water tank 201 is fixedly connected to the bottom plate 101 of the liquid pressure supply system 1, the pressure gauge adapter 202 is fixedly connected to the left side wall of the water tank 201, the pressure gauge 203 is fixedly connected to the pressure gauge adapter 202, the water tank cover 204 is welded to the water tank 201, and the drain switch 205 is fixedly connected to the front side wall of the water tank 201.
The workpiece clamping system 3 is: the bottom of the second adapter 301 is fixedly connected to a water tank cover 204 of the liquid storage and discharge system 2, the first sealing ring 302 is installed at a circumferential lower groove of the first metal sheet 303, the second sealing ring 304 is installed at a circumferential upper groove of the first metal sheet 303, the first silicone pad 305 is fixedly connected to the first metal sheet 303 through glue, a transparent dielectric material 306 is placed in a square groove of the first silicone pad 305, the second silicone pad 307 is installed on a small circular groove of the first silicone pad 305, the second metal sheet 308 is installed in a large circular groove of the first silicone pad 305 and a square groove of the second silicone pad 307, the first metal sheet 303, the second metal sheet 308 and parts between the first metal sheet and the second metal sheet are placed in the circular groove of the second adapter 301, and the metal pressing cap 309 is fixedly connected to the upper portion of the second adapter 301.
The laser processing system 4 is: the bottom of a supporting box body 401 is placed on the horizontal ground, the bottom of a processing platform 403 is fixedly connected to the upper portion of the supporting box body 401, a laser 402 is installed on a bottom plate inside the supporting box body 401, an optical focusing lens 404 is installed at the front end of an optical X-Y axis vibrating mirror 405, the bottom surface of the optical X-Y axis vibrating mirror 405 is fixedly connected to a left side wall platform of a Z axis lifting table 406, the bottom of the Z axis lifting table 406 is fixedly connected to the processing platform 403, a computer 407 is installed on the right side wall of the Z axis lifting table 406, and a power switch 408 is installed on the processing platform 403.
The beneficial effects of the utility model reside in that: novel conception, simple structure, safe and convenient use. The water in the water feeding tank is pressurized through the high-pressure resistant injector, so that a contact surface is generated between the transparent medium material and the water, the laser absorption rate of the transparent medium material at the contact interface is improved, and the processing of the transparent medium material is further realized; meanwhile, the applied local pressure limits the plasma diffusion in the processing area, and the processing efficiency is improved. In addition, because no chemical reagent is used as auxiliary liquid, the pollution to the processing surface can be effectively reduced, a novel technical means is provided for nanosecond laser processing of the transparent medium material, and the method has important application prospects in the fields of optics, precision processing and the like. The practicability is strong.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate example embodiments of the invention and together with the description serve to explain the invention without limitation.
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of a liquid pressure supply system according to the present invention;
FIG. 3 is a schematic view of the liquid storage and discharge system of the present invention;
FIG. 4 is a schematic structural view of a workpiece clamping system according to the present invention;
FIG. 5 is a cross-sectional view of the A-A side of the workpiece clamping system of the present invention;
fig. 6 is a schematic structural view of the laser processing system of the present invention;
FIG. 7 is a schematic diagram of static pressure water assisted nanosecond laser processing of a transparent dielectric material.
In the figure: 1. a liquid pressure supply system; 101. a base plate; 102. a first fixing part; 103. a first connecting plate; 104. an electric push rod; 105. a support; 106. a second connecting plate; 107. a second fixing part; 108. a high pressure resistant syringe; 109. a first conversion connector; 2. a liquid storage and discharge system; 201. a water tank; 202. a pressure gauge adapter; 203. a pressure gauge; 204. a water tank cover; 205. a drain switch; 3. a workpiece clamping system; 301. a second adapter; 302. a first sealing ring; 303. a first metal sheet; 304. a second sealing ring; 305. a first silica gel pad; 306. a transparent dielectric material; 307. a second silica gel pad; 308. a second metal sheet; 309. pressing a cap with metal; 4. a laser processing system; 401. supporting the box body; 402. a laser; 403. a processing platform; 404. an optical focusing lens; 405. an optical X-Y axis galvanometer; 406. a Z-axis lifting table; 407. a computer; 408. and a power switch.
Detailed Description
The details of the present invention and its embodiments are further described below with reference to the accompanying drawings.
Referring to fig. 1 to 7, the utility model discloses a device of supplementary nanosecond laser beam machining transparent medium material of static pressure water pressurizes through the water of high pressure resistant syringe feed water tank, makes and produces the contact surface between transparent medium material and the water, improves transparent medium material at the laser absorption rate of contact interface, and the regional plasma diffusion of restriction processing improves machining efficiency simultaneously. The processing device is novel, the problem of low laser absorption rate of the transparent medium is solved through the created contact interface, and the processability of the laser processing transparent medium material is improved; the applied local pressure limits the plasma diffusion and can effectively improve the processing efficiency. In addition, because no chemical reagent is used as auxiliary liquid, the pollution to the processing surface can be effectively reduced, and a novel technical means is provided for nanosecond laser processing of the transparent medium material.
Referring to fig. 1, the utility model discloses a supplementary nanosecond laser processing transparent medium material's of static pressure water device, supply pressure system 1, liquid to store and discharge system 2, work piece clamping system 3 and laser beam machining system 4 including liquid, wherein, liquid supplies pressure system 1 fixed connection on laser beam machining system 4's processing platform 403, and liquid is stored and is supplied pressure system 1 with discharge system 2 and liquid and be connected, and work piece clamping system 3 is stored with liquid and is connected with discharge system 2.
Referring to fig. 2, the liquid pressure supply system 1 includes a bottom plate 101, a first fixing member 102, a first connecting plate 103, a power push rod 104, a support 105, a second connecting plate 106, a second fixing member 107, a high pressure resistant syringe 108 and a first adapter 109. Bottom plate 101 fixed connection is on processing platform 403, the bottom of mounting one 102, the bottom of support 105 and the bottom of mounting two 107 are fixed connection respectively on bottom plate 101, the left end fixed connection of connecting plate one 103 is on the upper portion of mounting one 102, electric putter 104 left end fixed connection is on connecting plate one 103 right-hand member, electric putter 104 cylinder liner is put on support 105, connecting plate two 106 left end fixed connection is at electric putter 104's telescopic link rightmost end, connecting plate two 106 right-hand members and high pressure resistant syringe 108 push rod end face contact, high pressure resistant syringe 108 fixed connection is on mounting two 107, crossover sub one 109 left end fixed connection is in the exit of high pressure resistant syringe 108, crossover sub one 109 right-hand member fixed connection is at the basin 201 right side lateral wall of liquid storage and discharge system 2.
Referring to fig. 3, the liquid storage and discharge system 2 includes a water tank 201, a pressure gauge adapter 202, a pressure gauge 203, a water tank cover 204, and a drain switch 205. The bottom of the water tank 201 is fixedly connected to the bottom plate 101 of the liquid pressure supply system 1, the pressure gauge adapter 202 is fixedly connected to the left side wall of the water tank 201, the pressure gauge 203 is fixedly connected to the pressure gauge adapter 202, the water tank cover 204 is welded to the water tank 201, and the drain switch 205 is fixedly connected to the front side wall of the water tank 201.
Referring to fig. 4 and 5, the workpiece clamping system 3 includes a second adapter 301, a first sealing ring 302, a first metal sheet 303, a second sealing ring 304, a first silicone pad 305, a transparent dielectric material 306, a second silicone pad 307, a second metal sheet 308, and a metal pressing cap 309. The bottom of the second adapter 301 is fixedly connected to a water tank cover 204 of the liquid storage and discharge system 2, the first sealing ring 302 is installed at a circumferential lower groove of the first metal sheet 303, the second sealing ring 304 is installed at a circumferential upper groove of the first metal sheet 303, the first silicone pad 305 is fixedly connected to the first metal sheet 303 through glue, a transparent dielectric material 306 is placed in a square groove of the first silicone pad 305, the second silicone pad 307 is installed on a small circular groove of the first silicone pad 305, the second metal sheet 308 is installed in a large circular groove of the first silicone pad 305 and a square groove of the second silicone pad 307, the first metal sheet 303, the second metal sheet 308 and parts between the first metal sheet and the second metal sheet are placed in the circular groove of the second adapter 301, and the metal pressing cap 309 is fixedly connected to the upper portion of the second adapter 301.
Referring to fig. 6, the laser processing system 4 includes a supporting box 401, a laser 402, a processing platform 403, an optical focusing lens 404, an optical X-Y axis galvanometer 405, a Z axis elevating table 406, a computer 407, and a power switch 408. The bottom of a supporting box body 401 is placed on the horizontal ground, the bottom of a processing platform 403 is fixedly connected to the upper portion of the supporting box body 401, a laser 402 is installed on a bottom plate inside the supporting box body 401, an optical focusing lens 404 is installed at the front end of an optical X-Y axis vibrating mirror 405, the bottom surface of the optical X-Y axis vibrating mirror 405 is fixedly connected to a left side wall platform of a Z axis lifting table 406, the bottom of the Z axis lifting table 406 is fixedly connected to the processing platform 403, a computer 407 is installed on the right side wall of the Z axis lifting table 406, and a power switch 408 is installed on the processing platform 403.
The above description is only a preferred example of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made to the present invention should be included in the protection scope of the present invention.
Claims (5)
1. The utility model provides a device of supplementary nanosecond laser beam machining transparent dielectric material of static pressure water which characterized in that: the laser machining device comprises a liquid pressure supply system (1), a liquid storage and discharge system (2), a workpiece clamping system (3) and a laser machining system (4), wherein the liquid pressure supply system (1) is fixedly connected to a machining platform (403) of the laser machining system (4), the liquid storage and discharge system (2) is connected with the liquid pressure supply system (1), and the workpiece clamping system (3) is connected with the liquid storage and discharge system (2).
2. The apparatus of claim 1, wherein the apparatus comprises: the liquid pressure supply system (1) is as follows: the bottom plate (101) is fixedly connected to the processing platform (403), the bottom of the first fixing piece (102), the bottom of support (105) and the bottom of mounting two (107) are fixed connection respectively on bottom plate (101), connecting plate one (103) left end fixed connection is on the upper portion of mounting one (102), electric putter (104) left end fixed connection is on connecting plate one (103) right-hand member, electric putter (104) cylinder liner is put on support (105), connecting plate two (106) left end fixed connection is at the telescopic link rightmost end of electric putter (104), connecting plate two (106) right-hand member and high pressure resistant syringe (108) push rod end face contact, high pressure resistant syringe (108) fixed connection is on mounting two (107), first (109) left end fixed connection of conversion joint is in the exit of high pressure resistant syringe (108), first (109) right-hand member fixed connection of conversion joint is in basin (201) right side wall of liquid storage and discharge system (2).
3. The apparatus of claim 1, wherein the apparatus comprises: the liquid storage and discharge system (2) is: the bottom of the water tank (201) is fixedly connected to a bottom plate (101) of the liquid pressure supply system (1), the pressure gauge adapter (202) is fixedly connected to the left side wall of the water tank (201), the pressure gauge (203) is fixedly connected to the pressure gauge adapter (202), the water tank cover (204) is welded to the water tank (201), and the drainage switch (205) is fixedly connected to the front side wall of the water tank (201).
4. The apparatus of claim 1, wherein the apparatus comprises: the workpiece clamping system (3) is as follows: the bottom of the second adapter (301) is fixedly connected to a water tank cover (204) of the liquid storage and discharge system (2), the first sealing ring (302) is arranged at a circumferential lower groove of the first metal sheet (303), the second sealing ring (304) is arranged at a circumferential upper groove of the first metal sheet (303), the first silica gel pad (305) is fixedly connected to the first metal sheet (303) through glue, the transparent medium material (306) is placed in a square groove of the first silica gel pad (305), a second silica gel pad (307) is arranged on the small circular groove of the first silica gel pad (305), a second metal sheet (308) is arranged in the large circular groove of the first silica gel pad (305) and the square groove of the second silica gel pad (307), the first metal sheet (303), the second metal sheet (308) and parts between the first metal sheet and the second metal sheet are placed in the circular groove of the second conversion connector (301), and the metal pressing cap (309) is fixedly connected to the upper portion of the second conversion connector (301).
5. The apparatus of claim 1, wherein the apparatus comprises: the laser processing system (4) is as follows: the bottom of a supporting box body (401) is placed on the horizontal ground, the bottom of a processing platform (403) is fixedly connected to the upper portion of the supporting box body (401), a laser (402) is installed on a bottom plate inside the supporting box body (401), an optical focusing lens (404) is installed at the front end of an optical X-Y axis galvanometer (405), the bottom surface of the optical X-Y axis galvanometer (405) is fixedly connected to a left side wall platform of a Z axis lifting table (406), the bottom of the Z axis lifting table (406) is fixedly connected to the processing platform (403), a computer (407) is installed on the right side wall of the Z axis lifting table (406), and a power switch (408) is installed on the processing platform (403).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921601224.2U CN210524141U (en) | 2019-09-25 | 2019-09-25 | Device for processing transparent dielectric material by static pressure water assisted nanosecond laser |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921601224.2U CN210524141U (en) | 2019-09-25 | 2019-09-25 | Device for processing transparent dielectric material by static pressure water assisted nanosecond laser |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110560891A (en) * | 2019-09-25 | 2019-12-13 | 吉林大学 | Device and method for processing transparent dielectric material by using static pressure water to assist nanosecond laser |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110560891A (en) * | 2019-09-25 | 2019-12-13 | 吉林大学 | Device and method for processing transparent dielectric material by using static pressure water to assist nanosecond laser |
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