CN210524067U - Tin ball welding device - Google Patents

Abstract

The utility model relates to a solder ball welding device, which comprises a solder ball separation structure and an element placing structure, wherein the bottom of the solder ball separation structure is provided with a welding nozzle, and the welding nozzle comprises a first tin outlet end; the component placing structure is arranged below the first tin outlet end and comprises a bearing part, the bearing part is used for placing a component to be welded, the bearing part comprises a first end face used for placing the component to be welded, the first tin outlet end comprises a second end face used for outputting a tin ball, and the perpendicular line of the first end face and the perpendicular line of the second end face are relatively inclined. The embodiment of the utility model provides a tin ball welding set is through locating the first tin end that goes out of welding nozzle with bearing part, and bearing part and the relative slope of first tin end that goes out. Therefore, the welding points of the to-be-welded element and the first tin-out end of the welding nozzle which are placed on the bearing part can be closer, and the welding nozzle can be accurately aligned to the welding points in the welding process, so that the welding quality and the welding precision can be improved.

Description

Tin ball welding device

Technical Field

The utility model relates to a precision component welds technical field, especially relates to a tin ball welding set.

Background

With the development of science and technology, precision components such as electronic products and the like are more and more miniaturized, manufacturing processes are more and more complex, welding conditions are more and more rigorous, and the traditional manual welding technology can not meet the requirements of people on welding precision and welding quality for a long time. For example, most of the conventional microwave ferrite devices are welded manually, but the welding spots of the microwave ferrite devices are tiny, so that the welding precision and the welding quality are not satisfactory, and further, the connection strength and the working fatigue resistance strength of the manually welded microwave ferrite devices are poor. Therefore, there is an urgent need in the art to develop a solder ball bonding apparatus capable of improving the bonding precision and the bonding quality to adapt to the precise components with more and more rigorous bonding conditions, more and more complex manufacturing process and more tiny volume.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is desirable to provide a solder ball bonding apparatus capable of improving bonding accuracy and bonding quality.

A solder ball bonding apparatus comprising:

the bottom of the tin ball separation structure is provided with a welding nozzle, and the welding nozzle comprises a first tin outlet end; and

the component placement structure, the component placement structure is located the below of first tin end of going out, the component placement structure includes the bearing part, the bearing part is used for placing and treats the welding element, the bearing part is including being used for placing treat the first terminal surface of welding element, first tin end of going out is including the second terminal surface that is used for exporting the tin ball, the perpendicular line of first terminal surface with the perpendicular line relative tilt of second terminal surface.

The technical solution is further explained below:

in one embodiment, the included angle between the perpendicular to the first end surface and the perpendicular to the second end surface is α acute.

In one embodiment, the component placing structure further includes a first driving member connected to the supporting member, and the first driving member is configured to drive the supporting member to rotate.

In one embodiment, the first driving member includes a rotating shaft, the supporting member has a first through hole, the rotating shaft penetrates through the first through hole, and the rotating shaft is fixedly connected to the supporting member.

In one embodiment, the component placement structure further comprises a flat plate including a first face and a second face disposed opposite to each other, the first face placing the holding member, the second face being connected to the first driving member; the rotating shaft penetrates through the flat plate and then penetrates into the first through hole.

In one embodiment, the component placement structure further includes a second driving member connected to the flat plate for driving the flat plate to move back and forth in a direction from the holding member to the tip.

In one embodiment, the component placement structure further includes a buffer disposed between the supporting member and the first solder discharging terminal, and the buffer is disposed toward the supporting member.

In one embodiment, the tin ball separation structure further comprises a tin storage box, a working box and a cutting plate, wherein the tin storage box comprises a second tin outlet end, the working box is communicated with the second tin outlet end, a first channel for conveying tin balls is further arranged in the working box, the first channel is communicated with the first tin outlet end, the cutting plate is arranged in the working box, a second through hole is formed in the cutting plate corresponding to the second tin outlet end, and the hole diameters of the second through hole and the first channel are equal;

the cutting plate moves back and forth between a first position and a second position, the first position is the position of the cutting plate when the second through hole and the second tin outlet are aligned, and the second position is the position of the cutting plate when the second through hole and the first channel are aligned.

In one embodiment, the solder ball separation structure further comprises a third driving member, and the third driving member is connected with the cutting plate for driving the cutting plate to move back and forth between the first position and the second position.

In one embodiment, the working box is internally provided with a cavity for accommodating the third driving part and the cutting plate, the cavity comprises a first cavity and a second cavity communicated with the first cavity, and the first cavity is larger than the second cavity;

the cutting plate comprises a body and a cutting part arranged on the edge of the body, and the cutting part is provided with the second through hole; the body is arranged in the first cavity, the cutting part is arranged in the second cavity, and the second tin outlet end is communicated with the second cavity.

In one embodiment, the second tin outlet end is communicated with the second cavity along the thickness direction of the cut part, the thickness of the cut part is equal to the height of the second cavity along the thickness direction of the cut part, and the cut part moves in the second cavity along the direction perpendicular to the height of the second cavity.

In one embodiment, the solder ball separation structure further comprises a gas connector, and the gas connector is arranged on the working box;

the gas joint includes the end of giving vent to anger, the work box the first passageway with give vent to anger the end intercommunication, the first passageway runs through the work box with the second cavity.

In one embodiment, the soldering terminal further comprises a laser alignment structure, the laser alignment structure is arranged on one side of the solder ball separation structure and connected to the solder ball separation structure, and the laser alignment structure is used for aligning the welding tip to emit laser;

the laser alignment structure is internally provided with a pressure sensor used for sensing the change of the air pressure in the welding nozzle and a laser switch electrically connected with the pressure sensor, and the pressure sensor controls the opening and closing of the laser switch according to the change of the air pressure in the welding nozzle.

The tin ball welding device at least has the following beneficial effects:

(1) the embodiment of the utility model provides a tin ball welding set is through locating the below of the first tin end that goes out of welding nozzle with bearing member, and bearing member's first terminal surface and the relative slope of the second terminal surface of the first tin end that goes out. Therefore, the welding points of the to-be-welded element and the first tin-out end of the welding nozzle which are placed on the bearing part can be closer, and the welding nozzle can be accurately aligned to the welding points in the welding process, so that the welding quality and the welding precision can be improved.

(2) The embodiment of the utility model provides a tin ball welding set utilizes third drive component drive cutting board to remove in the work box through linking together third drive component and cutting board for the cutting board round trip movement between primary importance and second place. The second through hole on the cutting plate separates the solder ball of the second tin outlet end at the first position, and then when the second through hole is driven by the third driving part to move from the first position to the second position, the second through hole is aligned with the first channel, so that the first channel conveys the separated solder ball. The second through hole can move back and forth under the control of the third driving part, so that the solder ball can be continuously separated from the second tin outlet end by the second through hole. The tin ball welding device provided by the embodiment can accurately separate each tin ball, improves the separation efficiency, is favorable for improving the welding efficiency and the welding precision, and is more suitable for more precise elements.

Drawings

Fig. 1 is a schematic structural view of a solder ball bonding apparatus according to an embodiment of the present invention;

fig. 2 is a schematic structural view of a solder ball bonding apparatus at another angle according to an embodiment of the present invention;

FIG. 3 is a schematic cross-sectional view taken along the line A-A of FIG. 2;

fig. 4 is a schematic structural diagram of an element placement structure according to an embodiment of the present invention;

FIG. 5 is a schematic view of a support member and a component to be welded according to an embodiment of the present invention;

fig. 6 is a schematic structural view of a solder ball separation structure according to an embodiment of the present invention;

fig. 7 is an exploded schematic view of a solder ball separation structure according to an embodiment of the present invention;

fig. 8 is a schematic structural view of a solder ball separation structure at another angle according to an embodiment of the present invention;

fig. 9 is a schematic cross-sectional view taken along the direction B-B in fig. 8.

Description of reference numerals: 1. a solder ball separating structure, 11, a solder nozzle, 111, a first tin outlet, 12, a solder storage box, 121, a second tin outlet, 13, a work box, 131, an upper box cover, 132, a lower box cover, 133, a first channel, 134, a first chamber, 135, a second chamber, 14, a cutting plate, 141, a body, 142, a cutting part, 142a, a second through hole, 15, a third driving member, 151, a first transmission member, 152, a first slide rail, 153, a first guide member, 16, a gas connector, 161, a gas outlet, 162, a gas inlet, 2, a component placing structure, 21, a support member, 211, a first groove, 212, a first through hole, 22, a first driving member, 221, a rotating shaft, 23, a flat plate, 231, a first surface, 232, a second surface, 24, a second driving member, 25, a buffer, 26, a base, 261, a bottom pillar, 262, a long plate, 27, a fixing bracket, 28, a fastening member, 3. laser alignment structure, 4, element to be welded.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention can be embodied in many different forms other than those specifically described herein, and it will be apparent to those skilled in the art that similar modifications can be made without departing from the spirit and scope of the invention, and it is therefore not to be limited to the specific embodiments disclosed below.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The present embodiment provides a solder ball bonding apparatus having advantages of improving bonding accuracy and bonding quality, which will be described in detail below with reference to the accompanying drawings.

In one embodiment, referring to fig. 1 to 4 and fig. 6, a solder ball bonding apparatus includes a solder ball separation structure 1 and a device placement structure 2. The bottom of the solder ball separation structure 1 is provided with a welding tip 11, and the welding tip 11 includes a first tin outlet end 111. The component placement structure 2 is disposed below the first tin-out terminal 111, and the component placement structure 2 includes a supporting member 21. The supporting member 21 is used for placing the component 4 to be soldered, the supporting member 21 includes a first end surface for placing the component 4 to be soldered, the first solder terminal 111 includes a second end surface for outputting a solder ball, and a perpendicular line of the first end surface and a perpendicular line of the second end surface are inclined with respect to each other.

In the conventional solder ball bonding apparatus, the component 4 to be bonded is generally placed right below the first solder outlet 111, and since the solder point of the component to be bonded is generally interfered by other parts of the component 4 to be bonded or the position of the solder point is deviated so that the welding tip 11 cannot be directly aligned with the solder point, the bonding quality is low. However, in the solder ball bonding apparatus according to the embodiment of the present invention, the supporting member 21 is disposed below the first tin-out end 111 of the solder tip 11, and the first end surface of the supporting member 21 and the second end surface of the first tin-out end 111 are inclined relatively. In this way, the welding points of the component 4 to be welded placed on the supporting member 21 and the first tin-out end 111 of the welding tip 11 can be brought closer together, and the welding tip 11 can be accurately aligned with these welding points during welding, which is advantageous in improving the welding quality and the welding accuracy.

In one embodiment, referring to fig. 1 to 3, the included angle between the perpendicular line b of the first end surface and the perpendicular line a of the second end surface is α, which may be 5 °, 9 °, 20 °, 30 °, 45 °, etc. α is only required to ensure that the solder point of the to-be-soldered component 4 placed on the supporting member 21 and the first tin outlet 111 are in a straight line after the supporting member 21 is placed obliquely with respect to the soldering tip 11, so that the tin coming out of the first tin outlet 111 can accurately drop to the solder point, thereby facilitating to improve the soldering accuracy and the soldering quality.

In one embodiment, referring to fig. 4 and 5, a first groove 211 is further formed in the supporting member 21, the first groove 211 is disposed toward the welding tip 11, and the shape of the first groove 211 and the member 4 to be welded is matched for placing the member 4 to be welded. For example, when the to-be-welded component 4 is a microwave ferrite device with an approximately cubic shape, the first recess 211 is a hollow groove with a cubic shape matching the shape of the microwave ferrite device. Therefore, the microwave ferrite device can be fixed in the first groove 211 and is not easy to shake, and the welding tip 11 can be accurately aligned to the welding point of the element 4 to be welded, so that convenience is brought to the subsequent welding process.

In one embodiment, the element 4 to be soldered is a microwave ferrite device, and a magnetic element (not shown) is provided in the first recess 211. The microwave ferrite devices include isolators, circulators, switches, phase shifters, modulators, magneto-tuned filters, magneto-tuned oscillators, magnetic surface wave delay lines, and the like. The microwave ferrite device is made by utilizing the gyromagnetic effect of ferrite. The ferrite is a non-linear anisotropic magnetic substance, the magnetic conductivity of the ferrite changes along with the change of an external magnetic field, and the ferrite has non-linearity; when a constant magnetic field is applied, the permeability to the microwave magnetic field is also different in each direction, i.e., has anisotropy, and due to these characteristics, when an electromagnetic wave passes through the ferrite from different directions, a non-reciprocal property is exhibited, thereby making various non-reciprocal ferrite elements. Therefore, the magnetic element arranged in the first groove 211 can generate an attractive force to the microwave ferrite device, so that the microwave ferrite device to be welded can be more firmly fixed in the first groove 211. Specifically, four magnetic elements are provided at four corners of the first recess 211. It is understood that the magnetic elements may be in other numbers, and may be disposed in other positions of the first recess 211, which is not limited herein. Therefore, in the subsequent welding process, the microwave ferrite device to be welded is more firmly fixed in the supporting part 21 under the dual actions of the first groove 211 and the magnetic element, and does not shake or vibrate, and the first tin outlet end 111 of the welding tip 11 can be accurately aligned to the welding point of the microwave ferrite device, thereby being beneficial to improving the welding precision and the welding quality.

In one embodiment, referring to fig. 4 and 5, the component placement structure 2 further includes a first driving member 22. The first driving member 22 is connected to the supporting member 21, and the first driving member 22 is configured to drive the supporting member 21 to rotate. The first driving member 22 includes a rotating shaft 221, the supporting member 21 is provided with a first through hole 212, the rotating shaft 221 penetrates the first through hole 212, and the rotating shaft 221 is fixedly connected to the supporting member 21. Specifically, the rotation shaft 221 of the first driving member 22 is rotatable, the surface of the rotation shaft 221 is threaded, and the first through hole 212 is also threaded, so that the rotation shaft 221 can be screwed into the first through hole 212 to fixedly connect the rotation shaft 221 and the support member 21. When the rotation shaft 221 rotates, the support member 21 fixedly connected to the rotation shaft 221 also rotates, and the element to be welded 4 attached to the support member 21 also rotates. Therefore, in the welding process, the welding tip 11 is static, the element 4 to be welded can rotate relative to the welding tip 11 under the driving of the rotating shaft 221, each welding point on the element 4 to be welded can rotate to the first tin outlet end 111 of the welding tip 11 to be welded in sequence, and the alignment accuracy of the welding point and the welding tip 11 is guaranteed through the design, so that the welding efficiency can be improved. It should be understood that the fixing manner of the rotating shaft 221 and the supporting member 21 may be clamping, welding, riveting, etc., and is not limited in particular. Further, the first driving part 22 may be a motor or a cylinder.

In one embodiment, referring to fig. 1 to 4, the device placement structure 2 further includes a flat plate 23, the flat plate 23 includes a first surface 231 and a second surface 232 which are oppositely disposed, the first surface 231 is placed on the supporting member 21, and the second surface 232 is connected to the first driving member 22; the rotating shaft 221 passes through the plate 23 and then passes through the first through hole 212. When the flat plate 23 moves, the first driving member 22 and the holding member 21 move along with the flat plate 23.

In one embodiment, referring to fig. 1 to 4, the component placement structure 2 further includes a second driving member 24, the second driving member 24 is connected to the flat plate 23, and the second driving member 24 is configured to drive the flat plate 23 to move back and forth along the direction from the holding member 21 to the welding tip 11. Further, the component placement structure 2 further includes a buffer 25, the buffer 25 is disposed between the supporting member 21 and the first solder-out terminal 111, and the buffer 25 is disposed toward the supporting member 21.

In one embodiment, referring to fig. 1 to 4, the component placement structure 2 further includes a base 26, the plate 23 is disposed on the base 26, and the buffer 25 is connected to the base 26. Specifically, the base 26 includes a bottom pillar 261 and an elongated plate 262 provided on the bottom pillar 261, and the flat plate 23 is provided on the elongated plate 262.

Further, referring to fig. 3 and 4, the component placement structure 2 further includes a fixing bracket 27 and a fastening member 28, the fixing bracket 27 is disposed on one side of the flat plate 23, one end of the fixing bracket 27 is fixedly connected to the base 26, the other end of the fixing bracket 27 is provided with the buffer 25, a third through hole (not shown) is formed in the fixing bracket 27, the buffer 25 is disposed in the third through hole in a penetrating manner, and the fastening member 28 is used for fixing the buffer 25 in the third through hole. Specifically, the fixing bracket 27 is in an inverted "L" shape, and includes a cross bar and a vertical bar, wherein the cross bar is located between the first tin outlet end 111 and the flat plate 23, the vertical bar is fixed on one side of the flat plate 23, and the end of the vertical bar is fixed on the base 26. Thus, the buffer 25 is disposed on the cross bar such that the buffer 25 can be positioned just between the first tin outlet end 111 and the plate 23, such that the buffer 25 can just buffer the movement of the plate 23 toward the first tin outlet end 111. Further, the fastening member 28 may be a nut, so that the bumper 25 can be fixed to the rail by screwing the nut to the end of the bumper 25 after the bumper 25 passes through the third through hole. It is understood that the shape of the fixing bracket 27 may also be a Z-shape, a straight line shape, etc., as long as it is ensured that the buffer 25 is located between the first tin outlet end 111 and the flat plate 23 when mounted on the fixing bracket 27. The damper 25 may also be fixed to the fixing bracket 27 by means of snap-fit, riveting, or the like. The embodiment of the utility model provides a structure 2 is placed to component, through locating buffer 25 between dull and stereotyped 23 and the first tin end 111 of appearing, when second drive component 24 drive dull and stereotyped 23 when being close to the direction motion of welding nozzle 11, dull and stereotyped 23 can strike on buffer 25 earlier, dull and stereotyped 23 functioning speed can slow down thereupon and the motion stroke also is blocked by buffer 25, so dull and stereotyped 23 can directly not strike on welding nozzle 11, treat welding element 4 and welding nozzle 11 and also can not bump, thereby can effectively protect welding nozzle 11 and treat welding element 4.

The second driving member 24 is connected to the flat plate 23 for driving the flat plate 23 toward or away from the tip 11. Specifically, the second driving member 24 is an air cylinder and is disposed on the second surface 232 of the flat plate 23, the air cylinder includes a driving connecting rod, an end of the driving connecting rod penetrates through the flat plate 23 and is fixedly connected to the flat plate 23, and the driving connecting rod can drive the flat plate 23 to move toward or away from the welding tip 11 in the telescopic process. When the flat plate 23 moves in the direction close to the welding tip 11, the flat plate 23 will first hit the bumper 25, the moving speed of the flat plate 23 will be slowed down accordingly, and the moving stroke will also be blocked by the bumper 25, so that the flat plate 23 will not directly hit the welding tip 11, and the component 4 to be welded will not collide with the welding tip 11, thereby effectively protecting the welding tip 11 and the component 4 to be welded. It is understood that the second driving member 24 may be a driving structure such as an oil cylinder, a motor, etc., besides the air cylinder.

In an embodiment, referring to fig. 6, 7 and 9, the solder ball separation structure 1 further includes a solder storage box 12, a working box 13 and a cutting plate 14, the solder storage box 12 includes a second solder outlet 121, the working box 13 is connected to the second solder outlet 121, a first channel 133 for transporting the solder ball is further disposed in the working box 13, the first channel 133 is connected to the first solder outlet 111 of the solder nozzle 11, the cutting plate 14 is disposed in the working box 13, a second through hole 142a is disposed on the cutting plate 14 corresponding to the second solder outlet 121, and the second through hole 142a and the first channel 133 have the same aperture.

The cutting plate 14 is moved back and forth between a first position where the cutting plate 14 is positioned when the second through hole 142a and the second solder tail 121 are aligned, and a second position where the cutting plate 14 is positioned when the second through hole 142a and the first channel 133 are aligned.

In one embodiment, referring to fig. 7 and 9, the solder ball separation structure 1 further includes a third driving part 15. The third driving part 15 may be a driving structure such as a cylinder, an oil cylinder, a motor, etc. A third drive member 15 is disposed within the work box 13, the third drive member 15 being coupled to the cutting plate 14 for driving the cutting plate 14 to move back and forth between the first and second positions. Specifically, the third driving member 15 and the cutting plate 14 are connected together, the third driving member 15 drives the cutting plate 14 to move in the work box 13, so that the cutting plate 14 moves to a position where the second through hole 142a is aligned with the second tin outlet 121, the second through hole 142a separates the solder balls of the second tin outlet 121 at the position, and then when the second through hole 142a moves to the first channel 133 from the position where the second tin outlet 121 is separated by the driving of the third driving member 15, the second through hole 142a is aligned with the first channel 133, so that the first channel 133 transports the separated solder balls away. Since the second through hole 142a can move back and forth under the control of the third driving element 15, the second through hole 142a can continuously separate the solder ball from the second solder terminal 121. The tin ball separating device provided by the embodiment can accurately separate each tin ball, improves the separation efficiency, is favorable for improving the welding efficiency and the welding precision, and is more suitable for more precise elements.

In one embodiment, referring to fig. 7 and 8, a cavity is provided in the work box 13 for accommodating the third driving part 15 and the cutting plate 14. The cavity includes a first chamber 134 and a second chamber 135 in communication with the first chamber 134, the first chamber 134 being larger than the second chamber 135.

The cutting plate 14 comprises a body 141 and a cutting part 142 arranged at the edge of the body 141, and the cutting part 142 is provided with a second through hole 142 a; the body 141 is disposed in the first chamber 134, the cut portion 142 is disposed in the second chamber 135, and the second tin outlet 121 is connected to the second chamber 135. That is, the second tin outlet 121 is communicated with the second cavity 135, and the cut portion 142 having the second through hole 142a is disposed in the second cavity 135, so that when the second through hole 142a of the cut portion 142 is moved to a position communicated with the second tin outlet 121, the solder ball coming out of the second tin outlet 121 can directly fall into the second through hole 142 a. When the cutting portion 142 continues to move, i.e., the second through hole 142a is separated from the second tin-out end 121, the cutting portion 142 separates a solder ball. Then, when the second through hole 142a is moved to the first channel 133 from the position of the second solder outlet 121 by the third driving member 15, the second through hole 142a and the first channel 133 are aligned so that the first channel 133 transports the separated solder ball away. Since the second through hole 142a moves back and forth under the control of the third driving element 15, the second through hole 142a can continuously separate the solder ball from the second solder terminal 121.

In one embodiment, referring to fig. 7, 8 and 9, the second tin outlet 121 is connected to the second chamber 135 along the thickness direction of the cut portion 142, the thickness of the cut portion 142 is equal to the height of the second chamber 135 along the thickness direction of the cut portion 142, and the cut portion 142 moves in the second chamber 135 along the direction perpendicular to the height of the second chamber 135. That is, the cut portion 142 is completely matched with the second cavity 135, and the upper and lower planes of the cut portion 142 are completely attached to the wall surface of the second cavity 135, so that the second through hole 142a can directly contact the solder ball of the second tin outlet 121 and directly separate the solder ball.

In one embodiment, referring to fig. 7, the third driving part 15 includes a first transmission part 151, and the first transmission part 151 is fixed to the body 141. Specifically, the first transmission member 151 is a transmission link, the third driving member 15 drives the first transmission member 151 to move in the direction from the first channel 133 to the second tin outlet 121 in the working box 13, the body 141 fixedly connected to the first transmission member 151 can only move in the direction from the first channel 133 to the second tin outlet 121, that is, the third driving member 15 drives the cutting plate 14 to move in the direction from the first channel 133 to the second tin outlet 121 through the first transmission member 151, and further the second through hole 142a of the cutting plate 14 can also move back and forth between the second tin outlet 121 and the first channel 133. Further, a first slide rail 152 and a first guide member 153 disposed in the first slide rail 152 are disposed in the first cavity 134, the first slide rail 152 is disposed in the first cavity 134 along a direction from the first channel 133 to the second tin outlet 121, the first slide rail 152 is fixedly connected to the working box 13, and the first guide member 153 is fixedly connected to the body 141. That is, the first guide part 153 is movable with the body 141 with respect to the first slide rail 152. Since the first guiding component 153 is disposed in the first sliding rail 152, the first sliding rail 152 is disposed in the first chamber 134 along the direction from the first channel 133 to the second tin-out end 121, that is, the moving direction and the moving path of the first guiding component 153 are limited, and the first guiding component 153 can only move along the direction from the first channel 133 to the second tin-out end 121. Thus, the first transmission part 151 drives the cutting board 14 to move, the cutting board 14 drives the first guide part 153 fixedly connected to the cutting board 14 to move in the first slide rail 152, the running path of the first guide part 153 is limited by the first slide rail 152, and thus the movement of the cutting board 14 fixedly connected to the first guide part 153 is also indirectly limited by the first slide rail 152. In this way, the movement of the cutting plate 14 can be controlled more precisely, so that the second through hole 142a can be accurately aligned and communicated with the second tin outlet 121 and the first channel 133 when moving back and forth between the second tin outlet 121 and the first channel 133. It is understood that the first slide rail 152 can be fixed in the work box 13 by screwing, welding, clipping, etc., and the first guide member 153 can be fixed on the body 141 by screwing, welding, clipping, etc.

In one embodiment, referring to fig. 6, 7 and 9, the work box 13 includes an upper box cover 131 and a lower box cover 132 abutting against the upper box cover 131, the tin storage box 12 is disposed on the upper box cover 131, and the upper box cover 131 is opened with an opening (not shown), and the opening is communicated with the second tin outlet end 121. That is, the solder balls of the second tin-out terminal 121 can enter the second through hole 142a of the cutting plate 14 through the opening.

In one embodiment, referring to fig. 6 to 9, the solder ball separation structure 1 further includes a gas connector 16, and the gas connector 16 is disposed on the work box 13. The gas joint 16 comprises a gas outlet end 161, a first channel 133 of the working box 13 is communicated with the gas outlet end 161, and the first channel 133 penetrates through the working box 13 and the second chamber 135. Specifically, the first channel 133 penetrates the upper cover 131, the second chamber 135, and the lower cover 132 in this order. When the second through holes 142a of the cutting plate 14 are separated from the second tin outlet ends 121 and then move to the positions of the first channels 133 after the solder balls are separated from the second tin outlet ends 121, the gas from the gas outlet ends 161 enters the first channels 133 of the upper case cover 131 and blows onto the solder balls in the second through holes 142a, and the gas blows the solder balls down into the first channels 133 of the lower case cover 132, so that the solder balls are smoothly conveyed from the first channels 133 to the welding tip 11.

In one embodiment, referring to fig. 9, the gas connector 16 further includes a gas inlet 162, and the gas inlet 162 is connected to an external gas storage device and guides the gas to the gas outlet 161. Wherein, the gas entering from the gas inlet 162 is nitrogen. The nitrogen can blow the solder balls in the second through holes 142a into the first channels 133, and the nitrogen is inactive due to chemical properties, so that the solder balls can be prevented from being oxidized, and the quality of the solder balls is improved.

In an embodiment, referring to fig. 1, the solder ball bonding apparatus further includes a laser alignment structure 3, the laser alignment structure 3 is disposed on one side of the solder ball separation structure 1 and connected to the solder ball separation structure 1, and the laser alignment structure 3 is used for emitting laser in alignment with the nozzle 11. The specific welding steps are as follows: firstly, the solder ball separating structure 1 separates the solder balls one by one, and the separated solder balls reach the welding tip 11 through the first channel 133; then, by adjusting the fine adjustment structure of the laser alignment structure 3, the laser head of the laser alignment structure 3 is aligned to the solder ball in the first tin outlet end 111 of the welding tip 11; and finally, opening the laser fiber of the laser alignment structure 3, and enabling the solder balls to be melted and fall to the welding points of the components 4 to be welded by the laser head to emit laser so as to realize the welding point welding of the components 4 to be welded.

Further, the manner of opening the laser fiber is specifically as follows: when the gas in the first channel 133 is blown to the position of the welding tip 11, the diameter of the welding tip 11 is slightly smaller than the diameter of the solder ball, the welding tip 11 is blocked, so that the gas pressure in the first channel 133 is increased, the pressure sensor arranged in the laser alignment structure 3 senses the pressure change and converts the pressure change into an electric signal to be transmitted to the laser switch, the laser switch receives the signal of the increased gas pressure and then opens the laser fiber, and the laser head emits laser to enable the solder ball to be melted and fall to the welding point of the element 4 to be welded, so that the welding point welding of the element 4 to be welded is realized. The solder ball drips from the welding nozzle 11 after being melted, so that the air pressure in the welding nozzle 11 is reduced, the pressure sensor senses the pressure reduction and converts the information of the pressure reduction into an electric signal to be transmitted to the laser switch, and the laser switch receives the electric signal and closes the laser optical fiber.

The utility model provides a tin ball welding set is through locating the first tin end 111 that goes out of welding tip 11 with bearing member 21, and bearing member 21's first terminal surface and the relative slope of the second terminal surface of first tin end 111 that goes out. In this way, the welding points of the component 4 to be welded placed on the supporting member 21 and the first tin-out end 111 of the welding tip 11 can be brought closer together, and the welding tip 11 can be accurately aligned with these welding points during welding, which is advantageous in improving the welding quality and the welding accuracy.

In addition, the embodiment of the present invention provides a solder ball bonding apparatus, which utilizes the third driving member 15 to drive the cutting plate 14 to move in the working box 13 by connecting the third driving member 15 and the cutting plate 14 together, so that the cutting plate 14 moves back and forth between the first position and the second position. The second through hole 142a of the cutting plate 14 separates the solder ball of the second solder outlet 121 at the first position, and then when the second through hole 142a moves away from the first position to the second position under the driving of the third driving member 15, the second through hole 142a and the first channel 133 are aligned so that the first channel 133 transports the separated solder ball away. Since the second through hole 142a can move back and forth under the control of the third driving element 15, the second through hole 142a can continuously separate the solder ball from the second solder terminal 121. The tin ball welding device provided by the embodiment can accurately separate each tin ball, improves the separation efficiency, is favorable for improving the welding efficiency and the welding precision, and is more suitable for more precise elements.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (13)

1. A solder ball bonding apparatus, comprising:

the bottom of the tin ball separation structure is provided with a welding nozzle, and the welding nozzle comprises a first tin outlet end; and

the component placement structure, the component placement structure is located the below of first tin end of going out, the component placement structure includes the bearing part, the bearing part is used for placing and treats the welding element, the bearing part is including being used for placing treat the first terminal surface of welding element, first tin end of going out is including the second terminal surface that is used for exporting the tin ball, the perpendicular line of first terminal surface with the perpendicular line relative tilt of second terminal surface.

2. The solder ball bonding apparatus of claim 1, wherein an angle between a perpendicular to the first end surface and a perpendicular to the second end surface is α acute.

3. The solder ball bonding apparatus according to claim 1, wherein the device placement structure further comprises a first driving member connected to the supporting member, the first driving member being configured to drive the supporting member to rotate.

4. The solder ball bonding apparatus of claim 3, wherein the first driving member comprises a rotation shaft, the supporting member has a first through hole, the rotation shaft penetrates the first through hole, and the rotation shaft is fixedly connected to the supporting member.

5. The solder ball bonding apparatus of claim 4, wherein the component placement structure further comprises a flat plate including a first surface and a second surface disposed opposite to each other, the first surface being placed on the holding member, the second surface being connected to the first driving member; the rotating shaft penetrates through the flat plate and then penetrates into the first through hole.

6. The solder ball bonding apparatus according to claim 5, wherein the component placement structure further comprises a second driving member connected to the flat plate for driving the flat plate to move back and forth in a direction from the holding member to the nozzle.

7. The solder ball bonding apparatus according to claim 1, wherein the component placement structure further comprises a buffer provided between the supporting member and the first solder-out terminal, the buffer being disposed toward the supporting member.

8. The solder ball bonding apparatus of claim 1, wherein the solder ball separation structure further comprises a solder storage box, a work box and a cutting plate, the solder storage box comprises a second solder outlet, the work box is connected to the second solder outlet, a first channel for transporting solder balls is further disposed in the work box, the first channel is connected to the first solder outlet, the cutting plate is disposed in the work box, a second through hole is disposed on the cutting plate corresponding to the second solder outlet, and the second through hole and the first channel have the same diameter;

the cutting plate moves back and forth between a first position and a second position, the first position is the position of the cutting plate when the second through hole and the second tin outlet are aligned, and the second position is the position of the cutting plate when the second through hole and the first channel are aligned.

9. The solder ball bonding apparatus of claim 8, wherein the solder ball separation structure further comprises a third driving member, the third driving member and the cutting plate being connected to drive the cutting plate to move back and forth between the first position and the second position.

10. The solder ball bonding apparatus according to claim 9, wherein a cavity for accommodating the third driving member and the cutting plate is provided in the work box, the cavity comprising a first cavity and a second cavity communicating with the first cavity, the first cavity being larger than the second cavity;

the cutting plate comprises a body and a cutting part arranged on the edge of the body, and the cutting part is provided with the second through hole; the body is arranged in the first cavity, the cutting part is arranged in the second cavity, and the second tin outlet end is communicated with the second cavity.

11. The solder ball bonding apparatus of claim 10, wherein the second tin outlet communicates with the second cavity along a thickness direction of the cutout, the thickness of the cutout is equal to a height of the second cavity along the thickness direction of the cutout, and the cutout moves in the second cavity along a direction perpendicular to the height of the second cavity.

12. The solder ball bonding apparatus according to claim 10 or 11, further comprising a gas joint provided on the work box;

the gas joint includes the end of giving vent to anger, the work box the first passageway with give vent to anger the end intercommunication, the first passageway runs through the work box with the second cavity.

13. The solder ball bonding apparatus according to any of claims 1 to 11, further comprising a laser alignment structure disposed on one side of the solder ball separation structure and connected to the solder ball separation structure, the laser alignment structure being configured to emit laser light in alignment with the nozzle;

the laser alignment structure is internally provided with a pressure sensor used for sensing the change of the air pressure in the welding nozzle and a laser switch electrically connected with the pressure sensor, and the pressure sensor controls the opening and closing of the laser switch according to the change of the air pressure in the welding nozzle.

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