CN210519020U

CN210519020U - Lead-tin-plated printed circuit board

Info

Publication number: CN210519020U
Application number: CN201921579074.XU
Authority: CN
Inventors: 杨卫民
Original assignee: Xingan Yixing Electronic Co Ltd
Current assignee: Xingan Yixing Electronic Co Ltd
Priority date: 2019-09-23
Filing date: 2019-09-23
Publication date: 2020-05-12
Anticipated expiration: 2029-09-23

Abstract

The utility model relates to the technical field of circuit boards, specifically disclose a lead-tin plated printed circuit board, including circuit board and two bearer bars, the bearer bar has been fixed pegging graft to the left and right sides of circuit board, two bearer bars are symmetrical setting with the center of circuit board, the mounting groove has all been seted up to the center of one side that two bearer bars are relative, the inner wall of mounting groove is fixedly connected with the blotter, the blotter is square frame shape structure, the inner wall fixedly connected with rubber pad of blotter, the rubber pad is square frame shape structure, the shape structure of rubber pad agrees with the shape structure of circuit board, the left and right sides of circuit board is activity pegs graft respectively in the inside of two rubber pads, the surface of circuit board is laminated with; the utility model discloses when dropping from the eminence, the four corners suffers the collision, and the circuit board can directly not take place the contact with the barrier, has reduced the influence of external impact force to circuit board itself, has played the guard action to the inside connection structure of circuit board.

Description

Lead-tin-plated printed circuit board

Technical Field

The utility model relates to a circuit board technical field, concretely relates to lead-tin plated printed circuit board.

Background

An alloy electroplating process is a necessary flow in the production process of printed circuit boards, a fluoborate system is commonly adopted in the PCB industry in the past, and the plating solution has the advantages of stable plating layer, high deposition speed, high anode and cathode efficiency, compact plating layer and the like, but has the problems of difficult treatment of fluorine-containing wastewater, easy environmental pollution and the like, so people are always dedicated to research on the substitution of the fluoborate plating solution, wherein the zinc-lead alloy plating solution can perfectly substitute the fluoborate system, and the zinc-lead alloy plating solution has finer crystals than the fluoborate, low porosity, better corrosion resistance and environmental protection, so people use the zinc-lead alloy plating solution to electroplate the circuit boards at present.

Traditional lead-tin-plated printed circuit board is the cuboid structure mostly, and its four corners position department is comparatively sharp-pointed, and border position department is comparatively fragile, in transportation or use, if its four corners and border department receive striking, collision or when dropping from the eminence, construct the destruction to the junctional structure between each layer of circuit board easily to make the circuit board take place phenomenons such as electric leakage, short circuit, influence the normal use of circuit board.

SUMMERY OF THE UTILITY MODEL

The utility model provides a not enough to prior art, the utility model provides a lead-tin plated printed circuit board possesses advantages such as prevention circuit board damage, has solved the problem that traditional circuit board received easy damage after the collision.

The utility model discloses a lead-tin plated printed circuit board, including circuit board and two bearer bars, the left and right sides of circuit board is all fixed the grafting has the bearer bar, two the bearer bar is the symmetry setting with the center of circuit board, two the mounting groove has all been seted up to the central authorities of the relative one side of bearer bar, the inner wall fixedly connected with blotter of mounting groove, the blotter is square frame shape structure, the inner wall fixedly connected with rubber pad of blotter, the rubber pad is square frame shape structure, the shape structure of rubber pad agrees with mutually with the shape structure of circuit board, the left and right sides of circuit board activity respectively is pegged graft in the inside of two rubber pads, the surface of circuit board is laminated mutually with the inner wall of rubber pad.

The utility model discloses a lead-tin-plated printed circuit board, wherein the equal fixedly connected with of four corners position department of two relative one sides of rubber pad connects the gasket, two connect the relative one side of gasket and laminate with the top and the bottom of circuit board respectively, this structure setting has increased the stability of being connected between bearer bar and the circuit board.

The utility model discloses a lead-tin-plated printed circuit board, wherein connect the central authorities at gasket top and seted up threaded hole, the through-hole has been seted up at the circuit board top and with the corresponding position department of screw hole, screw hole female connection has the fastening bolt who is used for fixed connection gasket and circuit board, and this structure sets up for the staff can fix the bearer bar with the circuit board through fastening bolt, and the staff of being convenient for is to the dismouting of bearer bar.

The utility model discloses a lead-tin plated printed circuit board, wherein the even fixedly connected with buffering of inner wall of blotter is protruding, the buffering arch is half spherical structure, the rubber pad outer wall and with the protruding corresponding position department of buffering seted up the buffering recess, the shape structure of buffering arch agrees with mutually with the shape structure of buffering recess, the protruding fixing clip of buffering connects in the inside of buffering recess, and this structure setting has increased the area of contact between blotter and the rubber pad, has improved the shock resistance of blotter.

The utility model discloses a lead-tin plated printed circuit board, wherein two relative one side of bearer bar and be close to the central point department at front and the back and all seted up the slot, two fixed grafting has the protection shield between the slot, the shape structure of protection shield agrees with mutually with the shape structure of slot, and this structure setting is convenient for the staff to the dismantlement and the installation of protection shield.

The utility model discloses a lead-tin plated printed circuit board, wherein the cavity has been seted up to the inside of protection shield, the cavity is inside along horizontal equidistance fixedly connected with strengthening rib of level, the front of strengthening rib is "X" shape structure, the top and the bottom of strengthening rib respectively with the top and the bottom fixed connection of cavity, this structure setting, the effectual holistic intensity of protection shield that has improved the impact resistance of protection shield simultaneously, has prolonged the holistic life of the device.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a two bearer bars that set up, blotter and rubber pad that the cooperation bearer bar set up for the device is dropping from the eminence, when the four corners suffers the collision, the circuit board can directly not take place the contact with the barrier, the impact force that external object produced the circuit board simultaneously can be absorbed partly by blotter and rubber pad in the bearer bar, has reduced the influence of external impact force to circuit board itself, has played the guard action to the inside connection structure of circuit board, avoids its inside connection structure to receive the damage.

2. The utility model discloses a slot that sets up on the protection frame, the protection shield that sets up in the cooperation slot, make the protection shield can play the protection effect to the border department of circuit board, avoid the direct bumps at the border department of external object and circuit board, through the cavity that sets up in the protection shield, the strengthening rib that sets up in the cooperation cavity, the effectual holistic intensity of protection shield that has improved, the shock resistance of protection shield has been improved simultaneously, the holistic life of the device has been prolonged, through the connecting pad piece that sets up on the protection frame, the screw hole that sets up on the cooperation connecting pad piece, the staff of being convenient for installs protection frame and protection shield on the circuit board.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

FIG. 1 is a schematic view of the overall three-dimensional structure of the present invention;

FIG. 2 is a schematic perspective view of the protection frame of the present invention;

FIG. 3 is a front sectional structural view of the protection frame of the present invention;

fig. 4 is a schematic front sectional view of the connection plate of the present invention.

In the figure: 1. a circuit board; 2. a protective frame; 3. mounting grooves; 4. a cushion pad; 41. a buffer protrusion; 5. a rubber pad; 6. connecting a gasket; 7. a threaded hole; 8. a slot; 9. a protection plate; 91. a cavity; 10. and (5) reinforcing ribs.

Detailed Description

In the following description, numerous implementation details are set forth in order to provide a more thorough understanding of the present invention. It should be understood, however, that these implementation details should not be used to limit the invention. That is, in some embodiments of the invention, details of these implementations are not necessary. In addition, some conventional structures and components are shown in simplified schematic form in the drawings.

In addition, the descriptions related to "first", "second", etc. in the present invention are only for description purposes, not specifically referring to the order or sequence, and are not intended to limit the present invention, but only to distinguish the components or operations described in the same technical terms, and are not to be construed as indicating or implying any relative importance or implicit indication of the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

Please refer to fig. 1-4, the utility model discloses a lead-tin plated printed circuit board, including circuit board 1 and two bearer bars 2, bearer bar 2 has all been fixed to peg graft in the left and right sides of circuit board 1, two bearer bars 2 are the symmetry setting with the center of circuit board 1, mounting groove 3 has all been seted up to the central authorities of two relative one sides of bearer bar 2, the inner wall fixedly connected with blotter 4 of mounting groove 3, blotter 4 is square frame shape structure, the inner wall fixedly connected with rubber pad 5 of blotter 4, rubber pad 5 is square frame shape structure, the shape structure of rubber pad 5 agrees with the shape structure of circuit board 1 mutually, the left and right sides of circuit board 1 activity respectively is pegged graft in the inside of two rubber pads 5, the surface of circuit board 1 is laminated mutually with.

The four corners of the opposite sides of the two rubber pads 5 are fixedly connected with connecting gaskets 6, and the opposite sides of the two connecting gaskets 6 are respectively attached to the top and the bottom of the circuit board 1, so that the structure arrangement increases the stability of connection between the protection frame 2 and the circuit board 1.

Threaded hole 7 is seted up at the central authorities at connecting gasket 6 top, and the through-hole has been seted up at 1 top of circuit board and the position department corresponding with threaded hole 7, and threaded hole 7 female connection has the fastening bolt who is used for fixed connection gasket 6 and circuit board 1, and this structure sets up for the staff can fix protecting frame 2 and circuit board 1 mutually through fastening bolt, and the staff of being convenient for is to the dismouting of protecting frame 2.

The even fixedly connected with of inner wall of blotter 4 cushions arch 41, and buffering arch 41 is the hemisphere structure, and 5 outer walls of rubber pad and the position department corresponding with buffering arch 41 have seted up buffering recess, and the shape structure of buffering arch 41 agrees with mutually with the shape structure of buffering recess, and the fixed joint of buffering arch 41 has in the inside of buffering recess, and this structure setting has increased the area of contact between blotter 4 and the rubber pad 5, has improved blotter 4's shock resistance.

The slot 8 has all been seted up to two relative one sides of bearer bar 2 and the central point department that is close to the front and the back, and fixed the grafting has protection shield 9 between two slots 8, and the shape structure of protection shield 9 agrees with the shape structure of slot 8 mutually, and this structural setting is convenient for the staff to the dismantlement and the installation of protection shield 9.

Cavity 91 has been seted up to protection shield 9's inside, and cavity 91 is inside along horizontal equidistance fixedly connected with strengthening rib 10 of level, and the front of strengthening rib 10 is "X" shape structure, and the top and the bottom of strengthening rib 10 respectively with cavity 91's top and bottom fixed connection, this structural setting, the effectual holistic intensity of protection shield 9 that has improved protection shield 9's impact resistance simultaneously, has prolonged the holistic life of the device.

Use the utility model discloses the time, the staff is at first with one of them bearer bar 2 insert circuit board 1's left side, make the inner wall of rubber pad 5 laminate mutually with circuit board 1's surface, screw hole 7 on the connecting pad 6 this moment is corresponding with the connecting hole on the circuit board 1, later the staff twists fastening bolt in screw hole 7, accomplish the fixed to one of them bearer bar 2, later the staff inserts the left end of two protection shields 9 respectively in the slot 8 on circuit board 1 left side bearer bar 2, and insert the right side of another bearer bar 2 into circuit board 1, and make the right side of protection shield 9 insert in this bearer bar 2's slot 8, be fixed in circuit board 1 with this bearer bar 2 with same method at last, accomplish the equipment to the device.

The above description is only an embodiment of the present invention, and is not intended to limit the present invention. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. The utility model provides a lead-tin plating printed circuit board, includes circuit board (1) and two protecting frame (2), its characterized in that: the left and right sides of circuit board (1) all is fixed to be pegged graft and is had protecting frame (2), two protecting frame (2) is the symmetry setting with the center of circuit board (1), two installing groove (3) have all been seted up to the central authorities of the relative one side of protecting frame (2), the inner wall fixedly connected with blotter (4) of installing groove (3), blotter (4) are square frame shape structure, the inner wall fixedly connected with rubber pad (5) of blotter (4), rubber pad (5) are square frame shape structure, the shape structure of rubber pad (5) agrees with the shape structure of circuit board (1), the left and right sides of circuit board (1) is the activity respectively pegged graft in the inside of two rubber pads (5), the surface of circuit board (1) is laminated with the inner wall of rubber pad (5) mutually.

2. The lead-tin plated printed circuit board according to claim 1, characterized in that: the four corners of the two opposite sides of the rubber pads (5) are fixedly connected with connecting gaskets (6), and the two opposite sides of the connecting gaskets (6) are respectively attached to the top and the bottom of the circuit board (1).

3. The lead-tin plated printed circuit board according to claim 2, characterized in that: the middle of the top of the connecting gasket (6) is provided with a threaded hole (7), the top of the circuit board (1) and the position corresponding to the threaded hole (7) are provided with a through hole, and the threaded hole (7) is internally connected with a fastening bolt for fixedly connecting the gasket (6) and the circuit board (1).

4. The lead-tin plated printed circuit board according to claim 1, characterized in that: the even fixedly connected with buffering arch (41) of inner wall of blotter (4), buffering arch (41) are the hemisphere structure, rubber pad (5) outer wall and the position department corresponding with buffering arch (41) have seted up buffering recess, the shape structure of buffering arch (41) agrees with the shape structure of buffering recess mutually, buffering arch (41) fixed joint is in the inside of buffering recess.

5. The lead-tin plated printed circuit board according to claim 1, characterized in that: slots (8) are formed in the opposite sides of the two protection frames (2) and the positions, close to the center of the front face and the center of the back face, of the two protection frames, protection plates (9) are fixedly inserted between the two slots (8), and the shape structures of the protection plates (9) are matched with the shape structures of the slots (8).

6. The lead-tin plated printed circuit board according to claim 5, wherein: the protective plate is characterized in that a cavity (91) is formed in the protective plate (9), reinforcing ribs (10) are fixedly connected to the interior of the cavity (91) along the horizontal direction at equal intervals, the front face of each reinforcing rib (10) is of an X-shaped structure, and the top and the bottom of each reinforcing rib (10) are fixedly connected with the top and the bottom of the cavity (91) respectively.