CN210513514U

CN210513514U - Differential pressure sensor with silicon differential pressure chip protection structure

Info

Publication number: CN210513514U
Application number: CN201921886041.XU
Authority: CN
Inventors: 武安心; 刘现中
Original assignee: Wuhan Xinchen Technology Co Ltd
Current assignee: Wuhan Xinchen Technology Co Ltd
Priority date: 2019-11-05
Filing date: 2019-11-05
Publication date: 2020-05-12
Anticipated expiration: 2029-11-05

Abstract

The utility model discloses a differential pressure sensor with silicon differential pressure chip protection architecture, including differential sensor body, silicon differential pressure chip mounting bin and silicon differential pressure chip protection gland, silicon differential pressure chip mounting bin is installed at the top of differential sensor body, the inside both ends in silicon differential pressure chip mounting bin all are provided with the spout, and the spout installs the buffer board through the slider, the PCB board is installed at the top of buffer board, and the intermediate position department at PCB board top installs silicon differential pressure chip. The utility model discloses install first arc protection rubber ring, second arc protection rubber ring and rubber connection post, second arc protection rubber ring lid fits high-pressure entry below, can prevent that external steam from getting into silicon differential pressure chip installation storehouse in, the device uses the longer time, and second arc protection rubber ring produces deformation back, and first arc protection rubber ring also can effectively shelter from steam, avoids steam and silicon differential pressure chip to contact, plays the duplicate protection effect to silicon differential pressure chip.

Description

Differential pressure sensor with silicon differential pressure chip protection structure

Technical Field

The utility model relates to a differential pressure sensor technical field specifically is a differential pressure sensor with silicon differential pressure chip protection architecture.

Background

The differential pressure sensor is a sensor for measuring the difference between two pressures, and is generally used for measuring the pressure difference between the front end and the rear end of a certain device or part, the differential pressure sensor is commonly used for measuring the tail gas pressure difference of a front channel and a rear channel of an automobile engine tail gas particle catcher, the differential pressure sensor has the advantages of small volume, light weight and convenient installation, and a silicon differential pressure chip is easy to damage in the measuring process, so a protection structure is often arranged in the differential pressure sensor for protecting the silicon differential pressure chip, most of the existing differential pressure sensors with the silicon differential pressure chip protection structure directly install a rubber sheet at a high-pressure inlet and the silicon differential pressure chip, high pressure is transmitted through the rubber sheet, the silicon differential pressure chip can be protected through the rubber sheet, water vapor and the like are difficult to enter the interior of a gland, the silicon differential pressure chip is prevented, after long-time use, the sheet rubber produces deformation easily for it is inseparable with laminating between the top cap, thereby make in steam etc. gets into the top cap easily, cause silicon differential pressure chip short circuit to burn out, and simultaneously, when external high pressure just accessed in, atmospheric pressure impact force in the twinkling of an eye is great, and sensor inside lacks corresponding buffer structure, makes silicon differential pressure chip receive great impact force easily and damages.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a differential pressure sensor with silicon differential pressure chip protection architecture to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a differential pressure sensor with silicon differential pressure chip protection architecture, includes differential sensor body, silicon differential pressure chip mounting bin and silicon differential pressure chip protection gland, silicon differential pressure chip mounting bin is installed at the top of differential sensor body, the inside both ends in silicon differential pressure chip mounting bin all are provided with the spout, and the spout installs the buffer board through the slider, the PCB board is installed at the top of buffer board, and the intermediate position department at PCB board top installs silicon differential pressure chip, the internally mounted in silicon differential pressure chip mounting bin has silicon differential pressure chip protection gland, and the intermediate position department at silicon differential pressure chip protection gland top installs the pipe of impressing highly, the pipe of impressing highly passes silicon differential pressure chip mounting bin and extends to the outside in silicon differential pressure chip mounting bin, and the inside of the pipe of impressing highly is provided with high-pressure opening.

Preferably, the intermediate position department of silicon differential pressure chip protection gland bottom installs second arc protection rubber ring, and the intermediate position department of second arc protection rubber ring bottom installs first arc protection rubber ring, the intermediate position department of first arc protection rubber ring bottom installs the rubber connecting post, the one end that first arc protection rubber ring was kept away from to the rubber connecting post is connected with silicon differential pressure chip.

Preferably, the bottom of buffer board evenly installs buffer spring, and buffer spring keeps away from the one end of buffer board and all is connected with silicon differential pressure chip installation storehouse.

Preferably, the outer sides of the buffer springs are provided with antirust layers.

Preferably, a high-pressure inlet is arranged at the position, right opposite to the high-pressure port, of the top of the silicon differential pressure chip protection gland.

Preferably, the second arc-shaped protective rubber ring has the same width as the protective gland of the silicon differential pressure chip.

Compared with the prior art, the beneficial effects of the utility model are that: the differential pressure sensor with the silicon differential pressure chip protection structure is provided with a first arc-shaped protection rubber ring, a second arc-shaped protection rubber ring and a rubber connecting column, the second arc-shaped protection rubber ring covers the lower part of a high-pressure inlet, can prevent external water vapor from entering the silicon differential pressure chip mounting bin, the device is used for a long time, after the second arc-shaped protective rubber ring is deformed, the first arc-shaped protective rubber ring can also effectively shield water vapor to avoid the contact of the water vapor and the silicon differential pressure chip, the silicon differential pressure chip is protected doubly, meanwhile, the buffer plate and the buffer spring are installed on the device to be matched for use, when external high pressure is just connected, the silicon differential pressure chip is subjected to large impact force, the silicon differential pressure chip can push the buffer plate to slide downwards on the sliding groove through the PCB, through the elastic action of buffer spring, can play the effect of buffering impact, avoid silicon differential pressure chip to receive great impact force and damage.

Drawings

Fig. 1 is a schematic front sectional view of the present invention;

FIG. 2 is a schematic cross-sectional view of a silicon differential pressure chip mounting bin according to the present invention;

fig. 3 is a schematic view of a partial structure of the present invention.

In the figure: 1. a differential sensor body; 2. a silicon differential pressure chip mounting bin; 3. a buffer plate; 4. a first arc-shaped protective rubber ring; 5. a second arc-shaped protective rubber ring; 6. a high pressure pipe; 7. a high-pressure port; 8. a high pressure inlet; 9. a silicon differential pressure chip protection gland; 10. a silicon differential pressure chip; 11. a PCB board; 12. a buffer spring; 13. a rubber connecting column; 14. a chute.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides an embodiment: the utility model provides a differential pressure sensor with silicon differential pressure chip protection architecture, including differential sensor body 1, silicon differential pressure chip installation storehouse 2 and silicon differential pressure chip protection gland 9, silicon differential pressure chip installation storehouse 2 is installed at differential sensor body 1's top, the inside both ends in silicon differential pressure chip installation storehouse 2 all are provided with spout 14, and spout 14 installs buffer board 3 through the slider, PCB board 11 is installed at buffer board 3's top, and the intermediate position department at PCB board 11 top installs silicon differential pressure chip 10, the internally mounted of silicon differential pressure chip installation storehouse 2 has silicon differential pressure chip protection gland 9, and the intermediate position department at silicon differential pressure chip protection gland 9 top installs high pipe 6 of impressing, high pressure pipe 6 passes silicon differential pressure chip installation storehouse 2 and extends to the outside in silicon differential pressure chip installation storehouse 2, and the inside of high pressure pipe 6 of impressing is provided with high-pressure opening 7.

In this implementation:

further, the middle position department of silicon differential pressure chip protection gland 9 bottom installs second arc protection rubber ring 5, and the middle position department of second arc protection rubber ring 5 bottom installs first arc protection rubber ring 4, the middle position department of first arc protection rubber ring 4 bottom installs rubber connecting post 13, rubber connecting post 13 keeps away from the one end of first arc protection rubber ring 4 and is connected with silicon differential pressure chip 10, second arc protection rubber ring 5 covers in 8 below of high pressure inlet, can prevent that external steam from getting into silicon differential pressure chip installation storehouse 2, the device uses for a long time, second arc protection rubber ring 5 produces the deformation back, first arc protection rubber ring 4 also can effectively shelter from steam, avoid steam and silicon differential pressure chip 10 to contact, play the duplicate protection effect to silicon differential pressure chip 10.

Further, buffer spring 12 is evenly installed to the bottom of buffer board 3, and buffer spring 12 keeps away from the one end of buffer board 3 and all is connected with silicon differential pressure chip installation storehouse 2, and silicon differential pressure chip 10 receives great impact force, and silicon differential pressure chip 10 accessible PCB board 11 promotes buffer board 3 and slides downwards on spout 14, through buffer spring 12's elastic action, can play the effect of buffering impact force, avoids silicon differential pressure chip 10 to receive great impact force and damages.

Furthermore, the outer sides of the buffer springs 12 are provided with anti-rust layers, which is beneficial to prolonging the service life of the buffer springs 12.

Further, the top of the silicon differential pressure chip protection gland 9 is provided with a high-pressure inlet 8 right at the position of the high-pressure port 7, and external high-pressure air can enter the high-pressure inlet 8 through the high-pressure port 7, so that the silicon differential pressure chip 10 can be conveniently detected.

Further, the second arc-shaped protective rubber ring 5 has the same width as the silicon differential pressure chip protective gland 9, so that the second arc-shaped protective rubber ring 5 can completely cover the bottom of the high-pressure inlet 8.

The working principle is as follows: when the device is used, the device is firstly powered on, external high air pressure enters a high-pressure inlet 8 through a high-pressure port 7, high pressure impacts a second arc-shaped protective rubber ring 5, the second arc-shaped protective rubber ring 5 intensively transmits high pressure to a first arc-shaped protective rubber ring 4, the first arc-shaped protective rubber ring 4 transmits high pressure to a silicon differential pressure chip 10 through a rubber connecting column 13, a pressure value is detected through the silicon differential pressure chip 10, the second arc-shaped protective rubber ring 5 covers the lower part of the high-pressure inlet 8, external water vapor can be prevented from entering a silicon differential pressure chip mounting bin 2, the device is used for a long time, after the second arc-shaped protective rubber ring 5 is deformed, the first arc-shaped protective rubber ring 4 can also effectively shield the water vapor, the water vapor is prevented from contacting the silicon differential pressure chip 10, a double protection effect is achieved on the silicon differential pressure chip 10, when external high pressure is just connected, the air pressure impact force is larger, and the silicon, silicon differential pressure chip 10 transmits the impact force to PCB board 11 for PCB board 11 atress promotes buffer board 3 and slides downwards on spout 14, and buffer board 3 compression buffer spring 12 can help buffer board 3 to reset through buffer spring 12's elastic action, can cushion the impact force through buffer spring 12, avoids silicon differential pressure chip 10 to receive great impact force and damage.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a differential pressure sensor with silicon differential pressure chip protection architecture, includes differential sensor body (1), silicon differential pressure chip installation storehouse (2) and silicon differential pressure chip protection gland (9), its characterized in that: silicon differential pressure chip installation storehouse (2) is installed at the top of differential sensor body (1), silicon differential pressure chip installation storehouse (2) inside both ends all are provided with spout (14), and spout (14) install buffer board (3) through the slider, PCB board (11) are installed at the top of buffer board (3), and the intermediate position department at PCB board (11) top installs silicon differential pressure chip (10), the internally mounted of silicon differential pressure chip installation storehouse (2) has silicon differential pressure chip protection gland (9), and the intermediate position department at silicon differential pressure chip protection gland (9) top installs pipe (6) of impressing highly, pipe (6) of impressing highly pass silicon differential pressure chip installation storehouse (2) and extend to the outside of silicon differential pressure chip installation storehouse (2), and the inside of pipe (6) of impressing highly is provided with high-pressure opening (7).

2. The differential pressure sensor with silicon differential pressure chip protection architecture of claim 1, wherein: the utility model discloses a silicon differential pressure chip protection cover, including silicon differential pressure chip protection gland (9), the intermediate position department of silicon differential pressure chip protection gland (9) bottom installs second arc protection rubber ring (5), and the intermediate position department of second arc protection rubber ring (5) bottom installs first arc protection rubber ring (4), the intermediate position department of first arc protection rubber ring (4) bottom installs rubber connecting post (13), the one end that first arc protection rubber ring (4) were kept away from in rubber connecting post (13) is connected with silicon differential pressure chip (10).

3. The differential pressure sensor with silicon differential pressure chip protection architecture of claim 1, wherein: buffer spring (12) are evenly installed to the bottom of buffer board (3), and buffer spring (12) keep away from the one end of buffer board (3) and all are connected with silicon differential pressure chip installation storehouse (2).

4. The differential pressure sensor with silicon differential pressure chip protection architecture of claim 3, wherein: and the outer sides of the buffer springs (12) are provided with anti-rust layers.

5. The differential pressure sensor with silicon differential pressure chip protection architecture of claim 1, wherein: and a high-pressure inlet (8) is arranged at the position, right opposite to the high-pressure port (7), of the top of the silicon differential pressure chip protection gland (9).

6. The differential pressure sensor with silicon differential pressure chip protection architecture of claim 2, wherein: the width of the second arc-shaped protective rubber ring (5) is the same as that of the silicon differential pressure chip protective gland (9).