CN210497071U - Waterproof heat-conducting glue spraying tool for circuit board - Google Patents
Waterproof heat-conducting glue spraying tool for circuit board Download PDFInfo
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- CN210497071U CN210497071U CN201921392061.1U CN201921392061U CN210497071U CN 210497071 U CN210497071 U CN 210497071U CN 201921392061 U CN201921392061 U CN 201921392061U CN 210497071 U CN210497071 U CN 210497071U
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Abstract
The utility model discloses a spraying tool for waterproof heat-conducting glue of a circuit board, which comprises a spraying shell, wherein a holding tube is arranged at the side part of the spraying shell, the inside of the spraying shell is of a cavity structure, and a glue storage bin is arranged inside the spraying shell; the front surface of the glue storage bin is provided with main glue spraying needles arranged in a matrix manner, the front surface of the spraying shell is provided with a positioning net frame, the positioning net frame is provided with positioning net grooves arranged in a matrix manner, the outer ends of the main glue spraying needles penetrate through the positioning net grooves, and the inner ends of the main glue spraying needles are arranged inside the glue storage bin; the inside in storage rubber storehouse is equipped with the pinhole pipe, and the global of pinhole pipe is network structure, and the internally mounted of holding tube has the liquid suction pipe, and the one end and the pinhole union coupling of liquid suction pipe, the other end of liquid suction pipe are equipped with the filter bulb, through the butt joint union coupling between the one end of liquid suction pipe and the pinhole pipe, are equipped with the pump of glue pumping on the butt joint union coupling. The utility model can form a layer of waterproof heat-conducting film on the surface of the components on the circuit board, thereby protecting the components; the efficiency of protecting the components on the circuit board is greatly improved.
Description
Technical Field
The utility model relates to a spraying instrument, in particular to waterproof heat-conducting glue spraying instrument of circuit board.
Background
The spray coating is applied to the surface of the object to be coated by dispersing into uniform and fine droplets by means of a spray gun or a disc atomizer by means of pressure or centrifugal force. It can be divided into air spraying, airless spraying, electrostatic spraying and various derivatives of the above basic spraying forms, such as high flow low pressure atomized spraying, thermal spraying, automatic spraying, multiple spray groups, etc. The paint is atomized by a spray gun and is coated on the surface of an object. Compressed air spray painting, high-pressure airless spray painting and electrostatic spray painting. The painting operation uses flammable paints containing large amounts of solvent, which are prone to form explosive mixtures under conditions requiring rapid drying, due to solvent vapors that evaporate into the air. Particularly, electrostatic painting is carried out under the high voltage of over 60 kilovolts, and spark discharge is easy to occur when the distance between a painting nozzle and a workpiece to be painted is within 250 millimeters, so that flammable steam can be ignited. The existing spraying tool is inconvenient to spray the circuit board, particularly to spray waterproof heat-conducting glue on the circuit board, and cannot quickly spray a layer of waterproof heat-conducting glue on components of the circuit board; electrical components of the circuit board cannot be effectively protected.
SUMMERY OF THE UTILITY MODEL
The utility model mainly solves the technical problems in the prior art, thereby providing a spraying device which sprays waterproof heat-conducting glue to the components on the circuit board through the main glue spraying needle, and a layer of waterproof heat-conducting film is formed on the surfaces of the components on the circuit board after the heat-conducting glue is solidified, thereby protecting the components; the spraying tool for the waterproof heat-conducting glue of the circuit board greatly improves the efficiency of protecting components on the circuit board.
The above technical problem of the present invention can be solved by the following technical solutions:
a spraying tool for waterproof heat-conducting glue of a circuit board comprises a spraying shell, wherein a holding tube is arranged at the side part of the spraying shell, the inside of the spraying shell is of a cavity structure, and a glue storage bin is arranged inside the spraying shell; the front surface of the glue storage bin is provided with main glue spraying needles arranged in a matrix manner, the front surface of the spraying shell is provided with a positioning net frame, the positioning net frame is provided with positioning net grooves arranged in a matrix manner, the outer ends of the main glue spraying needles penetrate through the positioning net grooves, and the inner ends of the main glue spraying needles are arranged inside the glue storage bin; the inside in storage rubber storehouse is equipped with the pinhole pipe, and the global of pinhole pipe is network structure, and the internally mounted of holding tube has the liquid suction pipe, and the one end and the pinhole union coupling of liquid suction pipe, the other end of liquid suction pipe are equipped with the filter bulb, through the butt joint union coupling between the one end of liquid suction pipe and the pinhole pipe, are equipped with the pump of glue pumping on the butt joint union coupling.
Furthermore, the tip of pinhole pipe is external to have spouts the glue hose, spouts the end connection of glue hose's one end and pinhole pipe, spouts the other end of glue hose and is equipped with the grafting pipe, and the grafting pipe is pegged graft and is had vice glue spraying needle, is equipped with control switch on the grafting pipe.
Further, the main spray rubber needle comprises a needle body, a spraying port is arranged at the front end of the needle body and is of an open structure, a spraying ball is arranged at the rear end of the needle body, the surface of the spraying ball is of a net structure, the spraying ball is arranged inside the glue storage bin, and the spraying port is arranged at the position of the positioning net groove.
Furthermore, an electric heating spiral wire is sleeved on the outer peripheral surface of the needle body and is in a spiral shape; two ends of the electric heating spiral wire are externally connected with electric connecting wires, the pipe wall of the holding pipe is provided with a temperature controller, and the electric connecting wires are electrically connected with the temperature controller.
Furthermore, a wire collecting box is arranged at the side part of the spraying shell, and the end part of the electric connecting wire penetrates through the wire collecting box.
Furthermore, the diameter of the spraying ball is larger than the pipe diameter of the needle body, and the diameter of the outer end of the spraying port is larger than the pipe diameter of the needle body.
Further, the interior top both sides of spraying shell all are equipped with the fixing base, and the both sides inner wall of spraying shell all is equipped with the stopper, stores up the both ends in gluey storehouse and installs between fixing base and stopper.
Furthermore, a filter element is sleeved in the pinhole pipe.
Furthermore, a protective cover is arranged on the front face of the spraying shell and sleeved on the peripheral face of the positioning net frame.
Furthermore, the back of spraying shell is equipped with the cold wind case, and the side position of cold wind case is equipped with the cool air pump, and the front of cold wind case is equipped with the air outlet that is the matrix arrangement.
By adopting the spraying tool for the waterproof heat-conducting glue of the circuit board, the waterproof heat-conducting glue can be conveniently sprayed on the components on the circuit board through the spraying tool, and a waterproof heat-conducting film is formed on the surfaces of the components on the circuit board after the heat-conducting glue is solidified, so that the components are protected; putting the filter balls into a heat-conducting glue storage tank; the glue pumping pump is started, the glue pumping pump pumps the heat-conducting glue in the storage tank into the pinhole pipe through the liquid pumping pipe and the glue pumping pump, the pinhole pipe conveys the heat-conducting glue into the glue storage bin, the glue storage bin is sprayed out through the main glue spraying needle, an operator can hold the spraying tool, the front side of a spraying shell of the spraying tool is aligned to the surface of a component on the circuit board, the waterproof heat-conducting glue is sprayed on the component on the circuit board through the main glue spraying, and a waterproof heat-conducting film is formed on the surface of the component on the circuit board after the heat-conducting glue is solidified, so that the component is protected; the efficiency of protecting the components on the circuit board is greatly improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is the schematic structural diagram of the waterproof heat-conducting adhesive spraying tool for circuit boards of the present invention.
Fig. 2 is the structure diagram of the main glue injection needle of the present invention.
Fig. 3 is a bottom view of the spray shell of the present invention.
Fig. 4 is the structural schematic diagram of the cold air box of the utility model.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, and the scope of the present invention can be more clearly and clearly defined.
As shown in fig. 1 to 4, a spraying tool for a waterproof heat-conducting adhesive of a circuit board comprises a spraying shell 1, a holding tube 2 is arranged at the side part of the spraying shell 1, the spraying shell 1 is of a hollow cavity structure, and a glue storage bin 3 is arranged inside the spraying shell 1; the front surface of the glue storage bin 3 is provided with main glue spraying needles 7 which are arranged in a matrix manner, the front surface of the spraying shell 1 is provided with a positioning net frame 5, the positioning net frame 5 is provided with positioning net grooves 6 which are arranged in a matrix manner, the outer ends of the main glue spraying needles 7 penetrate through the positioning net grooves 6, and the inner ends of the main glue spraying needles 7 are arranged inside the glue storage bin 3; store up the inside in gluey storehouse 3 and be equipped with pinhole pipe 4, pinhole pipe 4 global be network structure, the internally mounted of holding pipe 2 has liquid suction pipe 9, and liquid suction pipe 9's one end is connected with pinhole pipe 4, and liquid suction pipe 9's the other end is equipped with filter ball 12, is connected through butt joint pipe 10 between liquid suction pipe 9's one end and the pinhole pipe 4, is equipped with glue pump 11 on butt joint pipe 10.
The utility model discloses the waterproof heat-conducting glue spraying tool of circuit board can conveniently spray waterproof heat-conducting glue for the components on the circuit board through this spraying tool, and the one deck waterproof heat-conducting film is formed on the components surface on the circuit board after the heat-conducting glue solidifies to protect the components; the filter ball 12 is placed in a heat-conducting glue storage tank; starting a glue pumping pump 11, pumping heat-conducting glue in a storage tank into a pinhole pipe 4 by the glue pumping pump 11 through a liquid pumping pipe 9 and the glue pumping pump 11, conveying the heat-conducting glue into a glue storage bin 3 by the pinhole pipe 4, spraying the glue storage bin 3 through a main glue spraying needle 7, enabling an operator to hold the spraying tool, aligning the front surface of a spraying shell 1 of the spraying tool to the surface of a component on a circuit board, spraying waterproof heat-conducting glue on the component on the circuit board through the main glue spraying needle 7, and forming a waterproof heat-conducting film on the surface of the component on the circuit board after the heat-conducting glue is cured so as to protect the component; the efficiency of protecting the components on the circuit board is greatly improved.
Preferably, the end of the pinhole tube 4 is externally connected with a glue spraying hose 19, one end of the glue spraying hose 19 is connected with the end of the pinhole tube 4, the other end of the glue spraying hose 19 is provided with an insertion tube 21, the insertion tube 21 is inserted with an auxiliary glue spraying needle 22, and the insertion tube 21 is provided with a control switch 20; the inserting pipe 21 can also perform fine spraying treatment on the components on the circuit board through the auxiliary glue spraying needle 22, and the control switch 20 is turned on; the glue spraying hose 19 conveys the heat-conducting glue in the pinhole pipe 4 to the auxiliary glue spraying needle 22 of the plug-in pipe 21, and the heat-conducting glue is sprayed on the surface of the component through the auxiliary glue spraying needle 22, so that fine spraying treatment is achieved.
Preferably, the main glue spraying needle 7 comprises a needle body 23, a spraying port 24 is arranged at the front end of the needle body 23, the spraying port 24 is of an open structure, a spraying ball 25 is arranged at the rear end of the needle body 23, the surface of the spraying ball 25 is of a net structure, the spraying ball 25 is arranged inside the glue storage bin 3, and the spraying port 24 is arranged at the position of the positioning net groove 6; the spraying ball 25 conveys the heat-conducting glue into the needle body 23, and the needle body 23 sprays the heat-conducting glue onto the surface of the component through the spraying port 24, so that fine spraying treatment is achieved.
Preferably, the peripheral surface of the needle body 23 is sleeved with an electric heating spiral wire 26, and the electric heating spiral wire 26 is in a spiral shape; two ends of the electric heating spiral wire 26 are externally connected with an electric connecting wire 27, the pipe wall of the holding pipe 2 is provided with a temperature controller 13, and the electric connecting wire 27 is electrically connected with the temperature controller 13; the temperature controller 13 controls the electric heating spiral wire 26 to realize electric heating, and the electric heating treatment is carried out on the needle body 23 through the electric heating spiral wire 26, so that the heat conducting glue in the needle body 23 keeps constant temperature.
Preferably, a junction box 14 is provided at a side position of the painting housing 1, and an end of the electric connection line 27 passes through the junction box 14; the electrical connection wires 27 are subjected to cluster wiring by the cluster block 14.
Preferably, the diameter of the spraying ball 25 is larger than the pipe diameter of the needle body 23, and the diameter of the outer end of the spraying port 24 is larger than the pipe diameter of the needle body 23; the heat-conducting glue can be sprayed out.
Preferably, both sides of the inner top of the spraying shell 1 are provided with fixed seats 15, both inner walls of both sides of the spraying shell 1 are provided with limit blocks 16, and both ends of the glue storage bin 3 are installed between the fixed seats 15 and the limit blocks 16; store up gluey storehouse 3 and firmly install through fixing base 15 and stopper 16.
Preferably, the inside of the pinhole pipe 4 is sleeved with a filter element; the inside of the pinhole tube 4 is subjected to a filtration treatment by the filter element.
Preferably, the front surface of the spraying shell 1 is provided with a protective cover 8, and the protective cover 8 is sleeved on the peripheral surface of the positioning screen frame 5; the outer peripheral surface of the positioning net frame 5 is protected by a protection cover 8.
Preferably, the back of the spraying shell 1 is provided with a cold air box 17, the side part of the cold air box 17 is provided with a cold air pump 18, and the front of the cold air box 17 is provided with air outlets 28 arranged in a matrix; an air source is provided for the cold air box 17 through the cold air pump 18, the cold air box 17 blows out cold air through the air outlet 28, the spraying tool is reversely enabled to be aligned to the back surface of the component of the circuit board after the thermal conductive adhesive is sprayed, the air outlet 28 of the cold air box 17 is aligned to the surface of the component of the circuit board after the thermal conductive adhesive is sprayed, and the cold air blown out through the air outlet 28 cools the thermal conductive adhesive layer.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.
Claims (10)
1. A spraying tool for waterproof heat-conducting glue of a circuit board comprises a spraying shell, wherein a holding tube is arranged at the side part of the spraying shell, the inside of the spraying shell is of a cavity structure, and a glue storage bin is arranged inside the spraying shell;
the method is characterized in that: the front surface of the glue storage bin is provided with main glue spraying needles arranged in a matrix manner, the front surface of the spraying shell is provided with a positioning net frame, the positioning net frame is provided with positioning net grooves arranged in a matrix manner, the outer ends of the main glue spraying needles penetrate through the positioning net grooves, and the inner ends of the main glue spraying needles are arranged inside the glue storage bin;
the inside in storage rubber storehouse is equipped with the pinhole pipe, and the global of pinhole pipe is network structure, and the internally mounted of holding tube has the liquid suction pipe, and the one end and the pinhole union coupling of liquid suction pipe, the other end of liquid suction pipe are equipped with the filter bulb, through the butt joint union coupling between the one end of liquid suction pipe and the pinhole pipe, are equipped with the pump of glue pumping on the butt joint union coupling.
2. The spraying tool for the waterproof heat-conducting glue of the circuit board according to claim 1, wherein: the tip of pinhole pipe is external to have spouts the glue hose, spouts the end connection of glue hose's one end and pinhole pipe, spouts the other end of glue hose and is equipped with the pipe of pegging graft, and the pipe of pegging graft is pegged graft and is had vice gluey needle of spouting, pegs graft and is equipped with control switch on the pipe.
3. The spraying tool for the waterproof heat-conducting glue of the circuit board according to claim 1, wherein: the main gluey needle of spouting includes the needle body, and the front end of needle body is equipped with the spraying mouth, and the spraying mouth is open structure, and the rear end of needle body is equipped with the spraying ball, and the surface of spraying ball is network structure, and the spraying ball is installed in the inside of storing up gluey storehouse, and the spraying mouth is installed in location net groove position.
4. The spraying tool of the waterproof thermal conductive adhesive for the circuit board according to claim 3, wherein: the peripheral surface of the needle body is sleeved with an electric heating spiral wire which is in a spiral shape; two ends of the electric heating spiral wire are externally connected with electric connecting wires, the pipe wall of the holding pipe is provided with a temperature controller, and the electric connecting wires are electrically connected with the temperature controller.
5. The spraying tool of the waterproof thermal conductive adhesive for the circuit board according to claim 3, wherein: the lateral part position of spraying shell is equipped with the line concentration box, and the tip of electricity connecting wire passes the line concentration box.
6. The spraying tool of the waterproof thermal conductive adhesive for the circuit board according to claim 3, wherein: the diameter of the spraying ball is larger than the pipe diameter of the needle body, and the diameter of the outer end of the spraying port is larger than the pipe diameter of the needle body.
7. The spraying tool for the waterproof heat-conducting glue of the circuit board according to claim 1, wherein: the interior top both sides of spraying shell all are equipped with the fixing base, and the both sides inner wall of spraying shell all is equipped with the stopper, and the both ends in storage rubber storehouse are installed between fixing base and stopper.
8. The spraying tool for the waterproof heat-conducting glue of the circuit board according to claim 1, wherein: the inside cover of pinhole pipe is equipped with the filter core.
9. The spraying tool for the waterproof heat-conducting glue of the circuit board according to claim 1, wherein: the front of the spraying shell is provided with a protective cover which is sleeved on the peripheral surface of the positioning net frame.
10. The spraying tool for the waterproof heat-conducting glue of the circuit board according to claim 1, wherein: the back of spraying shell is equipped with the cold wind case, and the side position of cold wind case is equipped with the cool air pump, and the front of cold wind case is equipped with the air outlet that is the matrix arrangement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921392061.1U CN210497071U (en) | 2019-08-26 | 2019-08-26 | Waterproof heat-conducting glue spraying tool for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921392061.1U CN210497071U (en) | 2019-08-26 | 2019-08-26 | Waterproof heat-conducting glue spraying tool for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210497071U true CN210497071U (en) | 2020-05-12 |
Family
ID=70591776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921392061.1U Active CN210497071U (en) | 2019-08-26 | 2019-08-26 | Waterproof heat-conducting glue spraying tool for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210497071U (en) |
-
2019
- 2019-08-26 CN CN201921392061.1U patent/CN210497071U/en active Active
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