CN210489587U - Semiconductor support that structural stability is strong - Google Patents
Semiconductor support that structural stability is strong Download PDFInfo
- Publication number
- CN210489587U CN210489587U CN201921580728.0U CN201921580728U CN210489587U CN 210489587 U CN210489587 U CN 210489587U CN 201921580728 U CN201921580728 U CN 201921580728U CN 210489587 U CN210489587 U CN 210489587U
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- gear
- rack
- slot
- semiconductor
- structural stability
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Abstract
The utility model discloses a semiconductor bracket with strong structural stability, which structurally comprises a supporting foot, a fixed plate, a placing plate, a slot and a clamping mechanism, wherein the clamping mechanism consists of a pressing block, a spring, a rotating rod, a first rack, a first slide rail, a first gear, a transmission belt, a second gear, a second rack, a pressing plate and a second slide rail, the semiconductor bracket with strong structural stability is provided with the clamping mechanism, when a semiconductor is placed into the slot, the semiconductor touches a bottom pressing block, at the moment, the pressing block is forced to move downwards to enable the rotating rod to rotate and push the first rack to slide, then the second rack is driven by the first gear, the transmission belt and the second gear to move leftwards to push the pressing plates at two sides into the semiconductor to be compressed and fixed, the problem that semiconductors with different thicknesses are easy to incline leftwards and rightwards in the slot, and the right angle of the inclined semiconductor is easy to slightly deform, causing economic loss and achieving the effect of being convenient for clamping.
Description
Technical Field
The utility model relates to a semiconductor support technical field, concretely relates to strong semiconductor support of structural stability.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has wide application in the fields of consumer electronics, communication systems, medical instruments and the like, for example, a diode is a device made of a semiconductor, the importance of the semiconductor is very great from the viewpoint of science and technology or economic development, most of electronic products today, such as computers, mobile phones or digital recorders, have close relationship with the semiconductor in core units, common semiconductor materials include silicon, germanium, gallium arsenide and the like, silicon is the most influential one of various semiconductor materials in commercial application, and the semiconductor needs to be temporarily placed in a bracket for fixing in the processing process.
When the semiconductor is placed in the bracket, the semiconductors with different thicknesses are easy to incline left and right in the slot, and the inclined semiconductor is easy to slightly deform when touching the right angle of the slot for a long time, so that economic loss is caused.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
In order to overcome the defects of the prior art, the semiconductor support with strong structural stability is provided, the problems that semiconductors with different thicknesses are easy to incline left and right in a slot, and the inclined semiconductors are easy to slightly deform when touching the right angle of the slot for a long time, so that economic loss is caused are solved, and the effect of facilitating clamping is achieved.
(II) technical scheme
The utility model discloses a following technical scheme realizes: the utility model provides a semiconductor bracket with strong structural stability, which comprises a supporting foot, wherein the supporting foot is fastened at the bottom of a fixed plate, the upper end of the fixed plate is fixed in parallel with a placing plate, the upper end of the placing plate is vertically fixed with an inserting groove, a clamping mechanism is arranged in the inserting groove, the clamping mechanism consists of a pressing block, a spring, a rotating rod, a first rack, a first sliding rail, a first gear, a driving belt, a second gear, a second rack, a pressing plate and a second sliding rail, the bottom of the pressing block is fastened with the spring, the bottom of the spring is fixed with the bottom of the inside of the inserting groove, two ends of the rotating rod are respectively in rotating fit with the pressing block and the first rack through a rotating shaft, the first sliding rail is fastened at the right side of the bottom of the inside of the inserting groove, the upper end of the first sliding rail is in sliding fit with the first rack, the first, the bottom of the first gear is meshed with the first rack, the first gear is in running fit with the lower end of the transmission belt through a belt pulley, the second gear is in running fit with the upper end of the transmission belt through the belt pulley, the upper end of the second gear is meshed with the second rack, arc welding is conducted on the right side of the pressing plate and the second rack, the second sliding rails are fixed on two sides inside the inserting grooves, and the pressing plate slides left and right along the middle of the second sliding rails.
Furthermore, the top of the pressing block is provided with anti-skid grains, and the width of the pressing block is eighty percent of the width of the groove in the middle of the slot.
Furthermore, the middle part of the spring is provided with a telescopic rod, and the natural length of the telescopic rod is the same as that of the spring.
Further, the second gear outer diameter is forty percent of the first gear outer diameter, and the first gear and the second gear are mounted in parallel with each other.
Furthermore, a limiting block is arranged on the right side of the second rack, and the length of the limiting block is twice of the height of the second rack.
Furthermore, the head end and the tail end of the pressing plate are provided with sliding blocks, and the sliding blocks are in sliding fit with the second sliding rail.
Furthermore, the number of the second slide rails is two, and the two second slide rails are symmetrically installed with each other.
(III) advantageous effects
Compared with the prior art, the utility model, following beneficial effect has:
through having set up clamping mechanism, the semiconductor touches the bottom when putting into the slot and presses the briquetting, press the briquetting atress to move down to make the dwang rotate and promote first rack and slide this moment, later through first gear, the transmission of drive belt and second gear, make the second rack remove left and push both sides clamp plate to compress tightly fixedly in the semiconductor, the semiconductor of having solved different thickness inclines about easily in the slot, the semiconductor of slope touches slot right angle department for a long time and takes place slight deformation easily, cause economic loss's problem, reach the tight effect of clamp of being convenient for.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the slot of the present invention;
fig. 3 is a schematic view of the front view structure of the clamping mechanism of the present invention.
In the figure: the device comprises a supporting foot-1, a fixing plate-2, a placing plate-3, a slot-4, a clamping mechanism-5, a pressing block-51, a spring-52, a rotating rod-53, a first rack-54, a first sliding rail-55, a first gear-56, a transmission belt-57, a second gear-58, a second rack-59, a pressing plate-510 and a second sliding rail-511.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, fig. 2 and fig. 3, the present invention provides a semiconductor support with strong structural stability: comprises a supporting foot 1, the supporting foot 1 is fastened at the bottom of a fixed plate 2, the upper end of the fixed plate 2 is fixed in parallel with a placing plate 3, the upper end of the placing plate 3 is vertically fixed with a slot 4, a clamping mechanism 5 is arranged in the slot 4, the clamping mechanism 5 comprises a pressing block 51, a spring 52, a rotating rod 53, a first rack 54, a first sliding rail 55, a first gear 56, a transmission belt 57, a second gear 58, a second rack 59, a pressing plate 510 and a second sliding rail 511, the bottom of the pressing block 51 is fastened with the spring 52, the bottom of the spring 52 is fixed with the bottom end in the slot 4, two ends of the rotating rod 53 are respectively in rotating fit with the pressing block 51 and the first rack 54 through a rotating shaft, the first sliding rail 55 is fastened at the right side of the bottom end in the slot 4, the upper end of the first sliding rail 55 is in sliding fit with the first rack 54, the first gear 56 and the, the bottom of the first gear 56 is engaged with the first rack 54, and the first gear 56 is rotatably engaged with the lower end of the transmission belt 57 through a pulley, the second gear 58 is rotatably engaged with the upper end of the transmission belt 57 through a pulley, the upper end of the second gear 58 is engaged with the second rack 59, the right side of the pressing plate 510 is arc-welded with the second rack 59, the second sliding rail 511 is fixed on both sides of the inside of the inserting groove 4, and the pressing plate 510 slides left and right along the middle of the second sliding rail 511.
The top of the pressing block 51 is provided with anti-slip lines, and the width of the pressing block 51 is eighty percent of the width of the groove in the middle of the slot 4.
Wherein, the middle part of the spring 52 is telescopic, and the telescopic rod has the same natural length as the spring 52.
Wherein the second gear 58 has an outer diameter that is forty percent of the outer diameter of the first gear 56, and the first gear 56 and the second gear 58 are mounted in parallel with each other.
Wherein, the right side of the second rack 59 is provided with a limiting block, and the length of the limiting block is twice of the height of the second rack 59.
The two ends of the head and the tail of the pressing plate 510 are provided with sliding blocks, and the sliding blocks are in sliding fit with the second sliding rails 511.
The number of the second sliding rails 511 is two, and the two second sliding rails 511 are symmetrically installed.
The working principle is as follows: when the semiconductor packaging machine is used, a user can put semiconductors into the slots 4 at the upper end of the placing plate 3 for fixing, the fixing plate 2 plays a supporting role, the supporting feet 1 play a bottom supporting and anti-skidding role, but semiconductors with different thicknesses are easy to incline left and right in the slots, the inclined semiconductors are easy to slightly deform when touching the right angle of the slots for a long time, so that economic loss is caused, the problem can be solved through the clamping mechanism 5, when the semiconductors are put into the slots 4, the semiconductors touch the bottom pressing block 51, at the moment, the pressing block 51 is stressed to move downwards so that the rotating rod 53 rotates and pushes the first rack 54 to slide along the first sliding rail 55, then the second rack 59 moves leftwards to slide the two side pressing plates 510 through the second sliding rail 511 and push the two side pressing plates to the semiconductors for compressing and fixing through the transmission of the first gear 56, the spring 52 plays a resetting role, and the elasticity of the spring, through having set up clamping mechanism 5, the semiconductor touches bottom when putting into slot 4 and presses down briquetting 51, press briquetting 51 atress to move down this moment and make dwang 53 rotate and promote first rack 54 to slide, later through first gear 56, the transmission of drive belt 57 and second gear 58, make second rack 59 remove left and push both sides clamp plate 510 to compress tightly fixedly in the semiconductor, the semiconductor of having solved different thickness inclines about easily in the slot, the semiconductor of slope touches slot right angle department for a long time and takes place slight deformation easily, cause economic loss's problem, reach the tight effect of clamp of being convenient for.
The basic principle and the main characteristics of the present invention and the advantages of the present invention have been shown and described above, and the present invention uses standard parts that can be purchased from the market, the special-shaped parts can be customized according to the description of the specification and the attached drawings, the specific connection mode of each part is all the conventional means such as bolt and rivet, welding, etc. mature in the prior art, and machinery, parts and equipment are all adopted in the prior art, and the conventional model is added to the conventional connection mode in the prior art, and detailed description is not given here.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921580728.0U CN210489587U (en) | 2019-09-23 | 2019-09-23 | Semiconductor support that structural stability is strong |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921580728.0U CN210489587U (en) | 2019-09-23 | 2019-09-23 | Semiconductor support that structural stability is strong |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210489587U true CN210489587U (en) | 2020-05-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921580728.0U Expired - Fee Related CN210489587U (en) | 2019-09-23 | 2019-09-23 | Semiconductor support that structural stability is strong |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210489587U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112268734A (en) * | 2020-10-16 | 2021-01-26 | 湖南筑升信息科技有限公司 | Portable highway engineering soil sampling device |
| CN114721231A (en) * | 2022-04-17 | 2022-07-08 | 江苏晟驰微电子有限公司 | Tool clamp for cleaning photoetching plate |
-
2019
- 2019-09-23 CN CN201921580728.0U patent/CN210489587U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112268734A (en) * | 2020-10-16 | 2021-01-26 | 湖南筑升信息科技有限公司 | Portable highway engineering soil sampling device |
| CN114721231A (en) * | 2022-04-17 | 2022-07-08 | 江苏晟驰微电子有限公司 | Tool clamp for cleaning photoetching plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200508 |