CN210471142U

CN210471142U - Structure of embedded intelligent shoes

Info

Publication number: CN210471142U
Application number: CN201920585109.4U
Authority: CN
Inventors: 李文水; 吴冬青; 赖文敦
Original assignee: Jinjiang Shuwen Intelligent Technology Co Ltd
Current assignee: Jinjiang Shuwen Intelligent Technology Co Ltd
Priority date: 2019-04-26
Filing date: 2019-04-26
Publication date: 2020-05-08
Anticipated expiration: 2029-04-26

Abstract

The utility model discloses a structure of embedded intelligent shoes, including shoe-pad mould, shoe-pad and sole, the shoe-pad upper surface is provided with intelligent module standing groove, shoe-pad mould bottom is provided with shoe-pad mould cavity, the inside intelligent module setpoint that is provided with of shoe-pad mould cavity, and shoe-pad module setpoint is located inside the intelligent module standing groove, all be provided with the protection box standing groove on shoe-pad mould cavity and the shoe-pad, the inside protection box that is provided with of protection box standing groove, protection box upper surface is provided with the visor, protection box outer wall one side is provided with control switch and the port that charges, the visor is formed by PU layer and anchor coat combination, the PU level is on the outer wall of anchor coat. The utility model discloses a setting of a series of structures can place the shoe-pad in with intelligent component and battery module in together inside, can not let the user feel uncomfortable because of the increase of shoe-pad thickness simultaneously.

Description

Structure of embedded intelligent shoes

Technical Field

The utility model relates to a wearing equipment technical field specifically is a structure of embedded intelligent shoes.

Background

With the progress of science and technology, the large-scale popularization of various electronic products and the rapid development of small-sized intelligent research, more and more electronic science and technology products are integrated into the lives of people, especially some wearable devices, and a great number of intelligent elements are increased while the electronic science and technology products are gradually developed to the practicability. By putting various intelligent electronic components into the common shoes, the common shoes are endowed with more practical new characteristics and new functions, and meanwhile, unprecedented new experience is provided for users, namely the common shoes are commonly called as intelligent shoes.

No matter direct action is in human sole portion intelligent shoes, still according to the preceding method with intelligent component and battery module put into the inside of shoe-pad together, receive the increase of shoe-pad height, can bring very big discomfort for the user, if place intelligent component and battery module respectively in inside shoe-pad and shoes, will bring a great deal of inconvenience for the use.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a structure of embedded intelligent shoes to solve the problem among the prior art.

In order to achieve the above object, the utility model provides a following technical scheme: the structure of the embedded intelligent shoe comprises a shoe pad mold, a shoe pad and a shoe sole, wherein an intelligent module placing groove is arranged on the upper surface of the shoe pad, the bottom of the insole mould is provided with an insole mould cavity, the insole mould cavity is internally provided with an intelligent module positioning point, the positioning point of the insole module is positioned in the intelligent module placing groove, the insole die cavity and the insole are both provided with a protection box placing groove, the protection box is arranged in the protection box placing groove, the upper surface of the protection box is provided with a protection cover, a control switch and a charging port are arranged on one side of the outer wall of the protection box, the protective cover is formed by combining a PU layer and a bonding layer, the PU layer is positioned on the outer wall of the bonding layer, the upper surface of the protective cover is provided with a covering layer, the upper surface of the sole is provided with a shoe pad keel, the shoe sole is characterized in that an embedding groove is formed in one side of the upper surface of the shoe sole, and the protection groove is connected with the embedding groove through a gap.

Preferably, the shoe-pad material is the PU material, shoe-pad mould need not to make the change with ordinary PU shoe-pad forming die's structure.

Preferably, the protection cover and the protection box are combined by ultrasonic bonding.

Preferably, the whole appearance design of the protection box is combined with the protection box placing groove of the insole die, and the whole protection box is embedded into the protection box placing groove of the insole through the protection cover after one-step forming.

Preferably, the insole is provided with an intelligent module placing groove from the half sole to the arch region, and a protection box placing groove is arranged at the heel position.

Compared with the prior art, the beneficial effects of the utility model are that: all electronic components of the utility model can be arranged in the insole die cavity during the molding, and then are consistent with the common PU insole, the insole is formed by one-step forming, the half sole position in the cavity of the insole die is designed by the positioning point of the intelligent module, the main function is to position the intelligent element in the forming process, the design of the placement groove of the protection box is positioned at the heel position in the cavity of the insole die, the main function is to place the protection box, the placement groove of the protection box is in a concave type in the cavity of the insole die, the protection box of the utility model is mainly used for placing the battery module and the control module needed by the intelligent element, and through the matching of the insole die, the protection box, the insole and the sole, the intelligent element and the battery module can be arranged in the insole together, and meanwhile, a user cannot feel uncomfortable due to the increase of the thickness of the insole. The utility model discloses a setting of a series of structures can place the shoe-pad in with intelligent component and battery module in together inside, can not let the user feel uncomfortable because of the increase of shoe-pad thickness simultaneously.

Drawings

Fig. 1 is a schematic structural view of the bottom of the insole mold of the present invention.

Fig. 2 is a side view of the protection box of the present invention.

Fig. 3 is a rear view of the protection box of the present invention.

Fig. 4 is a schematic structural view of the protection box of the present invention in the insole mold.

Fig. 5 is an enlarged schematic view of a portion a in fig. 4 according to the present invention.

Fig. 6 is a cross-sectional view of the protective cover of the present invention after molding.

Fig. 7 is a schematic structural view of the insole of the present invention.

Fig. 8 is a schematic structural view of the sole of the present invention.

In the figure: 1. an insole mould; 2. a protection box placing groove; 3. a shoe insole mold cavity; 4. Locating points of the intelligent module; 5. a protection box; 6. a protective cover; 7. a PU layer; 8. a bonding layer; 9. a cover layer; 10. an intelligent module placing groove; 11. a control switch; 12. a charging port; 13. shoe-pad; 14. a keel of the insole; 15. embedding a groove; 16. a shoe sole.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-8, in an embodiment of the present invention, an embedded intelligent shoe structure includes an insole mold 1, an insole 13 and a sole 16, an intelligent module placement groove 10 is disposed on an upper surface of the insole 13, an insole mold cavity 3 is disposed at a bottom of the insole mold 1, an intelligent module positioning point 4 is disposed inside the insole mold cavity 3, the insole 13 positioning point is disposed inside the intelligent module placement groove 10, a protection box placement groove 2 is disposed on both the insole mold cavity 3 and the insole 13, a protection box 5 is disposed inside the protection box placement groove 2, a protection cover 6 is disposed on an upper surface of the protection box 5, a control switch 11 and a charging port 12 are disposed on one side of an outer wall of the protection box 5, the protection cover 6 is formed by combining a PU layer 7 and a combining layer 8, the PU layer 7 is disposed on an outer wall of the combining layer 8, a covering layer 9 is disposed on an upper surface, sole 16 upper surface one side is provided with inlays groove 15, the protection with inlay through clearance connection between the groove 15, shoe-pad 13 material is the PU material, shoe-pad mould 1 and ordinary PU shoe-pad 13 forming die's structure, need not to make the change, ultrasonic bonding's mode is adopted to the mode that visor 6 and protection box 5 combine, the whole outward appearance design of protection box 5 combines shoe-pad mould 1's protection box standing groove 2, visor 6 inlays whole protection box 5 in shoe-pad 13's protection box standing groove 2 behind the one shot forming, shoe-pad 13 half is intelligent module standing groove 10 to the arch of foot region, the heel position is protection box standing groove 2.

The utility model discloses a theory of operation is: all electronic components of the utility model can be placed in the insole mould cavity 3 during the forming, and then are consistent with the common PU insole 13, the insole is formed by one-step forming, the half sole position in the insole die cavity 3 is designed by the intelligent module positioning point 4, the main function is to position the intelligent element in the forming process, the heel position in the insole die cavity 3 is designed to be positioned through the protection box placing groove 2, the main function is to place the protection box 5, the protection box placing groove 2 is in a concave type in the insole die cavity 3, the protection box 5 of the utility model is mainly used for placing the battery module and the control module needed by the intelligent element through the matching of the insole die 1, the protection box 5, the insole 13 and the sole 16, it is possible to incorporate the smart component inside the footwear insole 13 together with the battery module while not allowing the user to feel discomfort due to the increase in thickness of the footwear insole 13. The utility model discloses a setting of a series of structures can place the intelligent component in shoe-pad 13 with battery module in together inside, can not let the user feel uncomfortable because of the increase of shoe-pad 13 thickness simultaneously.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The structure of the embedded intelligent shoe comprises an insole die (1), an insole (13) and a sole (16), and is characterized in that an intelligent module placing groove (10) is formed in the upper surface of the insole (13), an insole die cavity (3) is formed in the bottom of the insole die (1), an intelligent module positioning point (4) is arranged inside the insole die cavity (3), the module positioning point of the insole (13) is located inside the intelligent module placing groove (10), protection box placing grooves (2) are formed in the insole die cavity (3) and the insole (13), a protection box (5) is arranged inside the protection box placing groove (2), a protective cover (6) is arranged on the upper surface of the protection box (5), a control switch (11) and a charging port (12) are arranged on one side of the outer wall of the protection box (5), and the protective cover (6) is formed by combining a PU layer (7) and a combining layer (8), PU layer (7) are located the outer wall of anchor coat (8), visor (6) upper surface is provided with overburden (9), sole (16) upper surface is provided with shoe-pad fossil fragments (14), sole (16) upper surface one side is provided with inlays groove (15), the protection with inlay through clearance connection between groove (15).

2. The structure of embedded intelligent shoes of claim 1, characterized in that, the shoe-pad (13) material is PU material, the shoe-pad mould (1) and the structure of ordinary PU shoe-pad (13) forming mould need not to be changed.

3. The structure of embedded intelligent shoes according to claim 1, characterized in that the protection cover (6) and the protection box (5) are combined by ultrasonic bonding.

4. The structure of the embedded intelligent shoe as claimed in claim 1, wherein the overall appearance design of the protection box (5) is combined with the protection box placing groove (2) of the insole mold (1), and the protection cover (6) inlays the entire protection box (5) in the protection box placing groove (2) of the insole (13) after one-step molding.

5. The structure of embedded intelligent shoes according to claim 1, characterized in that, the sole-arch area of the insole (13) is an intelligent module placing groove (10), and the heel position is a protection box placing groove (2).