CN210449523U - Electrostatic adsorption bipolar purification equipment - Google Patents
Electrostatic adsorption bipolar purification equipment Download PDFInfo
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- CN210449523U CN210449523U CN201921368586.1U CN201921368586U CN210449523U CN 210449523 U CN210449523 U CN 210449523U CN 201921368586 U CN201921368586 U CN 201921368586U CN 210449523 U CN210449523 U CN 210449523U
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Abstract
An electrostatic adsorption bipolar purification device comprises a metal framework, an ionization component, an electrostatic adsorption component, a plurality of first ceramic mounting plates, a metal connecting rod, a plurality of second ceramic mounting plates and a metal connecting plate; the ionization component comprises an ionization positive plate, an ionization negative plate, a first positive connecting column connected with the ionization positive plate and a first negative connecting column connected with the ionization negative plate; the electrostatic adsorption component comprises an electrostatic positive plate, an electrostatic negative plate, a second positive connecting column connected with the electrostatic positive plate and a second negative connecting column connected with the electrostatic negative plate. Therefore, the wiring is convenient, the isolation effect is good, short circuit cannot occur, and the safety is higher.
Description
Technical Field
The utility model relates to an air purification technical field, especially a bipolar clarification plant of electrostatic absorption.
Background
The air purification equipment is provided with a plurality of ionization plates and a plurality of electrostatic adsorption plates in order to improve the purification effect, wherein ionization positive plates of the ionization plates are required to be connected with a first power supply end, and ionization negative plates of the ionization plates are required to be grounded; the electrostatic positive plates of the plurality of electrostatic adsorption plates need to be connected with a second power supply end, and the electrostatic negative plates of the plurality of electrostatic adsorption plates need to be grounded. The connector lug is very many, and therefore the wiring is very troublesome, easy mutual interference moreover, if the ionization positive plate easily with the ionization negative plate short circuit, the static positive plate easily with the short circuit of static negative plate, the security is relatively poor.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a be convenient for the wiring, keep apart effectually, can not take place the short circuit, the bipolar clarification plant of electrostatic absorption that the security is higher to solve above-mentioned problem.
An electrostatic adsorption bipolar purification device comprises a metal frame, an ionization assembly, an electrostatic adsorption assembly, a plurality of first ceramic mounting plates, a metal connecting rod, a plurality of second ceramic mounting plates and a metal connecting plate, wherein the ionization assembly is arranged in the metal frame and is close to the first side of the metal frame; the ionization assembly comprises a plurality of ionization positive plates and ionization negative plates which are arranged in parallel and staggered mode, at least two first positive connecting columns connected with the ionization positive plates, and at least two first negative connecting columns connected with the ionization negative plates; the two ends of the first negative connecting column are connected with the metal frame, a first avoidance hole is formed in the position, corresponding to the first positive connecting column, of the ionization negative plate, a second avoidance hole is formed in the position, corresponding to the first positive connecting column, of the metal frame, the first positive connecting column penetrates through the first avoidance hole and the second avoidance hole, the two ends of the first positive connecting column respectively penetrate through a first ceramic mounting plate, and the first ceramic mounting plate is connected with an insulating bracket; the metal connecting rod is connected with at least two first positive connecting columns; the electrostatic adsorption component comprises a plurality of electrostatic positive plates and electrostatic negative plates which are arranged in parallel and staggered mode, second positive connecting columns connected with the electrostatic positive plates, and second negative connecting columns connected with the electrostatic negative plates; a third avoidance hole is formed in the position, corresponding to the second negative connecting column, of the static positive plate, a fourth avoidance hole is formed in the position, corresponding to the second positive connecting column, of the static negative plate, a fifth avoidance hole is formed in the position, corresponding to the second positive connecting column, of the metal frame, two ends of the second negative connecting column are connected with the metal frame, two ends of the second positive connecting column penetrate through the fifth avoidance hole and the second ceramic mounting plate, and the second ceramic mounting plate is connected with the insulating support; the metal connecting plate is connected with a plurality of second positive connecting columns.
Furthermore, the length of the ionization positive plate is smaller than that of the ionization negative plate, two ends of the ionization negative plate respectively protrude out of two ends of the ionization positive plate, and the two first negative connecting columns respectively penetrate through parts, protruding out of two ends of the ionization negative plates, of the positive plate.
Furthermore, a plurality of sharp parts are respectively arranged on two sides of the ionization positive plate in a protruding mode.
Furthermore, a connecting hole is formed in the position, corresponding to the second positive connecting column, of the metal connecting plate, a sixth avoiding hole is formed in the position, corresponding to the second positive connecting column, of the metal connecting plate, and one end of the second positive connecting column penetrates through the second ceramic mounting plate and the connecting hole and then is in threaded connection with the nut.
Further, the length of the second negative connecting column is smaller than that of the second positive connecting column.
Compared with the prior art, the electrostatic adsorption bipolar purification equipment comprises a metal frame, an ionization component which is arranged in the metal frame and is close to the first side of the metal frame, an electrostatic adsorption component which is arranged in the metal frame and is close to the second side of the metal frame, a plurality of first ceramic mounting plates, a metal connecting rod, a plurality of second ceramic mounting plates and a metal connecting plate; the ionization assembly comprises a plurality of ionization positive plates and ionization negative plates which are arranged in parallel and staggered mode, at least two first positive connecting columns connected with the ionization positive plates, and at least two first negative connecting columns connected with the ionization negative plates; the two ends of the first negative connecting column are connected with the metal frame, a first avoidance hole is formed in the position, corresponding to the first positive connecting column, of the ionization negative plate, a second avoidance hole is formed in the position, corresponding to the first positive connecting column, of the metal frame, the first positive connecting column penetrates through the first avoidance hole and the second avoidance hole, the two ends of the first positive connecting column respectively penetrate through a first ceramic mounting plate, and the first ceramic mounting plate is connected with an insulating bracket; the metal connecting rod is connected with at least two first positive connecting columns; the electrostatic adsorption component comprises a plurality of electrostatic positive plates and electrostatic negative plates which are arranged in parallel and staggered mode, second positive connecting columns connected with the electrostatic positive plates, and second negative connecting columns connected with the electrostatic negative plates; a third avoidance hole is formed in the position, corresponding to the second negative connecting column, of the static positive plate, a fourth avoidance hole is formed in the position, corresponding to the second positive connecting column, of the static negative plate, a fifth avoidance hole is formed in the position, corresponding to the second positive connecting column, of the metal frame, two ends of the second negative connecting column are connected with the metal frame, two ends of the second positive connecting column penetrate through the fifth avoidance hole and the second ceramic mounting plate, and the second ceramic mounting plate is connected with the insulating support; the metal connecting plate is connected with a plurality of second positive connecting columns. Therefore, the wiring is convenient, the isolation effect is good, short circuit cannot occur, and the safety is higher.
Drawings
Embodiments of the present invention are described below with reference to the accompanying drawings, in which:
fig. 1 is a schematic perspective view of an electrostatic adsorption bipolar purification apparatus provided by the present invention.
Fig. 2 is a schematic view of a first view angle of the electrostatic adsorption bipolar purification apparatus provided by the present invention.
Fig. 3 is a schematic diagram of a second view angle of the electrostatic adsorption bipolar purification apparatus provided by the present invention.
Fig. 4 is a schematic side view of the electrostatic adsorption bipolar purification apparatus provided by the present invention.
Detailed Description
The following describes in further detail specific embodiments of the present invention based on the drawings. It should be understood that the description herein of embodiments of the invention is not intended to limit the scope of the invention.
Referring to fig. 1 and 2, the electrostatic adsorption bipolar purification apparatus provided by the present invention includes a metal frame 10, an ionization component 20 disposed in the metal frame 10 and close to a first side of the metal frame 10, an electrostatic adsorption component 30 disposed in the metal frame 10 and close to a second side of the metal frame 10, a plurality of first ceramic mounting plates 25, a metal connecting rod 26, a plurality of second ceramic mounting plates 35, and a metal connecting plate 36.
The ionization assembly 20 includes a plurality of ionization positive plates 21, a plurality of ionization negative plates 22, two first positive connection posts 23 connecting the plurality of ionization positive plates 21, and two first negative connection posts 24 connecting the plurality of ionization negative plates 22.
In the present embodiment, each ionization positive electrode plate 21 is disposed adjacent to and parallel to two ionization negative electrode plates 22, that is, the ionization positive electrode plates 21 are disposed in a staggered manner from the ionization negative electrode plates 22. The ionization positive plate 21 has a length smaller than that of the ionization negative plate 22. Both ends of the ionization negative electrode plate 22 protrude from both ends of the ionization positive electrode plate 21, respectively.
Two first negative connection posts 24 respectively penetrate through both ends of the plurality of ionization negative plates 22 to protrude out of the positive plate 21. And the first negative connecting post 24 is electrically connected to the plurality of ionization plates 22. Both ends of the first negative connection post 24 are connected to the metal frame 10.
The two first positive connection posts 23 respectively penetrate through two ends of the ionization positive plates 21 and are electrically connected with the ionization positive plates 21.
A first avoiding hole 221 is formed in the position, corresponding to the first positive connecting post 23, of the ionization negative plate 22, and an inner diameter of the first avoiding hole 221 is far larger than a diameter of the first positive connecting post 23, for example, 4 to 8 times of the diameter of the first positive connecting post 23. The metal frame 10 is provided with a second avoiding hole 11 corresponding to the position of the first positive connecting column 23, the first positive connecting column 23 penetrates through the first avoiding hole 221 and the second avoiding hole 11, two ends of the first positive connecting column 23 respectively penetrate through a first ceramic mounting plate 25, and the first ceramic mounting plate 25 is connected with an insulating support. The circumferential outer sides of both ends of the first positive connection column 23 are provided with external threads, and the external threads are connected with a nut.
The two ends of the metal connecting rod 26 are respectively connected with the two first positive connecting posts 23. Specifically, a first through hole 261 is respectively opened at two ends of the metal connecting rod 26, and the first positive connecting post 23 passes through the first ceramic mounting plate 25 and the first through hole 261 and then is in threaded connection with the nut.
The two sides of the ionization positive plate 21 are respectively provided with a plurality of tips in a protruding manner, so that electric arcs can be generated by ionization.
With continued reference to fig. 3, the electrostatic adsorbing assembly 30 includes a plurality of electrostatic positive plates 31, a plurality of electrostatic negative plates 32, a second positive connecting column 33 connected to the plurality of electrostatic positive plates 31, and a second negative connecting column 34 connected to the plurality of electrostatic negative plates 32.
Each electrostatic positive plate 31 is adjacent to and parallel to two electrostatic negative plates 32, i.e. the electrostatic positive plates 31 and the electrostatic negative plates 32 are staggered.
The second positive connecting column 33 passes through the plurality of electrostatic positive plates 31 and is electrically connected to the electrostatic positive plates 31, and the second negative connecting column 34 passes through the plurality of electrostatic negative plates 32 and is electrically connected to the electrostatic negative plates 32.
The electrostatic positive plate 31 has a third avoiding hole 311 corresponding to the second negative connection post 34, and the electrostatic negative plate 32 has a fourth avoiding hole 321 corresponding to the second positive connection post 33.
Both ends of the second negative connection post 34 are connected to the metal frame 10.
A fifth avoidance hole 12 is formed in the metal frame 10 at a position corresponding to the second positive connection column 33, and two ends of the second positive connection column 33 penetrate through the fifth avoidance hole 12 and the second ceramic mounting plate 35. The second ceramic mounting plate 35 is connected to the insulating support. The circumferential outer sides of the two ends of the second positive connecting column 33 are provided with external threads, and the external threads are connected with a nut.
A connecting hole 361 is formed in the position, corresponding to the second positive connecting column 33, of the metal connecting plate 36, a sixth avoiding hole 362 is formed in the position, corresponding to the second positive connecting column 33, of the metal connecting plate, and one end of the second positive connecting column 33 penetrates through the second ceramic mounting plate 35 and the connecting hole 361 and then is in threaded connection with the nut.
The length of the second negative connection post 34 is smaller than that of the second positive connection post 33, that is, the second negative connection post 34 does not pass through the sixth avoiding hole 362. The sixth relief hole 362 facilitates grounding the second negative connection post 34.
Referring to fig. 4, during wiring, since the two first positive connection posts 23 are connected by the metal connection rod 26, only one of the two first positive connection posts 23 needs to be connected to the first positive power supply; since the plurality of second positive connection posts 33 are connected by the metal connection plate 36, only one of the plurality of second positive connection posts 33 needs to be connected to the second positive power supply; since the second negative connection posts 34 are connected to the metal frame 10 and the metal frame 10 is connected to the first negative connection posts 24, only one of the second negative connection posts 34 needs to be grounded, and the first negative connection post 24 and the rest of the second negative connection posts 34 do not need to be wired.
The first ceramic mounting plate 25 realizes the isolation between the first positive connecting column 23, the first negative connecting column 24 and the metal frame 10; the second ceramic mounting plate 35 achieves isolation between the second positive connection post 33 and the second negative connection post 34 and the metal frame 10.
Compared with the prior art, the electrostatic adsorption bipolar purification equipment comprises a metal frame 10, an ionization component 20 which is arranged in the metal frame 10 and is close to the first side of the metal frame 10, an electrostatic adsorption component 30 which is arranged in the metal frame 10 and is close to the second side of the metal frame 10, a plurality of first ceramic mounting plates 25, a metal connecting rod 26, a plurality of second ceramic mounting plates 35 and a metal connecting plate 36; the ionization component 20 comprises a plurality of ionization positive plates 21 and ionization negative plates 22 which are arranged in parallel and staggered, at least two first positive connecting columns 23 connected with the ionization positive plates 21, and at least two first negative connecting columns 24 connected with the ionization negative plates 22; the two ends of the first negative connecting column 24 are connected with the metal frame 10, a first avoiding hole 221 is formed in the position, corresponding to the first positive connecting column 23, of the ionization negative plate 22, a second avoiding hole 11 is formed in the position, corresponding to the first positive connecting column 23, of the metal frame 10, the first positive connecting column 23 penetrates through the first avoiding hole 221 and the second avoiding hole 11, the two ends of the first positive connecting column 23 respectively penetrate through a first ceramic mounting plate 25, and the first ceramic mounting plate 25 is connected with an insulating support; the metal connecting rod 26 is connected with at least two first positive connecting posts 23; the electrostatic adsorption component 30 comprises a plurality of electrostatic positive plates 31 and electrostatic negative plates 32 which are parallel and staggered, a second positive connecting column 33 connected with the plurality of electrostatic positive plates 31, and a second negative connecting column 34 connected with the plurality of electrostatic negative plates 32; a third avoidance hole 311 is formed in the position, corresponding to the second negative connecting column 34, of the electrostatic positive plate 31, a fourth avoidance hole 321 is formed in the position, corresponding to the second positive connecting column 33, of the electrostatic negative plate 32, a fifth avoidance hole 12 is formed in the position, corresponding to the second positive connecting column 33, of the metal frame 10, two ends of the second negative connecting column 34 are connected with the metal frame 10, two ends of the second positive connecting column 33 penetrate through the fifth avoidance hole 12 and the second ceramic mounting plate 35, and the second ceramic mounting plate 35 is connected with the insulating support; the metal connecting plate 36 is connected to the second positive connection posts 33. Therefore, the wiring is convenient, the isolation effect is good, short circuit cannot occur, and the safety is higher.
The above description is only for the preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention, and any modification, equivalent replacement or improvement within the spirit of the present invention is encompassed by the claims of the present invention.
Claims (5)
1. The utility model provides an electrostatic absorption bipolar purification equipment which characterized in that: the ionization assembly is arranged in the metal frame and is close to the first side of the metal frame, the electrostatic adsorption assembly is arranged in the metal frame and is close to the second side of the metal frame, the first ceramic mounting plates, the metal connecting rods, the second ceramic mounting plates and the metal connecting plates are arranged in the metal frame; the ionization assembly comprises a plurality of ionization positive plates and ionization negative plates which are arranged in parallel and staggered mode, at least two first positive connecting columns connected with the ionization positive plates, and at least two first negative connecting columns connected with the ionization negative plates; the two ends of the first negative connecting column are connected with the metal frame, a first avoidance hole is formed in the position, corresponding to the first positive connecting column, of the ionization negative plate, a second avoidance hole is formed in the position, corresponding to the first positive connecting column, of the metal frame, the first positive connecting column penetrates through the first avoidance hole and the second avoidance hole, the two ends of the first positive connecting column respectively penetrate through a first ceramic mounting plate, and the first ceramic mounting plate is connected with an insulating bracket; the metal connecting rod is connected with at least two first positive connecting columns; the electrostatic adsorption component comprises a plurality of electrostatic positive plates and electrostatic negative plates which are arranged in parallel and staggered mode, second positive connecting columns connected with the electrostatic positive plates, and second negative connecting columns connected with the electrostatic negative plates; a third avoidance hole is formed in the position, corresponding to the second negative connecting column, of the static positive plate, a fourth avoidance hole is formed in the position, corresponding to the second positive connecting column, of the static negative plate, a fifth avoidance hole is formed in the position, corresponding to the second positive connecting column, of the metal frame, two ends of the second negative connecting column are connected with the metal frame, two ends of the second positive connecting column penetrate through the fifth avoidance hole and the second ceramic mounting plate, and the second ceramic mounting plate is connected with the insulating support; the metal connecting plate is connected with a plurality of second positive connecting columns.
2. The electrostatic adsorption bipolar purification apparatus of claim 1, wherein: the length of ionization positive plate is less than the length of ionization negative plate, and the both ends of ionization negative plate are outstanding respectively in the both ends of ionization positive plate, and two first negative pole spliced poles pass the part that the both ends of a plurality of ionization negative plates are outstanding the positive plate respectively.
3. The electrostatic adsorption bipolar purification apparatus of claim 1, wherein: and a plurality of sharp parts are respectively arranged on two sides of the ionization positive plate in a protruding manner.
4. The electrostatic adsorption bipolar purification apparatus of claim 1, wherein: the metal connecting plate is provided with a connecting hole corresponding to the position of the second positive connecting column, a sixth avoiding hole corresponding to the position of the second positive connecting column, and one end of the second positive connecting column penetrates through the second ceramic mounting plate and the connecting hole and then is in threaded connection with the nut.
5. The electrostatic adsorption bipolar purification apparatus of claim 4, wherein: the length of the second negative connecting column is smaller than that of the second positive connecting column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921368586.1U CN210449523U (en) | 2019-08-21 | 2019-08-21 | Electrostatic adsorption bipolar purification equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921368586.1U CN210449523U (en) | 2019-08-21 | 2019-08-21 | Electrostatic adsorption bipolar purification equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210449523U true CN210449523U (en) | 2020-05-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921368586.1U Active CN210449523U (en) | 2019-08-21 | 2019-08-21 | Electrostatic adsorption bipolar purification equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210449523U (en) |
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2019
- 2019-08-21 CN CN201921368586.1U patent/CN210449523U/en active Active
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