CN210443358U

CN210443358U - Combined wafer thick film resistor

Info

Publication number: CN210443358U
Application number: CN201921713871.2U
Authority: CN
Inventors: 孙标; 汤华
Original assignee: Anhui Xiangsheng Technology Co ltd
Current assignee: Anhui Xiangsheng Technology Co ltd
Priority date: 2019-10-14
Filing date: 2019-10-14
Publication date: 2020-05-01
Anticipated expiration: 2029-10-14

Abstract

The utility model provides a modular wafer thick film resistor relates to wafer resistor installation technical field, including the resistance body, the wiring end electric connection of resistance body has the pin, the pin is perpendicular with the resistance body, the one end electric connection that the resistance body was kept away from to the pin has expansion device. The utility model discloses, overlap the folding silk surface that the carbon steel wire was made with the bread board cover, utilize and promote the slider, make the folding silk of slider extrusion make folding silk crooked, the slider upwards slides on the slide bar surface, the slider slides on installing the arch toward the soldering tin circular arc that the slide bar surface was equipped with, physical characteristic flexible has through soldering tin, thereby it warp to make slider extrusion soldering tin make it warp and block the slider, utilize crooked folding silk to increase the area of contact between pin and the bread board, thereby will fold the silk welding when welding pin and bread board, the problem that area of contact is not hard up easily for a short time between bread board and the pin has been solved.

Description

Combined wafer thick film resistor

Technical Field

The utility model relates to a wafer resistor installs technical field, especially relates to a modular wafer thick film resistor.

Background

When electric charges move in the conductor, the electric charges are collided and rubbed by other particles such as molecules and atoms, and the collision and rubbing result in the obstruction of the conductor to the current, the most obvious characteristic of the obstruction is that the conductor consumes electric energy to generate heat, the obstruction of the object to the current is called as the resistance of the object, the resistor is generally directly called as the resistor in daily life and is a current limiting element, after the resistor is connected in a circuit, the resistance value of the resistor is fixed and is generally two pins, the resistance value of the resistor can limit the magnitude of the current passing through a branch connected with the resistor, the resistor with the unchangeable resistance value is called as a fixed resistor, the resistance value of the resistor is called as a potentiometer or a variable resistor, and the ideal resistor is linear, namely the instantaneous current passing through the resistor is in direct proportion to the applied instantaneous voltage. A variable resistor for voltage division. On the exposed resistor body, one to two movable metal contacts are pressed. The contact location determines the resistance between either end of the resistor and the contact.

In the process of using the wafer thick film resistor, the pins of the resistor are required to be welded with bread, and the pins and the bread board are only simply welded, so that the problem of infirm welding is easily caused due to small contact area between the pins and the bread board.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art, and provides a combined wafer thick film resistor.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a modular wafer thick film resistor, includes the resistance body, the wiring end electric connection of resistance body has the pin, the pin is perpendicular with the resistance body, the one end electric connection that the resistance body was kept away from to the pin has expansion device.

Preferably, the position of the surface of the pin far away from the resistor body is fixedly connected with a baffle, the surface of the baffle is provided with grooves, and the grooves are uniformly distributed around the baffle.

Preferably, the expansion device comprises a sliding rod fixedly connected with the bottom end of the pin, a sliding block is connected to the surface of the sliding rod in a sliding mode, a folding wire is fixedly connected to the surface of the upper end of the sliding block, and one end, far away from the sliding block, of the folding wire is fixedly connected with the pin.

Preferably, the surface of the expansion device is sleeved with a bread board, and the bread board and the expansion device are welded through soldering tin.

Preferably, one end of the sliding rod, which is close to the pin, is provided with an arc-shaped bulge, and the arc-shaped bulge is formed by condensing molten soldering tin.

Preferably, the inner wall of the sliding block and the sliding rod are in clearance fit, and the upper end of the sliding block is uniformly provided with folding wires.

Advantageous effects

The utility model discloses in, overlap the bread board on the folding silk surface that the carbon steel wire was made, utilize and promote the slider, make the folding silk of slider extrusion make folding silk crooked, the slider upwards slides on the slide bar surface, the slider slides on the soldering tin circular arc dress arch that is equipped with toward the slide bar surface, physical characteristic that has flexibility through soldering tin, thereby it blocks the slider to make slider extrusion soldering tin make its deformation, utilize crooked folding silk to increase the area of contact between pin and the bread board, thereby will fold the silk welding when welding pin and bread board, the problem that area of contact is little easy not hard up between bread board and the pin has been solved.

Drawings

Fig. 1 is a schematic perspective view of a combined wafer thick film resistor according to the present invention;

fig. 2 is a schematic structural diagram of a combined wafer thick film resistor shown in fig. 1 according to the present invention;

FIG. 3 is a front view of a combined wafer thick film resistor according to the present invention;

fig. 4 is a schematic view of the mounting structure of the combined wafer thick film resistor according to the present invention.

Illustration of the drawings:

1. a resistor body; 2. a pin; 3. a baffle plate; 4. an expansion device; 401. a slide bar; 402. a slider; 403. folding the filaments; 5. a groove; 6. bread board.

Detailed Description

In order to make the technical means, the creation features, the achievement purposes and the functions of the present invention easy to understand, the present invention will be further explained below with reference to the following embodiments and the accompanying drawings, but the following embodiments are only the preferred embodiments of the present invention, and not all embodiments are included. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention.

Specific embodiments of the present invention will be described below with reference to the accompanying drawings.

Referring to fig. 1-4, a combined wafer thick film resistor, including resistor body 1, resistor body 1's wiring end electric connection has pin 2, pin 2 is perpendicular with resistor body 1, pin 2 keeps away from resistor body 1's one end electric connection has expansion device 4, resistor body 1's fixed position is kept away from on pin 2 surface is connected with baffle 3, baffle 3's surface is seted up flutedly 5, 5 evenly distributed of recess are around baffle 3, expansion device 4's surface cover is equipped with bread board 6, weld through soldering tin between bread board 6 and the expansion device 4.

Expansion device 4 includes the slide bar 401 with pin 2 bottom fixed connection, the surperficial sliding connection of slide bar 401 has slider 402, the upper end fixed surface of slider 402 is connected with folding silk 403, the one end and pin 2 fixed connection that slider 402 was kept away from to folding silk 403, the one end that slide bar 401 is close to pin 2 is equipped with circular-arc arch, and circular-arc arch forms for melting form soldering tin condenses, clearance fit between slider 402 inner wall and the slide bar 401 the two, the upper end of slider 402 evenly is equipped with folding silk 403.

The utility model discloses a theory of operation: the bread board 6 is sleeved on the surface of a folded wire 403 made of carbon steel wires, the slider 402 is pushed to enable the slider 402 to extrude the folded wire 403 to enable the folded wire 403 to be bent, the slider 402 slides upwards on the surface of the slide bar 401, the slider 402 slides towards a soldering tin arc mounting bulge arranged on the surface of the slide bar 401, the slider 402 extrudes soldering tin to enable the soldering tin to deform through the flexible physical characteristic of the soldering tin, so that the slider 402 is clamped, the contact area between the pins 2 and the bread board 6 is increased through the bent folded wire 403, the folded wire 403 is welded when the pins 2 and the bread board 6 are welded, and the problem that the contact area between the bread board 6 and the pins 2 is small and easy to loosen is solved.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A modular wafer thick film resistor comprising a resistor body (1), characterized in that: the resistor is characterized in that a wiring end of the resistor body (1) is electrically connected with a pin (2), the pin (2) is perpendicular to the resistor body (1), and one end, far away from the resistor body (1), of the pin (2) is electrically connected with an expansion device (4).

2. The combination wafer thick film resistor of claim 1, wherein: the resistor is characterized in that a baffle (3) is fixedly connected to the surface of the pin (2) far away from the resistor body (1), a groove (5) is formed in the surface of the baffle (3), and the grooves (5) are uniformly distributed around the baffle (3).

3. The combination wafer thick film resistor of claim 1, wherein: the expansion device (4) comprises a sliding rod (401) fixedly connected with the bottom end of the pin (2), the surface of the sliding rod (401) is connected with a sliding block (402) in a sliding mode, the upper end surface of the sliding block (402) is fixedly connected with a folding wire (403), and one end, far away from the sliding block (402), of the folding wire (403) is fixedly connected with the pin (2).

4. The combination wafer thick film resistor of claim 1, wherein: the surface of the expansion device (4) is sleeved with a bread board (6), and the bread board (6) and the expansion device (4) are welded through soldering tin.

5. The combination wafer thick film resistor of claim 3, wherein: one end of the sliding rod (401) close to the pin (2) is provided with an arc-shaped bulge, and the arc-shaped bulge is formed by condensing molten soldering tin.

6. The combination wafer thick film resistor of claim 3, wherein: the inner wall of the sliding block (402) is in clearance fit with the sliding rod (401), and the upper end of the sliding block (402) is uniformly provided with folding wires (403).