CN210442290U - Water content sensor - Google Patents
Water content sensor Download PDFInfo
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- CN210442290U CN210442290U CN201920192017.XU CN201920192017U CN210442290U CN 210442290 U CN210442290 U CN 210442290U CN 201920192017 U CN201920192017 U CN 201920192017U CN 210442290 U CN210442290 U CN 210442290U
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- circuit board
- probe
- content sensor
- injection molding
- moisture content
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- Measuring Fluid Pressure (AREA)
Abstract
The utility model discloses a moisture content sensor, which comprises a shell, a communication cable, a circuit board, a probe sealing bracket and an injection molding internal mold, wherein the probe and the probe sealing bracket are assembled to the circuit board after being integrally formed, and the communication cable is connected to the circuit board to form a circuit board assembly; the circuit board is molded in a low-temperature and low-pressure injection molding mode, and the circuit board is in a closed state and has waterproof performance by wrapping the circuit board and part of the probe sealing bracket by the injection molding inner mold and reserving a communication cable; the outer shell wraps the injection molding inner die. The utility model discloses a mode of the centre form is moulded plastics to low temperature low pressure replaces epoxy embedment technology, avoids the epoxy spot to remain. Meanwhile, the probe sealing support is added, the waterproof performance of the injection molding process is applied, and the structure size of the sensor can meet the requirement of accuracy, so that the accuracy of the sensor can be greatly improved.
Description
Technical Field
The utility model relates to a moisture content sensor.
Background
The soil/substrate moisture content sensor comprises a shell, a communication cable, a circuit board, a probe and epoxy resin filling materials. In the prior art, shells A and B are bonded into a cup-shaped shell through ultrasonic welding or glue, and a circuit board assembly is formed by a probe, a communication cable and a circuit board; the circuit board assembly is inserted into the cup-shaped shell, and the diameter of the cable sheath is closely matched with the size of the outlet hole position at the bottom of the cup-shaped shell; epoxy resin is injected from the opening of the cup-shaped shell at the probe for encapsulation. The tight fit maneuverability is poor for cup shell bottom wire hole and cable size, damages the cable easily. Epoxy resin is encapsulated, the curing time is long, mass production is not facilitated, glue flowing characteristics cause glue overflow, and the surfaces of the probe and the shell are stained. The epoxy resin is exposed seriously to the appearance of the finished product. Epoxy resin is filled and sealed, and the surface is uneven, so that the exposed lengths of the probes are different, and the measurement precision is influenced.
Disclosure of Invention
In order to solve the technical problem, an object of the utility model is to provide a moisture content sensor.
The utility model discloses a following technical scheme realizes:
a water content sensor comprises a shell, a communication cable, a circuit board, a probe sealing support and an injection molding inner die, and is characterized in that the probe and the probe sealing support are assembled on the circuit board after being integrally formed, and the communication cable is connected to the circuit board to form a circuit board assembly; the circuit board is molded in a low-temperature and low-pressure injection molding mode, and the circuit board is in a closed state and has waterproof performance by wrapping the circuit board and part of the probe sealing bracket by the injection molding inner mold and reserving a communication cable; the outer shell wraps the injection molding inner die.
Preferably, the outer shell comprises an upper shell and a lower shell, and the upper shell and the lower shell are attached to the injection-molded inner die and then fixed in an ultrasonic fusion mode, a glue bonding mode or a mechanical screw mode.
Preferably, the probe and the probe sealing bracket are formed integrally by a conventional injection molding process at high temperature and high pressure.
Preferably, the communication cable is connected to the circuit board by soldering.
Preferably, the probe and the probe sealing bracket are integrally connected with the circuit board in a screw mechanical fixing mode.
Preferably, the moisture content sensor is for measuring moisture content of soil or substrate.
Preferably, the probe is used for detecting the water content of the measurement object and obtaining a detection signal.
Preferably, the circuit board is used for processing signals measured by the probe.
Preferably, the communication cable is used for transmitting the signals processed by the circuit board.
Preferably, the water content sensor has waterproof performance.
The utility model discloses following beneficial effect has: the utility model discloses a mode of the centre form is moulded plastics to low temperature low pressure replaces epoxy embedment technology, improves production efficiency, avoids the epoxy spot to remain simultaneously. Meanwhile, a probe sealing support is added, the plastic which is subjected to high-temperature high-pressure injection molding is sealed with the plastic which is subjected to low-temperature low-pressure injection molding, the waterproof performance of the injection molding process is applied, and the accurate structural size which can be satisfied can greatly improve the precision of the sensor.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is an exploded view of the present invention.
Fig. 2 is a schematic diagram of the circuit board of the present invention after injection molding.
Fig. 3 is a schematic diagram of the present invention.
In the figure: 1. a probe; 2. a probe sealing support; 3. a circuit board; 4. a communication cable; 5. injection molding the inner mold; 6. a lower housing; 7. an upper housing; 8. the circuit board is subjected to injection molding; 9. and a water content sensor.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Referring to the attached drawings 1-3 of the specification, the moisture content sensor comprises a shell, a communication cable 4, a circuit board 3, a probe 1, a probe sealing support 2 and an injection molding inner die 5, wherein the probe 1 and the probe sealing support 2 are assembled on the circuit board 3 in a screw mechanical fixing mode after being formed into a whole through a high-temperature and high-pressure conventional injection molding process, and meanwhile, the communication cable 4 is connected to the circuit board 3 in a welding mode to form a circuit board assembly; the circuit board 3 is molded by low-temperature low-pressure injection molding, and the injection molding inner mold 5 wraps the circuit board 3 and part of the probe sealing support 2 while reserving the communication cable 4 to form an injection molded circuit board 8, so that the circuit board 3 is in a closed state and has waterproof performance; the shell comprises a lower shell 6 and an upper shell 7, and the upper shell 7 and the lower shell 6 are attached to the injection-molded inner die and then fixed in an ultrasonic fusion or glue bonding or mechanical screw mode; the shell wraps the injection molding inner die to form the water content sensor 9.
The water content sensor 9 is used for measuring the water content of soil or a substrate, and the probe is used for detecting the water content of a measuring object and obtaining a detection signal; the circuit board is used for processing signals measured by the probe; the communication cable is used for transmitting the signals processed by the circuit board; the moisture content sensor has waterproof performance.
The utility model discloses a mode of the centre form is moulded plastics to low temperature low pressure replaces epoxy embedment technology, improves production efficiency, avoids the epoxy spot to remain simultaneously. Meanwhile, a probe sealing support is added, the plastic which is subjected to high-temperature high-pressure injection molding is sealed with the plastic which is subjected to low-temperature low-pressure injection molding, the waterproof performance of the injection molding process is applied, and the accurate structural size which can be satisfied can greatly improve the precision of the sensor.
While the foregoing description shows and describes the preferred embodiments of the present invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not intended to be exhaustive or to exclude other embodiments and may be used in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. But that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention, which is to be limited only by the claims appended hereto.
Claims (10)
1. A water content sensor comprises a shell, a communication cable, a circuit board, a probe sealing support and an injection molding inner die, and is characterized in that the probe and the probe sealing support are assembled on the circuit board after being integrally formed, and the communication cable is connected to the circuit board to form a circuit board assembly; the circuit board is molded in a low-temperature and low-pressure injection molding mode, and the circuit board is in a closed state and has waterproof performance by wrapping the circuit board and part of the probe sealing bracket by the injection molding inner mold and reserving a communication cable; the outer shell wraps the injection molding inner die.
2. The water content sensor according to claim 1, wherein the outer shell comprises an upper shell and a lower shell, and the upper shell and the lower shell are attached to the injection-molded inner mold and then fixed by ultrasonic fusion, glue bonding or mechanical screw.
3. The moisture content sensor according to claim 1, wherein the probe and the probe sealing holder are integrally formed by a high-temperature and high-pressure injection molding process.
4. The moisture content sensor according to claim 1, wherein the communication cable is connected to the circuit board by soldering.
5. The moisture content sensor according to claim 1, wherein the probe and the probe sealing bracket are integrally connected with the circuit board by means of screw mechanical fixation.
6. The moisture content sensor according to any one of claims 1 to 5, wherein the moisture content sensor is for measuring moisture content of soil or substrate.
7. The water content sensor according to any one of claims 1 to 5, wherein the probe is configured to detect a water content of the measurement object and obtain a detection signal.
8. The moisture content sensor according to claim 7, wherein the circuit board is configured to perform signal processing on the signal measured by the probe.
9. The moisture content sensor according to claim 8, wherein the communication cable is used for transmitting the processed signal of the circuit board.
10. The moisture content sensor according to any one of claims 1 to 5, wherein the moisture content sensor has a waterproof property.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920192017.XU CN210442290U (en) | 2019-02-12 | 2019-02-12 | Water content sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920192017.XU CN210442290U (en) | 2019-02-12 | 2019-02-12 | Water content sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210442290U true CN210442290U (en) | 2020-05-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920192017.XU Active CN210442290U (en) | 2019-02-12 | 2019-02-12 | Water content sensor |
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| CN (1) | CN210442290U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109827997A (en) * | 2019-02-12 | 2019-05-31 | 拓霸(厦门)电子有限公司 | A kind of moisture sensor |
-
2019
- 2019-02-12 CN CN201920192017.XU patent/CN210442290U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109827997A (en) * | 2019-02-12 | 2019-05-31 | 拓霸(厦门)电子有限公司 | A kind of moisture sensor |
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